US20110062030A1 - Electrolyte composition - Google Patents
Electrolyte composition Download PDFInfo
- Publication number
- US20110062030A1 US20110062030A1 US12/878,207 US87820710A US2011062030A1 US 20110062030 A1 US20110062030 A1 US 20110062030A1 US 87820710 A US87820710 A US 87820710A US 2011062030 A1 US2011062030 A1 US 2011062030A1
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- US
- United States
- Prior art keywords
- electrolyte composition
- composition according
- electrolyte
- iminodisuccinate
- concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- 239000000203 mixture Substances 0.000 title claims abstract description 94
- 239000003792 electrolyte Substances 0.000 title claims abstract description 85
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 230000008021 deposition Effects 0.000 claims abstract description 20
- 229910052709 silver Inorganic materials 0.000 claims abstract description 20
- 239000004332 silver Substances 0.000 claims abstract description 20
- 150000002739 metals Chemical class 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 16
- PQHYOGIRXOKOEJ-UHFFFAOYSA-N 2-(1,2-dicarboxyethylamino)butanedioic acid Chemical class OC(=O)CC(C(O)=O)NC(C(O)=O)CC(O)=O PQHYOGIRXOKOEJ-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229940080260 iminodisuccinate Drugs 0.000 claims abstract description 3
- 150000002825 nitriles Chemical class 0.000 claims abstract description 3
- 238000000151 deposition Methods 0.000 claims abstract 5
- 239000008139 complexing agent Substances 0.000 claims description 34
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 18
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 claims description 13
- 229940091173 hydantoin Drugs 0.000 claims description 13
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 claims description 11
- 229910021645 metal ion Inorganic materials 0.000 claims description 11
- YIROYDNZEPTFOL-UHFFFAOYSA-N 5,5-Dimethylhydantoin Chemical compound CC1(C)NC(=O)NC1=O YIROYDNZEPTFOL-UHFFFAOYSA-N 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- -1 aluminium ions Chemical class 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 239000011575 calcium Substances 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- 159000000000 sodium salts Chemical group 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- 229910052783 alkali metal Inorganic materials 0.000 claims description 2
- 229910052791 calcium Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 claims description 2
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims 1
- NMUOATVLLQEYHI-UHFFFAOYSA-N iminoaspartic acid Chemical class OC(=O)CC(=N)C(O)=O NMUOATVLLQEYHI-UHFFFAOYSA-N 0.000 claims 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 abstract description 2
- 229910052708 sodium Inorganic materials 0.000 abstract description 2
- 239000011734 sodium Substances 0.000 abstract description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 21
- 239000008151 electrolyte solution Substances 0.000 description 8
- 229940021013 electrolyte solution Drugs 0.000 description 8
- RYKLZUPYJFFNRR-UHFFFAOYSA-N 3-hydroxypiperidin-2-one Chemical compound OC1CCCNC1=O RYKLZUPYJFFNRR-UHFFFAOYSA-N 0.000 description 7
- 150000002500 ions Chemical class 0.000 description 7
- GYBINGQBXROMRS-UHFFFAOYSA-J tetrasodium;2-(1,2-dicarboxylatoethylamino)butanedioate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CC(C([O-])=O)NC(C([O-])=O)CC([O-])=O GYBINGQBXROMRS-UHFFFAOYSA-J 0.000 description 7
- 239000000080 wetting agent Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- PJAHUDTUZRZBKM-UHFFFAOYSA-K potassium citrate monohydrate Chemical compound O.[K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O PJAHUDTUZRZBKM-UHFFFAOYSA-K 0.000 description 6
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 5
- 229940080258 tetrasodium iminodisuccinate Drugs 0.000 description 5
- 229910001369 Brass Inorganic materials 0.000 description 4
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 239000010951 brass Substances 0.000 description 4
- 238000005137 deposition process Methods 0.000 description 4
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 231100000331 toxic Toxicity 0.000 description 3
- 230000002588 toxic effect Effects 0.000 description 3
- 0 *C(=[5*])C(CC(=[2*])[3*])NC(CC(=[1*])[8*])C(=[6*])[7*] Chemical compound *C(=[5*])C(CC(=[2*])[3*])NC(CC(=[1*])[8*])C(=[6*])[7*] 0.000 description 2
- RHYBFKMFHLPQPH-UHFFFAOYSA-N N-methylhydantoin Chemical compound CN1CC(=O)NC1=O RHYBFKMFHLPQPH-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000536 complexating effect Effects 0.000 description 2
- 229940098779 methanesulfonic acid Drugs 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- RFTORHYUCZJHDO-UHFFFAOYSA-N 1,3-dimethylimidazolidine-2,4-dione Chemical compound CN1CC(=O)N(C)C1=O RFTORHYUCZJHDO-UHFFFAOYSA-N 0.000 description 1
- SIQZJFKTROUNPI-UHFFFAOYSA-N 1-(hydroxymethyl)-5,5-dimethylhydantoin Chemical compound CC1(C)N(CO)C(=O)NC1=O SIQZJFKTROUNPI-UHFFFAOYSA-N 0.000 description 1
- JLVVSXFLKOJNIY-UHFFFAOYSA-N Magnesium ion Chemical compound [Mg+2] JLVVSXFLKOJNIY-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- NPYPAHLBTDXSSS-UHFFFAOYSA-N Potassium ion Chemical compound [K+] NPYPAHLBTDXSSS-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229940053195 antiepileptics hydantoin derivative Drugs 0.000 description 1
- 229940053198 antiepileptics succinimide derivative Drugs 0.000 description 1
- 229910001424 calcium ion Inorganic materials 0.000 description 1
- 150000001860 citric acid derivatives Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 150000001469 hydantoins Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910001425 magnesium ion Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 239000001508 potassium citrate Substances 0.000 description 1
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000005588 protonation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- KKVTYAVXTDIPAP-UHFFFAOYSA-M sodium;methanesulfonate Chemical compound [Na+].CS([O-])(=O)=O KKVTYAVXTDIPAP-UHFFFAOYSA-M 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
- 150000003458 sulfonic acid derivatives Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 235000015870 tripotassium citrate Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- German Patent Application No. 10 2009 029 558.5 filed on Sep. 17, 2009 in Germany.
