AU547739B2 - Electroless copper deposition solutions - Google Patents
Electroless copper deposition solutionsInfo
- Publication number
- AU547739B2 AU547739B2 AU80875/82A AU8087582A AU547739B2 AU 547739 B2 AU547739 B2 AU 547739B2 AU 80875/82 A AU80875/82 A AU 80875/82A AU 8087582 A AU8087582 A AU 8087582A AU 547739 B2 AU547739 B2 AU 547739B2
- Authority
- AU
- Australia
- Prior art keywords
- electroless copper
- copper deposition
- deposition solutions
- solutions
- electroless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 230000008021 deposition Effects 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU80875/82A AU547739B2 (en) | 1981-12-21 | 1981-12-21 | Electroless copper deposition solutions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU80875/82A AU547739B2 (en) | 1981-12-21 | 1981-12-21 | Electroless copper deposition solutions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU8087582A AU8087582A (en) | 1983-07-15 |
| AU547739B2 true AU547739B2 (en) | 1985-10-31 |
Family
ID=3759817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU80875/82A Ceased AU547739B2 (en) | 1981-12-21 | 1981-12-21 | Electroless copper deposition solutions |
Country Status (1)
| Country | Link |
|---|---|
| AU (1) | AU547739B2 (en) |
-
1981
- 1981-12-21 AU AU80875/82A patent/AU547739B2/en not_active Ceased
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