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AU523988B2 - Depositing epitaxial layer from gaseous phase - Google Patents
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AU523988B2 - Depositing epitaxial layer from gaseous phase - Google Patents

Depositing epitaxial layer from gaseous phase

Info

Publication number
AU523988B2
AU523988B2 AU46046/79A AU4604679A AU523988B2 AU 523988 B2 AU523988 B2 AU 523988B2 AU 46046/79 A AU46046/79 A AU 46046/79A AU 4604679 A AU4604679 A AU 4604679A AU 523988 B2 AU523988 B2 AU 523988B2
Authority
AU
Australia
Prior art keywords
epitaxial layer
gaseous phase
depositing epitaxial
depositing
gaseous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU46046/79A
Other versions
AU4604679A (en
Inventor
Paulus Zacharias Antonius Maria Van Der Putte
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of AU4604679A publication Critical patent/AU4604679A/en
Application granted granted Critical
Publication of AU523988B2 publication Critical patent/AU523988B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/15Diffusion of dopants within, into or out of semiconductor bodies or layers from the substrate during epitaxy, e.g. autodoping; Preventing or using autodoping
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • H10P14/2902Materials being Group IVA materials
    • H10P14/2905Silicon, silicon germanium or germanium
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3411Silicon, silicon germanium or germanium
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/36Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done before the formation of the materials
AU46046/79A 1978-04-21 1979-04-12 Depositing epitaxial layer from gaseous phase Ceased AU523988B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NLAANVRAGE7804268,A NL187414C (en) 1978-04-21 1978-04-21 METHOD FOR APPLYING AN EPITAXIAL LAYER
NL7804268 1978-04-21

Publications (2)

Publication Number Publication Date
AU4604679A AU4604679A (en) 1979-10-25
AU523988B2 true AU523988B2 (en) 1982-08-26

Family

ID=19830695

Family Applications (1)

Application Number Title Priority Date Filing Date
AU46046/79A Ceased AU523988B2 (en) 1978-04-21 1979-04-12 Depositing epitaxial layer from gaseous phase

Country Status (8)

Country Link
JP (1) JPS54141560A (en)
AU (1) AU523988B2 (en)
CA (1) CA1134059A (en)
DE (1) DE2915883C2 (en)
FR (1) FR2423865A1 (en)
GB (1) GB2019644B (en)
IT (1) IT1112317B (en)
NL (1) NL187414C (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0671770B1 (en) * 1993-02-09 2000-08-02 GENERAL SEMICONDUCTOR, Inc. Multilayer epitaxy for a silicon diode
JP6477210B2 (en) 2015-04-30 2019-03-06 株式会社Sumco Method of manufacturing epitaxial silicon wafer
JP6358472B2 (en) * 2015-06-08 2018-07-18 信越半導体株式会社 Epitaxial wafer manufacturing method
JP6447960B2 (en) * 2016-04-01 2019-01-09 信越半導体株式会社 Manufacturing method of silicon epitaxial wafer

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL288409A (en) * 1962-02-02
DE2547692C3 (en) * 1975-10-24 1979-10-31 Siemens Ag, 1000 Berlin Und 8000 Muenchen Method for manufacturing a semiconductor device

Also Published As

Publication number Publication date
NL7804268A (en) 1979-10-23
JPS54141560A (en) 1979-11-02
NL187414C (en) 1991-09-16
GB2019644A (en) 1979-10-31
IT7921949A0 (en) 1979-04-18
FR2423865B1 (en) 1984-07-27
DE2915883C2 (en) 1987-01-22
DE2915883A1 (en) 1979-10-31
AU4604679A (en) 1979-10-25
IT1112317B (en) 1986-01-13
CA1134059A (en) 1982-10-19
FR2423865A1 (en) 1979-11-16
GB2019644B (en) 1982-09-29
NL187414B (en) 1991-04-16
JPS5538819B2 (en) 1980-10-07

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