AU645503B2 - Electro-active cradle circuits for the detection of access or penetration - Google Patents
Electro-active cradle circuits for the detection of access or penetrationInfo
- Publication number
- AU645503B2 AU645503B2 AU65034/90A AU6503490A AU645503B2 AU 645503 B2 AU645503 B2 AU 645503B2 AU 65034/90 A AU65034/90 A AU 65034/90A AU 6503490 A AU6503490 A AU 6503490A AU 645503 B2 AU645503 B2 AU 645503B2
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- AU
- Australia
- Prior art keywords
- circuit
- transducer
- voltage
- detection means
- metallic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001514 detection method Methods 0.000 title claims description 30
- 230000035515 penetration Effects 0.000 title claims description 19
- 238000000034 method Methods 0.000 claims description 55
- 229920000642 polymer Polymers 0.000 claims description 30
- 239000000126 substance Substances 0.000 claims description 27
- 230000015654 memory Effects 0.000 claims description 22
- -1 poly(vinylidene fluoride) Polymers 0.000 claims description 19
- 238000012545 processing Methods 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 230000005670 electromagnetic radiation Effects 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 8
- 230000004913 activation Effects 0.000 claims description 7
- 230000004075 alteration Effects 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 239000002322 conducting polymer Substances 0.000 claims description 5
- 229920001940 conductive polymer Polymers 0.000 claims description 5
- 230000006378 damage Effects 0.000 claims description 5
- 229910052736 halogen Inorganic materials 0.000 claims description 5
- 150000002367 halogens Chemical class 0.000 claims description 5
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 230000003213 activating effect Effects 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- 238000010292 electrical insulation Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000009972 noncorrosive effect Effects 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 4
- 239000004800 polyvinyl chloride Substances 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 239000003638 chemical reducing agent Substances 0.000 claims description 3
- 239000007800 oxidant agent Substances 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 229920002620 polyvinyl fluoride Polymers 0.000 claims description 3
- 229910052755 nonmetal Inorganic materials 0.000 claims 1
- 229920000131 polyvinylidene Polymers 0.000 claims 1
- 229920001746 electroactive polymer Polymers 0.000 description 21
- 239000008393 encapsulating agent Substances 0.000 description 12
- 238000012546 transfer Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 229920000128 polypyrrole Polymers 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Inorganic materials [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- ZOMBKNNSYQHRCA-UHFFFAOYSA-J calcium sulfate hemihydrate Chemical compound O.[Ca+2].[Ca+2].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O ZOMBKNNSYQHRCA-UHFFFAOYSA-J 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000011507 gypsum plaster Substances 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 101150087426 Gnal gene Proteins 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 229920000292 Polyquinoline Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical class [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- OYLGJCQECKOTOL-UHFFFAOYSA-L barium fluoride Chemical compound [F-].[F-].[Ba+2] OYLGJCQECKOTOL-UHFFFAOYSA-L 0.000 description 1
- 229910001632 barium fluoride Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical class [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- HTUMBQDCCIXGCV-UHFFFAOYSA-N lead oxide Chemical compound [O-2].[Pb+2] HTUMBQDCCIXGCV-UHFFFAOYSA-N 0.000 description 1
- PIJPYDMVFNTHIP-UHFFFAOYSA-L lead sulfate Chemical compound [PbH4+2].[O-]S([O-])(=O)=O PIJPYDMVFNTHIP-UHFFFAOYSA-L 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N lead(II) oxide Inorganic materials [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002601 radiography Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000003362 replicative effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000011540 sensing material Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- KVCGISUBCHHTDD-UHFFFAOYSA-M sodium;4-methylbenzenesulfonate Chemical compound [Na+].CC1=CC=C(S([O-])(=O)=O)C=C1 KVCGISUBCHHTDD-UHFFFAOYSA-M 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000010618 wire wrap Methods 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
- Measurement Of Radiation (AREA)
Description
ELECTRO-ACTIVE CRADLE CIRCUITS FOR THE DETECTION OF ACCESS OR PENETRATION
The present invention relates to the protection of information stored within electronic circuits, and in particular, to the protection of stored data from a hardware thief or hacker.
The protection will be achieved by the use of an electroactive Cradle circuit. A cradle is defined here as "a framework for support or
protection" (refer Collins Australian Dictionary of the English Language,
1981).
BACKGROUND ART
With the development of extensive computerised memory and the need for confidentiality of data stored within that memory, there have been developed a number of methods of preventing the theft of that "secret" information. Traditionally, computer software has been protected by means of encryption and decryption programming. Also, encryption and decryption hardware elements have been Incorporated into specific electronic packages to perform data protection under software control. With the development of suitable algorithms and keys contained in alterable memory, it has been possible to successfully protect data from an information thief or hacker who attempts to access that data by software means.