- This German Patent Application provides the basis for a claim of priority of invention for the invention described and claimed herein below under 35 U.S.C. 119 (a)-(d).
- the present application relates to an electrolyte composition for the deposition of metals onto substrates.
- the electrolyte composition at least comprises the metal ions of the metal which should be deposited with this composition.
- a further organic complexing agent which is known in prior art, is succinimide as well as its derivatives.
- This complexing agent is provided for example in U.S. Pat. No. 4,126,524.
- Known electrolyte compositions free of cyanide have one crucial disadvantage, namely very low deposition rates of only 0.8 to 1 ⁇ m per minute.
- a low deposition rate must be considered in long-term design of a facility for electrolytic deposition. Not only the acquisition and maintenance costs of the facility will be greatly increased, but also the cost of the electrolyte composition. Therefore because of the high prices of particular metals, such as silver, a high deposition rate becomes increasingly desirable.
- a suitable electrolyte composition should also have the ability to form complexes with foreign metal ions, which are not intended to be deposited onto the respective substrate, and thus to maintain the stability of the electrolyte composition during the whole deposition process and also thereafter. It is also desirable that the electrolyte composition survives fluctuations of the pH occurring during the galvanization process. Succinimide and hydantoin derivatives do not have these properties.
- electrolyte compositions which are suitable for a deposition of metals, in particular silver, onto solar cells.
- the galvanic deposition of silver onto solar cells is particularly desirable, because the applied layer has a conductivity which is near the theoretical conductivity, but on the other hand it is technically challenging.
- solar cells have a back side of aluminium. Therefore a mild alkaline pH is extremely important, because otherwise the aluminium would be dissolved which is not desired.
- An ideal pH of 9 to 10 has to be provided during the whole deposition process which requires special electrolyte compositions.
- electrolyte composition which combines a high deposition rate with a high stability with respect to foreign ions and fluctuations of the pH and which at the same time does not have toxicity.
- electrolyte composition should be suitable to be used for deposition of metals, in particular silver, onto solar cells.
- an electrolyte composition for the deposition of metals onto a substrate, particularly onto a solar cell which comprises at least one metal ion and which is characterized by the presence of an iminodisuccinate derivative as a complexing agent.
- an iminodisuccinate derivative of the present invention is abbreviated as IDSD.
- the IDSD in the electrolyte composition of the present invention is characterized by the following chemical formula (I):
- each of the R1, R2, R5 and R6 groups is selected from the group consisting of O, S and NH; each of the R3, R4, R7 and R8 groups is selected from the group consisting of OH, NH 2 , SH, O ⁇ and S ⁇ , and when at least one of the R3, R4, R7 and R8 groups is an O ⁇ or S ⁇ the IDSD is a salt comprising a sodium and/or potassium cation.
- the IDSD has the advantage of excellent complexing properties for numerous metals so that the composition according to the present invention is well suited for the deposition of a large number of metals.
- IDSD is not toxic and is biodegradable.
- the IDSD of the present invention is preferably used in the form of its alkali metal salts. These are for example the sodium salt or the potassium salt, wherein the sodium salt is a preferred embodiment of the present invention.
- the IDSD is an iminodisuccinate, in particular tetrasodium iminodisuccinate.
- the IDSD can be contained in the electrolyte composition in a concentration of 50 g/L to 250 g/L, provided that the IDSD is the main complexing agent in the composition.
- the IDSD is the main complexing agent and is present in the electrolyte composition in a concentration of 150 g/L to 225 g/L.
- main complexing agent in the sense of the present invention means that the ratio of the complexing agent which is designated as the main complexing agent to each other complexing agent in the electrolyte composition is at least 2:1. Preferably, this ratio is 5:1, further preferably it is 10:1 and most preferably the complexing agent designated as the main complexing agent is the only complexing agent in the electrolyte composition.
- the IDSD is used in combination with another complexing agent.
- the IDSD is used in a quantitatively smaller proportion than in cases in which the IDSD is the main complexing agent.
- the proportions in which the IDSD is present in the electrolyte composition of the present invention are from 2 g/L to 40 g/L, preferably from 5 g/L and 20 g/L.
