CN103687469A - Electronic component mounting apparatus - Google Patents

Abstract

The invention provides an electronic component mounting apparatus, wherein electronic components can be stably absorbed onto a substrate to be mounted. The electronic component mounting apparatus comprises an electronic component feeding unit, a carrying head main body provided with a suction nozzle, a suction nozzle drive part and a carrying head support used for supporting both the suction nozzle and the suction nozzle drive part, a carrying head moving mechanism used for moving the carrying head main body, a load detecting part used for detecting a load generated during the pressing process of the front end of the suction nozzle onto a testing surface, a suction nozzle shape detecting part used for detecting the shape of the suction nozzle, and a control unit used for controlling the operations of all the above parts. The control unit detects the outer shape of the suction nozzle, the absence or presence of a spring and the stroke of the spring by means of the load detecting part and the suction nozzle shape detecting part. Then the detection result is stored as the characteristics of the suction nozzle. Based on the characteristics of the suction nozzle, the control unit controls the suction nozzle drive part to drive the suction nozzle to move up and down.

Description

Electronic component mounting device

technical field

The present invention relates to an electronic component mounting device that holds an electronic component with a suction nozzle, moves the electronic component, and mounts the electronic component on a substrate.

Background technique

An electronic component mounting apparatus for mounting an electronic component on a substrate has a mounting head provided with a suction nozzle, and the electronic component is held by the suction nozzle and mounted on the substrate. The electronic component mounting device moves the suction nozzle of the mounting head in a direction perpendicular to the surface of the substrate to absorb the components in the electronic component supply device, and then makes the mounting head face to face in a direction parallel to the surface of the substrate. After reaching the mounting position of the suctioned component, the suction nozzle of the mounting head moves in a direction perpendicular to the surface of the substrate to approach the substrate, thereby mounting the suctioned electronic component on the substrate.

Here, the electronic component mounting apparatus has a mechanism for replacing the suction nozzle for suctioning the electronic component corresponding to the electronic component to be suctioned. As such a nozzle, there is a nozzle having a mechanism for adjusting a load to be pressed during suction or mounting (refer to Patent Documents 1 and 2). As a mechanism for adjusting the pressing load, there is a mechanism in which the tip of the suction nozzle and the base are connected by an elastic body such as a spring so that the tip can move relative to the base. By providing such an elastic body in the suction nozzle, the direction of the tip can be adjusted according to the shape of the suction surface of the electronic component. When using a suction nozzle with a load adjustment function, a load detection unit such as a load sensor is provided on the suction nozzle, and the vertical movement of the suction nozzle is controlled based on the detection result of the load detection unit.

Patent Document 1: Japanese Patent Application Laid-Open No. 09-246790

Patent Document 2: Japanese Unexamined Patent Publication No. 2006-147640

The electronic component mounting apparatus can suppress a large load from being applied to the electronic component supply apparatus or the board by detecting the load of the suction nozzle by the load detection unit provided on the suction nozzle. However, even if the load detection unit is provided, there may be cases where the detected load and the actual load deviate, or the suction nozzle is pushed in excessively, or the suction nozzle is separated, and the mounting operation of the electronic component becomes unstable. .

Contents of the invention

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic component mounting device capable of stably absorbing and mounting an electronic component on a substrate.

In order to solve the above-mentioned problems and achieve the purpose, the present invention is an electronic component mounting device, which is characterized in that it has: an electronic component supply device that supplies electronic components to the holding area; a mounting head body that has a suction nozzle and a suction nozzle drive part and a mounting head support body, the suction nozzle holds the electronic component supplied from the electronic component supply device to the holding area, the suction nozzle driving part drives the suction nozzle up and down and rotates, and drives the suction nozzle to the The suction nozzle supplies air pressure to drive the suction nozzle, the mounting head support supports the suction nozzle and the suction nozzle driving part; a mounting head moving mechanism moves the mounting head main body; a load detection part , which detects the load generated by pressing the front end of the suction nozzle against the measurement surface; a nozzle shape detection unit, which detects the shape of the suction nozzle; and a control device, which controls the operation of each part , the control device uses the load detection unit and the nozzle shape detection unit to detect the shape of the suction nozzle, the presence or absence of a spring and its spring stroke, and use the detected results as the characteristics of the suction nozzle and storing, and based on the stored characteristic of the nozzle, the up and down driving of the nozzle by the nozzle drive unit is controlled.