However, these known methods offer little security from a hardware hacker who obtains electronic information through physical access to such electronic circuitry. Electronic information or data compromise can occur by drilling through existing encapsulants of electronic circuitry so as to access data and/or address buses. These may be located by X-ray
radiography and/or ultrasonic techniques. Alternatively, employment of thermal, solvent, acid, simple mechanical scraping or mechanical fracture methods can be used to expose the data and/or address buses associated with the alterable memory.
Such alterable memory can comprise EPROM, E2PROM, RAM, DRAM and
PROM. Some devices though having some protection, permit learning of the methodology so that a thief can steal one device and therefore know the next. However, the hardware hacker can obtain no information front a severed communication channel external to the device due to software methods such as encryption and authentication procedures. Once the information thief or hacker has gained the knowledge of the authentication procedures and the data codes necessary, one could make use of this information to advantage. These types of security problems are
particularly relevant to financial institutions which use security systems
to secure computerised transfer of funds, the value of which is several minions of dollars per hour. In the case of a financial institution, once an information thief or hacker has gained the authentication procedure and the necessary data codes, illicit funds transfer could occur and the transfer would appear as a legal and authorised transaction. As such, any security compromise could result in the financial Institution incurring fraud losses, loss of integrity, recovery costs, adverse publicity and loss of commercial confidence.
US Patents 4 593 384; 4 691 350; 4 807 284 and 4,811,288 cover the area of securing stored data using a device that physically surrounds the circuit board being protected.
The security device in the 4 patents is comprised of:
1) a number of ceramic components that form a box that surrounds the circuit board. Ceramic is used because of its chemical resistance,
2) within the ceramic components are a number of conductive epoxy paths and sheets through which a hacker would penetrate if attempted penetration occurred,
3) in certain embodiments these conductive paths may also be
connected via thin wires that pass through the circuit board,
4) in a further embodiment thin nickel /gold layers were deposited onto the inside face of the ceramic housing. These layers were then etched to form parallel gold conductive paths (10-25μm thick with same spacing),
5) by shorting or breaking the conductive paths or sheets, a sense circuit will generate a low voltage that sets the RESET on the memory to be protected, and
6) a low temperature sensor (an unbalanced circuit) will also generate a low voltage if the temperature falls below -25°C. This ensures that if an attempt is made to freeze the memory below -90ºC in order to bypass the security device, the memory will be destroyed and thus protected.
US Patent 4 783 801 is for a security device to protect a circuit board. The security device is comprised of:
1) a housing in which one or more detectors may be situated. These detectors being vibration detectors, thermometers, microphones or
conductive paths that are shorted or broken upon penetration, and
2) the interface circuitry includes a clock arrangement that turns on the detectors for short intervals (ie:10ms every second) leading to a savi ng of upto 99% of the battery power and ensuri ng that the battery doe s not have to be periodically replaced. The interface can also decide whether
to destroy the memory using majority information from its detectors, (ie: 3 detectors out of 5 say yes then the Interface corrupts the memory).
US Patent 4 860 351 relates to a security device for a circuit board. The security device is comprised of:
1) very thin insulated Ni chrome wire is wrapped in very tight coils around the circuit to be protected. The circuit and enclosing wire is potted within an opaque cross-linked filled epoxy. The filler in the epoxy is alumina or silica which makes the epoxy difficult to machine,
2) if penetration is attempted the wires are shorted or broken, the interface circuit will sense this and destroy the memory, and
3) the wire is wrapped as several strands which enhances sensitivity to shorts and reduces EMI pickup due to cancellation. The wire wrap also forms an EM shield.
Such techniques have been proposed to provide protection against such compromise or ingress. However, these methods are complex and integrated with the device to be protected, thus making that device irreparable.
Overall, this invention is based on different materials and methods which will offer protection to data system(s) including such memory devices indicated below whilst permitting economic repairability and therefore recycling of that device.
Various methods are known to prevent or frustrate transmission of x-rays and other short wavelength radiation.
AU 41240/78 teaches that barium titanate, barium fluoride and lead sulfate can be added to an organo polysiloxane resin for X-ray shielding applications.
AU 17377/88 teaches that barytes can be added to Plaster-of-paris up to 60% by weight with Plaster-of-paris 35% by weight and other fillers, sealers and hardeners comprising the other 5% by weight. It is envisaged for use as an economic alternative to lead in floor, wall and ceiling shielding in hospitals.
W089/09472 relates to oxides, hydroxides and salts of bismuth loaded into polyethylene at weight fractions ranging from 30 to 80 % for use at flexible protection in surgical clothing such as gloves, aprons, boots and overalls.
GB 1 575 527 describes X-ray opaque surgical sponges using elastomers (ie: polyisobutylene, PVC and copolymers of VA and VC) loaded with 40 to 90 % weight fraction barium sulphate.
