AU644108B2 - Trivinyl ethers of polyols - Google Patents
Trivinyl ethers of polyolsInfo
- Publication number
- AU644108B2 AU644108B2 AU65484/90A AU6548490A AU644108B2 AU 644108 B2 AU644108 B2 AU 644108B2 AU 65484/90 A AU65484/90 A AU 65484/90A AU 6548490 A AU6548490 A AU 6548490A AU 644108 B2 AU644108 B2 AU 644108B2
- Authority
- AU
- Australia
- Prior art keywords
- formula
- compound
- acetylene
- trivinyl ether
- ether
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 229920005862 polyol Polymers 0.000 title claims description 7
- 150000003077 polyols Chemical class 0.000 title claims description 7
- 150000002170 ethers Chemical class 0.000 title claims description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 41
- 239000000203 mixture Substances 0.000 claims description 26
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 16
- 150000001875 compounds Chemical class 0.000 claims description 14
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 12
- 230000005855 radiation Effects 0.000 claims description 10
- 238000006886 vinylation reaction Methods 0.000 claims description 6
- -1 ether compound Chemical class 0.000 claims description 5
- 239000012952 cationic photoinitiator Substances 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- 239000003054 catalyst Substances 0.000 claims description 3
- GXBYFVGCMPJVJX-UHFFFAOYSA-N Epoxybutene Chemical compound C=CC1CO1 GXBYFVGCMPJVJX-UHFFFAOYSA-N 0.000 claims description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 claims 3
- 239000011261 inert gas Substances 0.000 claims 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 42
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 22
- 238000000576 coating method Methods 0.000 description 13
- 125000005677 ethinylene group Chemical group [*:2]C#C[*:1] 0.000 description 13
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 12
- 238000009472 formulation Methods 0.000 description 11
- 229910052757 nitrogen Inorganic materials 0.000 description 11
- 239000000178 monomer Substances 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 8
- 238000001723 curing Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 239000003085 diluting agent Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000003847 radiation curing Methods 0.000 description 7
- 229960000834 vinyl ether Drugs 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 150000002314 glycerols Chemical class 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 229930185605 Bisphenol Natural products 0.000 description 4
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000001294 propane Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 238000013019 agitation Methods 0.000 description 3
- 229940052303 ethers for general anesthesia Drugs 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 description 3
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 3
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 239000012043 crude product Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 150000002924 oxiranes Chemical class 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 239000011253 protective coating Substances 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 2
- 238000001029 thermal curing Methods 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- VOBUAPTXJKMNCT-UHFFFAOYSA-N 1-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound CCCCCC(OC(=O)C=C)OC(=O)C=C VOBUAPTXJKMNCT-UHFFFAOYSA-N 0.000 description 1
- PKDBCJSWQUOKDO-UHFFFAOYSA-M 2,3,5-triphenyltetrazolium chloride Chemical compound [Cl-].C1=CC=CC=C1C(N=[N+]1C=2C=CC=CC=2)=NN1C1=CC=CC=C1 PKDBCJSWQUOKDO-UHFFFAOYSA-M 0.000 description 1
- KTIBRDNFZLYLNA-UHFFFAOYSA-N 2-(2-hydroxyethenoxy)ethenol Chemical compound OC=COC=CO KTIBRDNFZLYLNA-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical class CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- JUDXBRVLWDGRBC-UHFFFAOYSA-N [2-(hydroxymethyl)-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(COC(=O)C(C)=C)COC(=O)C(C)=C JUDXBRVLWDGRBC-UHFFFAOYSA-N 0.000 description 1
- VZTQQYMRXDUHDO-UHFFFAOYSA-N [2-hydroxy-3-[4-[2-[4-(2-hydroxy-3-prop-2-enoyloxypropoxy)phenyl]propan-2-yl]phenoxy]propyl] prop-2-enoate Chemical compound C=1C=C(OCC(O)COC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OCC(O)COC(=O)C=C)C=C1 VZTQQYMRXDUHDO-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 125000002877 alkyl aryl group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000000711 cancerogenic effect Effects 0.000 description 1
- 231100000315 carcinogenic Toxicity 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012949 free radical photoinitiator Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011346 highly viscous material Substances 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 239000000852 hydrogen donor Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 239000002085 irritant Substances 0.000 description 1
- 231100000021 irritant Toxicity 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910000103 lithium hydride Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 235000013772 propylene glycol Nutrition 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 238000005690 transetherification reaction Methods 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical class C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- 239000003039 volatile agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C43/00—Ethers; Compounds having groups, groups or groups
- C07C43/02—Ethers
- C07C43/03—Ethers having all ether-oxygen atoms bound to acyclic carbon atoms
- C07C43/14—Unsaturated ethers
- C07C43/15—Unsaturated ethers containing only non-aromatic carbon-to-carbon double bonds
- C07C43/16—Vinyl ethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F16/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F16/12—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an ether radical
- C08F16/32—Monomers containing two or more unsaturated aliphatic radicals
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Paints Or Removers (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Description
TRIVINYL ETHERS OF POLYOLS
This invention relates to trivinyl ether monomers and resin formulations thereof useful in applications which require high speed cationic initiated radiation curing.
