AU2003233485A1 - Fluid assisted cryogenic cleaning - Google Patents

Fluid assisted cryogenic cleaning

Info

Publication number: AU2003233485A1
Authority: AU; Australia
Prior art keywords: cryogenic cleaning; fluid assisted; assisted cryogenic; fluid; cleaning
Prior art date: 2002-04-05
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU2003233485A

Inventor

Souvik Banerjee

Harlan Forrest Chung

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

BOC Inc

Original Assignee

Eco-Snow Systems Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-04-05

Filing date

2003-04-03

Publication date

2003-10-27

2002-12-19 Priority claimed from US10/324,221 external-priority patent/US6852173B2/en

2003-03-31 Priority claimed from US10/403,147 external-priority patent/US6949145B2/en

2003-04-03 Application filed by Eco-Snow Systems Inc filed Critical Eco-Snow Systems Inc

2003-10-27 Publication of AU2003233485A1 publication Critical patent/AU2003233485A1/en

Status Abandoned legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/80—Cleaning only by supercritical fluids
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
- B08B7/0092—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by cooling
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/003—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods using material which dissolves or changes phase after the treatment, e.g. ice, CO2
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Chemical Kinetics & Catalysis (AREA)
General Chemical & Material Sciences (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Cleaning Or Drying Semiconductors (AREA)
Cleaning By Liquid Or Steam (AREA)
Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

AU2003233485A 2002-04-05 2003-04-03 Fluid assisted cryogenic cleaning Abandoned AU2003233485A1 (en)

Applications Claiming Priority (9)

Application Number	Priority Date	Filing Date	Title
US36985202P	2002-04-05	2002-04-05
US36985302P	2002-04-05	2002-04-05
US60/369,853		2002-04-05
US60/369,852		2002-04-05
US10,324,221		2002-12-19
US10/324,221 US6852173B2 (en)	2002-04-05	2002-12-19	Liquid-assisted cryogenic cleaning
US10/403,147		2003-03-31
US10/403,147 US6949145B2 (en)	2002-04-05	2003-03-31	Vapor-assisted cryogenic cleaning
PCT/US2003/010354 WO2003086668A1 (en)	2002-04-05	2003-04-03	Fluid assisted cryogenic cleaning

Publications (1)

Publication Number	Publication Date
AU2003233485A1 true AU2003233485A1 (en)	2003-10-27

Family

ID=29255566

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU2003233485A Abandoned AU2003233485A1 (en)	2002-04-05	2003-04-03	Fluid assisted cryogenic cleaning

Country Status (6)

Country	Link
EP (1)	EP1494821A4 (en)
JP (1)	JP2005522056A (en)
KR (1)	KR20040098054A (en)
CN (1)	CN1665609A (en)
AU (1)	AU2003233485A1 (en)
WO (1)	WO2003086668A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20040029494A1 (en) *	2002-08-09	2004-02-12	Souvik Banerjee	Post-CMP cleaning of semiconductor wafer surfaces using a combination of aqueous and CO2 based cryogenic cleaning techniques
US7264679B2 (en)	2004-02-11	2007-09-04	Applied Materials, Inc.	Cleaning of chamber components
RU2356700C1 (en) *	2007-07-30	2009-05-27	Эдуард Михайлович ГОЦ	Method for vibration cutting and vibration cutter
PT103951A (en) *	2008-01-31	2009-07-31	Univ Nova De Lisboa	PROCESSING OF ELECTRICAL AND / OR ELECTRONIC ELEMENTS IN CELLULOSIC MATERIAL SUBSTRATES
CN102476108A (en) *	2010-11-23	2012-05-30	中国科学院微电子研究所	High-temperature steam and water mixed jet cleaning system and method
US9925639B2 (en) *	2014-07-18	2018-03-27	Applied Materials, Inc.	Cleaning of chamber components with solid carbon dioxide particles
JP2016093871A (en) *	2014-11-14	2016-05-26	株式会社東芝	Processing equipment and nozzle
JP2016093870A (en) *	2014-11-14	2016-05-26	株式会社東芝	Processing equipment
DE102015003942A1 (en) *	2015-03-26	2016-09-29	Linde Aktiengesellschaft	Deburring of molded parts, in particular rubber moldings
CN106493121B (en) *	2016-11-01	2017-10-03	武汉大学	A kind of nanometer cleaning method based on active liquid and laser
TW202221789A (en)	2020-11-27	2022-06-01	南韓商Ｐｓｋ有限公司	Method and apparatus for treating substrate
CN114042684B (en) *	2022-01-12	2022-03-22	北京通美晶体技术股份有限公司	Indium phosphide wafer and mixed cleaning process thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4631250A (en) *	1985-03-13	1986-12-23	Research Development Corporation Of Japan	Process for removing covering film and apparatus therefor
US4695327A (en) *	1985-06-13	1987-09-22	Purusar Corporation	Surface treatment to remove impurities in microrecesses
DE3612586A1 (en) *	1986-04-15	1987-10-29	Messer Griesheim Gmbh	METHOD FOR REMOVING MATERIAL REMAINS ON THE SURFACE OF WORKPIECES
JPH0349224A (en) *	1989-07-17	1991-03-04	Mitsubishi Electric Corp	Treating method for substrate
US5377705A (en) *	1993-09-16	1995-01-03	Autoclave Engineers, Inc.	Precision cleaning system
US5417768A (en) *	1993-12-14	1995-05-23	Autoclave Engineers, Inc.	Method of cleaning workpiece with solvent and then with liquid carbon dioxide
US5931721A (en) *	1994-11-07	1999-08-03	Sumitomo Heavy Industries, Ltd.	Aerosol surface processing
US5908510A (en) *	1996-10-16	1999-06-01	International Business Machines Corporation	Residue removal by supercritical fluids
US6066032A (en) *	1997-05-02	2000-05-23	Eco Snow Systems, Inc.	Wafer cleaning using a laser and carbon dioxide snow
US6306564B1 (en) *	1997-05-27	2001-10-23	Tokyo Electron Limited	Removal of resist or residue from semiconductors using supercritical carbon dioxide
US6332470B1 (en) *	1997-12-30	2001-12-25	Boris Fishkin	Aerosol substrate cleaner