- the IDSD can substantially increase the current efficiency of the deposition process.
- a further potential complexing agent which can advantageously be used in the electrolyte composition, is hydantoin or one or more of its derivatives.
- the group of the complexing agents “hydantoin or one or more of its derivatives” is abbreviated in the following by the generic name, hydantoin.
- hydantoin encompasses 1-methyl hydantoin, 1,3-dimethyl hydantoin, 5,5-dimethyl hydantoin and 1-hydroxymethyl-5,5-dimethyl hydantoin.
- the IDSD 5,5-dimethyl hydantoin is used.
- the additional complexing agent can be used in the electrolyte composition in a concentration of 50 g/L to 250 g/L. More preferably the concentration is in a range from 100 g/L to 175 g/L.
- hydantoin cannot form complexes with many foreign ions.
- foreign ions means ions of nickel, chromium and iron.
- an electrolyte solution with a very low sensitivity can be prepared.
- This combination of complexing agents has the additional advantage that higher amounts of the metal ion can be complexed.
- the complexing agent IDSD alone can only complex up to 20 g/L of silver, but in combination with 5,5-dimethyl hydantoin up to 60 g/L can be complexed.
- the electrolyte composition according to the present invention is preferably free of sulfonic acid derivatives. Furthermore, the electrolyte composition according to the present invention is preferably free of cyanides.
- the electrolyte composition according to the present invention comprises a conductivity additive.
- the conductivity additive improves the conductivity of the electrolyte composition and thus reduces the cell voltage during the galvanization process. This is desirable, because with a better conductivity of the electrolyte solution an improved current efficiency can be achieved.
- the conductivity additive is a citrate. This citrate is preferably present in a concentration of 20 g/L to 75 g/L, more preferably 30 g/L to 50 g/L. In this case citrate has not only the function of a conductivity additive, but does also form complexes with calcium and magnesium ions.
- citrate has the advantage that the electrolyte solution is not sensitive with respect to the incorporation of acids, since citrate can act as a buffer when fluctuations of pH occur. Therefore, this addition provides an advantage regarding the stability of the composition.
- a preferred citrate for use in the electrolyte composition of the invention is tripotassium citrate.
- the electrolyte composition according to the present invention is preferably adjusted to a pH of 8 to 12, more preferably 9.5 to 11.
- the IDSD can advantageously be used in the aforesaid pH ranges, since the degree of protonation of the complexing groups is sufficiently low.
- the electrolyte composition according to the present invention is suitable for deposition of different kinds of metals onto numerous substrates.
- the electrolyte composition comprises metal ions, which are ions of silver, calcium, magnesium, iron, chromium, cobalt, nickel, copper, tin and/or aluminium.
- the electrolyte composition comprises silver ions.
- the metal ions are present in the electrolyte composition in a concentration of 10 g/L to 60 g/L, preferably of 15 g/L to 40 g/L.
- a particularly preferable embodiment relates to an electrolyte composition in which IDSD is the only complexing agent and in which the proportion of metal ions is limited to at most 20 g/L.
- the electrolyte composition comprises a wetting agent in addition to the IDSD.
- the wetting agent increases the wettability of the substrate and thus results in an easier galvanic deposition. It has surprisingly been found that the addition of a wetting agent allows the deposition of glossy metal layers onto the substrate. On the contrary, with the methods and electrolyte compositions of the prior art only lustreless surfaces can be produced.
- the wetting agents are surface-active substances comprising a hydrophilic and a lipophilic part.
- the hydrophilic part preferably comprises a polyalkylene oxide chain, in particular a PEG chain.
- the wetting agent polyethylene glycol octyl (3-sulphopropyl)diether is most preferable.
- the substrates are selected from electrically conductive material.
- glass, metal, metal alloy and/or semiconductor substrates are preferable.
- Glass and silicon substrates are particularly preferred, but silicon is the most preferred substrate material.
- a method for silvering substrates, in particular the above-mentioned substrates is also another aspect of the present invention.
- the method preferably comprises the steps of placing the substrate in the electrolyte composition according to the present invention and applying a voltage between an anode and a cathode in electrical contact with the electrolyte composition, wherein the cathode is the substrate.
- the current density is about 1.5 A/dm 2 .
- the substrate can be electroplated with an increased current density. Temperatures of 0 to 100° C., particularly of 20 to 70° C. are preferred.
- the electrolyte composition is stirred during the galvanization process, to allow homogenous deposition.
- the electrolyte compositions according to the present invention are suitable to deposit metals even without current. So in particular embodiments of the method according to the present invention no voltage is applied. In this case for example it is possible to apply a metal layer onto an electrically conductive glass or a sheet brass. For such a method the temperature preferably has to be at least 40° C.
- the pH of the composition was 10.3.
- the pH of the composition was 10.3.
- the pH of the composition was 10.3.
- the following specific examples for the deposition of silver onto a solar cell were conducted with the same current density and over the same period of time.
- the solar cell was of the size of 125 ⁇ 125 mm with 6% of conductive area.
- the electroplated layer thickness correlates with the galvanization time. As shown, for the same conditions with respect to current density and time according to the present invention a layer thickness which is increased by more than 30% could be achieved. In the case of intended mean layer thicknesses of about 7 to 8 ⁇ m, with the use of the electrolyte composition according to the present invention a considerable advantage in time of much more than 30% can be achieved.