Radiation curable coatings and films such as those formed from an acrylate oligomer are in great demand because of their rapid curing properties. However, these compounds are normally highly viscous liquids or solids and thus are unsuitable as diluents for other polymeric components of a radiation curable formulation. Indeed, such compounds themselves require the incorporation of a diluent or solvent for uniform substrate coating, control of coating thickness and curing at low temperatures. Accordingly, low viscosity monofunctional diluents are usually included in their formulations. While these diluents are reactive, they materially reduce the cross-linked density of the finished product and consequently lower abrasion resistance and ability to withstand chemical attack.
Although solvents have been used to reduce viscosity, they are detrimental in radiation curing due to their volatility which presents problems for uniform composition control unless their evaporation prior to radiant exposure is effected. Obviously, such procedure extends processing time and may pose environmental drawbacks.
To some extent, the drawbacks of high viscosity monomers can be reduced by curing at elevated temperatures. However, this alternative significantly adds to the cost of the overall operation in the expenditure of energy, temperature control and loss of more volatile components in the composition or blistering of the coating resulting from entrained volatiles.
Since acrylates are not conducive to cationically induced radiation curing, they require more costly free radical systems which are oxygen inhibited unless effected in an inert atmosphere, generally under a blanket of nitrogen. Although formulation with a photoinitiator which undergoes bimolecular reaction with a hydrogen donor minimizes the inhibitory effect of air, this benefit is realized at the expense of a greatly reduced cure rate. Also, it is found that polymerization or curing in free radical systems ceases almost immediately upon removal from the source of radiation; thus, the cured product usually contains significant amounts of unpolymerized components. Accordingly, it is an aim of research to develop a monomer having the beneficial properties of acrylates but which is amenable to radiation curing at a rapid rate by cationically induced polymerization which is not oxygen inhibited and which permits continued polymerization after removal from the source of radiation exposure.
Finally, it is noted that the unsubstituted acrylates are sensitizers and skin irritants as well as being carcinogenic, so that specialized safety precautions must be taken to protect operators from exposure.
Certain epoxy compounds also have been used as coatings; however these monomers and their oligomers are not readily curable by radiation. Thermal curing is generally required to increase the rate of polymerization. While vinyl ethers such as those ethers the polyethylene glycols are curable by UV light, their resulting coatings lack toughness and substrate substantivity. Also these materials have low viscosity such that it is difficult to obtain film build-up prior to curing.
Vinyl ether compounds, and methods for effectively cationically polymerizing such compounds, have been described in the literature. See, for example, U.S. Patents 4,161,405; 4,518,788; 4,751,273; 4,775,732; and 4,749,807. However, the art is limited with respect to multifunctional vinyl ether monomers, and to formulations thereof, for forming protective coatings.
What is provided herein is a trifunctional vinyl ether monomer having the formula (I) :
CH2OCH=CH2 CH3-C-CH2-0CH=CH2 CH2-OCH=CH2
which is the trivinyl ether of l,l,l-tris(hydroxymethyl) ethane; and trivinyl ethers of alkoxylated glycerol having the formula (II) :
where 1 + m + n = 1 to 20; and
X and Y are independently H or CH3.
In the preferred forms of formula (II) , 1 + m + n = 3 to 10, corresponding to an ethoxylated or propoxylated glycerol, respectively.
