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USD674757S1 - Package carrier of light emitting diode - Google Patents
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USD674757S1 - Package carrier of light emitting diode - Google Patents

Package carrier of light emitting diode Download PDF

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Publication number
USD674757S1
USD674757S1 US29/410,013 US201229410013F USD674757S US D674757 S1 USD674757 S1 US D674757S1 US 201229410013 F US201229410013 F US 201229410013F US D674757 S USD674757 S US D674757S
Authority
US
United States
Prior art keywords
light emitting
emitting diode
package carrier
package
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/410,013
Inventor
Chia-Hao Wu
Chen-Hsiu Lin
Ming-Kun Weng
Yi-Chien Chang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lite On Technology Corp
Original Assignee
Silitek Electronic Guangzhou Co Ltd
Lite On Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silitek Electronic Guangzhou Co Ltd, Lite On Technology Corp filed Critical Silitek Electronic Guangzhou Co Ltd
Assigned to SILITEK ELECTRONIC (GUANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORP. reassignment SILITEK ELECTRONIC (GUANGZHOU) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, YI-CHIEN, LIN, CHEN-HSIU, WENG, MING-KUN, WU, CHIA-HAO
Application granted granted Critical
Publication of USD674757S1 publication Critical patent/USD674757S1/en
Assigned to LITE-ON ELECTRONICS (GUANGZHOU) LIMITED reassignment LITE-ON ELECTRONICS (GUANGZHOU) LIMITED CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of package carrier of light emitting diode showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The portions shown in dashed lines are for illustrative purposes only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for package carrier of light emitting diode, as shown and described.
US29/410,013 2011-10-31 2012-01-03 Package carrier of light emitting diode Active USD674757S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201130403880 2011-10-31
CN201130403880 2011-10-31

Publications (1)

Publication Number Publication Date
USD674757S1 true USD674757S1 (en) 2013-01-22

Family

ID=47521997

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/410,013 Active USD674757S1 (en) 2011-10-31 2012-01-03 Package carrier of light emitting diode

Country Status (1)

Country Link
US (1) USD674757S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD718258S1 (en) * 2012-09-02 2014-11-25 Cree, Inc. LED package
USD762596S1 (en) * 2015-04-02 2016-08-02 Genesis Photonics Inc. Light emitting diode package substrate

Citations (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020190262A1 (en) * 2001-04-09 2002-12-19 Koichi Nitta Light emitting device
US6686609B1 (en) * 2002-10-01 2004-02-03 Ultrastar Limited Package structure of surface mounting led and method of manufacturing the same
US6858870B2 (en) * 2003-06-10 2005-02-22 Galaxy Pcb Co., Ltd. Multi-chip light emitting diode package
US7067848B1 (en) * 2005-03-21 2006-06-27 Wen-Jen Lee High intensity LED
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD615504S1 (en) * 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US20100117099A1 (en) * 2008-11-07 2010-05-13 Jacob Chi Wing Leung Multi-chip light emitting diode modules
US20100123144A1 (en) * 2008-11-20 2010-05-20 Everlight Electronics Co., Ltd. Circuit structure of package carrier and multi-chip package
US20100127283A1 (en) * 2008-10-24 2010-05-27 Van De Ven Antony P Array layout for color mixing
US20100140633A1 (en) * 2009-02-19 2010-06-10 David Todd Emerson Methods for Combining Light Emitting Devices in a Package and Packages Including Combined Light Emitting Devices
US20100140634A1 (en) * 2009-11-09 2010-06-10 Cree Led Lighting Solutions, Inc. Solid state emitter package including red and blue emitters
USD622683S1 (en) * 2009-04-08 2010-08-31 Nichia Corporation Light emitting diode module
US20100252851A1 (en) * 2007-10-31 2010-10-07 Cree, Inc. Led package with increased feature sizes
US7821023B2 (en) * 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US20110006317A1 (en) * 2007-09-25 2011-01-13 Cree, Inc. Single multi-chip lamp sources and related methods
USD631020S1 (en) * 2010-04-29 2011-01-18 Edison Opto Corporation LED package
USD631019S1 (en) * 2010-04-21 2011-01-18 Epistar Corporation Light emitting diode packaging array
US20110062482A1 (en) * 2010-01-20 2011-03-17 Bridgelux, Inc. Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces
US7960744B2 (en) * 2007-06-29 2011-06-14 Seoul Semiconductor Co., Ltd. Multi-light emitting diode package
USD644190S1 (en) * 2010-09-29 2011-08-30 Kabushiki Kaisha Toshiba Light-emitting diode
US20110210346A1 (en) * 2010-02-26 2011-09-01 Silitek Electronic (Guangzhou) Co., Ltd. Led module
USD645416S1 (en) * 2009-12-22 2011-09-20 Panasonic Corporation Light-emitting diode
US20110248289A1 (en) * 2010-04-09 2011-10-13 Everlight Electronics Co., Ltd. Light emitting diode package, lighting device and light emitting diode package substrate
USD649944S1 (en) * 2010-07-07 2011-12-06 Panasonic Corporation Light emitting diode
USD649943S1 (en) * 2010-07-07 2011-12-06 Panasonic Corporation Light emitting diode
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
US8124988B2 (en) * 2008-05-28 2012-02-28 Semisilicon Technology Corp. Light emitting diode lamp package structure and assembly thereof
USD656906S1 (en) * 2008-01-10 2012-04-03 Cree Hong Kong Limited LED package
USD658139S1 (en) * 2011-01-31 2012-04-24 Cree, Inc. High-density emitter package
USD660257S1 (en) * 2011-01-31 2012-05-22 Cree, Inc. Emitter package
USD660258S1 (en) * 2011-05-04 2012-05-22 Epistar Corporation Light emitting diode
US20120138967A1 (en) * 2010-12-07 2012-06-07 Kabushiki Kaisha Toshiba Led package and method for manufacturing the same
US20120199852A1 (en) * 2011-02-04 2012-08-09 Cree, Inc. Light-emitting diode component

