AU509072B2 - Electroless copper plating solution - Google Patents
Electroless copper plating solutionInfo
- Publication number
- AU509072B2 AU509072B2 AU24999/77A AU2499977A AU509072B2 AU 509072 B2 AU509072 B2 AU 509072B2 AU 24999/77 A AU24999/77 A AU 24999/77A AU 2499977 A AU2499977 A AU 2499977A AU 509072 B2 AU509072 B2 AU 509072B2
- Authority
- AU
- Australia
- Prior art keywords
- plating solution
- copper plating
- electroless copper
- electroless
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU24999/77A AU509072B2 (en) | 1977-05-09 | 1977-05-09 | Electroless copper plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU24999/77A AU509072B2 (en) | 1977-05-09 | 1977-05-09 | Electroless copper plating solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU2499977A AU2499977A (en) | 1978-11-16 |
| AU509072B2 true AU509072B2 (en) | 1980-04-17 |
Family
ID=3713879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU24999/77A Expired AU509072B2 (en) | 1977-05-09 | 1977-05-09 | Electroless copper plating solution |
Country Status (1)
| Country | Link |
|---|---|
| AU (1) | AU509072B2 (en) |
-
1977
- 1977-05-09 AU AU24999/77A patent/AU509072B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| AU2499977A (en) | 1978-11-16 |
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