WO2026014752A1 - Electronic device including conductive portion - Google Patents

Abstract

The present disclosure relates to an electronic device. The electronic device according to an embodiment of the present disclosure comprise: a display; a rear cover spaced apart from the display in a first direction; a battery disposed between the display and the rear cover; a support including a support portion on which the battery is disposed and a conductive portion including a metal material; and a sealer disposed between the rear cover and the support, wherein the conductive portion may include a segment region overlapping the sealer in the first direction.

Description

Electronic devices containing conductive parts

Various embodiments of the present disclosure relate to electronic devices, for example, electronic devices including conductive portions.

Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. Recent electronic devices are being developed to enable portability and communication.

Electronic devices can refer to devices that perform specific functions based on their embedded programs, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio/video devices, desktop/laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video.

As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile terminal, can now incorporate a variety of functions. For example, in addition to communication functions, entertainment functions like gaming, multimedia functions like music and video playback, communication and security functions like mobile banking, and even calendar management and electronic wallet functions are being integrated into a single electronic device. These electronic devices are also becoming smaller and more portable for users.

The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

An electronic device according to one embodiment of the present disclosure includes a display; a rear cover spaced apart from the display in a first direction; a battery disposed between the display and the rear cover; a support including a support portion on which the battery is disposed and a conductive portion including a metal material; and a sealer disposed between the rear cover and the support, wherein the conductive portion may include a segmented area overlapping the sealer in the first direction.

A method for manufacturing an electronic device according to one embodiment of the present disclosure may include: arranging a support including a first conductive portion and a second conductive portion connected through a bridge; joining a non-conductive material to the support; performing anodizing on the surface of the support and the non-conductive material; and cutting a portion of the support and the non-conductive material on which the anodizing has been performed to form a segmented area.

The above-described aspects or other aspects, configurations and/or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

FIG. 2 is a front view, a side view, and a rear view of an unfolded state of an electronic device according to one embodiment of the present disclosure.

FIG. 3 is a front view, a side view, and a rear view of a folded state of an electronic device according to an embodiment of the present disclosure.

FIG. 4 is an exploded perspective view of an electronic device in an unfolded state according to one embodiment of the present disclosure.

FIG. 5 is a diagram of the internal structure of a portion of a housing according to one embodiment of the present disclosure.

FIG. 6 is a part of a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

FIG. 7 is a portion of a housing according to one embodiment of the present disclosure.

FIG. 8 is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure.

FIG. 9 is a part of an electronic device according to one embodiment of the present disclosure.

FIG. 10 is a drawing illustrating a method for manufacturing an electronic device according to one embodiment of the present disclosure.

FIG. 11 is a part of a housing in a manufacturing process of an electronic device according to one embodiment of the present disclosure.

FIG. 12 is a part of a cross-sectional view of a housing in a manufacturing process of an electronic device according to one embodiment of the present disclosure.

FIG. 13 is a part of a housing in a manufacturing process of an electronic device according to one embodiment of the present disclosure.

FIG. 14 is a part of a cross-sectional view of a housing in a manufacturing process of an electronic device according to one embodiment of the present disclosure.

FIG. 15 is a part of a housing in a manufacturing process of an electronic device according to one embodiment of the present disclosure.

FIG. 16 is a part of a housing in a manufacturing process of an electronic device according to one embodiment of the present disclosure.

FIG. 17 is a part of a housing in a manufacturing process of an electronic device according to one embodiment of the present disclosure.

FIG. 18 is a part of a cross-sectional view of a housing in a manufacturing process of an electronic device according to one embodiment of the present disclosure.

FIG. 19 is a part of a cross-sectional view of a housing in a manufacturing process of an electronic device according to one embodiment of the present disclosure.

FIG. 20 is a part of a housing in a manufacturing process of an electronic device according to one embodiment of the present disclosure.

FIG. 21 is a part of a housing in a manufacturing process of an electronic device according to one embodiment of the present disclosure.

FIG. 22 is a drawing illustrating processing of a housing in a manufacturing process of an electronic device according to one embodiment of the present disclosure.

FIG. 23 is a part of an electronic device according to one embodiment of the present disclosure.

FIG. 24 is a drawing illustrating a manufacturing process of an electronic device according to one embodiment of the present disclosure.

FIG. 25 is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure.

Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and/or structures.

The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described in this disclosure may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include a plurality of artificial neural network layers. The artificial neural network can be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model can additionally or alternatively include a software structure.

The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and/or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199). The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, ‘non-transitory’ simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

FIG. 2 illustrates a front view, a side view, and a rear view of an electronic device (101) in an unfolded state according to one embodiment of the present disclosure. FIG. 3 illustrates a front view, a side view, and a rear view of an electronic device (101) in a folded state according to one embodiment of the present disclosure.

Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment may include a first housing (210), a second housing (220), a flexible or foldable display (230) (hereinafter, simply referred to as “the first display (230)”) disposed in the first housing (210) and the second housing (220) (e.g., the display module (160) of FIG. 1), and a hinge cover (260). The electronic device (101) may include a housing (201). The housing (201) may include a first housing (210) and a second housing (220).

According to one embodiment, a surface on which the first display (230) is disposed may be defined as a front surface of the electronic device (101). The front surface of the electronic device (101) may be formed by a front plate (e.g., a glass plate or a polymer plate including various coating layers) having at least a portion that is substantially transparent. In addition, a surface opposite to the front surface may be defined as a rear surface of the electronic device (101). The rear surface of the electronic device (101) may be formed by a substantially opaque rear plate (hereinafter referred to as a “rear cover”). The rear cover may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. In addition, a surface surrounding a space between the front surface and the rear surface may be defined as a side surface of the electronic device (101). The side surface may be formed by a side bezel structure (or “side member”) that is coupled to the front plate and the rear cover and includes a metal and/or a polymer. In some embodiments, the rear cover and side bezel structures may be formed integrally and include the same material (e.g., a metal material such as aluminum).

The electronic device (101) may include at least one of a first display (230), an audio module (241, 243, 245), a sensor module (255), a camera module (253), a key input device (211, 212, 213), and a connector hole (214). According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., a key input device (211, 212, 213)) or additionally include another component (e.g., a light-emitting element).

According to one embodiment of the present disclosure, the first display (230) may be a display in which at least a portion of the display area can be transformed into a flat or curved surface. According to one embodiment, the first display (230) may include a folding area (231c), a first area (231a) disposed on one side (e.g., the upper side of the folding area (231c) illustrated in FIG. 2) with respect to the folding area (231c), and a second area (231b) disposed on the other side (e.g., the lower side of the folding area (231c) illustrated in FIG. 2). However, the division of the areas of the first display (230) illustrated in FIG. 2 is exemplary, and the first display (230) may be divided into a plurality of areas (e.g., four or more or two) depending on the structure or function. For example, in the embodiment illustrated in FIG. 2, the areas of the first display (230) may be divided by a folding area (231c) or a folding axis (A). According to one embodiment, the first display (230) may also be divided by areas based on another folding area (231c) or another folding axis (e.g., a folding axis perpendicular to the folding axis (A)). The first area (231a) may be arranged in the first housing (210). The second area (231b) may be arranged in the second housing (220).

According to one embodiment of the present disclosure, a microphone hole (241) may be arranged inside a microphone for acquiring external sound, and in some embodiments, a plurality of microphones may be arranged to detect the direction of the sound.

According to one embodiment of the present disclosure, the speaker holes (243, 245) may include an external speaker hole (243) and a call receiver hole (245). In some embodiments, the speaker holes (243, 245) and the microphone hole (241) may be implemented as a single hole, or a speaker may be included without the speaker hole (243, 245) (e.g., a piezo speaker). The positions and numbers of the microphone hole (241) and the speaker holes (243, 245) may vary depending on the embodiment.