Such methods can be used to enhance the devices of the present
i nvention .
DISCLOSURE OF THE INVENTION
It is an object of the present invention to substantially overcome or ameliorate, the abovementioned difficulties through provision of one or more transducers, which may be used in association with an encapsulant or housing which protects electronic circuit(s) that contain data required to be protected from the effects of hardware hacking. In certain applications both the transducer and the encapsulant or housing will be capable of being employed separately to provide protection. For example the transducer components could be supported via a suitable alternative support while the encapsulant could be used to provide a X-ray attenuating mechanical barrier to frustrate attempted penetration.
In accordance with one aspect of the present invention, there is disclosed an electronic circuit or device protected from tamper and/or theft of information contained therein, comprising said circuit, a transducer capable of generating a voltage, detection means to detect said voltage, and protection means associated therewith to destroy and/or alter said circuit, device and/or information and/or record said voltage, characterized in that said transducer is a polymeric pressure/voltage and/or temperature/voltage transducer associated with said detection means such that on alteration of pressure or temperature applied to said transducer beyond pre-set limits, said voltage is sensed by said detection means thereby activating said protection means.
In another aspect, the invention provides a method of protecting an electronic circuit or device or information stored therein from tamper and/or theft that occurs through an examination of said circuit or device, said method comprising providing a polymeric pressure/voltage and/or temperature/voltage transducer capable of generating a voltage adjacent said circuit or device, said transducer being associated with detection means to detect said voltage, and protection means associated with said detection means, such that on alteration of pressure or temperature applied to said transducer beyond pre-set limits, said voltage is sensed by said detection means thereby activating said protection means to destroy and/or alter said circuit, device and/or information and/or record said voltage.
The circuits or devices which may be protected in accordance with the present invention may include signal processing circuits,
encryption/decryption circuits, alterable memories and the like. The circuits or devices of the invention can be protected by a single
transducer which may be a pressure/voltage transducer or a temperature/voltage transducer. It is preferred that both a
pressure/voltage transducer and a temperature/voltage transducer be used.
The transducer may be arranged to fully cover or enclose the circuit so that any attempt to access the combination is required to pass through the transducer.
The detection means may be located within or adjacent to the transducer and preferably comprises at least two electrodes associated with the circuit. One of the electrodes may be earth. In order to disguise the transducer from examination by electromagnetic radiation and/or acoustics, it is preferred that the electrodes are non-metallic. For some
applications the detection means may include an associated electronic circuit, such as an amplifier, which may be located within or adjacent the transducer.
The transducer may contain an external or integrated switching means to prevent inadvertent activation of the protection means. It is preferred that a destructible conducting element may be provided adjacent the transducer to short-circuit the electrodes to prevent activation of the protection means prior to destruction of the conducting element. In general, the protection means will be activated only when the output of the detection means exceeds preset limits.
In a preferred embodiment of the invention, the"transducer output is disabled by connection of the detection means by metallic or non-metallic electrical conductors to a gating circuit or device which prevents the active output of the transducer being transmitted to the detector. The gating circuit can be controlled by elements of metallic or non-metallic components of a bridging circuit. The conditions of. the bridging circuit can be altered by breaking due to penetration of one or more bridge elements.
In an alternate preferred embodiment of the invention, the transducer is disabled by having the electrodes of the detection means connected by metallic or non-metallic conductors thus preventing the buildup of charge and hence prevent spurious or unwanted generation of voltage signals due to normal vibration or temperature variations. The connection may be affected in such a way so as to be broken upon any penetration tjhroygh to the transducer. On breaking of the connection, the transducer is immediately enabled to generate a voltage due to an attempted penetration.
Where it is desired to protect a circuit or device fron the effects of aggressive chemicals such as solvents, oxidising agents and/or reducing
agents, the transducer can be modified so as to generate a voltage on contact with the aggressive chemical. Alternately, a further chemical sensing/voltage transducer may be provided as part of the circuit or device. Such a further transducer can be constructed from a conducting polymer having groups or radicals incorporated therein which react with the aggressive chemical or from a piezo-electric polymer coated with a material which reacts with such aggressive cnemicals.
For some applications, it may be desirable to make the circuit, or transducer unable to be examined by electromagnetic radiation or acoustics to prevent/frustrate examination of the circuit or parts thereof with an acoustics or electromagnetic radiation resistant encapsulating element. The element may also be formulated to be resistant to agressive chemicals. It is preferred that the encapsulating element is formulated to achieve the maximum electromagnetic and/or acoustic and/or chemical attenuation whilst remaining both non-corrosive to contained components and electrically insulating. For example, the encapsulating element can be formulated with high atomic number compounds in a supporting material such as epoxy or polyurethane.in quantities up to and beyond 80% w/w. For some
applications, the encapsulating element may be formulated with small quantities of metal arranged throughout the element to further disguise the configuration of the circuit or device or part thereof. The encapsulating element may also include ceramic materials to further prevent/frustrate mechanical ingress and/or an electrical insulation layer.
