CN102412705A - AC-DC driving power supply device - Google Patents
AC-DC driving power supply device Download PDFInfo
- Publication number
- CN102412705A CN102412705A CN2011103838074A CN201110383807A CN102412705A CN 102412705 A CN102412705 A CN 102412705A CN 2011103838074 A CN2011103838074 A CN 2011103838074A CN 201110383807 A CN201110383807 A CN 201110383807A CN 102412705 A CN102412705 A CN 102412705A
- Authority
- CN
- China
- Prior art keywords
- plastic layer
- heat radiation
- power supply
- radiation plastic
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000004033 plastic Substances 0.000 claims abstract description 56
- 229920003023 plastic Polymers 0.000 claims abstract description 56
- 230000005855 radiation Effects 0.000 claims description 41
- 238000002347 injection Methods 0.000 claims description 10
- 239000007924 injection Substances 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910002804 graphite Inorganic materials 0.000 claims description 7
- 239000010439 graphite Substances 0.000 claims description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 5
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims description 3
- 150000004767 nitrides Chemical group 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 238000005265 energy consumption Methods 0.000 abstract description 3
- 238000001746 injection moulding Methods 0.000 abstract 2
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000003116 impacting effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an AC-DC driving power supply device which comprises a circuit board, wherein electronic components and input and output electric leads are arranged on the circuit board, a heat dissipation plastic layer is coated on the outer surface of a power supply main body formed by the circuit board and the electronic components in an injection molding mode, all or most of the outer surface of the heat dissipation plastic layer is exposed in the air, and the input and output electric leads extend out of the heat dissipation plastic layer. Because the power supply is formed outside the circuit board and the electronic components by injection molding of the heat dissipation plastic layer, the whole or most of the outer surface of the heat dissipation plastic layer is exposed in the air, and the heat generated during the work of the power supply is better taken away by utilizing the strong heat dissipation function of the heat dissipation plastic layer, so that the normal work of the electronic components in the power supply is ensured, the service life of the power supply is effectively prolonged, and the energy consumption is reduced.
Description
Technical field
The present invention relates to a kind of supply unit, especially a kind of AC-DC drive electric power unit good, that conversion efficiency is high that dispels the heat.
Background technology
Along with development of science and technology and people's demand, the use of electronic product is more and more, and most electronic products all need dispose AC-DC drive electric power unit (power supply device); The power supply device can be for being built in the electronic equipment; Also can independently be arranged on electronic equipment and use outward,, certainly lead to heat energy during work as the AC-DC driving power; Injure electronic devices and components easily; Also restricted simultaneously conversion efficiency,, must accelerate to leave the heat that electronic devices and components produced for reducing energy consumption and the electronic devices and components useful life that ensures in the power supply device.
At present, in various power supply devices, such as the LED supply unit of open air; Because the caloric value of AC-DC driving power is big, it normally is installed in electronic devices and components in the aluminium box, and in the aluminium box embedding insulating heat-conductive glue; To play the effect to cooling electronic component and protection, still, this structure radiating effect still remains to be improved; And the insulating heat-conductive glue process of institute's embedding is loaded down with trivial details, length consuming time; And on the one hand owing to contain solvent in the encapsulating material, its peroxide can injure the situation of components and parts in addition.
Summary of the invention
In order to overcome the deficiency of prior art, the object of the present invention is to provide a kind of have good heat dissipation effect, AC-DC drive electric power unit that production efficiency is high.
The technical scheme that the present invention takes is:
A kind of AC-DC drive electric power unit; Comprise wiring board; Wiring board is provided with electronic devices and components and input and output electric lead; Outer surface injection mo(u)lding in the power supply device main body that wiring board and electronic devices and components constituted is coated with the heat radiation plastic layer, and the whole perhaps major parts of the outer surface of heat radiation plastic layer expose in the air, and the input and output electric lead stretches out the heat radiation plastic layer.
Further, in the heat radiation plastic layer, be embedded with the installation connecting plate that stretches out the outside, be convenient to install the power supply device.