According to one embodiment of the present disclosure, the camera module (253) may include a first camera device (251) disposed on a first surface (210a) of a first housing (210) of the electronic device (101), and a second camera device (253) disposed on a second surface (210b). In addition, the electronic device (101) may further include a flash (not shown). The camera devices (251, 253) may include one or more lenses, an image sensor, and/or an image signal processor. The flash (not shown) may include, for example, a light-emitting diode or a xenon lamp.

According to one embodiment of the present disclosure, the sensor module (255) may generate an electric signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. Although not illustrated in the drawing, the electronic device (101) may additionally or alternatively include another sensor module (e.g., the sensor module (176) of FIG. 1) in addition to the sensor module (255) provided on the second surface (210b) of the first housing (210). The electronic device (101) may include, as a sensor module, at least one of a proximity sensor, a fingerprint sensor, an HRM sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor, for example.

According to one embodiment of the present disclosure, the key input devices (211, 212, 213) may be disposed on a side of a foldable housing (e.g., hinge cover (260), first housing (210), and/or second housing (220)). According to one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (211, 212, 213), and the key input devices that are not included may be implemented in another form, such as soft keys, on the first display (230). In some embodiments, the key input devices may be configured such that key input is implemented by a sensor module (e.g., gesture sensor).

According to one embodiment of the present disclosure, the connector hole (214) may be configured to accommodate a connector (e.g., a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, or, additionally or alternatively, a connector for transmitting and receiving audio signals to and from an external electronic device.

According to one embodiment of the present disclosure, a foldable housing may be implemented by combining a first housing (210), a second housing (220), a first back cover (240, back cover), a second back cover (250, back cover) and/or a hinge module (e.g., a hinge structure (270) of FIG. 4 described below). The foldable housing of the electronic device (101) is not limited to the shape and combination illustrated in FIG. 2, and may be implemented by combining and/or combining other shapes or parts. For example, the first housing (210) and the first back cover (240) may be formed integrally, and the second housing (220) and the second back cover (250) may be formed integrally. According to one embodiment of the present disclosure disclosed in this document, the term 'housing' may mean a combination and/or combined configuration of various other parts that are not mentioned. For example, it can be described that the first area (231a) of the first display (230) forms one side of the first housing (210). According to one embodiment, it can be described that the first area (231a) of the first display (230) is arranged or attached to one side of the first housing (210).

According to one embodiment of the present disclosure, the first housing (210) is connected to a hinge structure (e.g., the hinge structure (270) of FIG. 4 described below) and may include a first side (210a) facing a first direction and a second side (210b) facing a second direction opposite to the first direction. The second housing (220) is connected to a hinge structure (e.g., the hinge structure (270) of FIG. 4 described below) and includes a third side (220a) facing a third direction and a fourth side (220b) facing a fourth direction opposite to the third direction, and may rotate or pivot with respect to the first housing (210) about the hinge structure (or folding axis (A)).

According to one embodiment of the present disclosure, the first housing (210) and the second housing (220) may be arranged on both sides (or upper/lower sides) with respect to the folding axis (A). The angle or distance at which the first housing (210) and the second housing (220) intersect each other may vary depending on whether the state of the electronic device (101) is an unfolded state, a folded state, or a partially unfolded (or partially folded) intermediate state.

According to one embodiment of the present disclosure, at least a portion of the first housing (210) and the second housing (220) may be formed of a metallic material or a non-metallic material having a rigidity of a size selected to support the first display (230). At least a portion formed of the metallic material may serve as a ground plane or a radiating conductor of the electronic device (101), and when served as a ground plane, may be electrically connected to a ground line formed on a printed circuit board (e.g., printed circuit boards 216 and 226 of FIG. 4).

According to one embodiment of the present disclosure, a first rear cover (240) is disposed on one side (e.g., the upper side in FIG. 2) of the folding axis (A) on the rear side of the electronic device (101) and may have, for example, a substantially rectangular periphery, the periphery of which may be wrapped by the first housing (210) (and/or a side bezel structure). Similarly, a second rear cover (250) is disposed on the other side (e.g., the lower side in FIG. 2) of the folding axis (A) on the rear side of the electronic device (101) and may have its periphery wrapped by the second housing (220) (and/or a side bezel structure).

According to one embodiment of the present disclosure, the first rear cover (240) and the second rear cover (250) may have substantially symmetrical shapes with respect to the folding axis (A). However, the first rear cover (240) and the second rear cover (250) do not necessarily have mutually symmetrical shapes. According to one embodiment, the electronic device (101) may include the first rear cover (240) and the second rear cover (250) of various shapes. According to one embodiment, the first rear cover (240) may be formed integrally with the first housing (210), and the second rear cover (250) may be formed integrally with the second housing (220).

According to one embodiment of the present disclosure, the first rear cover (240), the second rear cover (250), the first housing (210), and the second housing (220) may form a space in which various components of the electronic device (101) (e.g., the printed circuit boards (216, 226) or the batteries (215, 225) of FIG. 4) may be placed. According to one embodiment, one or more components may be placed or visually exposed on the rear surface of the electronic device (101). For example, at least a portion of the second display (239) may be visually exposed through the first rear cover (240). According to one embodiment, one or more components or sensors may be visually exposed through the first rear cover (240). In various embodiments, the components or sensors may include a proximity sensor, a rear camera, and/or a flash. In addition, although not shown separately in the drawing, one or more components or sensors may be visually exposed through the second rear cover (250).

According to one embodiment of the present disclosure, a front camera (251) exposed on the front side of the electronic device (101) through one or more openings or a rear camera (253) exposed through the first rear cover (240) may include one or more lenses, an image sensor, and/or an image signal processor. A flash (not shown) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

According to one embodiment of the present disclosure, the foldable housing (210, 220, 260) may include a hinge cover (260), a first housing (210), and a second housing (220). The first housing (210) and the second housing (220) may be rotated with respect to the hinge structure (270). When the electronic device (101) is changed from an unfolded state to a folded state, the first housing (210) and the second housing (220) may be rotated with respect to the hinge structure (270) to bring them closer to each other. When the electronic device (101) is changed from a folded state to an unfolded state, a portion of the first housing (210) and a portion of the second housing (220) may be rotated with respect to the hinge cover (260) to move away from each other. According to one embodiment of the present disclosure, the folding direction of the first housing (210) and/or the second housing (220) may include a direction in which the first housing (210) and/or the second housing (220) rotates with respect to the hinge structure (270) when the first housing (210) and/or the second housing (220) transitions from an unfolded state to a folded state. The unfolding direction of the first housing (210) and/or the second housing (220) may include a direction in which the first housing (210) and/or the second housing (220) rotates with respect to the hinge structure (270) when the first housing (210) and/or the second housing (220) transitions from a folded state to an unfolded state.

According to one embodiment of the present disclosure, the electronic device (101) can be configured to have a folded state of the first display (230) or an unfolded state of the first display (230). For example, the first housing (210) and the second housing (220) can rotate about the folding axis (A) between a folded state in which the first region (231a) and the second region (231b) of the first display (230) face each other, and a state in which the first display (230) is unfolded by a specified angle from the folded state (e.g., the unfolded state of the electronic device (101) illustrated in FIG. 2).

According to one embodiment of the present disclosure, as the first housing (210) and the second housing (220) rotate about the folding axis (A), the electronic device (101) may include a folded state and an unfolded state. The folded state may be a state in which the first housing (210) and the second housing (220) face each other, and an angle formed by the first housing (210) and the second housing (220) may be less than a predetermined angle (e.g., 10 degrees). The unfolded state may be a state in which the electronic device (101) is fully unfolded or partially unfolded, and an angle formed by the first housing (210) and the second housing (220) may be greater than or equal to the predetermined angle.