To those skilled in the art, the well catalogued cryogenic threat of rapid cooling, to temperatures below -90ºC, of circuitry to ensure preservation of data, may be overcome by the inclusion of temperature sensors working in conjunction with the cradle and/or its signal processing circuitry. The thresholds of these sensors would be determined by the operating environment of the device being protected. In addition, to ensure the preservation of the piezoelectric effect in the piezoelectric sensing material, a high temperature sensing element may be included as part of the signal processing circuitry.
Conventional devices such as silicon integrated circuits,
transistors, resistors and capacitors in addition to equivalent devices made from electroactive polymers, will as a circuit receive the detection signal, perform any necessary signal processing and output to the
associated circuit being protected, a predetermined signal in response to the intrusion or investigation.
The s i gnal process i ng whi ch mi ght typi cal ly be performed by the polymer cradle circuits in conjunction with existing conventional
electronic devices would be ampl ifi cation, comparison, clipping, filtering as well as known logic functions. Signal processing could be carried but as an integral part of the cradle device or separately by the electronics board being protected. Power, if required, could be.derived from the application electronics board or be supplied from an auxiliary source, for example a lithium cell. The decision whether or not a dead or decaying power source condition causes circuit initiation (eg: failsafe) may be left up to the application subject to that protection.
Polymers suitable for processing Into pressure/voltage and
temperature/voltage transducers are generally halogen containing polymers which are available commercially. Poly(vinylidene fluoride),
poly(vinylidene fluoride-trifluoroethylene), polytetrafluoroethylene, polyvinyl chloride, polyvinyl fluoride or copolymers thereof are examples of the polymers available. In order to achieve higher piezoelectric and pyroelectric activity, these polymers should be stretched and polarized. The stretching of the polymer, followed by polarization in intense electric fields at elevated temperatures aligns the dipole moments within the film, producing the desired piezoelectric and pyroelectric effect. In order to polarize and use these polymers, electrically conducting electrodes can be deposited onto the faces of the material, to which electrical conductors may be connected. It is advantageous for certain applications to utilize single face electrode connections, achieved by forming separated electrodes on the one face.
Such piezoelectric and pyroelectric polymers are tough, lightweight, flexible and may be formed into complex shapes suitable for any application.
There is well established use of semi-conducting polymer composites or compounds which are made by the addition of conducting particles, such as silver, aluminium or carbon, to a polymer. However these materials, cannot be made to have sufficiently high conductivity for many
applications. There are now available a wide range of relatively new intrinsic conducting, semiconducting and piezoelectric polymers which can be synthesized in the laboratory, a few of which are available
commercially. Polyacetylene, poly p-phenylene, polyaniline, polythidphene, polyquinoline, polypyrrole and polypyrrone are some of the many
intrinsically conducting and semiconducting polymers which can be chosen for the fabrication of electronic devices and circuits. A wider range of
specific conductivities can be obtained than that possible using conducting polymer/compound composites. These new electroactive polymers are also more suitable for fabrication of electronic transducers. For example, polypyrrole can be synthesized to have a wide range of conductivity by aqueous or organic electro-chemistry using different concentrations of sodium p-toluene sulphonate as the dopant dissolved in the electrolyte. The deposited film of polypyrrole can be changed in shape by modifying the geometry of the anode formed to make a three-dimensional frame work. Using conducting and semiconducting polymers, a wide range of polymer pn junctions, transistors, chemsensors and batteries are being researched.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 is a plan view of the device that embodies the present invention.
Fig. 2 is a cut-away of an example of how the cradle encloses the device to be protected.
Fig. 3 is a plan view of an example of how the cradle is formed.
Fig. 4 is a schematic example of the signal processing circuitry.
BEST MODES OF CARRYING OUT THE INVENTION
A preferred embodiment of the present invention will now be described with reference to the drawings that illustrate the present invention.
An example of an electronic device which may be protected in accordance with the present invention is that of an alterable memory 1 as earlier described. Generally associated with the alterable memory 1 is a data encryption/decryption circuit or application specific data processing device 2 that interfaces the alterable memory 1 with a data connection 3 that provides communication with other devices (not illustrated). Note that the application specific processing device may exist in hard or software form. An example of such a device as now described would be a Personal Identification Number (PIN) pad used in automatic telling machines (ATMs) and electronic funds transfer point of sale (EFTPOS) machines operated by banks and other financial institutions. In such an example, the alterable memory 1 would contain a key or a series of keys required for the encryption processes typically carried out in a Personal Identification Number encryption transaction. Access to the key(s) contained within the alterable memory 1, could enable an information thief to compromise the system integrity.
