AU2006200920B2 - Packaging structure for a solar chip - Google Patents
Packaging structure for a solar chip Download PDFInfo
- Publication number
- AU2006200920B2 AU2006200920B2 AU2006200920A AU2006200920A AU2006200920B2 AU 2006200920 B2 AU2006200920 B2 AU 2006200920B2 AU 2006200920 A AU2006200920 A AU 2006200920A AU 2006200920 A AU2006200920 A AU 2006200920A AU 2006200920 B2 AU2006200920 B2 AU 2006200920B2
- Authority
- AU
- Australia
- Prior art keywords
- solar chip
- package structure
- light
- solar
- focusing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000004806 packaging method and process Methods 0.000 title description 2
- 230000009977 dual effect Effects 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 230000003667 anti-reflective effect Effects 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 230000006870 function Effects 0.000 description 4
- 238000012858 packaging process Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/40—Solar thermal energy, e.g. solar towers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
Description
AUSTRALIA Patents Act 1990 COMPLETE SPECIFICATION STANDARD PATENT Applicant(s): Higher Way Electronic Co., Ltd. and Millennium Communication Co., Ltd. Invention Title: PACKAGING STRUCTURE FOR A SOLAR CHIP The following statement is a full description of this invention, including the best method of performing it known to me/us: PACKAGE STRUCTURE FOR A SOLAR CHIP BACKGROUND OF THE INVENTION 5 Field of the Invention The present invention relates to a light-focusing package structure for a solar chip, particularly to a package structure for a solar chip, which may be assembled in to an array of arbitrary shape. 10 Description of the Related Art A solar cell utilizes photovoltaic effect to convert solar energy into electric energy. Refer to Fig.1 for the structure of a 15 conventional solar cell. The conventional solar cell 105 has an N-type-semiconductor layer 110, a P-type-semiconductor layer 112, an anti-reflective layer, and two electrodes 114 and 116. When photons enter into the solar cell 105, there are electrons-holes generated and diffusing across the junction between the 20 N-type-semiconductor layer 110 and the P-type-semiconductor layer 112. Thus, a current is generated from the top electrode 114 and the bottom electrode 116. Generally, the solar energy absorbed by the solar cell 105 may be raised by increasing the light-receiving area or utilizing a light-focusing device, such as a 25 lens structure. However, a large-area light-focusing element is 1A hard to fabricate, and an arbitrary-size assemblage of solar cells is also hard to accomplish. Besides, the yield thereof is also hard to promote, and the cost thereof is thus raised. Therefore, developing an easy-fabrication and easy-assemblage light-focusing 5 package structure for a solar chip is also one of the important subjects in the fields concerned. SUMMARY OF THE INVENTION It would be advantageous if embodiments of the invention provided a light-focusing package structure for a solar chip, which 10 may be fabricated with LED fabrication process to simply the packaging process of a light-focusing solar cell. It would be advantageous if embodiments of the invention provided a package structure for a solar chip. The LED lead frame and expoxy encapsulation structure are used to package a solar chip 15 in order to simplify the packaging process of a solar chip and implement the size-adjustability of a solar-cell assemblage. In one aspect, the present invention provides a light-focusing package structure for a solar chip, which includes: a solar chip; a substrate supporting the solar chip; a plurality of wiring connection 20 structures electrically coupled to the solar chip; and a covering encapsulating the solar chip, the substrate, and a portion of the wiring connections structures. Furthermore, the covering may focus sunlight and has an anti-reflective function to increase sunlight absorption. 2 BRIEF DESCRIPTION OF THE DRAWINGS Fig.1 is a diagram schematically showing the structure of a 5 conventional solar cell. Fig.2A and Fig.2B are diagrams schematically showing the package structure for a solar chip according to a first embodiment of the present invention. Fig.3A and Fig.3B are diagrams schematically showing the 10 package structure for a solar chip according to a second embodiment of the present invention. Fig.4A and Fig.4B are diagrams schematically showing the package structure for a solar chip according to a third embodiment of the present invention. 