Fig. 2 illustrates an unfolded state of the electronic device (101) in which the first housing (210) and the second housing (220) form an angle of approximately 180°. Fig. 2 and Fig. 3 illustrate a folded state of the electronic device (101) in which the first housing (210) and the second housing (220) are parallel and facing each other. In the folded state, the first region (231a) and the second region (231b) of the first display (230) can be positioned to face each other, and the folding region (231c) can be bent.

According to one embodiment of the present disclosure, folding of the electronic device (101) can be implemented in two ways: 'in-folding', in which the first region (231a) and the second region (231b) are folded to face each other, and 'out-folding', in which the first region (231a) and the second region (231b) are folded to face opposite directions. For example, in a folded state in the in-folding manner, the first region (231a) and the second region (231b) can be substantially concealed, and in a fully unfolded state, the first region (231a) and the second region (231b) can be arranged to face substantially the same direction. For example, in the folded state in the out-folding manner, the first region (231a) and the second region (231b) may be arranged facing in opposite directions and exposed to the outside, and in the fully unfolded state, the first region (231a) and the second region (231b) may be arranged facing in substantially the same direction.

According to one embodiment of the present disclosure, the first display (230) may include a display panel (not shown) and a window member (not shown), and at least a portion of which may be formed to be flexible. Although not separately illustrated, it will be readily understood by those skilled in the art that the first display (230) or the display panel includes various layers, such as a light-emitting layer, a substrate(s) encapsulating the light-emitting layer, an electrode or wiring layer, and/or an adhesive layer(s) bonding adjacent different layers. When the first display (230) (e.g., the folding area (231c)) is deformed into a flat shape and a curved shape, a relative displacement may occur between the layers forming the first display (230). The relative displacement due to the deformation of the first display (230) may increase as the point is further from the folding axis (A) and/or as the thickness of the first display (230) increases.

According to one embodiment of the present disclosure, a window member, for example, a thin film plate, may function as a protective film for protecting a display panel. As a protective film, the thin film plate may be made of a material that protects the display panel from external impact, is scratch-resistant, and reduces wrinkles in the folding area (231c) even during repeated folding and unfolding operations of the housings (210, 220). For example, the material of the thin film plate may include a transparent polyimide film (CPI) or an ultra-thin glass (UTG).

According to one embodiment of the present disclosure, the electronic device (101) may further include a protective member (206)(s) or a decorative cover (218, 228)(s) disposed on at least a portion of an edge of the first display (230) on the front surface (e.g., the first side (210a) or the third side (220a)). As an example, the protective member (206) and the decorative cover (218, 228) may be connected to each other to surround an edge of the first display (230). The protective member (206) or the decorative cover (218, 228) may prevent at least a portion of an edge of the first display (230) from contacting a mechanical structure (e.g., the first housing (210) or the second housing (220)). The protective member (206) or the decorative cover (218, 228) may be visually exposed to the outside of the electronic device (101).

According to one embodiment of the present disclosure, the decorative covers (218, 228) and the protective member (206) may be connected to each other. As an example, the decorative covers (218, 228) and the protective member (206) may be formed integrally. The decorative covers (218, 228) may extend along the folding axis (A). The decorative covers (218, 228) may include a first decorative cover (218) disposed between a portion of an edge of a first area (231a) of the first display (230) and an inner wall of the first housing (210). The decorative covers (218, 228) may include a second decorative cover (228) disposed between a portion of an edge of a second area (231b) of the first display (230) and an inner wall of the second housing (220). As an example, the first decorative cover (218) and the second decorative cover (228) can extend substantially parallel along the folding axis (A).

According to one embodiment of the present disclosure, a speaker hole (245) may be formed in a decorative cover (218) or a protective member (206) interposed between an edge of a first area (231a) of a first display (230) and an inner wall of a first housing (210). As an example, the speaker hole (245) may be formed in the first decorative cover (218).

FIG. 4 is an exploded perspective view of an electronic device (101) according to one embodiment of the present disclosure.

The description of the first housing (210) and the second housing (220) described with reference to FIGS. 2 and 3 can be equally applied to the first housing (210) and the second housing (220) of the same name, which are illustrated in FIG. 4.

In one embodiment, the display (230) may be exposed through a significant portion of the front surface of the electronic device (101). In some embodiments, the shape of the first display (230) may be formed to be substantially identical to the outer shape of the front surface of the electronic device (101).

In FIG. 4, 'Y' may mean the longitudinal direction of the electronic device (101) in the second state. In addition, in one embodiment of the present invention, '+Y' may mean the upward direction of the electronic device (101) with respect to the folding axis (A) of the electronic device (101), and '-Y' may mean the downward direction of the electronic device (101) with respect to the folding axis (A) of the electronic device (101).

According to one embodiment of the present disclosure, a foldable housing of an electronic device (101) may include a first housing (210) and a second housing (220). According to one embodiment, the first housing (210) may include a first surface (210a) and a second surface (210b) facing in an opposite direction to the first surface (210a), and the second housing (220) may include a third surface (220a) and a fourth surface (220b) facing in an opposite direction to the third surface (220a). The electronic device (101) or the foldable housing (210, 220, 260) may additionally or alternatively include a bracket assembly (217, 227). The bracket assembly (217, 227) may include a first bracket assembly (217) disposed in a first housing (210) and a second bracket assembly (227) disposed in a second housing (220). At least a portion of the bracket assembly (217, 227), for example, at least a portion of the first bracket assembly (217) and at least a portion of the second bracket assembly (227), may serve as a plate for supporting the hinge structure (270).

According to one embodiment of the present disclosure, various electrical components may be arranged on the printed circuit board (216, 226). For example, the printed circuit board (216, 226) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and/or an interface (e.g., the interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

According to one embodiment of the present disclosure, the printed circuit board (216, 226) may include a first printed circuit board (216) disposed on the side of the first bracket assembly (217) and a second printed circuit board (226) disposed on the side of the second bracket assembly (227). The first printed circuit board (216) and the second printed circuit board (226) may be disposed inside a space formed by the foldable housing (210, 220, 260), the bracket assembly (217, 227), the first rear cover (240) and/or the second rear cover (250). Components for implementing various functions of the electronic device (101) may be separately disposed on the first printed circuit board (216) and the second printed circuit board (226). For example, a processor may be placed on a first printed circuit board (216), and an audio interface may be placed on a second printed circuit board (226).

According to one embodiment of the present disclosure, a battery (215, 225) for supplying power to an electronic device (101) may be disposed adjacent to a printed circuit board (216, 226). At least a portion of the battery (215, 225) may be disposed, for example, substantially coplanar with the printed circuit board (216, 226). According to one embodiment, a first battery (215) may be disposed adjacent to a first printed circuit board (216), and a second battery (225) may be disposed adjacent to a second printed circuit board (226). The battery (215, 225) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. The battery (215, 225) may be integrally placed inside the foldable housing (210, 220, 260), or may be detachably placed in the foldable housing (210, 220, 260).

According to one embodiment of the present disclosure, the hinge structure (270) may be configured to provide a folding axis (e.g., the folding axis (A) of FIG. 2) and rotatably connect or couple the foldable housing (210, 220, 260) and/or the bracket assembly (217, 227). The hinge structure (270) may include a first hinge structure (271) disposed on the first printed circuit board (216) side and a second hinge structure (272) disposed on the second printed circuit board (226) side. The hinge structure (270) may be disposed between the first printed circuit board (216) and the second printed circuit board (226). According to one embodiment, the hinge structure (270) may be substantially integrally formed with at least a portion of the first bracket assembly (217) and at least a portion of the second bracket assembly (227).