The circuit combination of the alterable memory 1 and data
encryption/decryption circuit or application specific device 2 are enclosed within an electroactive polymer cradle 4 (Ref: Figs. 1. 2 & 3). The electroactive polymer cradle 4 is interfaced to the circuit combination 1 and 2 via a signal processing circuit 6 utilising metallic or non-metallic electrical conductors 7. The signal processing circuit 6 (Ref: Fig.4) comprises fundamentally of a low power amplifier capable of saturation at its output 9, replicating digital conditions and driven by the analog cradle output. The electroactive polymer cradle 4 covers all three dimensions of the circuit combination 1, 2, 6 and 7 such that the data connection 3 is the only physical connection from outside the cradle 4 to within the circuit combination 1, 2, 6 and 7. (Ref: Figs 1 & 2). The polymer cradle 4 may also be enclosed within an encapsulant or housing 5. The data connection 3 can be arranged to exit the encapsulant or housing 5 in the form of connecting pins or a cable or leads (not illustrated).
It will be realised by those skilled in the art that an information thief that obtains that information by accessing through software
techniques, would be resisted in any efforts by the encryption/decryption circuit or application specific processing device 2 and/or any one-way functions (OWFs) therein. As such, the alterable memory 1 is safe from software intervention as previously known in the art.
The electroactive polymer cradle 4 comprises electroactive polymer circuit(s). The cradle circuit(s) is arranged to fully cover (2D) or enclose (3D) the circuit combination 1, 2, 6 and 7 so that any attempts to hardware access the combination 1, 2, 6 and 7 are required to pass through the electroactive polymer cradle 4.
The electroactive polymer cradle comprises a variety of polymer devices linked by polymer or metallic electrical conductors. Some of these polymer devices are sensing elements, chemsensors, piezoelectric
transducers and thermal sensing elements. These sensors may be made sensitive to physical and/or chemical ingress to provide stimuli to other devices located within the cradle. It is also possible that the sensors be sens i ti ve to i nvesti gation by acousti c waves , el ectromagneti c radi ation and particle beams. Once activated by any ingress or destructive investigation of the cradle, the electroactive polymer circuit then emits a signal (s) in order to record the event or to initiate the alteration, corruption and/or destruction of the information stored within the alterable memory 1. This same method can also be adapted to initiate the alteration, corruption or
destruction of the data used by or stored by tne encryption/decryption or application specific algorithm within the encryption/decryption or application specific device 2.
The cradle output is normally inactive. Activation would occur as a result of any one of the aforementioned methods of hardware hacking and thus negate any criminal learning process. For certain applications, it is proposed that the cradle only be sensitive to a destructive penetration or attack that is being undertaken and not sensitive to external impacts or vibrations that will occur in everyday use of the types of circuits and devices that are to be protected. The electroactive polymer cradle 4 would remain in a "switched off" mode until an attempted penetration occurred. To switch off the electroactive polymer cradle 4 the electrodes 8
(Ref:Figs. 3 & 4) of the electroactive polymer cradle 4 would be formed in such a manner, that no output can occur. Figure 3 illustrates an example of the electroactive polymer cradle 4 from which plane electrode material has been removed to form an electrical pathway. On penetration of the electroactive polymer cradle 4, the electrode 8 conditions would be modified making the cradle output active.
Alternatively, the electrodes of the electroactive polymer cradle 4 could be connected by metallic or non metallic electrical conductors 7 to a gating circuit which would normally prevent the electroactive polymer cradle 4 from transmitting its output(s) to the signal processing circuit 6. The conductors could form for example, elements of a bridging circuit which would control the previously mentioned gating circuit. These conductors would be affected in such a way that any penetration through to the electroactive polymer cradle 4 would alter these conductors and influence the gating circuit.
The encapsulant or housing 5 may surround the electroactive polymer cradle circuit 4, its purpose being three-fold:
a) to mechanically support and contain the electroactive polymer cradle circuit 4 and the device or circuit being protected.
b) to prevent/frustrate examination or location of the
electroactive polymer cradle circuit 4 and the metallic buses, terminals and conducting paths of the enclosed electronic devices by X-ray methods and/or acoustics. It is also possible that the encapsulant or housing 5 could be formulated to prevent/frustrate examination or location by gamma rays, neutron beams and electromagnetic waves.
c) to prevent/frustrate dissolving or swelling in common solvents.
The encapsu l ant or hous i ng 5 when necessary wi l l be formul ated to achieve the maximum possible X-ray attenuation whilst remaining both non-corrosive to contained components and electrically insulating. High atomic number metallic salts and oxides, for example, barium and/or lead salts (e.g. Barytes and Litharge) would be added to a supporting material such as epoxy or polyurethane polymers in quantities up to and beyond 80% w/w. Small quantities of metal could also be arranged throughout the encapsulant or housing 5 to further disguise the actual position of the contained polymer cradle circuit and device(s) or circuit(s) being protected.
