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CN103674077A - Injection molding positioning structure for Hall sensor - Google Patents
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CN103674077A - Injection molding positioning structure for Hall sensor - Google Patents

Injection molding positioning structure for Hall sensor Download PDF

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Publication number
CN103674077A
CN103674077A CN201210321673.8A CN201210321673A CN103674077A CN 103674077 A CN103674077 A CN 103674077A CN 201210321673 A CN201210321673 A CN 201210321673A CN 103674077 A CN103674077 A CN 103674077A
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CN
China
Prior art keywords
hall element
sensor framework
groove
sensor
body head
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Pending
Application number
CN201210321673.8A
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Chinese (zh)
Inventor
张凤洪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DINGJIA (TIANJIN) AUTOMOBILE ELECTRONICS Co Ltd
Original Assignee
DINGJIA (TIANJIN) AUTOMOBILE ELECTRONICS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by DINGJIA (TIANJIN) AUTOMOBILE ELECTRONICS Co Ltd filed Critical DINGJIA (TIANJIN) AUTOMOBILE ELECTRONICS Co Ltd
Priority to CN201210321673.8A priority Critical patent/CN103674077A/en
Publication of CN103674077A publication Critical patent/CN103674077A/en
Pending legal-status Critical Current

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Abstract

An injection molding positioning structure for a Hall sensor comprises a sensor framework, a magnet and a Hall element, wherein three grooves are formed in the top of the sensor framework in the cylinder axial direction, the main body head of the Hall element, the magnet and a capacitor are respectively arranged in the three grooves, the main body head of the Hall element is tightly attached to the inner wall of the first groove on the sensor framework, a plurality of positioning bulges are arranged on the circumference of the sensor framework, the height and the shape of the positioning bulges are the same, and the circumference of the sensor framework is divided by the positioning projections into three equal parts. When the sensor framework is placed in an injection molding die, the top ends of the positioning bulges are simultaneously in contact with the inner wall of the injection molding die, so that the sensor framework and the injection molding die are coaxial. A clearance between the sensor framework and the inner wall of the injection molding die is a fixed distance, and the sensor framework cannot be displaced in the injection molding process, so that the qualified rate of products is ensured, and the precision of the Hall sensor in actual application is improved.