The radiation curable compositions of formula (II) include:
(a) between about 1 and 99.9 wt. % of a trivinyl ether of alkoxylated glycerol;
(b) between about 0.1 and about 5 wt. % of a cationic photoinitiator; and
(c) between about 0 and 99 wt. % of a polymerizable vinyl ether, epoxide, or acrylate oligomer.
The preferred compositions of formula (II) are those having from about 45 to about 95 wt. % of component (a) wherein:
1 + m + n = 3 to 10;
from about 0.5 to about 2 wt. % of component (b) ; and from about 0 to about 50 wt. % of component (c) .
Preferred trivinyl ether compounds (a) of formula (II) include the trivinyl ether of an ethoxylated glycerol having the formula:
and the trivinyl ether of a propoxylated glycerol having the formula:
The monomer of formula (I) may be prepared by direct vinylation of l,l,l-tris(hydroxymethyl) ethane with acetylene. In the batch form of the reaction, the mole ratio of polyol to acetylene can vary between about 1:3 and about 1:4.5. In the batch or continuous form of the process, the acetylene gas is bubbled through the polyol liquid itself, or a solution of the polyol in a suitable solvent, such as the dimethyl ether of tetraethylene glycol. Other methods of preparation also may be used for synthesis of the compound of the invention, such as catalytic transetherification of the polyol with a suitable vinyl ether having a boiling point higher than the monomer product.
The acetylene can be introduced into the reaction zone without dilution if present at low pressures; however, at elevated pressures, it is recommended that an inert non-oxygen containing gaseous diluent, such as nitrogen, a cl~c 3 alJcane or helium be used to dilute the acetylene reactant. When a diluent is employed, an acetylene concentration as low as 10% can be used, although between about 40 and about 60 wt. % acetylene in a diluent is most preferred.
The reaction is carried out in an oxygen free atmosphere which is generally achieved by purging with nitrogen and in the presence of a basic catalyst, such as an alkali metal hydroxide, e.g. potassium hydroxide, sodium hydroxide, and sodium, potassium or lithium metal, or hydride thereof. The concentration of catalyst employed can range from about 0.01% to about 5% by weight.
The process is effected at a temperature of between about 120° and about 180°C. , under from about 10 to about 200 psig. total pressure, in a period of from about 2 to about 100 hours reaction time. Preferred conditions include a temperature of between about 140° to about 170βC., under between about 50 and about 100 psig. acetylene pressure and a reaction period of from about 4 to 70 hours.
The trivinyl ether monomers of formula (II) may be prepared by direct vinylation of an ethoxylated or propoxylated glycerol with acetylene to provide monomers of the general formula above.
In either the batch or continuous process of the invention, the acetylene gas is bubbled through the alkoxylated glycerol liquid itself, or a solution of the alkoxylated glycerol in a suitable solvent, such as the dimethyl ether of tetraethylene glycol.
Examples of the cationic photoinitiator, component (b) , include the triphenyl sulfonium salt of phosphorous hexafluoride, diphenyl iodium salt, tetrazolium chloride, a phenyl onium salt and an alkyl aryl onium salt. A preferred cationic photoinitiator is triphenyl sulfonium hexafluorophosphate.
Suitable examples of the oligomer component (c) , include any of the mono- and di- vinyl ethers of di-, tri- or tetra- ethylene or propylene glycols; C2 to C20 alkylene divinyl ethers; benzene divinyl ether; and the corresponding thioethers and epoxides; and acrylates such as pentaerythritol triacrylate. Mixtures of such compounds also may be used. Preferred oligo ers are bisphenol. diepoxide; triethylene glycol divinyl ether; acrylated epoxides; vinyl ether functionalized oligomers; and hexanediol diacrylate or methacrylate, pentaerythritol triacrylate and trimethacrylate.
The above compositions are readily prepared by mixing the components in any order until a uniform mixture is obtained. The resulting composition which is a viscous liquid is easily applied to a substrate in a thickness of from about 0.1 to about 20 mils, preferably from about 0.5 to about 10 mils. Suitable substrates include glass, ceramic, metal, plastic, wood, masonary and fabrics.
