CN103325920A - LED body encapsulating mode - Google Patents

Abstract

The invention discloses a packaging form of LED light-emitting diodes, which comprises a printed circuit board, a chip, and a transparent molding part. The printed circuit board is provided with a positive electrode and a negative electrode, and the chip is bonded to the positive electrode or the negative electrode. On the electrodes, the positive pole and the negative pole of the chip are electrically connected to the positive electrode and the negative electrode respectively, and the molding part is arranged on the printed circuit board and covers the chip. Since the molded part is transparent, it will not block the light emitted by the chip, so the chip achieves the effects of high light efficiency, low light decay, and a large light-emitting angle (greater than 130°).

Description

A kind of packaging form of LED light-emitting diode body

technical field

The invention relates to a packaging form of an LED light emitting diode.

Background technique

Currently used LED chips include printed circuit boards and chips. The printed circuit board is provided with positive and negative electrodes, and there are bosses on both sides of the printed circuit board. Add liquid resin to solidify to form a molded part. The boss is made of opaque material. Only the light from the chip can be seen from the top, and the light from the side is blocked by the molding mold, resulting in low brightness of the light, which can no longer meet the current market pursuit. The effects of high light efficiency, low light decay, and large lighting angle (greater than 130°).

In addition, the existence of the boss requires more manpower, material resources, and financial resources, which increases the production cost, thereby pushing up the unit price of the product, which is not conducive to market competition.

Contents of the invention

The technical problem to be solved by the present invention is to provide a packaging form of LED light-emitting diode body. The LED chip achieves the effects of high light efficiency, low light decay, and a large light-emitting angle (greater than 130°), and solves the current problem of low brightness, The problem of light decay.

In order to solve the above technical problems, the technical solution of the present invention is: a packaging form of LED light-emitting diode, which is characterized in that it includes a printed circuit board, a chip, and a transparent molding part, and the printed circuit board is provided with a positive electrode and a negative electrode, the chip is bonded to the positive electrode or the negative electrode, the positive electrode and the negative electrode of the chip are electrically connected to the positive electrode and the negative electrode respectively, and the molding part is arranged on the printed circuit board and covers the chip.

As a preferred solution, the packaging form of the LED light-emitting diode also includes conductive wires, the chip is bonded to the positive electrode or the negative electrode through a non-conductive glue, and the positive electrode and the negative electrode of the chip are respectively connected to the positive electrode through the conductive wire. , The negative electrode is electrically connected.

As a preferred solution, the LED chip also includes conductive wires, the chip is bonded to the positive or negative electrode through conductive glue, the positive or negative electrode of the chip is in contact with the conductive glue, and the negative or positive electrode of the chip is The wire is electrically connected to the negative electrode or the positive electrode.

As a preferred solution, the compression molding part is made of silicone resin.

As a preferred solution, the compression molding part is a mixture of silicone resin and fluorescent powder.

As a preferred solution, the conductive wires are gold wires or alloy wires.

As a preferred solution, the molded part is made of silicone resin, and phosphor powder is sprayed on the chip.

As a preferred solution, the shape of the molded part is trapezoidal or hemispherical.

After adopting the above technical solution, the beneficial effect of the present invention is: since the molded part is transparent, and there are no other non-transparent bosses around it, it will not cause any obstruction to the light emitted by the chip, so the The chip achieves the effects of high light efficiency, low light decay, and a large luminous angle (greater than 130°). The molded part can be directly cured and formed on the printed circuit board by using a mold.

And because the molding part is made of silicone resin or a mixture of silicone resin and fluorescent powder, no additional mold is needed, which effectively reduces the input of manpower, material resources and financial resources, reduces production costs, and makes the chip more competitive in the market.

Description of drawings

The present invention will be further described below in conjunction with drawings and embodiments.

Fig. 1 is a structural sectional view of Embodiment 1 of the present invention;

Fig. 2 is a structural sectional view of Embodiment 2 of the present invention;

Fig. 3 is a structural sectional view of Embodiment 3 of the present invention;

In the accompanying drawings 1 to 3: 1. Printed circuit board; 2. Positive electrode; 3. Negative electrode; 4. Chip; 5. Non-conductive glue; 6. Compression molding part; 6-1. Phosphor powder; Wire.