As an enhancement for certain applications, fillers and/or hardeners would be incorporated into the encapsulant or housing 5 to further prevent/frustrate mechanical Ingress. In certain applications conducting materials either metallic or non-metallic would be incorporated into the encapsulant or housing 5 to provide an electromagnetic radiation shield that could be used for radiation hazard attenuation. When required an electrical insulation layer would also be added to the encapsulant or housing 5.
INDUSTRIAL APPLICABILITY
The present invention can be applied in general to any type of computing device, microprocessor, electronic device, storage element and logic element that contains information that is not to be disclosed. Also it can be used in any circuit or similar device that might be required to operate or fail in a desired or predetermined manner when subjected to forces, measures, or substances constituting intrusion.
The above described example of protecting keys used in funds transfer in Personal Identification Number (PIN) pads, Electronic Funds Transfer - Point of Sale (EFTPOS) or general information security is applicable throughout the financial industry as well as broader uses relating to electronically stored Information.
The present invention also has well placed application in the defence, communications, electronics and computing industries. Examples of possible areas of application are encryption/decryption processes and devices, smart card peripherals and magnetic stripe readers (MSRs).
A further application is in the protection of devices that control the function of, and the arming of explosives and ordinance.
The present invention offers to users of electronically stored information a means by which that information can be securely stored without the possibility of theft. As such, devices protected in accordance
with the present invention have applications throughout the financial and defence industries as well as in the general computing/electronics industry.
The foregoing only describes one emobdiment of the present invention and further embodiments, obvious to those skilled in the art, can be made thereto without departing from the scope of the present information.
Claims (62)
1. An electronic circuit or device protected from tamper and/or theft of information contained therein, comprising said circuit, a transducer capable of generating a voltage, detection mean-s to detect said voltage, and protection means associated therewith to destroy and/or alter said circuit, device and/or information and/or record said voltage, characterized in that said transducer is a polymeric pressure/voltage and/or temperature/voltage transducer associated with said detection means such that on alteration of pressure or temperature applied to said transducer beyond pre-set limits, said voltage is sensed by said detection means thereby activating said protection means.
2. The circuit or device of claim 1, wherein the electronic circuit or device comprises a signal processing circuit, an encryption/decryption circuit or an alterable memory.
3. The circuit or device of claim 1 or claim 2, wherein said transducer is a pressure/voltage transducer.
4. The circuit or device of any one of claims 1 to 3, wherein the transducer is a temperature/voltage transducer.
5. The circuit or device of any one of claims 1 to 4, wherein the transducer comprises a halogen containing polymer.
6. The circuit or device of claim 5, wherein the halogen containing polymer is poly(vinylidene fluoride), poly(vinylidene fluoride- trifluoroethylene), polytetrafluoroethylene, polyvinyl chloride, polyvinyl fluoride or copolymers thereof.
7. The circuit or device of claim 6, wherein said polymer is poly(vinylidene fluoride) or poly(vinylidene fluoride-trifluoroethylene).
8. The circuit or device of any one of claims 5 to 7, wherein the polymer is stretched and/or polarized.
9. The circuit or device of any one of claims 1 to 8, wherein the transducer is arranged to fully cover or enclose the circuit so that any attempt to access the combination is required to pass through the
transducer.
10. The circuit or device of any one of claims 1 to 9, wherein the detection means comprises at least two electrodes associated with said circuit.
11. The circuit or device of claim 10, wherein said electrodes are non-metallic.
12. The circuit or device of any one of claims 1 to 11, wherein said detection means further comprises an amplifier.
13. The circuit or device of any one of claims 1 to 12, wherein said transducer contains an external or integrated switching means to prevent inadvertent activation of said protection means.
14. The circuit or device of any one of claims 1 to 12, further comprising a destructible conducting element adjacent said transducer to short-circuit said electrodes to prevent activation of said protection means prior to destruction of said conducting element.
15. The circuit or device of any one of claims 1 to 12, wherein said protection means is adapted to be activated only when the output of said detection means exceeds preset limits.
16. The circuit or device of any one of claims 1 to 12, wherein the transducer output is disabled by connection of the detection means by metallic or non-metal 11c electrical conductors to a gating circuit or device which prevents the active output of the transducer being transmitted to the detector, said gating circuit being controlled by elements of metallic or non-metallic components of a bridging circuit, said bridging circuit conditions being altered by breaking due to penetration of one or more bridge elements.
17. The circuit or device of any one of claims 1 to 12, wherein the transducer is disabled by having the detection means connected by metallic or non-metallic conductors thus preventing the buildup of charge, and wherein the connection is affected in such a way so as to be broken upon any penetration through to the transducer and on breaking of the
connection, the transducer is immediately enabled to generate a voltage due to an attempted penetration.