Description

The injection moulding location structure of Hall element
Technical field
The present invention relates to the technical field of sensor, is a kind ofly to guarantee that Hall element is not subjected to displacement in injection moulding process specifically, thereby improves the injection moulding location structure of the Hall element of working sensor precision.
Background technology
The type of speed probe is a lot, because of Hall element there is contactless, long-life, high reliability, no-spark, without self-sustained oscillation, temperature performance is good, contamination resistance is strong, simple structure, firm, volume is little, the advantage such as shock-resistant, so select Hall effect proximity sensor as speed probe.This sensor is on-off element, is directly output as pulse duration frequency signal, but owing to there being electromagnetic noise interference, must carry out filtering and shaping to signal, improves and gathers accuracy and antijamming capability.Signal after processing converts the square-wave signal of standard to, and the input capture function by single-chip microcomputer can accurately obtain its pulse generation time, for control module computing and control provide rotating speed and top dead centre reference signal.
Hall element is to utilize metal of Hall effect principle work or wafer to be placed in magnetic field, magnetic field is perpendicular to thin slice, when thin slice passes to electric current, on the two sides of thin slice, will produce a micro-Hall voltage, if change the intensity in magnetic field, the size of Hall voltage also changes thereupon, when magnetic field disappears, and Hall voltage vanishing.The signal of Hall effect tachometric transducer output is rectangular pulse signal, is well suited for digital control system, and antijamming capability is strong.Sensor output voltage signal stabilization, as long as there is magnetic field, always Hall element produces identical voltage, and the size of output signal voltage and rotating speed are irrelevant, even under low speed state, still can obtain higher accuracy in detection.
In producing the process of Hall element, Hall element is inserted to injection mold, and to injected plastic in mould, thereby Hall element is coated, but fixing between due to sensor element and injection mold in actual injection moulding is produced, so Hall element can be subjected to displacement along with the plastics that inject, and then has influence on the precision of the sensor of producing.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind ofly guarantees that Hall element is not subjected to displacement in injection moulding process, thereby improves the injection moulding location structure of the Hall element of working sensor precision.
The technical scheme that the present invention takes for the technical matters existing in solution known technology is:
The injection moulding location structure of Hall element of the present invention, comprising:
Sensor framework, form the main body of carrying Hall element and magnet, it is shaped as cylindrical structure, top at sensor framework arranges three grooves along right cylinder axial distribution, top by sensor framework is followed successively by the first groove, the second groove and the 3rd groove to end direction, the first groove and the second groove mutual conduction, and the corresponding shaft core position that is arranged on sensor framework, on the outer wall circumference of sensor framework, a plurality of locator protrusionss are set, the height of each locator protrusions and trisection circumference identical with shape;
Hall element, comprises Hall element body head and capacitive part, between Hall element body head and capacitive part, by sheet metal conductor, is connected;
Magnet, is cylindrical structural, and longitudinally magnetizes.
Above-mentioned Hall element is schistose texture, wherein Hall element body head is inserted and secured in the first groove on sensor framework, at the second groove inner set magnet, magnet is close to Hall element body head, the capacitive part of Hall element is arranged in the 3rd groove, and the sheet metal conductor that connects Hall element body head and capacitive part is close on the outer wall of sensor framework.
The present invention can also be by the following technical solutions:
Described locator protrusions is separately positioned on the outer wall of sensor framework top and bottom.
Advantage and good effect that the present invention has are:
In the injection moulding location structure of Hall element of the present invention, on the top of sensor framework, arranging distributes arranges three grooves, by Hall element body head, magnet and capacitive part are separately positioned in three grooves, and a plurality of locator protrusionss are set on the outer wall of sensor framework, the height of each locator protrusions and trisection circumference identical with shape, when sensor framework is placed in injection mold, the top of each locator protrusions contacts with the inwall of injection mold simultaneously, thereby make sensor framework and injection mold coaxial, gap between sensor framework and injection mold inwall is fixed range, in injection moulding process, sensor framework can not be subjected to displacement, thereby guaranteed the qualification rate of product, improved Hall element precision in actual applications.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the injection moulding location structure of Hall element of the present invention;
Fig. 2 is the axial schematic diagram of injection moulding location structure of Hall element of the present invention.
Embodiment
Referring to drawings and Examples, the present invention will be described in detail.
Fig. 1 is the schematic diagram of the injection moulding location structure of Hall element of the present invention; Fig. 2 is the axial schematic diagram of injection moulding location structure of Hall element of the present invention.
As shown in Figure 1 to Figure 2, the injection moulding location structure of Hall element of the present invention, comprising:
Sensor framework 1, form the main body of carrying Hall element and magnet, it is shaped as cylindrical structure, top at sensor framework arranges three grooves along right cylinder axial distribution, top by sensor framework is followed successively by the first groove 1a, the second groove 1b and the 3rd groove 1c to end direction, the first groove and the second groove mutual conduction, and the corresponding shaft core position that is arranged on sensor framework, a plurality of locator protrusionss 2 are set on the outer wall circumference of sensor framework, the height of each locator protrusions and trisection circumference identical with shape;
Hall element, comprises Hall element body head 3 and capacitive part 4, between Hall element body head and capacitive part, by sheet metal conductor 5, is connected;
Magnet 6, is cylindrical structural, and longitudinally magnetizes.
Above-mentioned Hall element is schistose texture, wherein Hall element body head 3 is inserted and secured on 1a in the first groove on sensor framework, at the second groove 1b inner set magnet 6, magnet is close to Hall element body head, the capacitive part of Hall element 4 is arranged in the 3rd groove 1c, the sheet metal conductor 5 that connects Hall element body head and capacitive part is close on the outer wall of sensor framework, and Hall element body head is close on the inwall of first groove on sensor framework.
Locator protrusions is separately positioned on the outer wall of sensor framework top and bottom, and sensor framework can be firmly fixed in injection mold.
When sensor framework is placed in injection mold, the top of each locator protrusions contacts with the inwall of injection mold simultaneously, thereby make sensor framework and injection mold coaxial, gap between sensor framework and injection mold inwall is fixed range, in injection moulding process, sensor framework can not be subjected to displacement, thereby guaranteed the qualification rate of product
The above, it is only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction, although the present invention with preferred embodiment openly as above, yet, not in order to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, certainly can utilize the technology contents of announcement to make a little change or modification, become the equivalent embodiment of equivalent variations, in every case be the content that does not depart from technical solution of the present invention, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all belong in the scope of technical solution of the present invention.

