AU610283B2 - An arrangement for deactivating integrated circuits electrically - Google Patents
An arrangement for deactivating integrated circuits electrically Download PDFInfo
- Publication number
- AU610283B2 AU610283B2 AU25564/88A AU2556488A AU610283B2 AU 610283 B2 AU610283 B2 AU 610283B2 AU 25564/88 A AU25564/88 A AU 25564/88A AU 2556488 A AU2556488 A AU 2556488A AU 610283 B2 AU610283 B2 AU 610283B2
- Authority
- AU
- Australia
- Prior art keywords
- deactivating
- foil
- circuit
- capacitors
- arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/601—Capacitive arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
I~ II i 4 'i -I A6 OPI DATE 02/05/89 AOJP DATE 15/06/89
WORLD
APPLN. ID 25564 88 PCT Nu ,ER PCT/SE88/00493
PCT
INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (51) International Patent Classification 4 (11) International Publication Number: WO 89/ 03634 3/32 Al (43) International Publication Date: 20 April 1989 (20.04.89) (21) International Application Number: PCT/SE88/00493 (81) De t tat.T op ]at AU, BE (Eur-n ten uro patent), DE (22) International Filing Date. 23 September 1988 (23.09.88) peal palf, FI ean patent), GB (European patent ,HU (Erpean patent), JP, KP, KR, LU (European patent), NL (European (31) Priority Application Number: 8703913-7 patent), NO, SE (European patent), SU, US.
(32) Priority Date: 9 October 1987 (09.10.87) Published (33) Priority Country: SE With international search report.
(71) Applicant (for all designated States except US): CAR- MIS ENTERPRISES S.A. [CH/CH]; Torello Torello, 1, rue Monnier, CH-1206 Geneve (CH).
(72) Inventor; and Inventor/Applicant (for US only) RIMAN, Alf [SE/ SE]; Akervagen 21, S-352 49 Vaxj (SE).
(74) Agent: OMMING, Allan; A Omming Co AB, Sveavagen 28-30, S-1ll 34 Sto-kholm (SE).
(54) Title: AN ARRANGEMENT FOR DEACTIVATING INTEGRATED CIRCUITS ELECTRICALLY 8 "4 +2 7 L 4 3 (57) Abstract The invention relates to an arrangement for electrically deactivating IC-circiits by means of deactivating capacitors.
A particularly simple and effective electrical deactivation of such circuits is achieved in accordance with the invention by mounting, e.g. gluing, a metal foil on the circuit. The earth connection of the circuit is connected to the edge of the foil through a short conductor and each of the signal output and supply conductor is connected directly to the foil edge through a respective soldered chip capacitor 8).
CARMIS ENTERP I ES S A S. i SFP4 To: The Commissioner of Patents nature of Declarant( 11/81 Mario D Torello WO 89/03634 PCT/SE88/00493 1 An arrangement for deactivating integrated circuits electrically.
The present invention relates to an arrangement for deactivating integrated circuits electrically with the aid of deactivating capacitors connected between earth/signal outputs and/or earth/supply lines.
Troublesome interference occurs when a large number of fast acting integrated circuits, so-called IC-circuits, are connected together to a unit, e.g. a computer or data processor. For example, functioning of the equipment is on the one hand disturbed by surrounding influences, such as other computers, radio receivers, TV-apparatus and, on the other hand, the equipment itself has a disturbing influence on such peripheral apparatus and equipment, thereby producing erroneous results or no result at all. The interference referred to here is an electromagnetic interference (EMI), which may be radiating or conductorbound.
In addition to the problems which are manifested solely as interference, there is also a danger that the equipment will emit signals which can be captured at locations distansed from the equipment itself and utilized to obtain unauthorized or classified information, so-called revealing signals.
All of these problems are well known in the art. Thus, the surroundings can be shielded from these signals, by metalencapsulation of the equipment involved and by filtering the input and output signals. Such metal encapsulation becomes verv exoensive and difficult to effect, however, when the equipment concerned includes displays, visual display screens, keyboards, etc.. Furthermore, encapsula- WO 89/03634 PCT/SE88/00493, 2 tion does not assist against interference internally of the equipment. In order to safeguard against internal interference, it is standard practice to include a capacitor 4btween the supply voltage and earth on a circuit board or card in the case of IC-circuits.