18. The circuit or device of any one of claims 1 to 16, wherein said transducer is modified so as to generate a voltage on contact with an aggressive chemical.
19. The circuit or device of claim 18, wherein said aggressive chemical is a solvent, an oxidizing agent or a reducing agent.
20. The circuit or device of any one of claims 1 to 16, further comprising a chemical sensing/voltage transducer.
21. The circuit or device of claim 20, wherein said further transducer is a conducting polymer having groups or radicals incorporated therein which react with and/or sense said aggressive chemical.
22. The circuit or device of claim 20, wherein said further transducer is a piezo-electric polymer coated with a material which reacts with and/or senses said aggressive chemicals.
23. The circuit or device of any one of claims 1 to 22, wherein said circuit, or transducer is resistant to electromagnetic radiation or acoustics and/or aggressive chemicals to prevent/frustrate examination of the circuit or parts thereof.
24. The circuit or device of any one of claims 1 to 22, wherein said circuit, or transducer is transparent or opaque to electromagnetic radiation or acoustics to prevent/frustrate examination of the circuit or parts thereof.
25. The circuit or device of any one of claims 1 to 22, further comprising a chemical, acoustic or electromagnetic radiation resistant encapsulating element to prevent/frustrate examination of the device or part thereof.
26. The circuit or device of claim 25, wherein the encapsulating element is formulated to achieve the maximum chemical and/or
electromagnetic and/or acoustic attenuation whilst remaining both
non-corrosive to contained components and electrically insulating.
27. The circuit or device of any one of claims 25 to 26, wherein the encapsulating element is formulated with high atomic number compounds in a supporting material in quantities up to and beyond 80% w/w.
28. The circuit or device of claim 27, wherein the supporting material is epoxy or polyurethane.
29. The circuit or device of any one of claims 25 to 28, wherein the encapsulating element is formulated with small quantities of metal arranged throughout the element to further disguise the configuration of the circuit or device or part thereof.
30. The circuit or device of any one of claims 25 to 29, wherein the encapsulating element includes ceramic materials to further
prevent/frustrate mechanical ingress.
31. The circuit or device of any one of claims 25 to 30, wherein the encapsulating element includes an electrical insulation layer.
32. A method of protecting an electronic circuit or device or information stored therein from tamper and/or theft that occurs through an examination of said circuit or device, said method comprising providing a polymeric pressure/voltage and/or temperature/voltage transducer capable of generating a voltage adjacent said circuit or device, said transducer being associated with detection means to detect said voltage, and protection means associated with said detection means, such that on alteration of pressure or temperature applied to said transducer beyond pre-set limits, said voltage is sensed by said detection means thereby activating said protection means to destroy and/or alter said circuit, device and/orinformation and/or record said voltage.
33. The method according to claim 32, wherein the electronic circuit or device comprises a signal processing circuit, an encryption/decryption circuit or an alterable memory.
34. The method according to claim 32 or claim 33, wherein said transducer is a pressure/voltage transducer.
35. The method according to any one of claims 32 to 34, wherein the transducer is a temperature/voltage transducer.
36. The method according to any one of claims 32 to 35, wherein the transducer comprises a halogen containing polymer.
37. The method according to claim 36, wherein the halogen containing polymer is poly(vinyl idene fluoride), poly(vinyl idene fluoride- trlfluoroethylene), polytetrafluoroethylene, polyvinyl chloride, polyvinyl fluoride or copolymers thereof.
38. The method according to claim 37, wherein said polymer is poly(vinylidene fluoride) or poly(vinylidene fluoride-trifluoroethylene).
39. The method according to any one of claims 36 to 38, wherein the polymer is stretched and/or polarized.
40. The method according to any one of claims 32 to 39, wherein the transducer is arranged to fully cover or enclose the circuit so that any attempt to access the combination is required to pass through the
transducer.
41. The method according to any one of claims 32 to 40, wherein the detection means comprises at least two electrodes associated with said circuit.
42. The method according to claim 41, wherein said electrodes are non-metallic.
43. The method according to any one of claims 32 to 42, wherein said detection means further comprises an amplifier.
44. The method according to any one of claims 32 to 43, wherein said transducer contains an external or integrated switching means to prevent inadvertent activation of said protection means.
45. The method according to any one of claims 32 to 44, wherein a destructible conducting element is provided adjacent said transducer to short-circuit said electrodes to prevent activation of said protection means prior to destruction of said conducting element.
46. The method according to any one of claims 32 to 45, wherein said protection means is adapted to be activated only when the output of said detection means exceeds preset limits.