- An electrolyte composition according to the present invention with IDSD as the only complexing agent comprises the following components:
- Tetrasodium iminodisuccinate (Baypure CX100 200 g/L from Lanxess) Tripotassium citrate monohydrate 40 g/L Potassium hydroxide 65 g/L Silver as silver methane sulfonate 18 g/L Ionogenic wetting agent EA 15-90 Raschig 7 ml/L Methane sulfonic acid (for pH adjustment to 10.0) 10 ml/L
- An electrolyte composition according to the present invention with IDSD as the only complexing agent comprises the following components:
- Tetrasodium iminodisuccinate (Baypure CX100 200 g/L from Lanxess) Sodium methane sulfonate 40 g/L Potassium hydroxide 65 g/L Silver as silver methane sulfonate 18 g/L Ionogenic wetting agent EA 15-90 Raschig 7 ml/L Methane sulfonic acid (pH adjusted to 10.0) 10 ml/L
- the pH of the composition was 10.3.
- the pH of the composition was 10.3.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Photovoltaic Devices (AREA)
Abstract
The electrolyte composition is used in a method of depositing metals, in particular, onto substrates, especially solar cells. The electrolyte composition is particularly suitable for the deposition of metals, in particular silver, onto solar cells. The electrolyte composition is preferably free of cyanides and contains at least one metal, preferably silver, and an iminodisuccinate derivative, preferably a sodium or postassium iminodisuccinate.
Description
- The subject matter described and claimed herein below is also described in German Patent Application No. 10 2009 029 558.5, filed on Sep. 17, 2009 in Germany. This German Patent Application provides the basis for a claim of priority of invention for the invention described and claimed herein below under 35 U.S.C. 119 (a)-(d).
- 1. The Field of the Invention
- The present application relates to an electrolyte composition for the deposition of metals onto substrates. The electrolyte composition at least comprises the metal ions of the metal which should be deposited with this composition.
- 2. The Description of the Related Art
- The galvanic deposition of metals from electrolyte solutions is known in the art. For this purpose the respective metal must be dissolved in the electrolyte solutions to form its ion and to maintain it in this state. For the latter purpose complexing agents are usually used. An important criterion for suitable complexing agents is the sufficiently high stability of the respectively formed complex. Cyanide has often been used in the prior art as the complexing agent, because it forms extremely stable complexes with numerous metals. Especially silver forms excellent complexes with cyanide and provides good results in a deposition process of that metal on surfaces. However cyanide has the disadvantage of being extremely toxic so that its use as a complexing agent is not desired.
- Therefore much effort has been made to replace the toxic complexing agent cyanide by other complexing agents. One example of this sort of complexing agent is hydantoin and some of its derivatives. The use of hydantoin as a complexing agent is discussed for example in EP 1 918 426 A2.
- A further organic complexing agent, which is known in prior art, is succinimide as well as its derivatives. This complexing agent is provided for example in U.S. Pat. No. 4,126,524.
- Known electrolyte compositions free of cyanide have one crucial disadvantage, namely very low deposition rates of only 0.8 to 1 μm per minute. A low deposition rate must be considered in long-term design of a facility for electrolytic deposition. Not only the acquisition and maintenance costs of the facility will be greatly increased, but also the cost of the electrolyte composition. Therefore because of the high prices of particular metals, such as silver, a high deposition rate becomes increasingly desirable.
- A suitable electrolyte composition should also have the ability to form complexes with foreign metal ions, which are not intended to be deposited onto the respective substrate, and thus to maintain the stability of the electrolyte composition during the whole deposition process and also thereafter. It is also desirable that the electrolyte composition survives fluctuations of the pH occurring during the galvanization process. Succinimide and hydantoin derivatives do not have these properties.
- It is particularly desirable to provide electrolyte compositions which are suitable for a deposition of metals, in particular silver, onto solar cells. On the one hand, the galvanic deposition of silver onto solar cells is particularly desirable, because the applied layer has a conductivity which is near the theoretical conductivity, but on the other hand it is technically challenging. Usually, solar cells have a back side of aluminium. Therefore a mild alkaline pH is extremely important, because otherwise the aluminium would be dissolved which is not desired. An ideal pH of 9 to 10 has to be provided during the whole deposition process which requires special electrolyte compositions.
- It is the object of the invention to provide an electrolyte composition which combines a high deposition rate with a high stability with respect to foreign ions and fluctuations of the pH and which at the same time does not have toxicity. In addition, the electrolyte composition should be suitable to be used for deposition of metals, in particular silver, onto solar cells.
- The aforesaid object is attained according to the invention by the subject matter of the appended patent claims.
- This object is in particular attained by an electrolyte composition for the deposition of metals onto a substrate, particularly onto a solar cell, which comprises at least one metal ion and which is characterized by the presence of an iminodisuccinate derivative as a complexing agent. In the following, the iminodisuccinate derivative of the present invention is abbreviated as IDSD.