15 DETAILED DESCRIPTION OF THE INVENTION Refer to Fig.2A a diagram schematically showing the package structure for a solar chip according to a first embodiment of the present invention. The dual In-line solar-chip package 20 structure 10 includes: a solar chip 12, a substrate 14, multitudes of wiring connection structures 16, and a covering 18. In this embodiment, the substrate 14 is used to sustain or support the solar chip 12 and made of an electrically-conductive metal, such as copper or iron. The solar chip 12 may be a mono-crystalline-silicon 25 solar chip, a polycrystalline-silicon solar chip, an amorphous-silicon solar chip, or a gallium arsenide solar chip. The solar chip 12 is 3 affixed onto the surface of the substrate 14 via an appropriate method, such as via an adhesive layer (not shown in the drawing). However, in the present invention, the affixing method is not limited to using an adhesive layer. The solar chip 12 includes: at least 5 one N-type-semiconductor layer, at least one P-type-semiconductor layer, an absorptive layer, and two electrodes. Those two electrodes are respectively electrically coupled to different wiring connection structures 16. In this embodiment, the positive electrode and the negative electrode are separately disposed at 10 different sides of the solar chip 12, but, in another embodiment of the present invention, the positive electrode and the negative electrode may be disposed at same side of the solar chip 12, as shown in Fig.2B. It is understood that the structure of the solar chip 12 is not limited to that mentioned above but may further 15 include other structures, such as a glass substrate and a barrier layer. Inner leads 13 and 19 are respectively used to electrically connect the electrodes to external leads 15 and 11. The external leads 11 and 15 are configured to attach and electrically couple to an external structure (not shown in the drawing) and may also be 20 used as power leads. The external leads 11 and 15 may be disposed at appropriate positions of the solar-chip package structure 10, such as the lateral side or the bottom of the solar chip 12. However, the present invention does not limit the external-lead position to those mentioned above. 25 The covering 18, such as an epoxy body, covers and protects the solar chip 12 and the inner leads 13 and 19, and may 4 focus sunlight. In another embodiment, the covering 18 may also function as an anti-reflective layer and let more sunlight enter into the dual In-line solar-chip package structure 10. Due to the characteristic of its material, the covering 18 may be fabricated into 5 various geometrical shapes to focus the sunlight from various directions. Thus, the dual In-line solar-chip package structure 10 may receive the sunlight coming from every direction even it is still at a fixed position. Therefore, the present invention may solve the problem that the solar panel consisting of assembled solar chips 10 has to modify its orientation to follow the sun's track to increase incident sunlight. Besides, the dual In-line solar-chip package structure 10 can be fabricated with a common LED packaging process without any extra mold and machine. Further, the dual In-line solar-chip package structures 10 may be assembled in the 15 same method as LED uses. Thus, the dual In-line solar-chip package structures 10 may be assembled into a solar-energy system of a desired size and geometry. Refer to Fig.3A and Fig.3B diagrams schematically showing the package structure for a solar chip according to a second 20 embodiment of the present invention. Similar to the dual In-line solar-chip package structure 10, the SMD (Surface Mount Device) solar-chip package structure 20 includes: a solar chip 12, a substrate 14, multitudes of wiring connection structures 16, and a covering. Different wiring connection structures 16 are 25 respectively connected to the positive electrode and the negative electrode, which are simultaneously disposed at same side of the 5 solar chip 12 or separately disposed at different sides of the solar chip 12. Dissimilar to the dual In-line solar-chip package structure 10, the SMD solar-chip package structure 20 has external leads 11 and 15 extending from the lateral sides of the solar chip 12. 