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AU415604B2 - Printed circuit component mounting technique - Google Patents
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AU415604B2 - Printed circuit component mounting technique - Google Patents

Printed circuit component mounting technique

Info

Publication number
AU415604B2
AU415604B2 AU25412/67A AU2541267A AU415604B2 AU 415604 B2 AU415604 B2 AU 415604B2 AU 25412/67 A AU25412/67 A AU 25412/67A AU 2541267 A AU2541267 A AU 2541267A AU 415604 B2 AU415604 B2 AU 415604B2
Authority
AU
Australia
Prior art keywords
printed circuit
component mounting
circuit component
mounting technique
technique
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU25412/67A
Other versions
AU2541267A (en
Inventor
JOHN HENRY RYAN and VINCENT FRANCIS CHURCHILL HENRY BAIN STEWART
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Services Ltd
Original Assignee
Standard Telephone and Cables Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables Pty Ltd filed Critical Standard Telephone and Cables Pty Ltd
Priority to AU25412/67A priority Critical patent/AU415604B2/en
Publication of AU2541267A publication Critical patent/AU2541267A/en
Application granted granted Critical
Publication of AU415604B2 publication Critical patent/AU415604B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10575—Insulating foil under component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
AU25412/67A 1968-07-12 1968-07-12 Printed circuit component mounting technique Expired AU415604B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU25412/67A AU415604B2 (en) 1968-07-12 1968-07-12 Printed circuit component mounting technique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AU25412/67A AU415604B2 (en) 1968-07-12 1968-07-12 Printed circuit component mounting technique

Publications (2)

Publication Number Publication Date
AU2541267A AU2541267A (en) 1970-01-15
AU415604B2 true AU415604B2 (en) 1971-07-23

Family

ID=3714222

Family Applications (1)

Application Number Title Priority Date Filing Date
AU25412/67A Expired AU415604B2 (en) 1968-07-12 1968-07-12 Printed circuit component mounting technique

Country Status (1)

Country Link
AU (1) AU415604B2 (en)

Also Published As

Publication number Publication date
AU2541267A (en) 1970-01-15

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