According to one embodiment of the present disclosure, a 'housing structure' may refer to a foldable housing (210, 220, 260), and at least one component disposed inside the foldable housing (210, 220, 260) assembled and/or coupled. The housing structure may include a first housing structure and a second housing structure. For example, an assembled configuration including at least one component among a first housing (210), a first bracket assembly (217) disposed inside the first housing (210), a first printed circuit board (216), and a first battery (215) may be referred to as a 'first housing structure'. In another example, an assembled configuration including at least one component among a second housing (220), a second bracket assembly (227) disposed inside the second housing (220), a second printed circuit board (226), and a second battery (225) may be referred to as a 'second housing structure'. However, it should be noted that the 'first housing structure and second housing structure' here are not limited to the addition of the above-described components, and may additionally include or omit various other components.

According to one embodiment of the present disclosure, the flexible connecting member (280) may be, for example, a flexible printed circuit board (FPCB). The flexible connecting member (280) may connect various electrical components arranged on the first printed circuit board (216) and the second printed circuit board (226). To this end, the flexible connecting member (280) may be arranged to cross the 'first housing structure' and the 'second housing structure'. According to one embodiment, the flexible connecting member (280) may be arranged to cross at least a portion of the hinge structure (270). According to one embodiment, the flexible connecting member (280) may be configured to connect the first printed circuit board (216) and the second printed circuit board (226) across the hinge structure (270), for example, along a direction parallel to the y-axis of FIG. 4. For another example, the flexible connecting member (280) may be extended or arranged through an opening (273, 274) formed in the hinge structure (270). At this time, a part (281) of the flexible connecting member (280) may be arranged to span one side (e.g., the upper side) of the first hinge structure (271), and another part (282) of the flexible connecting member (280) may be arranged to span one side (e.g., the upper side) of the second hinge structure (272). In addition, another part (283) of the flexible connecting member (280) may be arranged on the other side (e.g., the lower side) of the first hinge structure (271) and the second hinge structure (272). A space (hereinafter referred to as a “wiring space”) surrounded by at least a portion of the first hinge structure (271), at least a portion of the second hinge structure (272), and at least a portion of the hinge cover (260) may be formed adjacent to the first hinge structure (271) and the second hinge structure (272). According to one embodiment, at least a portion (283) of the flexible connecting member (280) may be disposed within the wiring space.

According to one embodiment of the present disclosure, the hinge cover (260) may be configured to accommodate or enclose at least a portion of the hinge structure (270) or the wiring space. In some embodiments, the hinge cover (260) may form a wiring space together with the hinge structure (270) and protect a component (e.g., at least a portion (283) of the flexible connecting member (280)) disposed within the wiring space from external impact. According to one embodiment, the hinge cover (260) may be disposed between the first housing (210) and the second housing (220). In the in-folding type electronic device (101), the hinge cover (260) may be at least partially concealed by the foldable housing (210, 220, 260). For example, in the folded state, the hinge cover (260) may be visually exposed to the external space between the rear surface of the first housing (210) (e.g., the first rear cover (240)) and the rear surface of the second housing (220) (e.g., the second rear cover (250)), and in the unfolded state, it may be substantially accommodated within the interior of the first housing (210) or the second housing (220) and visually concealed.

According to one embodiment of the present disclosure, an antenna module (219, 229) (e.g., antenna module (197) of FIG. 1) may be disposed between a rear cover (240, 250) and a battery (215, 225). According to one embodiment, the antenna module (219, 229) may include a first antenna module (219) disposed on the side of the first housing (210) and a second antenna module (229) disposed on the side of the second housing (220). The antenna module (219, 229) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna, thereby enabling short-range communication with an external device or wirelessly transmitting and receiving power required for charging. According to one embodiment, the antenna structure may be formed by a portion or combination of the side bezel structure and/or the bracket assembly of the foldable housing (210, 220, 260).

According to one embodiment of the present disclosure, the rear cover (240, 250) may include a first rear cover (240) and a second rear cover (250). The rear cover (240, 250) may be combined with the foldable housing (210, 220, 260) to protect the above-described components (e.g., a printed circuit board (216, 226), a battery (215, 225), a flexible connecting member (280), or an antenna module (219, 229)) disposed within the foldable housing (210, 220, 260). As described above, the rear cover (240, 250) may be formed substantially integrally with the foldable housing (210, 220, 260).

According to one embodiment of the present disclosure, the protective member (206) and/or the decorative cover (218, 228) can protect at least a portion of an edge of the first display (230). The protective member (206) can be positioned between an edge of a first area (231a, see FIG. 2) of the first display (230) and an inner wall of the first housing (210) and/or between an edge of a second area (231b, see FIG. 2) of the first display (230) and an inner wall of the second housing (220) to prevent the edge of the first display (230) from directly contacting the inner walls of the housings (210, 220).

Fig. 5 is a drawing of a portion of the internal structure of the housing (201). The components described with reference to Fig. 5 may be partially or entirely identical to the components described with reference to Figs. 1 to 4. The components described with reference to Fig. 5 may be partially or entirely identical to the components described with reference to Figs. 6 to 25.

According to one embodiment, the electronic device (101) may include a housing (201). The description of the housing (201) may be identical to the description of the housing (201) described with reference to FIGS. 1 to 4. For example, the housing (201) may include a first housing (210) and a second housing (220).

According to one embodiment, the electronic device (101) may include a support (300). The support (300) may be a part of a housing (201). The housing (201) may include the support (300).

According to one embodiment, the electronic device (101) may include a battery (215, 225). The battery (215, 225) may be disposed inside the housing (201). The battery (215, 225) may be disposed on a support (300). The support (300) may support the battery (215, 225).

In one embodiment, the electronic device (101) may include a non-conductive member (310). The non-conductive member (310) may be coupled to a support (300). The non-conductive member (310) may include a non-conductive material. The non-conductive member (310) may be manufactured by injection molding. The non-conductive member (310) may extend along an edge of the support (300). The non-conductive member (310) may be arranged to surround the battery (215, 225). The non-conductive member (310) may be referred to as an “injection structure.” The non-conductive member (310) may be referred to as a “reinforcing member.” The non-conductive member (310) may be referred to as a “support frame.”

Fig. 6 is a cross-sectional view taken along the A-A' reference line illustrated in Fig. 5. The components described with reference to Fig. 6 may be partially or entirely identical to the components described with reference to Figs. 1 to 5. The components described with reference to Fig. 6 may be partially or entirely identical to the components described with reference to Figs. 7 to 25.

According to one embodiment, the electronic device (101) may include a display (230). The description of the display (230) may be identical to the description of the display (230) described with reference to FIGS. 1 to 5. The display (230) may form the front surface (first surface) of the electronic device (101).

According to one embodiment, the electronic device (101) may include a rear cover (240). The description of the rear cover (240) may be identical to the description of the rear cover (240) described with reference to FIGS. 1 to 5. The rear cover (240) may form the rear surface (second surface) of the electronic device (101). The rear cover (240) may be coupled to a support (300). The rear cover (240) may be spaced apart from the display (230) in a first direction (D1). The first direction (D1) may be a direction from the display (230) toward the rear cover (240) (for example, a -Z direction).

In one embodiment, the battery (215) may be positioned between the display (230) and the rear cover (240). The support (300) may be positioned between the display (230) and the rear cover (240). The non-conductive member (310) may be positioned between the display (230) and the rear cover (240).

According to one embodiment, the support (300) may include a support portion (320). The support portion (320) may be positioned between the display (230) and the rear cover (240). The battery (215) may be supported by the support portion (320).

In one embodiment, the support (300) may include a conductive portion (301). The conductive portion (301) may be a portion of the support (300). The conductive portion (301) may include a metallic material. The conductive portion (301) may include a conductive material. The conductive portion (301) may extend from the support portion (320) toward the outside of the electronic device (101). At least a portion of the conductive portion (301) may form a side surface of the electronic device (101). The conductive portion (301) may perform an antenna function. The conductive portion (301) may be configured to be capable of communicating with the outside. The conductive portion (301) may be referred to as an "antenna."

