Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
  • H10P90/12—Preparing bulk and homogeneous wafers
  • H10P90/128—Preparing bulk and homogeneous wafers by edge treatment, e.g. chamfering
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
  • B24B37/00—Lapping machines or devices; Accessories
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
  • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
  • H10P90/12—Preparing bulk and homogeneous wafers
  • H10P90/123—Preparing bulk and homogeneous wafers by grinding or lapping
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
  • H10P90/12—Preparing bulk and homogeneous wafers
  • H10P90/124—Preparing bulk and homogeneous wafers by processing the backside of the wafers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
  • H10P90/12—Preparing bulk and homogeneous wafers
  • H10P90/126—Preparing bulk and homogeneous wafers by chemical etching
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
  • H10P90/12—Preparing bulk and homogeneous wafers
  • H10P90/129—Preparing bulk and homogeneous wafers by polishing

Landscapes

• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Mechanical Treatment Of Semiconductor (AREA)
• Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
• Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
• Chemical & Material Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• General Chemical & Material Sciences (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=63523108

Family Applications (1)

Country Status (8)

Families Citing this family (3)

Family Cites Families (11)

• 2017
  • 2017-03-13 JP JP2017047448A patent/JP6610587B2/en active Active
• 2018
  • 2018-02-27 SG SG11201908162R patent/SG11201908162RA/en unknown
  • 2018-02-27 DE DE112018000935.1T patent/DE112018000935B4/en active Active
  • 2018-02-27 CN CN201880016747.2A patent/CN110383427B/en active Active
  • 2018-02-27 KR KR1020197026388A patent/KR102454449B1/en active Active
  • 2018-02-27 WO PCT/JP2018/007083 patent/WO2018168426A1/en not_active Ceased
  • 2018-02-27 US US16/487,471 patent/US11361959B2/en active Active
  • 2018-03-05 TW TW107107171A patent/TWI736746B/en active

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