Because of the improved liquid viscosity, it is possible to retain higher thicknesses of film build-up on the substrate surface. By regulating the amounts of component (a) with respect to component (c) , the desired viscosity, e.g. between about 30 and about 1,000 cps, is achieved without the introduction of extraneous chemical solvents and the like. The presence of the multifunctional vinyl ethers also permits rapid radiation curing, for example within a period of less than one second exposure to between about 100 to about 800 millijoules/cm2 of uv light; between about 0.5 and about 5 megarads dosage of radiation from an electron beam or equivalent dosage from laser emissions. It is to be understood that many other, sources of radiation can be used to effect curing. The radiation curing process is carried out at about room temperature under ambient pressure in the absence of solvent normally required with highly viscous materials.
The present compositions also lend themselves to thermal curing procedures effected at a temperature between about 70°C. and about 150°C. for a period of from about 5 to about 25 minutes in the presence of conventional initiators. Because of their sensitivity to curing by exposure to a source of radiation, the present products are also useful as photoresists when coated on a photographic film.
The compositions of this invention, when cured, provide clear films or coatings of superior toughness, abrasion resistance, and resistance to chemical attack in acid or basic media.
EXAMPLE 1
Preparation of the Trivinyl Ether of 1,1,1-Tris(Hydroxymethy1) Ethane
Tris(hydroxymethyl) ethane (1201.5 g) , tetraethylene glycol dimethyl ether (1000 g) and potassium hydroxide, 85% pellets (30 g) were charged into a one-gallon autoclave. The autoclave was purged three times with nitrogen, heated to 110βC. and held under vacuum at 20 mm Hg for 10 minuts. Propane (100 psig.) was then added and the temperature was raised to 140°C. The propane pressure was readjusted to 100 psig. and acetylene (100 psig.) was introduced to start the vinylation. The reaction was complete in 62 hours. The autoclave was then cooled to room temperature, purged two times with nitrogen and discharged. 2797 g of crude product was obtained which contained 86.4% of the trivinyl ether of tris(hydroxymethyl) ethane, as determined by glc analysis.
The crude product (2788 g) was distilled with a 30 plates Oldershaw column at a reduced pressure of 7 mm Hg. A total of 646.9 g of the trivinyl ether of tris(hydroxymethyl) ethane with 99% purity was collected between 69° and 71°C. The structure of the trivinyl ether was identified by nmr analysis.
EXAMPLE 2
Preparation of Trivinyl Ether of Ethoxylated Glycerol (where 1 + m + n = 5)
Glycerol (870 g., 9.4 moles) and sodium hydroxide (1.0 g.) were charged into a one-gallon autoclave. The mixture was purged three times with nitrogen, heated to 140βC. and subjected to a vacuum of 30 mm Hg for one-half hour. The temperature of the solution was then brought to
155°C. and ethylene oxide (2080 g., 47.3 moles) was added at 30 psig. After all the ethylene oxide was consumed, the autoclave was cooled to 30°C., purged two times with nitrogen and discharged.
2,171 g. (7 moles) of the crude ethoxylated glycerol and 15.6 g. (0.28 moles) of potassium hydroxide then were charged into the one-gallon autoclave. The autoclave was again purged three times with nitrogen and subjected to a vacuum of 20 mm Hg at 140°C. for one-half hour. Propane (100 psig.) and then acetylene (100 psig.) were added. The autoclave was heated at 140°C. for 48 hours and then at 150°C. for 24 hours to give the trivinyl ether of ethoxylated glycerol.
EXAMPLE 3
Preparation of Trivinyl Ether of Propyoxylated Glycerol (l + m -t- n ~*= 6)
Glycerol (552 g. , 6 moles) and sodium hydroxide (0.6 g.) where charged into a one-gallon stainless steel autoclave. The autoclave was purged three times with nitrogen, heated to 115°C. and subjected to a vacuum of 30 mm Hg for one-half hour. Propylene oxide (2088 g., 36 moles) was added at 30 psig. After all the propylene oxide was consumed, the autoclave was cooled to 30°C. , purged two times with nitrogen and discharged.
1,502 g. (3.4 moles) of the crude propyoxylated glycerol and 18.75 g. (0.29 moles) of 85% potassium hydroxide pellets were charged into the one-gallon autoclave. The autoclave was again purged three times with nitrogen and subjected to a vacuum of 30 mm Hg for one-half hour at 140βc. Propane (100 psig.) and then acetylene (100 psig.) were added. The vinylation reaction was continued
for 6 hours at 140°C. and 20 hours at 160°C. to provide the crude trivinyl ether of the propyoxylated glycerol. The crude trivinyl ether was distilled with a thin film evaporator to give pure trivinyl ether of propyoxylated glycerol as a clear liquid. The structure of the trivinyl ether was confirmed by nmr analysis.