47. The method according to any one of claims 32 to 43, wherein the transducer output is disabled by connection of the detection means by metallic or non-metallic electrical conductors to a gating circuit or device which prevents the active output of the transducer being transmitted to the detector, said gating circuit being controlled by elements of metallic or non-metallic components of a bridging circuit, said bridging circuit conditions being altered by breaking due to penetration of one or more bridge elements.
48. The method according to any one of claims 32 to 43, wherein the transducer Is disabled by having the detection means connected by metallic or non-metallic conductors thus preventing the buildup of charge, and wherein the connection is affected in such a way so as to be broken upon any penetration through to the transducer and on breaking of the
connection, the transducer is immediately enabled to generate a voltage due to an attempted penetration.
49. The method according to any one of claims 32 to.48, wherein said transducer is modified so as to generate a voltage on contact with an aggressive chemical.
50. The method according to claim 49, wherein said aggressive chemical is a solvent, an oxidizing agent or a reducing agent,
51. The method according to any one of claims 32 to 47, wherein a chemical sensing/voltage transducer is provided in association with said pressure/voltage transducer and/or said temperature/voltage transducer.
52. The method according to claim 51, wherein said chemical
sensing/voltage transducer is a conducting polymer having groups or radicals incorporated therein which react with and/or sense said aggressive chemical.
53. The method according to claim 51, wherein said chemical
sensing/voltage transducer is a piezo-electric polymer coated with a material which reacts with and/or senses said aggressive chemicals.
54. The method according to any one of claims 32 to 53, wherein said circuit, or transducer is resistant to electromagnetic radiation or acoustics and/or aggressive chemicals to prevent/frustrate examination of the circuit or parts thereof.
55. The method according to any one of claims 32 to 53, wherein said circuit, or transducer is transparent or opaque to electromagnetic radiation or acoustics to prevent/frustrate examination of the circuit or parts thereof.
56. The method according to any one of claims 32 to 53, wherein a chemical, acoustic or electromagnetic radiation resistant encapsulating element is provided external said circuit or device to prevent/frustrate examination of the device or part thereof.
57. The method according to claim 56, wherein the encapsulating element is formulated to achieve the maximum chemical and/or
electromagnetic and/or acoustic attenuation whilst remaining both
non-corrosive to contained components and electrically insulating.
58. The method according to any one of claims 56 to 57, wherein the encapsulating element is formulated with high atomic number compounds in a supporting material in quantities up to and beyond 80% w/w.
59. The method according to claim 58, wherein the supporting material is epoxy or polyurethane.
60. The method according to any one of claims 56 to 59, wherein the encapsulating element is formulated with small quantities of metal arranged throughout the element to further disguise the configuration of the circuit or device or part thereof.
61. The method according to any one of claims 56 to 60, wherein the encapsulating element includes ceramic materials to further
prevent/frustrate mechanical ingress.
62. The method according to any one of flaims 56 to 61, wherein the encapsulating element includes an electrical insulation layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU65034/90A AU645503B2 (en) | 1989-10-03 | 1990-10-03 | Electro-active cradle circuits for the detection of access or penetration |
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AUPJ6685 | 1989-10-03 | ||
| AUPJ668589 | 1989-10-03 | ||
| AUPK1574 | 1990-08-03 | ||
| AUPK157490 | 1990-08-03 | ||
| AUPK191090 | 1990-08-23 | ||
| AUPK1910 | 1990-08-23 | ||
| AU65034/90A AU645503B2 (en) | 1989-10-03 | 1990-10-03 | Electro-active cradle circuits for the detection of access or penetration |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU6503490A AU6503490A (en) | 1991-04-28 |
| AU645503B2 true AU645503B2 (en) | 1994-01-20 |
Family
ID=27423667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU65034/90A Ceased AU645503B2 (en) | 1989-10-03 | 1990-10-03 | Electro-active cradle circuits for the detection of access or penetration |
Country Status (1)
| Country | Link |
|---|---|
| AU (1) | AU645503B2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4783801A (en) * | 1983-12-29 | 1988-11-08 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Apparatus for protecting secret information |
| US4811288A (en) * | 1985-09-25 | 1989-03-07 | Ncr Corporation | Data security device for protecting stored data |
| US4860351A (en) * | 1986-11-05 | 1989-08-22 | Ibm Corporation | Tamper-resistant packaging for protection of information stored in electronic circuitry |
-
1990
- 1990-10-03 AU AU65034/90A patent/AU645503B2/en not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4783801A (en) * | 1983-12-29 | 1988-11-08 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Apparatus for protecting secret information |
| US4811288A (en) * | 1985-09-25 | 1989-03-07 | Ncr Corporation | Data security device for protecting stored data |
| US4860351A (en) * | 1986-11-05 | 1989-08-22 | Ibm Corporation | Tamper-resistant packaging for protection of information stored in electronic circuitry |
Also Published As
| Publication number | Publication date |
|---|---|
| AU6503490A (en) | 1991-04-28 |
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