Ye et al., 2022 - Google Patents
Synthesis of Bi–Pb–Sn–Cd solder particles for joining Ag-plated PZT ceramics at 100 CYe et al., 2022
- Document ID
- 735368134903877458
- Author
- Ye L
- Liu Y
- He H
- Zhang M
- Zhu Q
- Sun X
- Li X
- Publication year
- Publication venue
- Journal of Materials Science: Materials in Electronics
External Links
Snippet
The rapid development of current multifunctional and flexible electronics has posed increased demand for low-temperature solder materials. The joining of Ag-plated PZT ceramics at a low soldering temperature of 100° C using Bi–Pb–Sn–Cd solder paste was …
- 229910000679 solder 0 title abstract description 100
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0103—Zinc [Zn]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
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