EXAMPLE 4
To a 4-ounce amber colored bottle is added 25 g. of trivinyl ether of ethoxylated glycerol prepared in Example 2 and 0.5 g. of triphenyl sulfonium hexafluorophosphate at a temperature of 60°C. with constant agitation. The formulation is coated onto a polyester plate by hand draw-down using a No. 3 Mayer bar to give a coating thickness of about 0.2 mil. The plate is subjected to a UV light exposure of 15 joules/cm2 by passing it under two 200 watt/inch UV lamps at 700 feet/minute. This is followed by a thermal bake at 177°C. for 10 minutes. A protective chemical coating on the polyester is formed.
EXAMPLE 5
To a 4 ounce amber colored bottle is added 25 g. of bisphenol diepoxide having a molecular weight of 370-384 and 12.5 g. (0.062 moles) of triethylene glycol divinyl ether at a temperature of 45°C. with constant agitation. After a uniformly blended liquid mixture is obtained, 0.062 moles of trivinyl ether of propyoxylated glycerol (Example 2) is added and agitation is continued for an additional 15 minutes at the blend temperature. After a uniform liquid mixture is obtained 0.25 g. of a fluorinated alkyl ester surfactant and 2 g. of triphenyl sulfonium hexafluoro¬ phosphate are added and mixed therein at about 45°C. This
formulation is coated on a aluminumn panel by hand draw-down using a No. 3 Mayer bar to give a coating thickness of 0.4 mil. The panel is subjected to a UV light exposure of 15 joules/cm2 by passing them under two 200 watt/inch UV lamps at 100 feet/minute. This was followed by a thermal bake at 177°C. for 10 minutes. A highly cross-linked protective polymer film is formed which is chemical and abrasion resistant.
EXAMPLE 6
The formulation from Example 5 is repeated except that an acrylated epoxy oligomer (Ebecryl 3700, Radcure Specialties) is used in place of the bisphenol diepoxide. Two grams of 1-hydroxycyclohexylphenyl ketone was also added as a free radical photoinitiator. This formulation is coated on an oak panel using a #24 Mayer bar to give a coating thickness of 1.0 mil. The panel is subjected to uv light exposure of 15 joules/cm2 by passing them under two 200 watt/inch UV lamps at 100 feet/minute. A highly cross-linked protective polymer film which is chemical and abrasion resistant is formed.
EXAMPLE 7
The formulation from Example 5 is repeated except that a vinyl ether functional urethane prepared from a hydroxy vinyl ether and a toluene diisocyanate was used in place of the bisphenol diepoxide.
This formulation is coated on a polyester film using a #3 Mayer bar to give a coating thickness of 0.3 mil. The panel is exposed to UV light of 15 joules/cm2 by passing them under two 200 watt/inch UV lamps at 100 feet/minute. A fully cured protective coating is formed.
FIELDS OF USE
The compound of the invention exhibits a high speed cationic initiated radiation curing property, which enables its use in applications which require high speed curing, such as radiation curable coatings, photoresists in the electronic industry, and printing inks, which applications require ultraviolet or electronic beam activation.
It is to be understood that the above examples are provided to illustrate specific and preferred embodiments of the invention and that many modifications and alterations can be made in these examples without departing from the scope of the invention.
Claims (9)
1. Trivinyl ether compounds having the formula (I):
CH2OCH=CH2 CH3-C-CH2-OCH=CH2 CH2-OCH=CH2
and formula (II) :
where 1 + m + n = 1 to 20; and
X and Y are independently H or CH3,
2. The compound of formula (I) of claim 1 which is the trivinyl ether of l,l,l-tris(hydroxymethyl) ethane.
3. The compound of formula (I) of claim 1 which is made by direct vinylation of l,l,l-tris(hydroxymethyl) ethane.
4. The compound of formula (I) of claim 3 made by direct vinylation at about 120° to 175°C., in the presence of 0.5 to 2% KOH as catalyst, at about 50 to 100 psi. acetylene pressure, in an inert gas at about the same pressure as the acetylene, at a mole ratio of polyol to acetylene of about 1:3 to 1:4.5.