This solution is also encumbered with a number of drawbacks, however. For example, the solution is not particularly effective and does not assist against signals of a revealing nature or EMI. Furthermore, the devices required herefor require too much space in compact equipment.
Other solutions, exhaustively described in the literature, include the use of ferrite filters, ferrite plates, multilayer circuit board and flat caoacitors for fitting above or beneath IC-circuits. A further possibility is that of mounting one or more capacitors in a dense array above an IC-circuit. This solution is also inefficient, however.
None of the known solutions is sufficiently effective or simple enough for efficient application, particularly not to existing equipment.
Consequently, an object of the present invention is to provide a simple, inexpensive and effective solution to the problem of deactivating IC-circuits electrically.
This object is achieved in accordance with the invention by covering at least the major part of the under-surface or over-surface of such an IC-circuit with a metal foil which is connected to the earth connection of the circuit by means of a short conductor extending to the edge of the foil and with the signal outputs and/or the supply conductor of the circuit also connected to the edges of the foil, via the deactivating capacitors. A deactivator of this kind can be easily constructed. The metal foil may, WO 89/03634 PCT/SE88/00493 3 advantageously, be glued to one side of the IC-circuit, level with the edge surfaces thereof, and to this end may be self-adhesive. Connection of the deactivating capacitors then becomes highly practicable and easy to carry out, particularly when one or more of these capacitors consist of chip capacitors soldered between on one hand respective signal outputs or the supply conductor and on the other hand adjacent points on the foil edge.
Deactivation of an integrated circuit in accordance with the invention fulfills all of the criteria upon which effective deactivation depends, such as the presence of short and broad supply conductors so as to obtain a low series inductance, supply-voltage and signal-voltage application surfaces of small dimensions (small areas, short lengths), smallest possible loop area, low capacitor losses and low impeJance of the earthing surface. The effect produced by the present invention can be confirmed in practice, suitably by carrying out comparison tests, as recited in the following description.
The invention will now be described in more detail with reference to the accompanying drawing, which illustrates schematically an exemplifying embodiment of the inventive arrangement and test apparatus with associated result curves. More specifically: Figure 1 is a perspective view of an IC-circuit according to the invention; Figure 2 is a diagrammatic illustration of test apparatus; Figure 3 is a circuit diagram of the tested IC-circuit with connections; and Figures h, 5, 6 and 7 illustrate curves obtained in the tests.
I
WO 89/03634 PCT/SE88/00493 4 In the embodiment illustrated in Figure 1, an IC-circuit in the form of a conventional elongated capsule 1 which has a sheet of copper foil 2 firmly glued to the upper surface thereof. The connecting legs of the capsule are arranged along the two long sides of the capsule, wherewith the leg 3 is earthed and the leg 4 is an output. A voltage supply leg 5 is arranged on the hidden side of the caosule. The earthed leg 3 is connected to the edge of the foil 2 by means of a very short firmly soldered conductor 6, and the output leg 4 is connected to the edge of said foil through a firmly welded clip capacitor 7. The voltage supply leg 5 is connected to the edge of the foil through a further chip capacitor 8.
In the diagrammatic Figure 2 illustration an IC-capsule 1 is located in a screened room 10. The capsule 1 is connected to a signal generator 11. Also located in the screened room is a biconcave-antenna 12, which is connected to an antenna amplifier 13, a spectrum analyser 14 and a printer The IC-circuit 1 illustrated in Figure 3 has marked thereon three points A-E, of which points A and E represent points on a circuit board adjacent the capsule 1 and the points B, C, D are points located directly on the capsule legs.
The following measurements were made with a capacitor of 150 nF coupled between A and E.
1. No additional measures taken, corresponding to the normal situation in a computer e.g. max EMI-level 56 dB (Figure 4) ,1 -;1 WO 89/03634 PCT/SE88/00493 2. 100 nF 4, 7 nF between BoD: max EMI-level 34 dB 47 nF 4, 7 nF between CoD (Figure 3. As 2+ferrite plate (Figure 6) max EMI-level 28 dB 4. Chip capacitor 100 nF between BoD max EMI-level 13 dB Chip capacitor U7 nF between CoD.
and copper foil mounted in accordance with the description (Figure 7).
