dissipation coefficientとは 意味・読み方・使い方

Thus the interior anisotropy of the plate member after rolled is removed so that the member has a suitable thermal expansion coefficient and the warpage of a resulting metallic plate for heat dissipation is reduced.例文帳に追加

このため、圧延後の板部材内部の異方性が解消され、熱膨張率が適度なものとなり、放熱用金属板の反り量が低減される。 - 特許庁

To provide a heat dissipation plate for a semiconductor device that achieves the high thermal conductance efficiency in a simple configuration and allows adjustment of the thermal expansion coefficient.例文帳に追加

この発明は、構成簡易にして、高効率な熱伝導効率を実現し得、且つ、熱膨張係数の調整を実現し得るようにすることにある。 - 特許庁

To provide a heat dissipation material having a thermal expansion coefficient lower than that of conventional copper alloys and also having high electric conductivity and also to provide its manufacturing method.例文帳に追加

従来の銅合金よりも低い熱膨張係数を有し、且つ高導電率を有する放熱材料及びその製造方法を提供する。 - 特許庁

To provide a thin heat spreader having a thermal expansion characteristics similar to the thermal expansion coefficient of a silicon chip and an excellent heat-dissipation characteristics for improved connection reliability.例文帳に追加

接続信頼性を向上可能なシリコンチップの熱膨張係数に近似した熱膨張特性と優れた放熱特性を有する薄型のヒートスプレッダを提供する。 - 特許庁

To provide a resin composite composition having a glass transition point (Tg) of about 200°C or more, a low coefficient of thermal expansion, and excellent heat dissipation, and a semiconductor sealing material and a substrate using the same.例文帳に追加

ガラス転移点（Ｔｇ）が約２００℃以上で、熱膨張率が小さく、放熱性に優れる樹脂複合組成物およびこれを用いた半導体封止材ならびに基板を提供する。 - 特許庁

To provide a preferable resin composition for a circuit board as a circuit board material of electronic equipment due to a low linear expansion coefficient, a low specific permittivity, a low dielectric dissipation factor, a high heat resistance, and high mechanical strengths.例文帳に追加

低線膨張係数、低比誘電率、低誘電正接、高耐熱性、高機械的強度を兼備し、電子機器の回路基板材料として好適な回路基板用樹脂組成物を得る。 - 特許庁

In the conductive rubber roller 10 having a conductive rubber layer 1 as its outermost layer, the surface layer of the rubber layer is an oxidation film, a dielectric dissipation facto is 0.1 to 1.5 and a friction coefficient is 0.1 to 1.5.例文帳に追加

導電性ゴム層１を最外層に備えた導電性ゴムローラ１０においてゴム層の表層部分を酸化膜とし、かつ、誘電正接を０．１〜１．５、摩擦係数を０．１〜１．５としている。 - 特許庁

To provide a metal-coated carbon material excellent not only in high heat conductivity but also in rigidity and surface smoothness and reducing thermal expansion coefficient, and a heat dissipation substrate using the metal-coated carbon material.例文帳に追加

高熱伝導性だけではなく、剛性、表面平滑性に優れ、かつ熱膨張係数が小さい金属被覆炭素材料、および該金属被覆炭素材料を用いた放熱基板を提供する。 - 特許庁