- The IDSD in the electrolyte composition of the present invention is characterized by the following chemical formula (I):
- In the above formula each of the R1, R2, R5 and R6 groups is selected from the group consisting of O, S and NH; each of the R3, R4, R7 and R8 groups is selected from the group consisting of OH, NH2, SH, O− and S−, and when at least one of the R3, R4, R7 and R8 groups is an O− or S− the IDSD is a salt comprising a sodium and/or potassium cation. The IDSD has the advantage of excellent complexing properties for numerous metals so that the composition according to the present invention is well suited for the deposition of a large number of metals. At the same time, the sensitivity of the electrolyte composition is decreased, since also impurities in the form of foreign ions can form complexes so that in the solution no precipitation takes place. In addition, IDSD is not toxic and is biodegradable. The IDSD of the present invention is preferably used in the form of its alkali metal salts. These are for example the sodium salt or the potassium salt, wherein the sodium salt is a preferred embodiment of the present invention. In particularly preferable embodiments the IDSD is an iminodisuccinate, in particular tetrasodium iminodisuccinate.
- According to the present invention the IDSD can be contained in the electrolyte composition in a concentration of 50 g/L to 250 g/L, provided that the IDSD is the main complexing agent in the composition. In preferred embodiments the IDSD is the main complexing agent and is present in the electrolyte composition in a concentration of 150 g/L to 225 g/L.
- The term “main complexing agent” in the sense of the present invention means that the ratio of the complexing agent which is designated as the main complexing agent to each other complexing agent in the electrolyte composition is at least 2:1. Preferably, this ratio is 5:1, further preferably it is 10:1 and most preferably the complexing agent designated as the main complexing agent is the only complexing agent in the electrolyte composition.
- In alternative embodiments the IDSD is used in combination with another complexing agent. In these embodiments the IDSD is used in a quantitatively smaller proportion than in cases in which the IDSD is the main complexing agent. In embodiments in which the IDSD is not the main complexing agent, but is used in combination with another complexing agent the proportions in which the IDSD is present in the electrolyte composition of the present invention are from 2 g/L to 40 g/L, preferably from 5 g/L and 20 g/L.
- Under consideration of the above-mentioned amounts the IDSD can substantially increase the current efficiency of the deposition process.
- A further potential complexing agent, which can advantageously be used in the electrolyte composition, is hydantoin or one or more of its derivatives. The group of the complexing agents “hydantoin or one or more of its derivatives” is abbreviated in the following by the generic name, hydantoin. Thus, the scope of the term “hydantoin” in the following encompasses 1-methyl hydantoin, 1,3-dimethyl hydantoin, 5,5-dimethyl hydantoin and 1-hydroxymethyl-5,5-dimethyl hydantoin. In particularly preferable embodiments besides the IDSD 5,5-dimethyl hydantoin is used.
- In preferred embodiments the additional complexing agent can be used in the electrolyte composition in a concentration of 50 g/L to 250 g/L. More preferably the concentration is in a range from 100 g/L to 175 g/L. As already mentioned above, hydantoin cannot form complexes with many foreign ions. Here the term “foreign ions” means ions of nickel, chromium and iron. However, when hydantoin is used together with IDSD, an electrolyte solution with a very low sensitivity can be prepared. This combination of complexing agents has the additional advantage that higher amounts of the metal ion can be complexed. For example, the complexing agent IDSD alone can only complex up to 20 g/L of silver, but in combination with 5,5-dimethyl hydantoin up to 60 g/L can be complexed.
- The electrolyte composition according to the present invention is preferably free of sulfonic acid derivatives. Furthermore, the electrolyte composition according to the present invention is preferably free of cyanides.
- In preferred embodiments the electrolyte composition according to the present invention comprises a conductivity additive. The conductivity additive improves the conductivity of the electrolyte composition and thus reduces the cell voltage during the galvanization process. This is desirable, because with a better conductivity of the electrolyte solution an improved current efficiency can be achieved. According to the present invention, preferably the conductivity additive is a citrate. This citrate is preferably present in a concentration of 20 g/L to 75 g/L, more preferably 30 g/L to 50 g/L. In this case citrate has not only the function of a conductivity additive, but does also form complexes with calcium and magnesium ions. In addition, the use of citrate has the advantage that the electrolyte solution is not sensitive with respect to the incorporation of acids, since citrate can act as a buffer when fluctuations of pH occur. Therefore, this addition provides an advantage regarding the stability of the composition. A preferred citrate for use in the electrolyte composition of the invention is tripotassium citrate.
- The electrolyte composition according to the present invention is preferably adjusted to a pH of 8 to 12, more preferably 9.5 to 11. The IDSD can advantageously be used in the aforesaid pH ranges, since the degree of protonation of the complexing groups is sufficiently low.
- The electrolyte composition according to the present invention is suitable for deposition of different kinds of metals onto numerous substrates. Preferably, the electrolyte composition comprises metal ions, which are ions of silver, calcium, magnesium, iron, chromium, cobalt, nickel, copper, tin and/or aluminium. In particularly preferable embodiments the electrolyte composition comprises silver ions.
- Preferably, the metal ions are present in the electrolyte composition in a concentration of 10 g/L to 60 g/L, preferably of 15 g/L to 40 g/L. A particularly preferable embodiment relates to an electrolyte composition in which IDSD is the only complexing agent and in which the proportion of metal ions is limited to at most 20 g/L.