As will be seen from Figures 4-6 and Figure 7, there is a considerable difference between the conventional arrangements according to 1-3 above and the inventive arrangement represented by 4.
f
Claims (3)
1. An arrangement for electrically deactivating integrated circuits by means of deactivating capacitors located between earth/signal outputs and/or earth/supply conduc- tors, characterized in that at least the major part of the upper surface or the bottom surface of such an integrated circuit is covered with metal foil which is con- nected to the earth connection of the circuit by means of a short conductor to the edge of the foil and to the circuit signal outputs and/or supply conductor via the deactivating capacitors 8) which are also connected to the foil edges.
2. An arrangement according to Claim 1, characterized in that one or more of the deactivating capacitors is/are chip capacitors 8) soldered between on the one hand respective signal outputs or supply conductor and on the other hand adjacent points on the foil edge.
3. An arrangement according to Claim 1 or 2, characterized in that the metal foil is glued to one side of the integrated circuit flush with the edges of said side. J
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE8703913A SE458004C (en) | 1987-10-09 | 1987-10-09 | DEVICE FOR ELECTRIC RELAXATION OF INTEGRATED CIRCUITS |
| SE8703913 | 1987-10-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU2556488A AU2556488A (en) | 1989-05-02 |
| AU610283B2 true AU610283B2 (en) | 1991-05-16 |
Family
ID=20369821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU25564/88A Ceased AU610283B2 (en) | 1987-10-09 | 1988-09-23 | An arrangement for deactivating integrated circuits electrically |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US4920444A (en) |
| EP (1) | EP0391926A1 (en) |
| JP (1) | JPH03500593A (en) |
| KR (1) | KR890702419A (en) |
| CN (1) | CN1013463B (en) |
| AU (1) | AU610283B2 (en) |
| BG (1) | BG51169A3 (en) |
| BR (1) | BR8807736A (en) |
| DK (1) | DK86990D0 (en) |
| ES (1) | ES2009117A6 (en) |
| FI (1) | FI901524A0 (en) |
| HU (1) | HUT54265A (en) |
| SE (1) | SE458004C (en) |
| WO (1) | WO1989003634A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5557504A (en) * | 1993-08-31 | 1996-09-17 | Sgs-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with detachable module |
| US5570273A (en) * | 1993-08-31 | 1996-10-29 | Sgs-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with low-profile detachable module |
| USD358804S (en) | 1993-09-02 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Detachable integrated circuit module |
| USD358805S (en) | 1993-09-24 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Detachable integrated circuit module |
| US6274224B1 (en) | 1999-02-01 | 2001-08-14 | 3M Innovative Properties Company | Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article |
| US6577492B2 (en) | 2001-07-10 | 2003-06-10 | 3M Innovative Properties Company | Capacitor having epoxy dielectric layer cured with aminophenylfluorenes |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3614546A (en) * | 1970-01-07 | 1971-10-19 | Rca Corp | Shielded semiconductor device |
| US4177480A (en) * | 1975-10-02 | 1979-12-04 | Licentia Patent-Verwaltungs-G.M.B.H. | Integrated circuit arrangement with means for avoiding undesirable capacitive coupling between leads |
| US4598307A (en) * | 1982-09-22 | 1986-07-01 | Fujitsu Limited | Integrated circuit device having package with bypass capacitor |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4636918A (en) * | 1982-07-30 | 1987-01-13 | Rogers Corporation | Decoupled integrated circuit package |
| JPS5934625A (en) * | 1982-08-20 | 1984-02-25 | 松尾電機株式会社 | Method of producing chip solid electrolyte condenser |
| JPS60117705A (en) * | 1983-11-30 | 1985-06-25 | 日本メクトロン株式会社 | Bypass capacitor for integrated circuit |
| US4626958A (en) * | 1985-01-22 | 1986-12-02 | Rogers Corporation | Decoupling capacitor for Pin Grid Array package |
-
1987
- 1987-10-09 SE SE8703913A patent/SE458004C/en not_active IP Right Cessation
-
1988
