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AU652156B2 - Method and apparatus for packaging semiconductor device - Google Patents
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AU652156B2 - Method and apparatus for packaging semiconductor device - Google Patents

Method and apparatus for packaging semiconductor device

Info

Publication number
AU652156B2
AU652156B2 AU78464/91A AU7846491A AU652156B2 AU 652156 B2 AU652156 B2 AU 652156B2 AU 78464/91 A AU78464/91 A AU 78464/91A AU 7846491 A AU7846491 A AU 7846491A AU 652156 B2 AU652156 B2 AU 652156B2
Authority
AU
Australia
Prior art keywords
semiconductor device
packaging semiconductor
packaging
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU78464/91A
Other versions
AU7846491A (en
Inventor
Atsushi Miki
Masanori Nishiguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2178721A external-priority patent/JPH0465844A/en
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of AU7846491A publication Critical patent/AU7846491A/en
Application granted granted Critical
Publication of AU652156B2 publication Critical patent/AU652156B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

AU78464/91A 1990-06-19 1991-06-18 Method and apparatus for packaging semiconductor device Ceased AU652156B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP16034990 1990-06-19
JP2-160346 1990-06-19
JP2178721A JPH0465844A (en) 1990-07-06 1990-07-06 Semiconductor element mounting method
JP2-178721 1990-07-06

Publications (2)

Publication Number Publication Date
AU7846491A AU7846491A (en) 1992-01-02
AU652156B2 true AU652156B2 (en) 1994-08-18

Family

ID=26486884

Family Applications (1)

Application Number Title Priority Date Filing Date
AU78464/91A Ceased AU652156B2 (en) 1990-06-19 1991-06-18 Method and apparatus for packaging semiconductor device

Country Status (1)

Country Link
AU (1) AU652156B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113327879B (en) * 2021-05-14 2022-08-16 长江存储科技有限责任公司 Chuck adjusting device and method and wafer bonding device and method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4899921A (en) * 1988-10-28 1990-02-13 The American Optical Corporation Aligner bonder

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4899921A (en) * 1988-10-28 1990-02-13 The American Optical Corporation Aligner bonder

Also Published As

Publication number Publication date
AU7846491A (en) 1992-01-02

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