unfoamとは 意味・読み方・使い方

An unfoam molded body P_1 is arranged in a cavity of both divided dies 1a, 1b and a mold bundle is carried out.例文帳に追加

両分割金型１ａ、１ｂのキャビティ内に未発泡成形体Ｐ_1 を配置して型締めする。 - 特許庁

The method of manufacturing a semiconductor device comprises a substrate positioning step of positioning a substrate having a semiconductor element mounted thereon in a molding die and an unfoam positioning step of locating an unfoam which starts its foaming at a predetermined temperature at a predetermined position on the substrate.例文帳に追加

半導体素子を搭載した基板を成形金型内に配置する基板配置工程と、所定温度で発泡を開始する未発泡体を該基板の所定位置に配置する未発泡体配置工程とを備える。 - 特許庁

To manufacture a multilayer foam molded body wherein an outer layer is a foam layer in which micro foaming cells are dispersed uniformly, and an inner layer is an unfoam layer.例文帳に追加

微細発泡セルが均一に分散された発泡体層を外層とし、未発泡体層を内層とする多層発泡成形体を製造できるようにする。 - 特許庁

By maintaining a pressure inside the cavity at a supercritical pressure or more, the desired region forming the foam layer of the unfoam molded body P_1 is impregnated with the supercritical fluid (gas for foaming).例文帳に追加

キャビティ内の圧力を臨界圧力以上に維持することにより、超臨界流体（発泡用ガス）を未発泡成形体Ｐ_1 の発泡体層を形成する所定領域に含浸させる。 - 特許庁

The method further comprises a thermoplastic injecting step of injecting a thermoplastic resin having a temperature not lower than the predetermined temperature into the molding die after the substrate positioning step and the unfoam positioning step.例文帳に追加

さらに該基板配置工程および該未発泡体配置工程の後に、該成形金型内に該所定温度以上の熱可塑性樹脂を注入する熱可塑性樹脂注入工程を備える。 - 特許庁