Here, it is preferable that the control device detects the presence or absence of a stopper on the nozzle using the nozzle shape detection unit, and determines that the nozzle is for load control when the stopper is provided. nozzle.

In addition, it is preferable that the load detection unit is a load sensor.

In addition, it is preferable that the nozzle shape detection unit is a laser sensor connected to the head support.

In addition, it is preferable that the characteristics of the suction nozzle include contact load value and Z-axis motion speed, and the control device is based on the spring stroke, contact load value, Z-axis motion speed, The state of the suction nozzle is determined by using the execution time of each operation when the suction nozzle mounts the electronic component.

In addition, it is preferable that the control device detects an actual operation time when the electronic component is mounted by the suction nozzle, and compares a theoretical value detected based on the characteristics of the suction nozzle with the actual operation time. , to detect the change of the spring stroke of the suction nozzle.

In addition, it is preferable that the control device determines that it is normal when the difference between the theoretical value and the actual operating time is within a threshold value, and corrects the characteristics of the suction nozzle based on the actual operating time. If the difference between the theoretical value and the actual operating time is greater than or equal to a threshold value, it is determined to be abnormal, and the target nozzle is set to be prohibited from use.

The effect of the invention

According to the present invention, electronic components can be sucked and mounted on a substrate by appropriate load control corresponding to the suction nozzle. Thereby, there is an effect that the electronic component can be stably adsorbed and mounted on the substrate.

Description of drawings

FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting device.

FIG. 2 is a schematic diagram showing a schematic configuration of a component supply unit.

FIG. 3 is a schematic diagram showing a schematic configuration of the electronic component mounting device.

4 is a schematic diagram showing a schematic configuration of a mounting head of the electronic component mounting apparatus.

5 is a schematic diagram showing a schematic configuration of a mounting head of the electronic component mounting apparatus.

FIG. 6 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 7 is a flowchart showing an example of the operation of the electronic component mounting device.

Fig. 8 is an explanatory diagram showing a schematic configuration of a suction nozzle.

Fig. 9 is an explanatory diagram showing the relationship between the operation of the suction nozzle and the detected load.

Fig. 10 is an explanatory diagram showing an example of the operation of the suction nozzle.

Fig. 11 is an explanatory diagram showing an example of characteristics of a suction nozzle.

FIG. 12 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 13 is an explanatory diagram showing an example of the operation of the electronic component mounting device.

FIG. 14 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 15 is a flowchart showing an example of the operation of the electronic component mounting device.

Fig. 16 is an explanatory diagram showing the relationship between the operation of the suction nozzle and the detected load.

Fig. 17 is an explanatory diagram showing the relationship between the operation of the suction nozzle and the detected load.

Fig. 18 is an explanatory diagram showing the relationship between the operation of the suction nozzle and the detected load.

Explanation of symbols

8 Substrate, 10 Electronic component mounting device, 11 Frame body, 12 Substrate transport unit, 14, 14f, 14r Component supply unit, 15 Mounting head, 16XY moving mechanism, 17VCS unit, 18 Replacement nozzle holding mechanism, 19 Component storage unit, 20 Control device, 22X-axis driving part, 24Y-axis driving part, 30 Mounting head body, 31 Mounting head support body, 32 Suction nozzle, 34 Nozzle driving part, 38 Laser recognition device (nozzle shape detection part), 40 Operation part , 42 display unit, 48 load sensor, 60 control unit, 62 mounting head control unit, 64 component supply control unit, 80 electronic component, 100 electronic component supply device

Detailed ways

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by the form (henceforth embodiment) for carrying out the following invention. In addition, the constituent elements in the following embodiments include elements that can be easily conceived by those skilled in the art, elements that are substantially the same, and elements within a so-called equivalent range. In addition, components disclosed in the following embodiments may be appropriately combined.

Hereinafter, embodiments of the electronic component mounting apparatus according to the present invention will be described in detail based on the drawings. In addition, this invention is not limited by this embodiment. FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting device.

