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AU450494B2 - A method of manufacturing lead frames - Google Patents
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AU450494B2 - A method of manufacturing lead frames - Google Patents

A method of manufacturing lead frames

Info

Publication number
AU450494B2
AU450494B2 AU32355/71A AU3235571A AU450494B2 AU 450494 B2 AU450494 B2 AU 450494B2 AU 32355/71 A AU32355/71 A AU 32355/71A AU 3235571 A AU3235571 A AU 3235571A AU 450494 B2 AU450494 B2 AU 450494B2
Authority
AU
Australia
Prior art keywords
lead frames
manufacturing lead
manufacturing
frames
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU32355/71A
Other versions
AU3235571A (en
Inventor
Jay Heinlen Frederick
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of AU3235571A publication Critical patent/AU3235571A/en
Application granted granted Critical
Publication of AU450494B2 publication Critical patent/AU450494B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
AU32355/71A 1970-09-08 1971-08-13 A method of manufacturing lead frames Expired AU450494B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7003470A 1970-09-08 1970-09-08

Publications (2)

Publication Number Publication Date
AU3235571A AU3235571A (en) 1973-02-15
AU450494B2 true AU450494B2 (en) 1974-07-11

Family

ID=22092718

Family Applications (1)

Application Number Title Priority Date Filing Date
AU32355/71A Expired AU450494B2 (en) 1970-09-08 1971-08-13 A method of manufacturing lead frames

Country Status (11)

Country Link
US (1) US3650232A (en)
AT (1) AT318042B (en)
AU (1) AU450494B2 (en)
BE (1) BE772314A (en)
CA (1) CA966986A (en)
DE (1) DE2143809A1 (en)
ES (1) ES394780A1 (en)
FR (1) FR2106369B1 (en)
GB (1) GB1305337A (en)
NL (1) NL7112352A (en)
SE (1) SE360216B (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3815205A (en) * 1973-03-02 1974-06-11 Nasa Device for configuring multiple leads
US4158745A (en) * 1977-10-27 1979-06-19 Amp Incorporated Lead frame having integral terminal tabs
US4214120A (en) * 1978-10-27 1980-07-22 Western Electric Company, Inc. Electronic device package having solder leads and methods of assembling the package
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
US4252864A (en) * 1979-11-05 1981-02-24 Amp Incorporated Lead frame having integral terminal tabs
FR2538961B1 (en) * 1982-12-30 1985-07-12 Europ Composants Electron BASE FOR INTEGRATED CIRCUIT
US4972572A (en) * 1985-11-13 1990-11-27 Fujitsu Limited IC sheet cutting press and IC sheet processing apparatus using the same
US4819476A (en) * 1987-07-17 1989-04-11 Amp Incorporated Tooling for forming machines having improved guidance, tool mounting, and pilot pin systems
NL9100470A (en) * 1991-03-15 1992-10-01 Asm Fico Tooling METHOD AND APPARATUS FOR MANUFACTURING A SINGLE PRODUCT FROM INTEGRATED CIRCUITS INCLUDED ON A LEADFRAME
US5570273A (en) * 1993-08-31 1996-10-29 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with low-profile detachable module
US5557504A (en) * 1993-08-31 1996-09-17 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with detachable module
USD358804S (en) 1993-09-02 1995-05-30 Sgs-Thomson Microelectronics, Inc. Detachable integrated circuit module
USD358805S (en) 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Detachable integrated circuit module
EP0823719B1 (en) * 1996-07-26 2002-06-05 Nec Corporation Solid electrolytic capacitor having pre-plated lead terminals and manufacturing process thereof
JP2000243889A (en) * 1999-02-22 2000-09-08 Sony Corp Apparatus and method for processing shape of lead frame for semiconductor device and lead frame for semiconductor device
WO2018087027A1 (en) * 2016-11-11 2018-05-17 Lumileds Holding B.V. Method of manufacturing a lead frame
CN117644134B (en) * 2024-01-23 2024-05-14 佛山市阿玛达机械科技有限公司 Cold roll forming device for sheet metal processing and operation method thereof
CN121755608A (en) * 2024-09-26 2026-03-31 恩智浦美国有限公司 Method and apparatus for deforming the J-shaped pins of a packaged semiconductor device.
CN119747739B (en) * 2025-03-07 2025-07-18 厦门特克精密工业有限公司 Lead frame cutting device and cutting process

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3571920A (en) * 1965-12-16 1971-03-23 Berg Electronics Inc Method for transistor manufacture
US3440027A (en) * 1966-06-22 1969-04-22 Frances Hugle Automated packaging of semiconductors
US3524249A (en) * 1966-10-08 1970-08-18 Nippon Electric Co Method of manufacturing a semiconductor container
US3559285A (en) * 1968-01-08 1971-02-02 Jade Corp Method of forming leads for attachment to semi-conductor devices

Also Published As

Publication number Publication date
FR2106369A1 (en) 1972-05-05
AT318042B (en) 1974-09-25
FR2106369B1 (en) 1977-04-22
DE2143809A1 (en) 1972-03-09
CA966986A (en) 1975-05-06
AU3235571A (en) 1973-02-15
BE772314A (en) 1972-03-07
GB1305337A (en) 1973-01-31
NL7112352A (en) 1972-03-10
US3650232A (en) 1972-03-21
ES394780A1 (en) 1974-03-01
SE360216B (en) 1973-09-17

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