addition for plating solutionとは 意味・読み方・使い方

The addition agent for the electroless copper-plating solution employs a compound having two or more of unit structures expressed by the general formula (1) in the molecule, wherein R represents a hydrogen atom or an aliphatic group; and Y represents an aliphatic group having an acidic group of less than 6 by pKa as a substituent.例文帳に追加

下記一般式（１）で示される単位構造を分子内に２つ以上有することを特徴とする化合物を無電解銅めっき液の添加剤として用いる。 - 特許庁

To provide a method for manufacturing an abrasive grain-fixed wire in which, without any addition of a leveling agent to a plating solution, the adhesive strength of abrasive grains to a wire body is enhanced, and also, the machining performance or cutting performance by the abrasive grains is also improved.例文帳に追加

メッキ液中にレベリング剤を添加することなく、砥粒のワイヤ本体への固着強度の向上及び砥粒による切削性能又は切断性能の向上を同時に図り得る固定砥粒ワイヤの製造方法を提供する。 - 特許庁