5. A compound of formula (II) of claim 1 wherein 1 + m + n is 3 to 10.
6. A compound of formula (II) according to claim 1 wherein both X and Y are H.
7. A compound of formula (II) according to claim 1 wherein X is H and Y is CH3.
8. A compound of formula (II) according to claim 1 wherein X is CH3 and Y is H.
9. A radiation curable composition comprising:
(a) between about 1 and 99.9 wt. % of the trivinyl ether compound of formulas (I) or (II) of claim 1;
(b) between about 0.1 and about 5 wt. % of a cationic photoinitiator; and
(c) between about 0 and 99 wt. % of a polymerizable vinyl ether, epoxide or acrylate oligomer.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US437706 | 1982-10-29 | ||
| US42441989A | 1989-10-20 | 1989-10-20 | |
| US424419 | 1989-10-20 | ||
| US43770689A | 1989-11-17 | 1989-11-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU6548490A AU6548490A (en) | 1991-05-16 |
| AU644108B2 true AU644108B2 (en) | 1993-12-02 |
Family
ID=27026322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU65484/90A Ceased AU644108B2 (en) | 1989-10-20 | 1990-10-11 | Trivinyl ethers of polyols |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0496789A4 (en) |
| AU (1) | AU644108B2 (en) |
| CA (1) | CA2027747A1 (en) |
| WO (1) | WO1991005756A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4215076A1 (en) * | 1992-05-07 | 1993-11-11 | Wacker Chemie Gmbh | Siloxane copolymers containing vinyloxy groups, their preparation and use |
| DE4215030A1 (en) * | 1992-05-07 | 1993-11-11 | Wacker Chemie Gmbh | Siloxane copolymers containing vinyloxy groups, their preparation and use |
| DE19509352A1 (en) * | 1995-03-15 | 1996-09-19 | Basf Ag | Process for working up reaction mixtures resulting from addition reactions to acetylene or propyne |
| DE10017222A1 (en) * | 2000-04-06 | 2001-10-11 | Basf Ag | Process for the preparation of alkenyl ethers |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4751273A (en) * | 1986-08-19 | 1988-06-14 | Allied-Signal, Inc. | Vinyl ether terminated urethane resins |
| US4766252A (en) * | 1987-10-16 | 1988-08-23 | Gaf Corporation | Solvent and stain resistant coatings |
| US4828873A (en) * | 1987-10-16 | 1989-05-09 | Gaf Corporation | Solvent and stain resistant coating |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR724955A (en) * | 1930-10-30 | 1932-05-06 | Ig Farbenindustrie Ag | Process for the production of vinyl ethers |
| GB1518141A (en) * | 1974-05-02 | 1978-07-19 | Gen Electric | Polymerizable compositions |
| US4026705A (en) * | 1975-05-02 | 1977-05-31 | General Electric Company | Photocurable compositions and methods |
| US4142042A (en) * | 1976-06-23 | 1979-02-27 | Diamond Shamrock Corporation | Alkenyl ethers from high molecular weight polyols |
| US4885319A (en) * | 1988-02-29 | 1989-12-05 | Gaf Corporation | Solvent resistant irradiation curable coatings |
-
1990
- 1990-10-11 AU AU65484/90A patent/AU644108B2/en not_active Ceased
- 1990-10-11 EP EP19900915681 patent/EP0496789A4/en not_active Withdrawn
- 1990-10-11 WO PCT/US1990/005773 patent/WO1991005756A1/en not_active Ceased
- 1990-10-16 CA CA 2027747 patent/CA2027747A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4751273A (en) * | 1986-08-19 | 1988-06-14 | Allied-Signal, Inc. | Vinyl ether terminated urethane resins |
| US4766252A (en) * | 1987-10-16 | 1988-08-23 | Gaf Corporation | Solvent and stain resistant coatings |
| US4828873A (en) * | 1987-10-16 | 1989-05-09 | Gaf Corporation | Solvent and stain resistant coating |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2027747A1 (en) | 1991-04-21 |
| WO1991005756A1 (en) | 1991-05-02 |
| EP0496789A1 (en) | 1992-08-05 |
| EP0496789A4 (en) | 1992-10-21 |
| AU6548490A (en) | 1991-05-16 |
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