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IEEE Computer
Special Issue on Power- and Temperature-Aware Computing

Mircea R. Stan
University of Virginia
ECE Department, Thornton Hall, E209
351 McCormick Road, P. O. Box 400743
Charlottesville, VA 22904-4743
phone/fax: (434) 924 3503 / (434) 924 8818
email: mircea@virginia.edu
http://www.ece.Virginia.EDU/~mrs8n/
Kevin Skadron
University of Virginia
CS Department, Olsson Hall 215
151 Engineer's Way, P. O. Box 400740
Charlottesville, VA 22904-4740
phone/fax: (434) 982-2042 / (434) 982-2214
email: skadron@virginia.edu
http://www.cs.Virginia.EDU/~skadron/

Call for Papers

Despite the continuous scaling of processes and supply voltages, and the increased awareness of low-power issues in the computer design and design automation communities, power consumption by state-of-the-art ICs has continually increased in recent years. This apparent paradox results from the increased density enabled by process scaling and a multilayer interconnect, coupled with increases in area and especially in clock frequency driven by an insatiable market for high performance systems. Temperature is also on the verge of becoming a first-class design constraint along with the more traditional constraints of cost, performance, and power. The increasing importance of thermal effects stems from an exponential increase in on-chip power densities, with today's processors having power densities greater than a hot plate and within an order of magnitude of a rocket nozzle. An integrated and coordinated set of design techniques is required in order to successfully manage growing power and thermal demands while still meeting performance, reliability, and cost targets.

Research, characterization, and survery papers are requested for the December 2003 issue of IEEE Computer. This issue will be devoted to the subjects of Power-Aware and Temperature-Aware Computing, including run-time and compile-time techniques at the circuit, architecture, and system levels for improving battery life, current delivery, and operating temperature; and integrated concerns of reliability and quality of service. An integrated and coordinated set of design techniques is required in order to successfully manage growing power and thermal demands while still meeting performance, reliability, and cost targets. Example topics of interest include circuit, architecture, and system techniques for regulating static and dynamic power; improved models for power, current-delivery, and thermal aspects; compiler-hardware and OS-hardware cooperation, methods for optimizing energy efficiency subject to real-time or quality-of-service requirements, and active-cooling techniques.

Send inquiries to Guest Editors Mircea R. Stan, (mircea@virginia.edu) and Kevin Skadron, (skadron@virginia.edu). Submit pdf documents by June 1 to computer-ma@computer.org and specify the special issue of Power-Aware and Temperature-Aware Computing.