In addition, as preferred implementation, be coated with described heat radiation plastic layer in the direct injection mo(u)lding of outer surface of the power supply device main body that wiring board and electronic devices and components constituted, said heat radiation plastic layer is an insulator.
In addition, as other a kind of preferred implementation, between the outer surface of the power supply device main body that wiring board and electronic devices and components constituted and heat radiation plastic layer, the heat conductive insulating layer is arranged, said heat radiation plastic layer is insulator or nonisulated body.
Further, described heat radiation plastic layer is the graphite radiating plastic layer, and radiating effect is desirable.
In addition, described heat radiation plastic layer also can be the nitride plastic layer that dispels the heat.
Further, described heat radiation plastic layer contains the zinc oxide of 10-15% or the niobium pentaoxide of 4-5%, can shielding electromagnetic wave, prevent that electromagnetic wave that power supply produces from impacting the operate as normal of other components and parts.
The invention has the beneficial effects as follows: because AC-DC drive electric power unit of the present invention coats wiring board and electronic devices and components with the heat radiation plastic layer of injection mo(u)lding, the outer surface of heat radiation plastic layer all or major parts expose in the air, utilize the powerful heat sinking function of heat radiation plastic layer; The heat that is produced when better the power supply device being worked is taken away; Guarantee the electronic devices and components operate as normal in the power supply device, effectively improve the working life of power supply device, and reduce energy consumption; Simultaneously; Owing to adopt injection mo(u)lding, its production efficiency is high, and has avoided containing solvent in the encapsulating and cause the impaired situation of components and parts.
Description of drawings
Below in conjunction with accompanying drawing the present invention is described further.
Fig. 1 is the structural representation of embodiment of the present invention one (directly injection mo(u)lding coats);
Fig. 2 is the structural representation of embodiment of the present invention two (tape insulation layer);
Fig. 3 is the structural representation of embodiment of the present invention three (directly injection mo(u)lding coats, has the installation connecting plate);
Fig. 4 is the structural representation of embodiment of the present invention four (tape insulation layer, the installation connecting plate is arranged).
Embodiment
Referring to figs. 1 through Fig. 4; A kind of power supply device of the present invention; Comprise wiring board 1, wiring board 1 is provided with electronic devices and components 2 and input and output electric lead 3, electronic devices and components 2 and input and output electric lead 3 and wiring board welding; The outer surface injection mo(u)lding of the power supply device main body that is constituted at wiring board 1 and electronic devices and components 2 is coated with heat radiation plastic layer 4; The outer surface of heat radiation plastic layer 4 all or major parts expose in the air, promptly with heat radiation plastic layer 4 as main heat conduction and radiator, input and output electric lead 3 stretches out heat radiation plastic layer 4.
Wherein, the graphite radiating plastic layer that is provided in the patent application that heat radiation plastic layer 4 can be proposed by the inventor in the early time.
As preferred implementation; Specifying information for the graphite radiating plastic layer material that is adopted is following; This graphite radiating plastic layer is to be applied on January 6th, 2011 by the inventor; And open on June 15th, 2011, public announcement of a patent application is number for the plastic material of being put down in writing in the application for a patent for invention prospectus of CN102093691A that is mixed with the graphite radiating powder body material is made, and the embodiment of its plastic material is set forth at this no longer one by one.Graphite radiating plastic layer among the present invention can also be other execution mode.
Certainly, heat radiation plastic layer 4 also can nitride the heat radiation plastic layer, polyphenylene sulfide (PPS) compound that concrete as Japanese bright dipping company is produced, the STANYL heat-conducting plastic of Dutch DSM N. V..
Further, described heat radiation plastic layer contains the zinc oxide of 10-15% or the niobium pentaoxide of 4-5%, can shielding electromagnetic wave, prevent that electromagnetic wave that power supply produces from impacting the operate as normal of other components and parts.
Further,, in heat radiation plastic layer 4, be embedded with the installation connecting plate 5 that stretches out the outside, be convenient to install the power supply device on other mounting bracket like Fig. 3, Fig. 4.