Patent Citations (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020190262A1 (en) * 2001-04-09 2002-12-19 Koichi Nitta Light emitting device
US6686609B1 (en) * 2002-10-01 2004-02-03 Ultrastar Limited Package structure of surface mounting led and method of manufacturing the same
US6858870B2 (en) * 2003-06-10 2005-02-22 Galaxy Pcb Co., Ltd. Multi-chip light emitting diode package
US7821023B2 (en) * 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US7067848B1 (en) * 2005-03-21 2006-06-27 Wen-Jen Lee High intensity LED
US7960744B2 (en) * 2007-06-29 2011-06-14 Seoul Semiconductor Co., Ltd. Multi-light emitting diode package
US20110006317A1 (en) * 2007-09-25 2011-01-13 Cree, Inc. Single multi-chip lamp sources and related methods
USD615504S1 (en) * 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
US20100252851A1 (en) * 2007-10-31 2010-10-07 Cree, Inc. Led package with increased feature sizes
USD656906S1 (en) * 2008-01-10 2012-04-03 Cree Hong Kong Limited LED package
US8124988B2 (en) * 2008-05-28 2012-02-28 Semisilicon Technology Corp. Light emitting diode lamp package structure and assembly thereof
US20100127283A1 (en) * 2008-10-24 2010-05-27 Van De Ven Antony P Array layout for color mixing
US20100117099A1 (en) * 2008-11-07 2010-05-13 Jacob Chi Wing Leung Multi-chip light emitting diode modules
US20100123144A1 (en) * 2008-11-20 2010-05-20 Everlight Electronics Co., Ltd. Circuit structure of package carrier and multi-chip package
US20100140633A1 (en) * 2009-02-19 2010-06-10 David Todd Emerson Methods for Combining Light Emitting Devices in a Package and Packages Including Combined Light Emitting Devices
USD628169S1 (en) * 2009-04-08 2010-11-30 Nichia Corporation Light emitting diode module
USD622683S1 (en) * 2009-04-08 2010-08-31 Nichia Corporation Light emitting diode module
US20100140634A1 (en) * 2009-11-09 2010-06-10 Cree Led Lighting Solutions, Inc. Solid state emitter package including red and blue emitters
USD645416S1 (en) * 2009-12-22 2011-09-20 Panasonic Corporation Light-emitting diode
US20110062482A1 (en) * 2010-01-20 2011-03-17 Bridgelux, Inc. Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces
US20110210346A1 (en) * 2010-02-26 2011-09-01 Silitek Electronic (Guangzhou) Co., Ltd. Led module
US20110248289A1 (en) * 2010-04-09 2011-10-13 Everlight Electronics Co., Ltd. Light emitting diode package, lighting device and light emitting diode package substrate
USD631019S1 (en) * 2010-04-21 2011-01-18 Epistar Corporation Light emitting diode packaging array
USD631020S1 (en) * 2010-04-29 2011-01-18 Edison Opto Corporation LED package
USD649943S1 (en) * 2010-07-07 2011-12-06 Panasonic Corporation Light emitting diode
USD649944S1 (en) * 2010-07-07 2011-12-06 Panasonic Corporation Light emitting diode
USD644190S1 (en) * 2010-09-29 2011-08-30 Kabushiki Kaisha Toshiba Light-emitting diode
US20120138967A1 (en) * 2010-12-07 2012-06-07 Kabushiki Kaisha Toshiba Led package and method for manufacturing the same
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
USD658139S1 (en) * 2011-01-31 2012-04-24 Cree, Inc. High-density emitter package
USD660257S1 (en) * 2011-01-31 2012-05-22 Cree, Inc. Emitter package
US20120199852A1 (en) * 2011-02-04 2012-08-09 Cree, Inc. Light-emitting diode component
USD660258S1 (en) * 2011-05-04 2012-05-22 Epistar Corporation Light emitting diode

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD718258S1 (en) * 2012-09-02 2014-11-25 Cree, Inc. LED package
USD762596S1 (en) * 2015-04-02 2016-08-02 Genesis Photonics Inc. Light emitting diode package substrate

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