Detailed ways

The packaging form of an LED light-emitting diode according to the present invention will be further described in detail through specific embodiments below.

Example 1

As shown in Figure 1, a packaging form of LED light-emitting diodes includes a printed circuit board 1, electrodes, chips 4, and a transparent molding part 6. The printed circuit board 1 is provided with a positive electrode 2 and a negative electrode 3, Both the positive electrode 2 and the negative electrode 3 are installed on the upper surface of the printed circuit board 1, the chip 4 is bonded to the positive electrode 2 or the negative electrode 3, and the positive electrode and the negative electrode of the chip 4 are electrically connected to the positive electrode 2 and the negative electrode 3 respectively. The compression molding part 6 is located on the upper part of the positive electrode 2, the negative electrode 3, the chip 4 and the printed circuit board 1 and the compression molding part 6 is arranged on the upper surface of the printed circuit board 1 and the chip 4 and part of the positive electrode 2, the negative electrode Electrode 3 covered.

In this embodiment, the chip 4 also includes a conductive wire 7, the chip 4 is bonded to the positive electrode 2 or the negative electrode 3 through a non-conductive glue 5, and the positive electrode and the negative electrode of the chip 4 are respectively connected to the positive electrode 2 through the conductive wire 7. , Negative electrode 3-phase electric connection. Of course, the chip 4 can also be bonded to the positive electrode 2 or the negative electrode 3 by conductive glue, and at this moment, the positive pole or the negative pole of the chip 4 is in contact with the conductive glue, and the negative pole or the positive pole of the chip 4 is connected to the negative electrode through the conductive wire 7. 3 or positive electrode 2-phase electric connection. The conductive wire 7 is made of gold wire or alloy wire.

In this embodiment, the shape of the molding part 6 is trapezoidal, and the material used for the molding part 6 is silicone resin or a mixture of silicone resin and phosphor powder, and the light emitted by the chip 4 is converted into white light.

Example 2

The structure of this embodiment is basically the same as that of the embodiment 1, except that the material of the molded part 6 is silicone resin, and the surface of the chip 4 is sprayed with fluorescent powder.

Example 3

The structure of this embodiment is basically the same as that of Embodiment 2, except that the shape of the molded part 6 is a semicircle.

Claims (8)

1. A packaging form of LED light-emitting diodes, characterized in that: comprising a printed circuit board, a chip, a transparent molding part, the printed circuit board is provided with a positive electrode and a negative electrode, and the chip is bonded to the positive electrode Or on the negative electrode, the positive electrode and the negative electrode of the chip are electrically connected to the positive electrode and the negative electrode respectively, and the molding part is arranged on the printed circuit board and covers the chip. 2. A packaging form of LED light-emitting diodes as claimed in claim 1, wherein the LED chip also includes conductive wires, and the chip is bonded to the positive electrode or the negative electrode by non-conductive glue, and the positive electrode, the The negative electrode is electrically connected to the positive electrode and the negative electrode respectively through conductive wires. 3. A packaging form of LED light-emitting diodes as claimed in claim 1, characterized in that: the LED chip also includes conductive wires, the chip is bonded to the positive electrode or the negative electrode by conductive glue, and the positive or negative electrode of the chip is In contact with the conductive glue, the negative or positive electrode of the chip is electrically connected to the negative electrode or the positive electrode through a conductive wire. 4. A packaging form of LED light-emitting diode according to any one of claims 1 to 3, characterized in that: the molding part is made of silicone resin. 5. A packaging form of LED light-emitting diodes according to claim 4, characterized in that: the conductive wires are gold wires or alloy wires. 6 . A package form of LED light emitting diode according to any one of claims 1 to 3 , characterized in that: the molding part is a mixture of silicone resin and phosphor powder. 7. A packaging form of LED light-emitting diode according to any one of claims 1 to 3, characterized in that: the molded part is made of silicone resin, and phosphor powder is sprayed on the chip. 8. A packaging form of LED light-emitting diodes according to claim 7, characterized in that: the shape of the molding part is trapezoidal or hemispherical.

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