In addition, as preferred implementation, like Fig. 1, Fig. 3; The direct injection mo(u)lding of outer surface of the power supply device main body that is constituted at wiring board 1 and electronic devices and components 2 is coated with described heat radiation plastic layer 4; Simultaneously, said heat radiation plastic layer 4 is an insulator, and heat directly is passed to heat radiation plastic layer 4.
In addition, as other a kind of preferred implementation, like Fig. 2, Fig. 4; Between the outer surface of the power supply device main body that wiring board 1 and electronic devices and components 2 are constituted and heat radiation plastic layer 4, heat conductive insulating layer 5 is arranged, this heat conductive insulating layer 5 can be the heat radiation coating of insulation, therefore; In such cases; Said heat radiation plastic layer can be insulator, also can be nonisulated body, and both all can.
In the process of above-mentioned packaging power, earlier, make the moisture content of wiring board be lower than 0.5/1000th with the wiring board dehumidifying, its process can be that wiring board is positioned in 103-108 degree centigrade the environment, baking got final product in 3-4 hour.
Certainly, the present invention is except above-mentioned execution mode, and other equivalent technical solutions also should be within its protection range.
Claims (7)
1. AC-DC drive electric power unit; Comprise wiring board; Wiring board is provided with electronic devices and components and input and output electric lead; It is characterized in that: the outer surface injection mo(u)lding in the power supply device main body that wiring board and electronic devices and components constituted is coated with the heat radiation plastic layer, and the whole perhaps major parts of the outer surface of heat radiation plastic layer expose in the air, and the input and output electric lead stretches out the heat radiation plastic layer.
2. a kind of AC-DC drive electric power unit according to claim 1 is characterized in that: in the heat radiation plastic layer, be embedded with the installation connecting plate that stretches out the outside.
3. a kind of AC-DC drive electric power unit according to claim 1; It is characterized in that: the direct injection mo(u)lding of outer surface in the power supply device main body that wiring board and electronic devices and components constituted is coated with described heat radiation plastic layer, and said heat radiation plastic layer is an insulator.
4. a kind of AC-DC drive electric power unit according to claim 1; It is characterized in that: between the outer surface of the power supply device main body that wiring board and electronic devices and components constituted and heat radiation plastic layer, the heat conductive insulating layer is arranged, said heat radiation plastic layer is insulator or nonisulated body.
5. a kind of AC-DC drive electric power unit according to claim 1 is characterized in that: described heat radiation plastic layer is the graphite radiating plastic layer.
6. a kind of AC-DC drive electric power unit according to claim 1 is characterized in that: described heat radiation plastic layer is a nitride heat radiation plastic layer.
7. according to the arbitrary described a kind of AC-DC drive electric power unit of claim 1-6, it is characterized in that: described heat radiation plastic layer contains the zinc oxide of 10-15% or the niobium pentaoxide of 4-5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103838074A CN102412705A (en) | 2011-11-28 | 2011-11-28 | AC-DC driving power supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103838074A CN102412705A (en) | 2011-11-28 | 2011-11-28 | AC-DC driving power supply device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102412705A true CN102412705A (en) | 2012-04-11 |
Family
ID=45914616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103838074A Pending CN102412705A (en) | 2011-11-28 | 2011-11-28 | AC-DC driving power supply device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102412705A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106402680A (en) * | 2016-10-12 | 2017-02-15 | 上海莎瑞光电科技有限公司 | Led lamp and manufacturing method thereof |
