AU2005229707B2 - Cold/heat conditioning device with thermoelectric cooling chip - Google Patents
Cold/heat conditioning device with thermoelectric cooling chip Download PDFInfo
- Publication number
- AU2005229707B2 AU2005229707B2 AU2005229707A AU2005229707A AU2005229707B2 AU 2005229707 B2 AU2005229707 B2 AU 2005229707B2 AU 2005229707 A AU2005229707 A AU 2005229707A AU 2005229707 A AU2005229707 A AU 2005229707A AU 2005229707 B2 AU2005229707 B2 AU 2005229707B2
- Authority
- AU
- Australia
- Prior art keywords
- thermoelectric cooling
- cooling chip
- heat
- cold
- conditioning device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000001816 cooling Methods 0.000 title claims description 38
- 230000003750 conditioning effect Effects 0.000 title claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000004378 air conditioning Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 235000003140 Panax quinquefolius Nutrition 0.000 description 2
- 240000005373 Panax quinquefolius Species 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Description
56826 JOM:MN P/00/011 AUSTRALIA Regulation 3.2 Patents Act 1990 COMPLETE SPECIFICATION FOR A STANDARD PATENT ORIGINAL Name of Applicant: CHUAN SHENG CHEN Actual Inventor: CHUAN SHENG CHEN Address for Service: COLLISON & CO., 117 King William Street, Adelaide, S.A. 5000 Invention Title: COLD/HEAT CONDITIONING DEVICE WITH THERMOELECTRIC COOLING CHIP The following statement is a full description of this invention, including the best method of performing it known to us: 1 TITLE: COLD/HEAT CONDITIONING DEVICE WITH THERMO ELECTRIC COOLING CHIP BACKGROUND OF THE INVENTION (a) Technical Field of the Invention 5 The present invention generally relates to cold/hot conditioning devices and, more particularly, to a cold / heat conditioning device utilizing one or more thermoelectric cooling chips. (b) Description of the Prior Art Traditional air conditioners and refrigerators utilize compressor and 10 refrigerant to produce the required low temperatures. The use of the compressor has quite a few disadvantages. The compressor is heavy and bulky, making the installation and transportation very inconvenient. The compressor also consumes a lot of energy, in addition to the annoying noise it produces. On the other hand, the refrigerant is also not environmentally 15 friendly. SUMMARY OF THE INVENTION The primary purpose of the present invention is to provide a novel cold/heat conditioning device with thermoelectric cooling chip to replace the traditional air conditioners and refrigerators, which not only consumes less 20 energy but also is environmentally friendly. The present invention mainly utilizes a specialized semiconductor chip, thermoelectric cooling chip, for producing the coldness. A cooling circulating member and a heat dissipating member are configured at the two sides of the thermoelectric cooling chip. The coldness produced by the thermoelectric cooling chip is delivered by a 25 cold conduction plate and cooling pipes, and is stored in fins of the cooling circulating member. A temperature controller determines a desired temperature and the coldness stored by the fins are blown out as cool air by a 2 fan. Similarly, the heat produced by the chip is dissipated by the heat dissipating member. As such, the present invention could reach the desired temperature within a short period of time without the conventional compressor. The present invention therefore is easier to install and transport, consumes less 5 power, and produces almost no noise and pollution to the environment. The foregoing object and summary provide only a brief introduction to the present invention. To fully appreciate these and other objects of the present invention as well as the invention itself, all of which will become apparent to those skilled in the art, the following detailed description of the 10 invention and the claims should be read in conjunction with the accompanying drawings. Throughout the specification and drawings identical reference numerals refer to identical or similar parts. Many other advantages and features of the present invention will become manifest to those versed in the art upon making reference to the detailed 15 description and the accompanying sheets of drawings in which a preferred structural embodiment incorporating the principles of the present invention is shown by way of illustrative example. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a functional diagram showing the various components of the 20 present invention. FIG. 2 is a schematic diagram showing the various components of the present invention. FIG. 3 is a perspective schematic diagram showing the appearance of the present invention. 25 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The following descriptions are of exemplary embodiments only, and are not intended to limit the scope, applicability or configuration of the invention 3 in any way. Rather, the following description provides a convenient illustration for implementing exemplary embodiments of the invention. Various changes to the described embodiments may be made in the function and arrangement of the elements described without departing from the scope 5 of the invention as set forth in the appended claims. As shown in FIGS. 1-3, the present invention mainly contains a power supply member 1, at least a thermoelectric cooling chip 2, a cooling circulating member 3, a heat dissipating member 4, and a temperature controller 5. The cooling circulating member 3 and the heat dissipating 10 member 4 are fixedly installed on a cold production surface and a heat production surface of the thermoelectric cooling chip 2, respectively. The cooling circulating member 3 contains a cold conduction plate 31, cooling pipes 32, and fins 33. The heat dissipating member 4, on the other hand, contains a heat conduction plate 41, heat dissipating pipes 42, fins 43, and a 15 fan 44. The coldness produced by the thermoelectric cooling chip 2 is conducted to and stored in the fins 33 via the cold conduction plate 31 and the cooling pipes 32. A desired temperature is set by temperature up/down buttons 52 and a temperature fixing button 51 of the temperature controller 5, via a wired or wireless connection. Then the coldness stored in the fins 33 is 20 blown out by the fan 44 as cool air 34. The heat produced by the thermoelectric cooling chip 2 is dissipated out of the present invention as hot air 45 by the heat conduction plate 41, heat dissipating pipes 42, fins 43, and the fan 44. As such, the present invention could reach the desired temperature within a short period of time. 25 The cold and heat conduction plates 31 and 41 are usually made of metallic materials having high thermal conductivity such as copper or aluminum. The cold and heat conduction plates 31 and 41 could also be made into hollow containers having an appropriate circulating fluid 35 inside.