According to one embodiment, the conductive portion (301) may include a first conductive portion (330). The first conductive portion (330) may form a side surface of the electronic device (101). The first conductive portion (330) may be exposed to the exterior of the electronic device (101). At least a portion of the first conductive portion (330) may be disposed between the display (230) and the rear cover (240).

In one embodiment, the conductive portion (301) may include a second conductive portion (340). The second conductive portion (340) may be positioned between the display (230) and the rear cover (240). The second conductive portion (340) may be located inside the housing (201). The second conductive portion (340) may be spaced apart from the first conductive portion (330). The second conductive portion (340) may be positioned between the first conductive portion (330) and the battery (215).

According to one embodiment, the second conductive portion (340) may include a second-first conductive portion (341) and a second-second conductive portion (342). The second-first conductive portion (341) and the second-second conductive portion (342) may be spaced apart from each other in the first direction (D1).

According to one embodiment, the non-conductive member (310) may include a first non-conductive portion (311). The first non-conductive portion (311) may be positioned between the first conductive portion (330) and the second-first conductive portion (341). The first non-conductive portion (311) may fill a space formed between the first conductive portion (330) and the second-first conductive portion (341).

In one embodiment, the non-conductive member (310) may include a second non-conductive portion (312). The second non-conductive portion (312) may be positioned between the first conductive portion (330) and the second-second conductive portion (342). The second non-conductive portion (312) may fill a space formed between the first conductive portion (330) and the second-second conductive portion (342).

According to one embodiment, the first non-conductive portion (311) and the second non-conductive portion (312) may be spaced apart from each other. The first non-conductive portion (311) and the second non-conductive portion (312) may face each other. The second-first conductive portion (341) and the second-second conductive portion (342) may be spaced apart from each other. The second-first conductive portion (341) and the second-second conductive portion (342) may face each other.

According to one embodiment, the electronic device (101) may include a segmented area (350). The segmented area (350) may be formed inside the housing (201). The segmented area (350) may be formed by cutting at least a portion of the conductive portion (301). The segmented area (350) may refer to a space formed by cutting a portion of the conductive portion (301). The segmented area (350) may be formed between the 2-1 conductive portion (341) and the 2-2 conductive portion (342). The segmented area (350) may be formed between the first non-conductive portion (311) and the second non-conductive portion (312). At least a portion of the segmented region (350) may be formed between the first non-conductive portion (311) and the second non-conductive portion (312), and the remainder may be formed between the second-first conductive portion (341) and the second-second conductive portion (342). The segmented region (350) may be located between the first conductive portion (330) and the battery (215). The segmented region (350) may mean a space surrounded by the conductive portion (301) and the non-conductive body (310).

In one embodiment, the electronic device (101) may include a sealer (249). The sealer (249) may reduce the penetration of fluid into the interior of the housing (201). The sealer (249) may be positioned between the support (300) and the rear cover (240). The sealer (249) may be positioned between the non-conductive member (310) and the rear cover (240). The sealer (249) may face a portion of the first conductive portion (330).

According to one embodiment, the segmented area (350) may overlap with the sealer (249) in the first direction (D1). The sealer (249) may be positioned to be spaced apart from the segmented area (350) in the first direction (D1). The segmented area (350) and the sealer (249) may be spaced apart from each other in the first direction (D1). The segmented area (350) and the sealer (249) may be aligned in the first direction (D1).

The electronic device (101) according to an embodiment of the present disclosure can expand the waterproof area by the sealer (249) by forming the segmented area (350) to overlap with the sealer (249) in the first direction (D1). For example, unlike the comparative embodiment in which the segmented area (350) and the sealer (249) are positioned on the same plane, the electronic device (101) according to an embodiment of the present disclosure can expand the area in which the sealer (249) is positioned by the volume occupied by the segmented area (350) by arranging the segmented area (350) and the sealer (249) to overlap with each other in the first direction (D1).

FIG. 7 is a drawing of the structure of FIG. 5 with the battery (215) and the non-conductive member (310) removed. FIG. 8 is a drawing showing only the conductive portion (301) and the non-conductive member (310) in the structure of FIG. 6. FIG. 8 is a drawing showing the non-conductive member (310) placed in a cross-sectional view taken along the B-B' reference line shown in FIG. 7. FIG. 9 is an enlarged view of a portion of the conductive portion (301) and the non-conductive member (310) in the structure of FIG. 5. The components described with reference to FIGS. 7 to 9 may be partly or entirely the same as the components described with reference to FIGS. 1 to 6. The components described with reference to FIGS. 7 to 9 may be partly or entirely the same as the components described with reference to FIGS. 10 to 25.

According to one embodiment, the support (300) may include a conductive portion (301) and a supporting portion (320). The supporting portion (320) may be spaced apart from the first conductive portion (330). The second conductive portion (340) may be spaced apart from the first conductive portion (330). The second conductive portion (340) may be connected to the supporting portion (320). The second conductive portion (340) may surround an area where a battery (e.g., battery (215) of FIG. 5) is placed.

In one embodiment, the support (300) may include a gap (302). The gap (302) may be formed between a first conductive portion (330) and a second conductive portion (340). A non-conductive member (310) may be positioned within the gap (302) formed between the first conductive portion (330) and the second conductive portion (340). The non-conductive member (310) may be positioned to fill the gap (302).

According to one embodiment, the conductive portion (301) may be arranged along the edge of the support (300). For example, the conductive portion (301) may include a plurality of conductive portions (301, 3301, 3302) spaced apart from each other.

According to one embodiment, the support (300) may include a segmented area (350). The segmented area (350) may be formed between the second-first conductive portion (341) and the second-second conductive portion (342). The segmented area (350) may be formed between the first non-conductive portion (311) and the second non-conductive portion (312). The segmented area (350) may be formed by cutting a portion of the conductive portion (301). For example, the segmented area (350) may be formed by cutting a portion of the conductive portion (301) by a processing tool (M).

According to one embodiment, the support (300) may include a sealing area (248). The sealing area (248) may be formed on one side of the non-conductive member (310). A sealer (249) may be placed in the sealing area (248).

According to one embodiment, the segmented area (350) and the sealing area (248) may overlap in the first direction (D1). The segmented area (350) and the sealing area (248) may be aligned in the first direction (D1). The sealing area (248) may be spaced apart from the segmented area (350) in the first direction (D1).

In one embodiment, a segmented region (350) may be formed between the support portion (320) and the conductive portion (301). A non-conductive material (310) may fill a portion of the space formed between the support portion (320) and the conductive portion (301). A sealer (249) may be disposed between the support portion (320) and the conductive portion (301).

According to one embodiment, the sealing area (248) may be formed between the support portion (320) and the conductive portion (301). The first width (G1) of the sealing area (248) may be larger than the second width (G2) of the segmented area (350). In the electronic device according to the comparative embodiment, the width of the sealing area (248) is reduced by the width of the segmented area (350) by positioning the segmented area (350) within the sealing area (248). In the electronic device (101) according to the embodiment of the present disclosure, the segmented area (350) may be formed to overlap the sealing area (248) in the first direction (D1), thereby expanding the sealing area (248) by the volume occupied by the segmented area (350).

FIG. 10 is a block diagram illustrating a manufacturing method (900) of an electronic device (101) according to an embodiment of the present disclosure. The components described with reference to FIG. 10 may be partially or entirely identical to the components described with reference to FIGS. 1 to 9. The components described with reference to FIG. 10 may be partially or entirely identical to the components described with reference to FIGS. 11 to 25.