5 Therefore, the SMD solar-chip package structure 20 has a flattened geometry. Thus, the contact points of the external leads 11 and 15 may be affixed to an external element via an SMT method. Besides, the covering of the SMD solar-chip package structure 20 may be made of an anti-reflective transparent material to increase incident 10 sunlight. Refer to Fig.4A and Fig.4B diagrams schematically showing the package structure for a solar chip according to a third embodiment of the present invention. The TO (Transistor Outline)-Cans solar-chip package structure 30 includes: a solar 15 chip 12, a TO header 14, a TO body 18. In this embodiment, the solar chip 12 is affixed to the TO header 14 and electrically coupled to the inner lead 13 and the contact 17 on the TO header 14. The inner lead 13 and the contact 17 may penetrate the TO header 14 and extend outward to function as external leads 15 and 11. The 20 TO body 18 may protect the solar chip 12 and focus the sunlight coming from all directions, and the TO body 18 may be made of an anti-reflective material so that more sunlight may penetrate the TO body 18. The shape of the TO body 18 is not limited to be the column shape shown Fig.4A and Fig.4B but may further include all 25 shapes having light-focusing effect. Besides, what is installed on the TO header 14 is not limited to one or multitudes solar chips 12 6 but may also include chips and elements of other functions. Those embodiments described above are to clarify the technical thoughts and characteristics of the present invention in order to enable the persons skilled in the art to understand, make 5 and use the present invention. However, it is not intended to limit the scope of the present invention, and any equivalent modification and variation according to the spirit of the present invention is to be also included within the scope of the claims of the present invention. 10 In the claims which follow and in the preceding description of the invention, except where the context requires otherwise due to express language or necessary implication, the word "comprise" or variations such as "comprises" or "comprising" is used in an inclusive 15 sense, i.e. to specify the presence of the stated features but not to preclude the presence or addition of further features in various embodiments of the invention. A reference herein to a prior art document is not an admission 20 that the document forms part of the common general knowledge in the art in Australia. 7
Claims (20)
1.A light-focusing package structure for a solar chip, comprising: a solar chip; a substrate supporting said solar chip; 5 a plurality of wiring connection structures electrically coupled to said solar chip; and a covering encapsulating said solar chip, said substrate, and said wiring connection structures, focusing sunlight, and comprising an anti-reflective structure to benefit sunlight absorption. 10
2.The light-focusing package structure for a solar chip according to claim 1, wherein said covering is formed via a plastic injection-molding process.
3.The light-focusing package structure for a solar chip according to claim 1, wherein said covering is formed via a mold-filling 15 process.
4. The light-focusing package structure for a solar chip according to claim 1, wherein said covering is formed via filling epoxy into a mold.
5. The light-focusing package structure for a solar chip according to 20 claim 1, which includes a package structure with leads.
6. The light-focusing package structure for a solar chip according to claim 1, which includes a dual In-Line package structure.
7. The light-focusing package structure for a solar chip according to claim 1, which includes a surface mount device package 25 structure.
8. The light-focusing package structure for a solar chip according to 8 claim 1, comprising a Transistor Outline-Cans package structure.
9. The light-focusing package structure for a solar chip according to claim 1, wherein said wiring connection structures further comprise a plurality of power leads penetrating through and 5 extending outward from said covering.
10.The light-focusing package structure for a solar chip according to claim 1, wherein said covering is a transparent cap.
11. The light-focusing package structure for a solar chip according to claim 1, wherein said covering is a hollow pipe. 10
12. The light-focusing package structure for a solar chip according to claim 1, wherein said solar chip is a mono-crystalline-silicon solar chip.
13. The light-focusing package structure for a solar chip according to claim 1, wherein said solar chip is a polycrystalline-silicon 15 solar chip.
14. The light-focusing package structure for a solar chip according to claim 1, wherein said solar chip is an amorphous-silicon solar chip.
15. The light-focusing package structure for a solar chip according 20 to claim 1, wherein said solar chip is a compound solar chip.