2003
- 2003-04-03 WO PCT/US2003/010354 patent/WO2003086668A1/en not_active Ceased
- 2003-04-03 JP JP2003583667A patent/JP2005522056A/en active Pending
- 2003-04-03 KR KR10-2004-7015867A patent/KR20040098054A/en not_active Ceased
- 2003-04-03 AU AU2003233485A patent/AU2003233485A1/en not_active Abandoned
- 2003-04-03 CN CN038103621A patent/CN1665609A/en active Pending
- 2003-04-03 EP EP03728337A patent/EP1494821A4/en not_active Withdrawn

Also Published As

Publication number	Publication date
CN1665609A (en)	2005-09-07
WO2003086668A1 (en)	2003-10-23
KR20040098054A (en)	2004-11-18
EP1494821A4 (en)	2009-11-25
EP1494821A1 (en)	2005-01-12
JP2005522056A (en)	2005-07-21

Legal Events

Date	Code	Title	Description
2005-01-13	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase

Publication	Publication Date	Title
AU2003221426A1 (en)	2003-09-29	Pipe joint
AU2003225523A1 (en)	2003-09-02	Functional pipelines
AUPS207802A0 (en)	2002-06-06	Pipe coupling
AU2003213205A1 (en)	2003-09-29	Contoured tubing closure
AU2003239380A1 (en)	2003-11-11	Cryogenic fluid coupling
AU2003278346A1 (en)	2004-06-15	Umbilical pipe
AU2003233485A1 (en)	2003-10-27	Fluid assisted cryogenic cleaning
AU2003221782A1 (en)	2003-11-17	Fluid applicator
AU2003229984A1 (en)	2004-02-09	Fluid connection assembly
AU2003281318A1 (en)	2004-01-23	Pipe joint
AU2003281316A1 (en)	2004-01-23	Parts for fluid
AU2003266169A1 (en)	2004-02-09	Fluid filters
AU2003285023A1 (en)	2004-05-13	Fluid heater
AU2003248781A1 (en)	2004-01-23	Visual media
AU2003235292A1 (en)	2003-12-19	Hose connection structure
AU2003283218A1 (en)	2004-06-23	Fluid dispenser
AU2002337308A1 (en)	2003-09-02	Fluid pump
AU2003277866A1 (en)	2004-04-19	Symmetrical hose coupling
AU2003201053A1 (en)	2003-07-30	Valve unit
AU2003298886A1 (en)	2004-06-23	Replacement joint fluid
AU2002359033A1 (en)	2003-07-24	Pipe joint
AU2003298249A1 (en)	2004-07-22	Liquid embolisate
AU2003246579A1 (en)	2004-01-19	Pipe cleaning nozzle
AUPS293602A0 (en)	2002-07-04	Pipe cleaning container
AUPS131702A0 (en)	2002-05-09	Fluid coupling