| CN108882502A (en) * | 2017-05-11 | 2018-11-23 | 裕晨科技股份有限公司 | Circuit board with heat conduction and heat dissipation functions |
| CN118450593A (en) * | 2023-09-28 | 2024-08-06 | 荣耀终端有限公司 | Heat dissipation shielding structure, processing method, circuit board assembly and electronic equipment |
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| CN1530975A (en) * | 2003-03-12 | 2004-09-22 | 厦门量子星科技有限公司 | Capacitance and filter assembly for eliminating high-frequency electromagnetic interference in high-voltage circuit |
| CN1701097A (en) * | 2001-12-19 | 2005-11-23 | 纳幕尔杜邦公司 | Polyamide resin composition having electromagnetic interference shielding properties and articles formed therefrom |
| CN1787128A (en) * | 2004-12-11 | 2006-06-14 | 鸿富锦精密工业（深圳）有限公司 | Electric Source adapter and its mfg. method |
| CN101161721A (en) * | 2006-10-10 | 2008-04-16 | 聚鼎科技股份有限公司 | Heat-conducting and electrically insulating polymer materials and heat-dissipating substrates containing them |
| CN101213895A (en) * | 2005-07-07 | 2008-07-02 | 旭硝子株式会社 | Electromagnetic wave shielding film and protective plate for plasma display panel |
| CN101415314A (en) * | 2007-10-19 | 2009-04-22 | 浩然科技股份有限公司 | Sealed power supply |
| CN201732178U (en) * | 2009-12-30 | 2011-02-02 | 甘国工 | Optical filter with electromagnetic shielding function and displayer using same |
| CN102093691A (en) * | 2011-01-06 | 2011-06-15 | 黄柱联 | Heat-dissipation graphite powder mixed plastic material |
| CN202050351U (en) * | 2011-02-28 | 2011-11-23 | 成都吉奥科技有限公司 | Power supply adapter convenient for heat radiation |
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2011
- 2011-11-28 CN CN2011103838074A patent/CN102412705A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1481422A (en) * | 2000-10-26 | 2004-03-10 | �ձ�A&L��ʽ���� | Flame-retardant and electromagnetic wave-shielding thermoplastic resin composition |
| CN1379154A (en) * | 2001-04-02 | 2002-11-13 | Ad－技术株式会社 | Wall paper for shielding electromagnetic wave |
| CN1701097A (en) * | 2001-12-19 | 2005-11-23 | 纳幕尔杜邦公司 | Polyamide resin composition having electromagnetic interference shielding properties and articles formed therefrom |
| CN1530975A (en) * | 2003-03-12 | 2004-09-22 | 厦门量子星科技有限公司 | Capacitance and filter assembly for eliminating high-frequency electromagnetic interference in high-voltage circuit |
| CN1787128A (en) * | 2004-12-11 | 2006-06-14 | 鸿富锦精密工业（深圳）有限公司 | Electric Source adapter and its mfg. method |
| CN101213895A (en) * | 2005-07-07 | 2008-07-02 | 旭硝子株式会社 | Electromagnetic wave shielding film and protective plate for plasma display panel |
| CN101161721A (en) * | 2006-10-10 | 2008-04-16 | 聚鼎科技股份有限公司 | Heat-conducting and electrically insulating polymer materials and heat-dissipating substrates containing them |
| CN101415314A (en) * | 2007-10-19 | 2009-04-22 | 浩然科技股份有限公司 | Sealed power supply |
| CN201732178U (en) * | 2009-12-30 | 2011-02-02 | 甘国工 | Optical filter with electromagnetic shielding function and displayer using same |
| CN102093691A (en) * | 2011-01-06 | 2011-06-15 | 黄柱联 | Heat-dissipation graphite powder mixed plastic material |
| CN202050351U (en) * | 2011-02-28 | 2011-11-23 | 成都吉奥科技有限公司 | Power supply adapter convenient for heat radiation |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106402680A (en) * | 2016-10-12 | 2017-02-15 | 上海莎瑞光电科技有限公司 | Led lamp and manufacturing method thereof |
| CN108882502A (en) * | 2017-05-11 | 2018-11-23 | 裕晨科技股份有限公司 | Circuit board with heat conduction and heat dissipation functions |
| CN118450593A (en) * | 2023-09-28 | 2024-08-06 | 荣耀终端有限公司 | Heat dissipation shielding structure, processing method, circuit board assembly and electronic equipment |
| CN118450593B (en) * | 2023-09-28 | 2025-03-21 | 荣耀终端股份有限公司 | Heat dissipation shielding structure and processing method, circuit board assembly, and electronic equipment |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120411 |