- 1988-09-23 WO PCT/SE1988/000493 patent/WO1989003634A1/en not_active Ceased
- 1988-09-23 HU HU886251A patent/HUT54265A/en unknown
- 1988-09-23 BR BR888807736A patent/BR8807736A/en unknown
- 1988-09-23 JP JP63508452A patent/JPH03500593A/en active Pending
- 1988-09-23 FI FI901524A patent/FI901524A0/en not_active IP Right Cessation
- 1988-09-23 AU AU25564/88A patent/AU610283B2/en not_active Ceased
- 1988-09-23 EP EP88909138A patent/EP0391926A1/en not_active Withdrawn
- 1988-10-03 US US07/251,640 patent/US4920444A/en not_active Expired - Fee Related
- 1988-10-07 ES ES8803499A patent/ES2009117A6/en not_active Expired
- 1988-10-08 CN CN88109121A patent/CN1013463B/en not_active Expired
-
1989
- 1989-06-08 KR KR1019890701031A patent/KR890702419A/en not_active Withdrawn
-
1990
- 1990-04-02 BG BG091634A patent/BG51169A3/en unknown
- 1990-04-06 DK DK086990A patent/DK86990D0/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3614546A (en) * | 1970-01-07 | 1971-10-19 | Rca Corp | Shielded semiconductor device |
| US4177480A (en) * | 1975-10-02 | 1979-12-04 | Licentia Patent-Verwaltungs-G.M.B.H. | Integrated circuit arrangement with means for avoiding undesirable capacitive coupling between leads |
| US4598307A (en) * | 1982-09-22 | 1986-07-01 | Fujitsu Limited | Integrated circuit device having package with bypass capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| BG51169A3 (en) | 1993-02-15 |
| BR8807736A (en) | 1990-08-07 |
| KR890702419A (en) | 1989-12-23 |
| AU2556488A (en) | 1989-05-02 |
| DK86990A (en) | 1990-04-06 |
| SE8703913D0 (en) | 1987-10-09 |
| HU886251D0 (en) | 1990-11-28 |
| ES2009117A6 (en) | 1989-08-16 |
| FI901524A7 (en) | 1990-03-27 |
| SE458004B (en) | 1989-02-13 |
| CN1032470A (en) | 1989-04-19 |
| HUT54265A (en) | 1991-01-28 |
| WO1989003634A1 (en) | 1989-04-20 |
| EP0391926A1 (en) | 1990-10-17 |
| CN1013463B (en) | 1991-08-07 |
| SE458004C (en) | 1991-10-07 |
| JPH03500593A (en) | 1991-02-07 |
| DK86990D0 (en) | 1990-04-06 |
| US4920444A (en) | 1990-04-24 |
| FI901524A0 (en) | 1990-03-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0663142B1 (en) | Electromagnetic radiation reduction technique using grounded conductive traces circumscribing internal planes of printed circuit boards | |
| CA2064859C (en) | Multi-layer circuit board that suppresses radio frequency interference from high frequency signals | |
| US8559189B2 (en) | Riser card for power supply | |
| JPH0447998B2 (en) | ||
| JP2001160663A (en) | Circuit board | |
| GB2143954A (en) | A capacitive method and apparatus for checking connections of a printed circuit board | |
| JPH036626B2 (en) | ||
| AU610283B2 (en) | An arrangement for deactivating integrated circuits electrically | |
| US5519583A (en) | Integrated common mode current decoupler for I/O cables | |
| EP0636887A1 (en) | Probe for capacitive open-circuit tests | |
| EP1031839A3 (en) | Test fixture for matched impedance testing | |
| EP1061784B1 (en) | Radio-electronic unit | |
| CN214481451U (en) | A PCB laminated structure and circuit board | |
| US6103978A (en) | Printed wiring board having inner test-layer for improved test probing | |
| EP0619936B1 (en) | A method and a device to measure electromagnetic radiation emitted from or received by a circuit card | |
| US20090115399A1 (en) | Shielded Current Sensor | |
| US6477057B1 (en) | High frequency de-coupling via short circuits | |
| US6411113B1 (en) | Radio frequency test fixture | |
| AU2002215000A1 (en) | Module for a testing device for testing printed circuit boards | |
| AU3192201A (en) | Radiocommunication module in the form of an electronic macro-component, corresponding interface structure and transfer method onto a motherboard | |
| JPS59188992A (en) | Printed circuit board | |
| US6542382B2 (en) | Densely arranged electrically shielded communication panels | |
| CN210376216U (en) | Printed circuit board, display device and attaching test system | |
| WO2000004585A3 (en) | Chip carrier device and method for the production of a chip carrier device with an electrical test | |
| JPS5812477Y2 (en) | Shield structure of high frequency equipment |