- In preferred embodiments of the present invention the electrolyte composition comprises a wetting agent in addition to the IDSD. The wetting agent increases the wettability of the substrate and thus results in an easier galvanic deposition. It has surprisingly been found that the addition of a wetting agent allows the deposition of glossy metal layers onto the substrate. On the contrary, with the methods and electrolyte compositions of the prior art only lustreless surfaces can be produced. The wetting agents are surface-active substances comprising a hydrophilic and a lipophilic part. The hydrophilic part preferably comprises a polyalkylene oxide chain, in particular a PEG chain. The wetting agent polyethylene glycol octyl (3-sulphopropyl)diether is most preferable.
- The use of the electrolyte composition for the galvanic deposition of metals onto substrates is a further part of the present invention. Preferably, the substrates are selected from electrically conductive material. In particular, glass, metal, metal alloy and/or semiconductor substrates are preferable. Glass and silicon substrates are particularly preferred, but silicon is the most preferred substrate material.
- A method for silvering substrates, in particular the above-mentioned substrates is also another aspect of the present invention. The method preferably comprises the steps of placing the substrate in the electrolyte composition according to the present invention and applying a voltage between an anode and a cathode in electrical contact with the electrolyte composition, wherein the cathode is the substrate.
- Preferably, the current density is about 1.5 A/dm2.
- With an increase of temperature the substrate can be electroplated with an increased current density. Temperatures of 0 to 100° C., particularly of 20 to 70° C. are preferred.
- Preferably, the electrolyte composition is stirred during the galvanization process, to allow homogenous deposition.
- Surprisingly it has been found that the electrolyte compositions according to the present invention are suitable to deposit metals even without current. So in particular embodiments of the method according to the present invention no voltage is applied. In this case for example it is possible to apply a metal layer onto an electrically conductive glass or a sheet brass. For such a method the temperature preferably has to be at least 40° C.
- The following specific embodiments of the present invention do not limit the scope thereof, but are for illustration.
- An electrolyte composition composed of the following components was tested:
-
Silver as silver methane sulfonate 30 g/L Tripotassium citrate monohydrate 40 g/L Potassium hydroxide 65 g/L 5,5-Dimethyl hydantoin 130 g/L - The pH of the composition was 10.3.
- An electrolyte composition composed of the following components was tested:
-
Silver as silver methane sulfonate 30 g/L Tripotassium citrate monohydrate 40 g/L Potassium hydroxide 65 g/L 5,5-Dimethyl hydantoin 130 g/L Tetrasodium iminodisuccinate 10 g/L - The pH of the composition was 10.3.
- The above-mentioned electrolyte according to example 1 of the invention and the electrolyte according to the comparative example were filled into separate beakers, and in each beaker a brass sheet having the dimensions of 10 cm×7 cm was electroplated on one side with non-pulsed direct current for 10 min. Both electrolytes were stirred with a respective stirrer at 400 rpm and the current strength was 0.75 A. Higher current densities could not be achieved with these electrolytes in the beakers.
- After the galvanization process on the brass sheet, which has been treated with the solution according to the present invention, a weight increase of 498 mg was measured, whereas the weight increase in the case of the comparative electrolyte composition without IDSD was only 333 mg.
- In a further test the coating of solar cells with the electrolyte compositions of the comparative example and the example 2 according to the present invention was performed. This test was otherwise conducted in the same way as the first test, except that the electrolyte compositions were stirred with respective stirrers at 210 rpm and a current strength of 150 mA was used over a time period of 7.5 min.
-
-
Silver as silver methane sulfonate 30 g/L Tripotassium citrate monohydrate 40 g/L Potassium hydroxide 65 g/L 5,5-Dimethyl hydantoin 130 g/L Tetrasodium iminodisuccinate 5 g/L - The pH of the composition was 10.3.
- The following specific examples for the deposition of silver onto a solar cell were conducted with the same current density and over the same period of time. The solar cell was of the size of 125×125 mm with 6% of conductive area.
- With the electrolyte composition according to the present invention in the case of a voltage of 0.7 V a weight increase of 353 mg on the solar cell was measured. The current efficiency was 70.5%. The electroplated layer thickness at the contact finger was 11.9 μm.
- In the case of a voltage of 0.59 V with the electrolyte solution of the comparative example a weight increase of 320 mg on the solar cell was measured. The current efficiency was 63%. The electroplated layer thickness at the contact finger was 9 μm.
- Thus it has been shown that, when IDSD is included in the electrolyte compositions with otherwise the same conditions, an improvement of electrolyte efficiency can be achieved. The electroplated layer thickness correlates with the galvanization time. As shown, for the same conditions with respect to current density and time according to the present invention a layer thickness which is increased by more than 30% could be achieved. In the case of intended mean layer thicknesses of about 7 to 8 μm, with the use of the electrolyte composition according to the present invention a considerable advantage in time of much more than 30% can be achieved.