According to one embodiment, a method (900) for manufacturing an electronic device (101) may include a first processing (901) operation. The first processing (901) operation may include an operation for processing the shape of a support (300). The first processing (901) operation may include an operation for forming an outer shape of the support (300).

According to one embodiment, a method (900) for manufacturing an electronic device (101) may include an injection molding operation (902). The injection molding operation (902) may include an operation for manufacturing a non-conductive material (310). The injection molding operation (902) may include an operation for bonding the non-conductive material (310) to a support (300).

According to one embodiment, the method (900) for manufacturing an electronic device (101) may include a second processing (903) operation. The second processing (903) operation may include an operation of forming a support portion (320) and a conductive portion (903).

According to one embodiment, a method (900) for manufacturing an electronic device (101) may include an anodizing operation (904). The anodizing operation (904) may include anodizing a support (300) to which a non-conductive material (310) is bonded.

According to one embodiment, the method (900) for manufacturing an electronic device (101) may include a third processing (905) operation. The third processing (905) operation may include an operation for forming a segmented area (350). The operation for forming the segmented area (350) may be performed after the anodizing (904) operation. The method (900) for manufacturing an electronic device (101) according to an embodiment of the present disclosure may uniformly form an anodizing film on the surface of the support (300) and the non-conductive member (310) by forming the segmented area (350) after the anodizing (904) operation.

Fig. 11 is a drawing of a support (300) after the first processing (901) illustrated in Fig. 10. Fig. 12 is a cross-sectional view taken along the C-C' reference line illustrated in Fig. 11. The components described with reference to Figs. 11 and 12 may be partially or entirely identical to the components described with reference to Figs. 1 to 10. The components described with reference to Figs. 11 and 12 may be partially or entirely identical to the components described with reference to Figs. 13 to 25.

According to one embodiment, after the first processing (901) operation, the support (300) may include a first conductive portion (330) and a second conductive portion (340). A gap (302) may be formed between the first conductive portion (330) and the second conductive portion (340). After the first processing (901) operation, the support (300) may include a bridge (370). The bridge (370) may connect a portion of the first conductive portion (330) and a portion of the second conductive portion (340). The first conductive portion (330) and the second conductive portion (340) may not be separated from each other by the bridge (370).

In one embodiment, the second conductive portion (340) may be connected to the support portion (320) prior to processing. The second conductive portion (340) may be connected to the first conductive portion (330) via a bridge (370). The bridge (370) may extend past the gap (302).

Fig. 13 is a drawing of the support (300) and the non-conductive body (310) after the injection (902) operation illustrated in Fig. 10. Fig. 14 is a cross-sectional view taken along the D-D' reference line illustrated in Fig. 13. The components described with reference to Figs. 13 and 14 may be partly or entirely the same as the components described with reference to Figs. 1 to 12. The components described with reference to Figs. 13 and 14 may be partly or entirely the same as the components described with reference to Figs. 15 to 25.

In one embodiment, a non-conductive member (310) can be coupled to a support (300). The non-conductive member (310) can be manufactured by injection molding a non-conductive material. At least a portion of the non-conductive member (310) can be disposed between the support portion (320) and the conductive portion (301). At least a portion of the non-conductive member (310) can fill a gap (302) formed between the first conductive portion (330) and the support portion (320). At least a portion of the non-conductive member (310) can fill a gap (302) formed between the first conductive portion (330) and the second conductive portion (340).

In one embodiment, the non-conductive member (310) may include a first non-conductive portion (311) and a second non-conductive portion (312). Each of the first non-conductive portion (311) and the second non-conductive portion (312) may be disposed within a gap (302). A bridge (370) may be disposed between the first non-conductive portion (311) and the second non-conductive portion (312). The bridge (370) may partition the first conductive portion (330) and the second conductive portion (340).

Fig. 15 is a drawing of a support (300) and a non-conductive body (310) after the second processing (903) operation illustrated in Fig. 10. Fig. 16 is an enlarged view of the S region illustrated in Fig. 15. Fig. 17 is a drawing of the S region illustrated in Fig. 15 viewed obliquely. Fig. 18 is a cross-sectional view taken along the E-E' reference line illustrated in Fig. 16. Fig. 19 is a cross-sectional view taken along the F-F' reference line illustrated in Fig. 16. The components described with reference to Figs. 15 to 19 may be partly or entirely the same as the components described with reference to Figs. 1 to 14. The components described with reference to Figs. 15 to 19 may be partly or entirely the same as the components described with reference to Figs. 20 to 25.

According to one embodiment, after the second processing (903) operation, the support portion (320) may have a space in which a battery (e.g., battery (215) of FIG. 6) is placed. After the second processing (903) operation, the bridge (370) may not be removed. The bridge (370) may connect the first conductive portion (330) and the second conductive portion (340). The non-conductive member (310) may be placed between the first conductive portion (330) and the second conductive portion (340).

In one embodiment, the non-conductive member (310) can fill the gap (302) formed between the first conductive portion (330) and the second conductive portion (340). The bridge (370) can cross the gap (302) formed between the first conductive portion (330) and the second conductive portion (340).

According to one embodiment, the bridge (370) can electrically connect the first conductive portion (330) and the second conductive portion (340). The bridge (370) can thermally connect the first conductive portion (330) and the second conductive portion (340). During an anodizing operation (e.g., anodizing (904) of FIG. 10), the bridge (370) can transfer current applied to the first conductive portion (330) to the second conductive portion (340). During an anodizing operation (e.g., anodizing (904) of FIG. 10), the bridge (370) can transfer heat applied to the first conductive portion (330) to the second conductive portion (340). During the anodizing (904) operation, the bridge (370) transfers the current applied to the first conductive portion (330) to the second conductive portion (340), so that uniform coloring can be achieved on the first and second conductive portions (330, 340). During the polishing operation after the anodizing (904) operation, the bridge (370) transfers the heat applied to the first conductive portion (330) to the second conductive portion (340), so that the first and second conductive portions (330, 340) can have a uniform gloss.

According to one embodiment, a bridge (370) may be positioned between a first non-conductive portion (311) and a second non-conductive portion (312). The bridge (370) may transfer current and heat applied to the first conductive portion (330) to the first and second non-conductive portions (311, 312).

According to one embodiment, at least a portion of the non-conductive member (310) may be arranged to cover one side of the second conductive portion (340).

Fig. 20 is a drawing of a support (300) and a non-conductive member (310) after the anodizing (904) operation illustrated in Fig. 10. Fig. 21 is a drawing of the S1 region of the structure illustrated in Fig. 20 viewed obliquely. The components described with reference to Figs. 20 and 21 may be partly or entirely identical to the components described with reference to Figs. 1 to 19. The components described with reference to Figs. 20 and 21 may be partly or entirely identical to the components described with reference to Figs. 22 to 25.

According to one embodiment, the bridge (370) can maintain the connection between the first conductive portion (330) and the second conductive portion (340) during the anodizing operation (904). The method (900) for manufacturing an electronic device (101) according to an embodiment of the present disclosure can uniformly transfer heat and current to the first and second conductive portions (330, 340) by having the bridge (370) connect the first conductive portion (330) and the second conductive portion (340) during the anodizing operation (904), thereby uniformly forming the coloration, hardness, and gloss of the surface of the support (300).

In one embodiment, after the anodizing (904) operation, the support (300) may include a machining area (3501). The machining area (3501) may include a portion of the conductive portion (330, 340). The machining area (3501) may include a portion of the non-conductive portion (310).

According to one embodiment, the electronic device (101) according to the embodiment of the present disclosure can form a segmented area (350) by cutting the processing area (3501) after the anodizing (904) operation.