Claims (2)

1. an injection moulding location structure for Hall element, is characterized in that, comprising:
Sensor framework, form the main body of carrying Hall element and magnet, it is shaped as cylindrical structure, top at sensor framework arranges three grooves along right cylinder axial distribution, top by sensor framework is followed successively by the first groove, the second groove and the 3rd groove to end direction, the first groove and the second groove mutual conduction, and the corresponding shaft core position that is arranged on sensor framework, on the outer wall circumference of sensor framework, a plurality of locator protrusionss are set, the height of each locator protrusions and trisection circumference identical with shape;
Hall element, comprises Hall element body head and capacitive part, between Hall element body head and capacitive part, by sheet metal conductor, is connected;
Magnet, is cylindrical structural, and longitudinally magnetizes.
Above-mentioned Hall element is schistose texture, wherein Hall element body head is inserted and secured in the first groove on sensor framework, at the second groove inner set magnet, magnet is close to Hall element body head, the capacitive part of Hall element is arranged in the 3rd groove, and the sheet metal conductor that connects Hall element body head and capacitive part is close on the outer wall of sensor framework.
2. the injection moulding location structure of Hall element according to claim 1, is characterized in that: described locator protrusions is separately positioned on the outer wall of sensor framework top and bottom.
CN201210321673.8A 2012-08-30 2012-08-30 Injection molding positioning structure for Hall sensor Pending CN103674077A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210321673.8A CN103674077A (en) 2012-08-30 2012-08-30 Injection molding positioning structure for Hall sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210321673.8A CN103674077A (en) 2012-08-30 2012-08-30 Injection molding positioning structure for Hall sensor

Publications (1)

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CN103674077A true CN103674077A (en) 2014-03-26

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108859043A (en) * 2018-07-13 2018-11-23 南京塑维网络科技有限公司 A kind of mold data acquisition terminal, mold and system
CN109931840A (en) * 2019-03-27 2019-06-25 合肥联宝信息技术有限公司 A kind of detection mold

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08247786A (en) * 1995-03-13 1996-09-27 Nissan Motor Co Ltd Method for manufacturing sensor and detection unit
US20030193328A1 (en) * 2002-04-16 2003-10-16 Sumitomo Electric Industries, Ltd. Revolution detecting sensor
CN1811457A (en) * 2005-01-28 2006-08-02 爱信精机株式会社 Rotational speed detecting sensor
CN201242448Y (en) * 2008-08-08 2009-05-20 常州明珠电器有限公司 Hall sensor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08247786A (en) * 1995-03-13 1996-09-27 Nissan Motor Co Ltd Method for manufacturing sensor and detection unit
US20030193328A1 (en) * 2002-04-16 2003-10-16 Sumitomo Electric Industries, Ltd. Revolution detecting sensor
CN1811457A (en) * 2005-01-28 2006-08-02 爱信精机株式会社 Rotational speed detecting sensor
CN201242448Y (en) * 2008-08-08 2009-05-20 常州明珠电器有限公司 Hall sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108859043A (en) * 2018-07-13 2018-11-23 南京塑维网络科技有限公司 A kind of mold data acquisition terminal, mold and system
CN109931840A (en) * 2019-03-27 2019-06-25 合肥联宝信息技术有限公司 A kind of detection mold

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Application publication date: 20140326