- An electrolyte composition according to the present invention with IDSD as the only complexing agent comprises the following components:
-
Tetrasodium iminodisuccinate (Baypure CX100 200 g/L from Lanxess) Tripotassium citrate monohydrate 40 g/L Potassium hydroxide 65 g/L Silver as silver methane sulfonate 18 g/L Ionogenic wetting agent EA 15-90 Raschig 7 ml/L Methane sulfonic acid (for pH adjustment to 10.0) 10 ml/L - An electrolyte composition according to the present invention with IDSD as the only complexing agent comprises the following components:
-
Tetrasodium iminodisuccinate (Baypure CX100 200 g/L from Lanxess) Sodium methane sulfonate 40 g/L Potassium hydroxide 65 g/L Silver as silver methane sulfonate 18 g/L Ionogenic wetting agent EA 15-90 Raschig 7 ml/L Methane sulfonic acid (pH adjusted to 10.0) 10 ml/L -
-
Silver as silver methane sulfonate 30 g/L Tripotassium citrate monohydrate 0 g/L Potassium hydroxide 65 g/L 5,5-Dimethyl hydantoin 130 g/L - The pH of the composition was 10.3.
-
-
Silver as silver methane sulfonate 30 g/L Tripotassium citrate monohydrate 20 g/L Potassium hydroxide 65 g/L 5,5-Dimethyl hydantoin 130 g/L - The pH of the composition was 10.3.
- In the case of a process temperature of 40° C., the electrolytes were stirred with a stirrer at 130 rpm and a current density of 0.75 A. With an electrolyte solution containing citrate it was possible to deposit 347 mg of silver onto the sheet brass, whereas in the case of an electrolyte solution without citrate only 154 mg of silver was deposited. The voltage of 2.4 V and 4 V, respectively, is a measure for the conductivity of the composition.
- While the invention has been illustrated and described as embodied in an electrolyte composition, it is not intended to be limited to the details shown, since various modifications and changes may be made without departing in any way from the spirit of the present invention.
- Without further analysis, the foregoing will so fully reveal the gist of the present invention that others can, by applying current knowledge, readily adapt it for various applications without omitting features that, from the standpoint of prior art, fairly constitute essential characteristics of the generic or specific aspects of this invention.
- What is claimed is new and is set forth in the following appended claims.
Claims (24)
1. An electrolyte composition for deposition of metals onto a substrate, said electrolyte composition comprising:
at least one metal ion, and
an iminodisuccinate derivative.
2. The electrolyte composition according to claim 1 , wherein the iminodisuccinate derivative comprises a species of the formula (I):
3. The electrolyte composition according to claim 1 , wherein the iminodisuccinate derivative is a salt.
4. The electrolyte composition according to claim 3 , wherein the salt is a sodium salt or a potassium salt.
5. The electrolyte composition according to claim 1 , wherein said at least one metal ion is selected from the group consisting of silver, calcium, magnesium, iron, chromium, cobalt, nickel, copper and aluminium ions.
6. The electrolyte composition according to claim 1 , wherein said at least one metal ion is a silver ion.
7. The electrolyte composition according to claim 1 , containing from 10 g/L to 60 g/L of said at least one metal ion.
8. The electrolyte composition according to claim 1 , wherein the iminodisuccinate derivative is an alkali metal iminodisuccinate.
9. The electrolyte composition according to claim 1 , wherein the iminodisuccinate derivative is a main complexing agent therein and is present in a concentration of 50 g/L to 250 g/L.
10. The electrolyte composition according to claim 9 , wherein the concentration of the iminodisuccinate derivative is from 150 g/L to 225 g/L.
11. The electrolyte composition according to claim 1 , containing another complexing agent besides the iminodisuccinate derivative and wherein the iminosuccinate derivative is contained therein in a concentration of 2 g/L to 40 g/L.
12. The electrolyte composition according to claim 11 , wherein the concentration of the iminodisuccinate derivative is from 5 g/L to 20 g/L.
13. The electrolyte composition according to claim 1 , further comprising a hydantoin in addition to the iminodisuccinate derivative, and wherein said hydantoin is contained therein in a concentration of 50 g/L to 250 g/L.
14. The electrolyte composition according to claim 13 , wherein said concentration of said hydantoin is from 100 g/L to 175 g/L.
15. The electrolyte composition according to claim 1 , further comprising a hydantoin in addition to the iminodisuccinate derivative, and wherein said hydantoin is 5,5-dimethyl hydantoin.
16. The electrolyte composition according to claim 1 , which is free of cyanides.
17. The electrolyte composition according to claim 1 , further comprising a citrate.
18. The electrolyte according to claim 17 , wherein said citrate is present in a concentration of 20 g/L to 75 g/L.
19. The electrolyte according to claim 17 , wherein said citrate is present in a concentration of 30 g/L to 50 g/L.
20. The electrolyte composition according claim 1 , having a pH of between 8 and 12.
21. The electrolyte composition according to claim 20 , wherein said pH is 9.5 to 11.
22. A method of depositing metals on a substrate, said method comprising galvanically depositing said at least one metal from the said electrolyte composition as defined in claim 1 onto the substrate.