Fig. 22 is a drawing illustrating the processing of a segmented area (350) using a cross-sectional view along the G-G' reference line illustrated in Fig. 20. Fig. 23 is an enlarged drawing of the segmented area (350) after the third processing (905) operation illustrated in Fig. 10. The components described with reference to Figs. 22 and 23 may be partly or entirely the same as the components described with reference to Figs. 1 to 21. The components described with reference to Figs. 22 and 23 may be partly or entirely the same as the components described with reference to Figs. 24 and 25.

According to one embodiment, during the third processing operation (e.g., the third processing (905) of FIG. 10), the processing tool (M) can cut the processing area (3501). During the third processing (905) operation, the processing tool (M) can remove the bridge (370). The bridge (370) can be located within the processing area (3501).

According to one embodiment, after the third machining operation (e.g., the third machining (905) of FIG. 10), the support (300) may include a segmented area (350). After the third machining (905), a portion of the segmented area (350) may be formed between the first non-conductive portion (311) and the second non-conductive portion (312). The second-first conductive portion (341) and the second-second conductive portion (342), which are connected to each other before the third machining (905), may be separated and spaced from each other after the third machining (905). The segmented area (350) may face the first conductive portion (330).

According to one embodiment, the segmented area (350) may mean a space surrounded by a conductive portion (330, 340) and a non-conductive body (310). The segmented area (350) may also mean a recess, which is a sunken portion of the conductive portion (330, 340) and the non-conductive body (310).

According to one embodiment, the segmented area (350) may include a border (351). The border (351) may have a closed loop shape. The border (351) may be formed to be curved toward the inside of the segmented area (350).

FIG. 24 is a diagram schematically illustrating a method for manufacturing a support (300) according to an embodiment of the present disclosure. The components described with reference to FIG. 24 may be partially or entirely identical to the components described with reference to FIGS. 1 to 23. The components described with reference to FIG. 24 may be partially or entirely identical to the components described with reference to FIG. 25.

Referring to FIG. 10 and FIG. 24, the first processing (901) operation may include an operation of processing the base material (901a) of the support (300). After the first processing (901) operation, a bridge (370) may be formed.

Referring to FIGS. 10 and 24, the injection (902) operation may include forming a non-conductive material into a space formed on both sides of the bridge (370).

Referring to FIGS. 10 and 24, the second processing (903) operation may include an operation of cutting the support portion (320) to form a space in which the battery (215) is accommodated.

Referring to FIG. 10 and FIG. 24, the anodizing (904) operation may include an operation of applying a current to the conductive portion (301) to color the surface of the support (300) and forming a gloss on the surface of the support (300) through a polishing operation. The bridge (370) may evenly transmit heat and current to the first conductive portion (330) and the second conductive portion (340) during the anodizing (904) operation.

Referring to FIG. 10 and FIG. 24, the third processing (905) operation may include an operation of forming a segmented area (350).

FIG. 25 is a cross-sectional view of a support (400) and a non-conductive member (410) having a segmented region (450) formed thereon according to one embodiment of the present disclosure. The components described with reference to FIG. 25 may be partially or entirely identical to the components described with reference to FIGS. 1 to 24.

According to one embodiment, the support (400) may include a support portion (420) and a first conductive portion (430). The description of the support portion (420) and the first conductive portion (430) may be identical to the description of the support portion (320) and the first conductive portion (330) described with reference to FIGS. 1 to 24.

In one embodiment, the support (400) may include a second conductive portion (440). The second conductive portion (440) may form a continuous surface. For example, unlike the embodiments of FIGS. 1 to 24 , the second conductive portion (440) may not include a segmented region.

According to one embodiment, the support (400) may include a segmented area (450) and a sealing area (248). The segmented area (450) and the sealing area (248) may overlap in the first direction (D1).

According to one embodiment, the machining tool (M1) can machine a portion of the support (400) and a portion of the non-conductive body (410) along the first direction (D1). The segmented region (450) can be formed to extend in the first direction (D1).

An electronic device includes an antenna that forms part of a housing. The antenna may be configured with a segmented conductive portion. The segmented portion of the antenna and a sealing area to prevent fluid ingress may be formed within the same area. The sealing area may be reduced to a size corresponding to the volume occupied by the segmented portion of the antenna.

The problem to be solved in the present disclosure may be to expand the sealing area.

The problem to be solved in the present disclosure may be to uniformly form the coloring and glossiness of the housing.

The problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

An electronic device according to various embodiments of the present disclosure can expand a sealing area by overlapping a sealing area and a segmentation area in a first direction.

An electronic device according to various embodiments of the present disclosure can form a housing with uniform coloring and glossiness by processing a segmented area after anodizing.

The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

An electronic device (e.g., 101 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a display (e.g., 230 of FIGS. 1 to 25).

An electronic device (e.g., 101 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a display (e.g., 230 of FIGS. 1 to 25) and a rear cover (e.g., 240 of FIGS. 1 to 25) spaced apart in a first direction.

An electronic device (e.g., 101 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a battery (e.g., 215 of FIGS. 1 to 25) disposed between the display (e.g., 230 of FIGS. 1 to 25) and the rear cover (e.g., 240 of FIGS. 1 to 25).

An electronic device (e.g., 101 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a support (e.g., 300 of FIGS. 1 to 25) including a supporting portion (e.g., 320 of FIGS. 1 to 25) on which the battery (e.g., 215 of FIGS. 1 to 25) is placed and a conductive portion (e.g., 301 of FIGS. 1 to 25) including a metal material.

An electronic device (e.g., 101 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a sealer (e.g., 249 of FIGS. 1 to 25) disposed between the rear cover (e.g., 240 of FIGS. 1 to 25) and the support (e.g., 300 of FIGS. 1 to 25).

According to one embodiment of the present disclosure, the conductive portion (e.g., 301 of FIGS. 1 to 25) may include a segmented region (e.g., 350 of FIGS. 1 to 25) overlapping the sealer (e.g., 249 of FIGS. 1 to 25) in the first direction.

The support (e.g., 300 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a sealing area (e.g., 248 of FIGS. 1 to 25) in which the sealer (e.g., 249 of FIGS. 1 to 25) is arranged and overlaps the segmented area (e.g., 350 of FIGS. 1 to 25) in the first direction.

According to one embodiment of the present disclosure, the segmented region (e.g., 350 of FIGS. 1 to 25) may be spaced apart from the sealer (e.g., 249 of FIGS. 1 to 25) in a second direction opposite to the first direction.

According to one embodiment of the present disclosure, the sealer (e.g., 249 of FIGS. 1 to 25) may extend from an outer edge facing the exterior of the electronic device (e.g., 101 of FIGS. 1 to 25) to an inner edge facing the battery.

According to one embodiment of the present disclosure, the segmented region (e.g., 350 of FIGS. 1 to 25) may be a recess sunken in a direction toward the outside of the electronic device (e.g., 101 of FIGS. 1 to 25).

According to one embodiment of the present disclosure, the segmented region (e.g., 350 of FIGS. 1 to 25) may be formed by cutting a portion of the support (e.g., 300 of FIGS. 1 to 25) at a position spaced apart from the sealer (e.g., 249 of FIGS. 1 to 25).

According to one embodiment of the present disclosure, the segmented region (e.g., 350 of FIGS. 1 to 25) may be located between the support portion (e.g., 320 of FIGS. 1 to 25) and the conductive portion (e.g., 301 of FIGS. 1 to 25).

According to one embodiment of the present disclosure, the support (e.g., 300 of FIGS. 1 to 25) may be coupled to the support and may include a non-conductive member (e.g., 310 of FIGS. 1 to 25) forming at least a portion of the segmented region (e.g., 350 of FIGS. 1 to 25).

At least a portion of the non-conductive member (e.g., 310 of FIGS. 1 to 25) according to one embodiment of the present disclosure may be positioned between the sealer (e.g., 249 of FIGS. 1 to 25) and the segmented region (e.g., 350 of FIGS. 1 to 25).

