TW201612141A - Alkali-soluble resin, photosensitive resin composition, and use thereof - Google Patents
Alkali-soluble resin, photosensitive resin composition, and use thereofInfo
- Publication number
- TW201612141A TW201612141A TW104131352A TW104131352A TW201612141A TW 201612141 A TW201612141 A TW 201612141A TW 104131352 A TW104131352 A TW 104131352A TW 104131352 A TW104131352 A TW 104131352A TW 201612141 A TW201612141 A TW 201612141A
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- alkali
- soluble resin
- integer
- solvent
- Prior art date
Links
- 239000011347 resin Substances 0.000 title abstract 2
- 229920005989 resin Polymers 0.000 title abstract 2
- 239000011342 resin composition Substances 0.000 title 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 abstract 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract 2
- 125000000217 alkyl group Chemical group 0.000 abstract 2
- 125000004432 carbon atom Chemical group C* 0.000 abstract 2
- 229920001577 copolymer Polymers 0.000 abstract 2
- 239000002904 solvent Substances 0.000 abstract 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 abstract 1
- 125000005370 alkoxysilyl group Chemical group 0.000 abstract 1
- 229910021417 amorphous silicon Inorganic materials 0.000 abstract 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 abstract 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
- 239000000178 monomer Substances 0.000 abstract 1
- 150000003138 primary alcohols Chemical class 0.000 abstract 1
- 125000005504 styryl group Chemical group 0.000 abstract 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
This alkali-soluble resin comprises a copolymer dissolved in a solvent, the copolymer including a polymeric unit containing a carboxyl group based on an unsaturated carboxylic acid, etc. and a polymeric unit containing an alkoxysilyl group based on a monomer of formula (1) below. The solvent is a specific alcohol having a linear or branched chain alkyl group having 4 or 5 carbon atoms. The specific alcohol is preferably a primary alcohol with an alkyl group having 4 carbon atoms, and more preferably 1-butanol. X-(CH2)a-Si(OR)b(CH3)3-b (1) In formula (1), X is a vinyl group, styryl group, or (meth)acryloyl group, R is a methyl group or ethyl group, a is an integer of 0-3, and b is an integer of 1-3.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014196958A JP6458236B2 (en) | 2014-09-26 | 2014-09-26 | Alkali-soluble resin, photosensitive resin composition and use thereof |
| JP??2014-196958 | 2014-09-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201612141A true TW201612141A (en) | 2016-04-01 |
| TWI669287B TWI669287B (en) | 2019-08-21 |
Family
ID=55581224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104131352A TWI669287B (en) | 2014-09-26 | 2015-09-23 | Alkali-soluble resin, photosensitive resin composition and use thereof |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6458236B2 (en) |
| KR (1) | KR20170063762A (en) |
| CN (1) | CN106715598B (en) |
| TW (1) | TWI669287B (en) |
| WO (1) | WO2016047703A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102139060B1 (en) * | 2015-09-30 | 2020-07-29 | 후지필름 가부시키가이샤 | Resist composition, resist film using the same, method for forming pattern, and method for manufacturing electronic device |
| JP7047652B2 (en) * | 2017-09-28 | 2022-04-05 | Jsr株式会社 | Radiation-sensitive resin compositions and their uses |
| KR102658153B1 (en) * | 2017-09-28 | 2024-04-16 | 제이에스알 가부시끼가이샤 | Radiation-sensitive resin composition and use thereof |
| JP7035889B2 (en) * | 2017-09-28 | 2022-03-15 | Jsr株式会社 | Radiation-sensitive resin compositions and their uses |
| JP7392719B2 (en) * | 2019-06-25 | 2023-12-06 | 株式会社レゾナック | Photosensitive resin composition, cured resin film, and image display element |
| TWI890801B (en) * | 2020-06-03 | 2025-07-21 | 日商富士軟片股份有限公司 | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device |
| EP4577606A1 (en) | 2022-08-26 | 2025-07-02 | Merck Patent GmbH | Composition |
| CN119768736A (en) | 2022-08-26 | 2025-04-04 | 默克专利股份有限公司 | Composition |
| CN117666282B (en) * | 2023-11-27 | 2025-10-03 | 深圳幻臻技术有限公司 | Photopolymer and film thereof, film preparation method, and printing substrate |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4526856A (en) * | 1983-05-23 | 1985-07-02 | Allied Corporation | Low striation positive diazoketone resist composition with cyclic ketone(s) and aliphatic alcohol as solvents |
| JPS60206802A (en) * | 1984-03-30 | 1985-10-18 | Dainippon Ink & Chem Inc | Production of vinyl polymer having silyl group of improved hydrolyzability |
| JPS60206812A (en) * | 1984-03-31 | 1985-10-18 | Dainippon Ink & Chem Inc | Room temperature-setting resin composition containing vinyl polymer having silyl group of improved hydrolyzability |
| JPH02233709A (en) * | 1989-03-08 | 1990-09-17 | Kansai Paint Co Ltd | Resin, organic liquid, non-aqueous dispersion, aqueous liquid, curable composition and coating composition |
| KR101068111B1 (en) * | 2005-01-27 | 2011-09-27 | 주식회사 동진쎄미켐 | Photosensitive resin composition |
| JP2006337567A (en) * | 2005-05-31 | 2006-12-14 | Sekisui Chem Co Ltd | Photo-curable resin composition for photoresist, column spacer, and liquid crystal display element |
| JP5135820B2 (en) * | 2007-02-20 | 2013-02-06 | Ｊｓｒ株式会社 | Alkali-soluble polymer, radiation-sensitive composition for forming colored layer, color filter, and liquid crystal display device |
| JP5108480B2 (en) * | 2007-11-28 | 2012-12-26 | 東京応化工業株式会社 | Photosensitive resin composition for interlayer insulation film |
| JP5375412B2 (en) * | 2009-07-30 | 2013-12-25 | Ｊｓｒ株式会社 | Resin composition for forming fine pattern and method for forming fine pattern |
| JP5413666B2 (en) * | 2009-11-20 | 2014-02-12 | Ｄｉｃ株式会社 | Composite resin composition, primer coating agent containing the same, and laminate |
| TW201310166A (en) * | 2011-08-31 | 2013-03-01 | Everlight Chem Ind Corp | Resin and composition thereof for manufacture insulator layer and over coat |
| JP5935297B2 (en) * | 2011-11-09 | 2016-06-15 | Jnc株式会社 | Positive photosensitive composition |
| JP6218393B2 (en) * | 2013-02-28 | 2017-10-25 | 東京応化工業株式会社 | Photosensitive resin composition for interlayer insulation film |
-
2014
- 2014-09-26 JP JP2014196958A patent/JP6458236B2/en active Active
-
2015
- 2015-09-23 TW TW104131352A patent/TWI669287B/en active
- 2015-09-24 KR KR1020177010773A patent/KR20170063762A/en not_active Withdrawn
- 2015-09-24 CN CN201580051227.1A patent/CN106715598B/en active Active
- 2015-09-24 WO PCT/JP2015/076970 patent/WO2016047703A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| CN106715598A (en) | 2017-05-24 |
| TWI669287B (en) | 2019-08-21 |
| JP2016069400A (en) | 2016-05-09 |
| WO2016047703A1 (en) | 2016-03-31 |
| JP6458236B2 (en) | 2019-01-30 |
| CN106715598B (en) | 2019-07-19 |
| KR20170063762A (en) | 2017-06-08 |
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