23. The method as defined in claim 22 , wherein the substrate is a solar cell.
24. A method of silvering a substrate, said method comprising the steps of:
a) placing the substrate in an electrolyte composition according to claim 1 ; and
b) applying a voltage between an anode and a cathode in electrical contact with the electrolyte composition, wherein the cathode is the substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009029558.5 | 2009-09-17 | ||
| DE102009029558A DE102009029558A1 (en) | 2009-09-17 | 2009-09-17 | electrolyte composition |
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| US20110062030A1 true US20110062030A1 (en) | 2011-03-17 |
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| US12/878,207 Abandoned US20110062030A1 (en) | 2009-09-17 | 2010-09-09 | Electrolyte composition |
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| US (1) | US20110062030A1 (en) |
| EP (1) | EP2309035B1 (en) |
| JP (1) | JP2011102430A (en) |
| KR (1) | KR20110030365A (en) |
| CN (1) | CN102021613B (en) |
| DE (1) | DE102009029558A1 (en) |
| TW (1) | TW201114953A (en) |
Cited By (7)
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|---|---|---|---|---|
| US20100119713A1 (en) * | 2007-05-03 | 2010-05-13 | Atotech Deutschland Gmbh | Process for applying a metal coating to a non-conductive substrate |
| CN106011954A (en) * | 2016-07-25 | 2016-10-12 | 贵州大学 | Cyanide-free copper electro-plating solution, preparation method and using method thereof |
| EP2818242B1 (en) * | 2013-06-28 | 2018-12-05 | Rohm and Haas Electronic Materials LLC | Method for electroless metallization using catalysts containing allantoin |
| WO2020038948A1 (en) | 2018-08-21 | 2020-02-27 | Umicore Galvanotechnik Gmbh | Electrolyte for the cyanide-free deposition of silver |
| DE102019106004A1 (en) * | 2019-03-08 | 2020-09-10 | Umicore Galvanotechnik Gmbh | Additive for the cyanide-free deposition of silver |
| US11246905B2 (en) | 2016-08-15 | 2022-02-15 | President And Fellows Of Harvard College | Treating infections using IdsD from Proteus mirabilis |
| EP4549633A1 (en) | 2023-11-06 | 2025-05-07 | Axon Cable | Cyanide-free silver bath composition and uses thereof |
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| WO2013113810A2 (en) * | 2012-02-01 | 2013-08-08 | Atotech Deutschland Gmbh | Electroless nickel plating bath |
| CN105350037A (en) * | 2015-12-17 | 2016-02-24 | 宏正(福建)化学品有限公司 | A kind of alkaline cyanide-free zinc-nickel alloy plating solution and its electroplating process |
| US20180219257A1 (en) * | 2017-01-25 | 2018-08-02 | Industrial Technology Research Institute | Aluminum-ion battery |
| CN112352789A (en) * | 2020-11-18 | 2021-02-12 | 上海聚治新材料科技有限公司 | Preparation method of silver chloride ion symbiotic disinfection concentrated solution |
| CN113818056B (en) * | 2021-09-18 | 2023-05-26 | 中国航发北京航空材料研究院 | Iminodisuccinic acid cyanide-free silver plating process additive and application method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100119713A1 (en) * | 2007-05-03 | 2010-05-13 | Atotech Deutschland Gmbh | Process for applying a metal coating to a non-conductive substrate |
| US8152914B2 (en) * | 2007-05-03 | 2012-04-10 | Atotech Deutschland Gmbh | Process for applying a metal coating to a non-conductive substrate |
| EP2818242B1 (en) * | 2013-06-28 | 2018-12-05 | Rohm and Haas Electronic Materials LLC | Method for electroless metallization using catalysts containing allantoin |
| CN106011954A (en) * | 2016-07-25 | 2016-10-12 | 贵州大学 | Cyanide-free copper electro-plating solution, preparation method and using method thereof |
| US11246905B2 (en) | 2016-08-15 | 2022-02-15 | President And Fellows Of Harvard College | Treating infections using IdsD from Proteus mirabilis |
| WO2020038948A1 (en) | 2018-08-21 | 2020-02-27 | Umicore Galvanotechnik Gmbh | Electrolyte for the cyanide-free deposition of silver |
| US11846036B2 (en) | 2018-08-21 | 2023-12-19 | Umicore Galvanotechnik Gmbh | Electrolyte for the cyanide-free deposition of silver |
| DE102019106004A1 (en) * | 2019-03-08 | 2020-09-10 | Umicore Galvanotechnik Gmbh | Additive for the cyanide-free deposition of silver |
| DE102019106004B4 (en) | 2019-03-08 | 2023-11-30 | Umicore Galvanotechnik Gmbh | Additive for the cyanide-free deposition of silver |
| EP4549633A1 (en) | 2023-11-06 | 2025-05-07 | Axon Cable | Cyanide-free silver bath composition and uses thereof |
| FR3155008A1 (en) | 2023-11-06 | 2025-05-09 | Axon Cable | Cyanide-free silver plating bath composition and its uses |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102009029558A1 (en) | 2011-03-31 |
| KR20110030365A (en) | 2011-03-23 |
| EP2309035B1 (en) | 2014-12-10 |
| JP2011102430A (en) | 2011-05-26 |
| TW201114953A (en) | 2011-05-01 |
| EP2309035A1 (en) | 2011-04-13 |
| CN102021613B (en) | 2015-09-30 |
| CN102021613A (en) | 2011-04-20 |
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