The non-conductive body (e.g., 310 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a first non-conductive portion (e.g., 311 of FIGS. 1 to 25).

The non-conductive member (e.g., 310 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include the first non-conductive portion (e.g., 311 of FIGS. 1 to 25) and the second non-conductive portion (e.g., 312 of FIGS. 1 to 25) spaced apart in the first direction.

At least a portion of the segmented region (e.g., 350 of FIGS. 1 to 25) according to one embodiment of the present disclosure may be located between the first non-conductive portion (e.g., 311 of FIGS. 1 to 25) and the second non-conductive portion (e.g., 312 of FIGS. 1 to 25).

According to one embodiment of the present disclosure, the conductive portion (e.g., 301 of FIGS. 1 to 25) may include a first conductive portion (e.g., 330 of FIGS. 1 to 25) spaced apart from the support portion (e.g., 320 of FIGS. 1 to 25).

According to one embodiment of the present disclosure, a second conductive portion (e.g., 340 of FIGS. 1 to 25) may be disposed between the support portion (e.g., 320 of FIGS. 1 to 25) and the first conductive portion (e.g., 330 of FIGS. 1 to 25) and forming at least a portion of the segmented region (e.g., 350 of FIGS. 1 to 25).

The second conductive portion (e.g., 340 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a second-first conductive portion (e.g., 341 of FIGS. 1 to 25).

The second conductive portion (e.g., 340 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include the 2-1 conductive portion (e.g., 341 of FIGS. 1 to 25) and the 2-2 conductive portion (e.g., 342 of FIGS. 1 to 25) spaced apart in the first direction.

At least a portion of the segmented region (e.g., 350 of FIGS. 1 to 25) according to one embodiment of the present disclosure may be formed between the 2-1 conductive portion (e.g., 341 of FIGS. 1 to 25) and the 2-2 conductive portion (e.g., 342 of FIGS. 1 to 25).

The segmented region (e.g., 350 of FIGS. 1 to 25 ) according to one embodiment of the present disclosure may include a curved edge (e.g., 351 of FIGS. 1 to 25 ) that is curved away from the battery (e.g., 215 of FIGS. 1 to 25 ).

According to one embodiment of the present disclosure, the conductive portion (e.g., 301 of FIGS. 1 to 25) may include a first conductive portion (e.g., 330 of FIGS. 1 to 25) and a second conductive portion (e.g., 340 of FIGS. 1 to 25) that are spaced apart from each other.

According to one embodiment of the present disclosure, the first conductive portion (e.g., 330 of FIGS. 1 to 25) and the second conductive portion (e.g., 340 of FIGS. 1 to 25) can be separated by removing a bridge (e.g., 370 of FIGS. 1 to 25) connecting the first conductive portion (e.g., 330 of FIGS. 1 to 25) and the second conductive portion (e.g., 340 of FIGS. 1 to 25).

According to one embodiment of the present disclosure, the bridge (e.g., 370 of FIGS. 1 to 25) may be configured to be removed after an anodizing operation (e.g., 904 of FIGS. 1 to 25) is performed on the support (e.g., 300 of FIGS. 1 to 25).

A method for manufacturing an electronic device according to one embodiment of the present disclosure (e.g., 900 of FIGS. 1 to 25) may include an operation (e.g., 901 of FIGS. 1 to 25) of placing a support (e.g., 300 of FIGS. 1 to 25) including a first conductive portion (e.g., 330 of FIGS. 1 to 25) and a second conductive portion (e.g., 340 of FIGS. 1 to 25) connected via a bridge (e.g., 370 of FIGS. 1 to 25).

A method for manufacturing an electronic device according to one embodiment of the present disclosure (e.g., 900 of FIGS. 1 to 25) may include an operation (e.g., 902 of FIGS. 1 to 25) of bonding a non-conductive material (e.g., 310 of FIGS. 1 to 25) to the support (e.g., 300 of FIGS. 1 to 25).

A method for manufacturing an electronic device according to one embodiment of the present disclosure (e.g., 900 of FIGS. 1 to 25) may include an operation (e.g., 904 of FIGS. 1 to 25) of performing anodizing on the surface of the support (e.g., 300 of FIGS. 1 to 25) and the non-conductive material (e.g., 310 of FIGS. 1 to 25).

A method for manufacturing an electronic device according to one embodiment of the present disclosure (e.g., 900 of FIGS. 1 to 25) may include an operation (e.g., 905 of FIGS. 1 to 25) of cutting a portion of the support (e.g., 300 of FIGS. 1 to 25) on which the anodizing is performed and the non-conductive body (e.g., 310 of FIGS. 1 to 25) to form a segmented area (e.g., 350 of FIGS. 1 to 25).

Although the detailed description of the present disclosure has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of the present disclosure.

While this disclosure has been described by way of example and example, it should be understood that the example is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

Claims (15)

In the electronic device (101), display (230); A rear cover (240) spaced apart from the above display (230) in the first direction; A battery (215) placed between the display (230) and the rear cover (240); A support (300) including a supporting portion (320) on which the battery (215) is placed and a conductive portion (301) including a metal material; and Includes a sealer (249) placed between the rear cover (240) and the support (300), The above challenging portion (301) is An electronic device including a segmented area (350) overlapping the sealer (249) in the first direction. In the first paragraph, The above support (300) is An electronic device having a sealer (249) disposed thereon and including a sealing area (248) overlapping the segmented area (350) in the first direction. In claim 1 or 2, The above segmented area (350) is An electronic device spaced apart from the sealer (249) in a second direction opposite to the first direction. In any one of the first to third clauses, The above sealer (249) is, An electronic device extending from an outer edge facing the outside of the electronic device (101) to an inner edge facing the battery. In any one of claims 1 to 4, The above segmented area (350) is An electronic device having a recess sunken in the direction facing the outside of the electronic device (101). In any one of claims 1 to 5, The above segmented area (350) is An electronic device formed by cutting a portion of the support (300) at a position spaced apart from the sealer (249). In any one of claims 1 to 6, The above segmented area (350) is An electronic device located between the above support portion (320) and the above conductive portion (301). In any one of the first to seventh paragraphs, An electronic device comprising a non-conductive material (310) coupled to the support (300) and forming at least a portion of the segmented region (350). In paragraph 8, An electronic device in which at least a portion of the non-conductive body (310) is located between the sealer (249) and the segmented area (350). In paragraph 8 or 9, The above non-conductive body (310) is First non-conductive portion (311); and It includes the first non-conductive portion (311) and the second non-conductive portion (312) spaced apart in the first direction, An electronic device in which at least a portion of the segmented region (350) is located between the first non-conductive portion (311) and the second non-conductive portion (312). In any one of claims 1 to 10, The above challenging portion (301) is A first conductive portion (330) spaced apart from the above support portion (320); and An electronic device comprising a second conductive portion (340) disposed between the support portion (320) and the first conductive portion (330) and forming at least a portion of the segmented area (350). In Article 11, The above second challenging portion (340) is Part 2-1 Challenge (341); and It includes the 2-1 conductive portion (341) and the 2-2 conductive portion (342) spaced apart in the first direction, An electronic device in which at least a portion of the above segmented region (350) is formed between the second-first conductive portion (341) and the second-second conductive portion (342). In any one of claims 1 to 12, The above segmented area (350) is An electronic device comprising a curved edge (351) facing away from the battery (215). In any one of claims 1 to 13, The above conductive portion (301) includes a first conductive portion (330) and a second conductive portion (340) that are spaced apart from each other, An electronic device in which the first conductive portion (330) and the second conductive portion (340) are separated by removing the bridge (370) connecting the first conductive portion (330) and the second conductive portion (340). In Article 14, The above bridge (370) is An electronic device configured to be removed after an anodizing operation (904) is performed on the above support (300).