4 Without the conventional compressor, the present invention could achieve the desired air-conditioning effect simply based on the thermoelectric cooling chip, the cooling circulating member, and the heat dissipating member. The thermoelectric cooling chip could produce a temperature as low as -5 C. 5 After the conduction and circulation, a temperature as low as 5 C40 C eild still be maintained, which is well within the requirement for air conditioning purpose. The present invention is environmentally friendly if the conventional refrigerant is not used as the circulating fluid 35. In addition, without the use 10 of the compressor, the present invention could provide a power saving up to 60%-70%. In addition, the present invention is much lighter in weight and smaller in form factor as no bulky compressor is required. The present invention is therefore easier in installation and transportation. Please note that the foregoing one or more thermoelectric cooling chip, 15 the cooling circulating member, and the heat dissipating member could be combined into a basic module and, depending on the required cold/heat conditioning capacity for larger room or warmer environment, one or more such basic module could be integrated together to form a more powerful cold/hot conditioning device. 20 It will be understood that each of the elements described above, or two or more together may also find a useful application in other types of methods differing from the type described above. While certain novel features of this invention have been shown and described and are pointed out in the annexed claim, it is not intended to be 25 limited to the details above, since it will be understood that various omissions, modifications, substitutions and changes in the forms and details of the device illustrated and in its operation can be made by those skilled in the art without departing in any way from the spirit of the present invention.
Claims (2)
1. A variable temperature conditioning device with thermoelectric cooling chip comprising: 5 at least a thermoelectric cooling chip; a cooling circulating member comprising a cold conduction plate, a plurality of cooling pipes, and a plurality of fins, said cooling circulating member fixedly installed on a cold production surface of said 10 thermoelectric cooling chip; a heat dissipating member comprising a heat conduction plate, a plurality of heat dissipating pipes, a plurality of fins, and a fan, said heat dissipating member fixedly installed on a heat production surface of said thermoelectric cooling chip; and 15 a temperature controller for setting a desired temperature by temperature control buttons of said temperature controller via a wired or wireless connection to said air conditioning device; wherein the coldness produced by said thermoelectric cooling chip is conducted to and stored in said fins via said cold conduction plate and 20 said cooling pipes; the coldness stored in said fins is blown out by said fan as cool air according to said desired temperature; the heat produced by said thermoelectric cooling chip is dissipated out as hot air by said heat conduction plate, said heat dissipating pipes, said fins, and said fan. 25
2. The variable temperature conditioning device with thermoelectric cooling chip according to claim 1, wherein said conditioning device comprises additional sets of said thermoelectric cooling chip, said cooling circulating member, and said heat dissipating member.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094124008 | 2005-07-15 | ||
| TW094124008A TWI284188B (en) | 2005-07-15 | 2005-07-15 | An air conditioner with a semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU2005229707A1 AU2005229707A1 (en) | 2007-02-01 |
| AU2005229707B2 true AU2005229707B2 (en) | 2010-07-15 |
Family
ID=37734112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2005229707A Ceased AU2005229707B2 (en) | 2005-07-15 | 2005-11-04 | Cold/heat conditioning device with thermoelectric cooling chip |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2007024484A (en) |
| AU (1) | AU2005229707B2 (en) |
| MY (1) | MY138850A (en) |
| TW (1) | TWI284188B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109915965A (en) * | 2017-12-13 | 2019-06-21 | 林世轩 | Fan mechanism with cooling chip cooling |
| CN110662924B (en) * | 2017-12-14 | 2021-10-08 | 周兆泰 | Semiconductor Refrigeration Heating Air Conditioner |
| CN108507013A (en) * | 2018-02-11 | 2018-09-07 | 青岛海尔空调器有限总公司 | A kind of fresh air conditioner indoor unit |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3757530A (en) * | 1972-04-12 | 1973-09-11 | Control Data Corp | Cooling system for data processing apparatus |
| US6351951B1 (en) * | 1998-03-30 | 2002-03-05 | Chen Guo | Thermoelectric cooling device using heat pipe for conducting and radiating |
| US6401761B1 (en) * | 2000-09-20 | 2002-06-11 | Tokai Rubber Industries, Ltd. | Hydrogen fuel hose |
| US6574967B1 (en) * | 2002-01-31 | 2003-06-10 | Samsung Electronics Co., Ltd. | Cooling and heating apparatus using thermoelectric module |
-
2005
- 2005-07-15 TW TW094124008A patent/TWI284188B/en not_active IP Right Cessation
- 2005-11-01 JP JP2005318579A patent/JP2007024484A/en active Pending
- 2005-11-04 AU AU2005229707A patent/AU2005229707B2/en not_active Ceased
- 2005-11-08 MY MYPI20055227A patent/MY138850A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3757530A (en) * | 1972-04-12 | 1973-09-11 | Control Data Corp | Cooling system for data processing apparatus |
| US6351951B1 (en) * | 1998-03-30 | 2002-03-05 | Chen Guo | Thermoelectric cooling device using heat pipe for conducting and radiating |
| US6401761B1 (en) * | 2000-09-20 | 2002-06-11 | Tokai Rubber Industries, Ltd. | Hydrogen fuel hose |
| US6574967B1 (en) * | 2002-01-31 | 2003-06-10 | Samsung Electronics Co., Ltd. | Cooling and heating apparatus using thermoelectric module |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2005229707A1 (en) | 2007-02-01 |
| MY138850A (en) | 2009-08-28 |
| JP2007024484A (en) | 2007-02-01 |
| TWI284188B (en) | 2007-07-21 |
| TW200702608A (en) | 2007-01-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FGA | Letters patent sealed or granted (standard patent) | ||
| MK14 | Patent ceased section 143(a) (annual fees not paid) or expired |