16. The light-focusing package structure for a solar chip according to claim 1, wherein said solar chip absorbs sunlight.
17. The light-focusing package structure for a solar chip according to claim 1, wherein the positive electrode and the negative 25 electrode of said solar chip are simultaneously disposed at same side of said solar chip. 9
18. The light-focusing package structure for a solar chip according to claim 1, wherein the positive electrode and the negative electrode of said solar chip are respectively disposed at different sides of said solar chip.
19. The light-focusing package structure for a solar chip according to claim 1, wherein the leads of said package structure are assembled into an array.
20. The light-focusing package structure for a solar chip according to claim 1, wherein said covering is for an array of said solar chips. 10
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2006200920A AU2006200920B2 (en) | 2006-03-03 | 2006-03-03 | Packaging structure for a solar chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2006200920A AU2006200920B2 (en) | 2006-03-03 | 2006-03-03 | Packaging structure for a solar chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU2006200920A1 AU2006200920A1 (en) | 2007-09-20 |
| AU2006200920B2 true AU2006200920B2 (en) | 2009-09-10 |
Family
ID=38529509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2006200920A Ceased AU2006200920B2 (en) | 2006-03-03 | 2006-03-03 | Packaging structure for a solar chip |
Country Status (1)
| Country | Link |
|---|---|
| AU (1) | AU2006200920B2 (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA804230A (en) * | 1969-01-14 | Magee Vincent | Devices for converting solar energy into electric energy | |
| DE2924510A1 (en) * | 1979-06-18 | 1981-01-08 | Imchemie Kunststoff Gmbh | Solar cell concentrator with Fresnel lens - has single or double sided Fresnel lens embedded in plastics or glass |
| GB2060256A (en) * | 1979-10-05 | 1981-04-29 | Torino Politecnico | Thermophotovoltaic converter |
| US5167724A (en) * | 1991-05-16 | 1992-12-01 | The United States Of America As Represented By The United States Department Of Energy | Planar photovoltaic solar concentrator module |
| US6075652A (en) * | 1995-02-17 | 2000-06-13 | Washi Kosan Co., Ltd. | Convex-microgranular surface structure |
| US6091020A (en) * | 1995-06-06 | 2000-07-18 | The Boeing Company | Photovoltaic cells having a concentrating coverglass with broadened tracking angle |
| US20030075212A1 (en) * | 2001-10-23 | 2003-04-24 | Chen Leon L.C. | Photovolataic array module design for solar electric power generation systems |
-
2006
- 2006-03-03 AU AU2006200920A patent/AU2006200920B2/en not_active Ceased
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA804230A (en) * | 1969-01-14 | Magee Vincent | Devices for converting solar energy into electric energy | |
| DE2924510A1 (en) * | 1979-06-18 | 1981-01-08 | Imchemie Kunststoff Gmbh | Solar cell concentrator with Fresnel lens - has single or double sided Fresnel lens embedded in plastics or glass |
| GB2060256A (en) * | 1979-10-05 | 1981-04-29 | Torino Politecnico | Thermophotovoltaic converter |
| US5167724A (en) * | 1991-05-16 | 1992-12-01 | The United States Of America As Represented By The United States Department Of Energy | Planar photovoltaic solar concentrator module |
| US6075652A (en) * | 1995-02-17 | 2000-06-13 | Washi Kosan Co., Ltd. | Convex-microgranular surface structure |
| US6091020A (en) * | 1995-06-06 | 2000-07-18 | The Boeing Company | Photovoltaic cells having a concentrating coverglass with broadened tracking angle |
| US20030075212A1 (en) * | 2001-10-23 | 2003-04-24 | Chen Leon L.C. | Photovolataic array module design for solar electric power generation systems |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2006200920A1 (en) | 2007-09-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FGA | Letters patent sealed or granted (standard patent) | ||
| MK14 | Patent ceased section 143(a) (annual fees not paid) or expired |