An electronic component mounting apparatus 10 shown in FIG. 1 is an apparatus for mounting electronic components on a substrate 8 . The electronic component mounting apparatus 10 has: a housing 11; a substrate conveyance unit 12; component supply units 14f, 14r; a mounting head 15; an XY moving mechanism 16; a VCS unit 17; 20 ; the operation unit 40 ; the display unit 42 ; and the load sensor 48 . In addition, the XY movement mechanism 16 has an X-axis drive unit 22 and a Y-axis drive unit 24 . Here, as shown in FIG. 1 , the electronic component mounting apparatus 10 according to the present embodiment has component supply units 14 f and 14 r on the front side and the rear side centering on the board conveyance unit 12 . In the electronic component mounting apparatus 10 , the component supply unit 14 f is arranged on the front side of the electronic component mounting apparatus 10 , and the component supply unit 14 r is arranged on the rear side of the electronic component mounting apparatus 10 . In addition, below, when not distinguishing especially two component supply units 14f and 14r, it is called the component supply unit 14. The housing 11 is a box for accommodating various parts constituting the electronic component mounting apparatus 10 .

The structure of the substrate 8 is not particularly limited as long as it is a component for mounting electronic components. The substrate 8 of this embodiment is a plate-shaped member, and a wiring pattern is provided on the surface. On the surface of the wiring pattern provided on the substrate 8 , solder is attached as a joining member for joining the wiring pattern of the plate-like member and the electronic component by reflow.

The substrate transport unit 12 is a transport mechanism that transports the substrate 8 in the X-axis direction in the drawing. The substrate conveyance unit 12 includes: a guide rail extending in the X-axis direction; and a conveyance mechanism that supports the substrate 8 and moves the substrate 8 along the guide rail. In the substrate conveyance unit 12 , the surface to be mounted of the substrate 8 faces the mounting head 15 , and the substrate 8 is conveyed in the X-axis direction by moving the substrate 8 along the rails by the conveyance mechanism. The board conveying part 12 conveys the board|substrate 8 supplied from the equipment which supplies to the electronic component mounting apparatus 10, to a predetermined position on the guide rail. The mounting head 15 mounts the electronic component on the surface of the substrate 8 at the above predetermined position. The substrate conveyance part 12 conveys the board|substrate 8 to the apparatus which performs the next process after mounting electronic components on the board|substrate 8 conveyed to the said predetermined position. In addition, various configurations can be used as the transport mechanism of the substrate transport unit 12 . For example, it is possible to use a conveyor-type conveyance mechanism that integrates a conveyance mechanism. In this conveyance mechanism, a guide rail arranged along the conveyance direction of the substrate 8 and an endless belt rotating along the guide rail are combined so that The substrate 8 is transported in a state where the substrate 8 is placed on it.

In the electronic component mounting apparatus 10, a component supply unit 14f is arranged on the front side, and a component supply unit 14r is arranged on the rear side. The component supply unit 14f on the front side and the component supply unit 14r on the rear side each have an electronic component supply device that holds a plurality of electronic components mounted on the substrate 8 so that they can be supplied to the mounting head 15, that is, can be supplied by the mounting head 15. Electronic components are supplied to the holding position while being held (attracted or gripped). Component supply units 14f and 14r of the present embodiment have the same configuration and have a plurality of electronic component supply devices. The electronic component supply device supplies electronic components to the holding positions where the electronic components are held by the mounting heads 15 , respectively. Hereinafter, the configuration of the component supply unit 14 will be described.

The component supply unit 14 has a plurality of electronic component supply devices (hereinafter simply referred to as “component supply devices”) 100 as shown in FIG. 2 . The plurality of component supply devices 100 shown in FIG. 2 are held on a support table (container) 102 . In addition, other devices (for example, a measuring device, a camera, etc.) of the component supply apparatuses 100 and 100 may be mounted on the support table 102 .

The component supply unit 14 has an electronic component supply device 100 on which an electronic component holding tape (chip component holding tape) in which a plurality of mount-type electronic components is fixed in a holding tape main body is mounted, and the electronic component holding tape The holding position of the held mounted electronic component is peeled off from the holding tape main body, so that the mounted electronic component at the holding position can be held by the suction nozzle or the gripping nozzle provided on the mounting head.

In the electronic component supply apparatus 100 , electronic components are supplied to the mounting head 15 using an electronic component holding tape configured by pasting chip-type electronic components to be mounted on a substrate on the holding tape. In addition, the electronic component holding tape forms a plurality of accommodation chambers on the holding tape, and accommodates electronic components in the accommodation chambers. The electronic component supply apparatus 100 is a holding tape feeder that holds an electronic component holding tape, conveys the held electronic component holding tape, and moves the storage chamber to a place where the electronic component can be sucked by the suction nozzle of the mounting head 15. Keep the area. Furthermore, by moving the storage chamber to the holding area, the electronic component housed in the storage chamber can be exposed at a predetermined position, and the electronic component can be sucked and gripped by the suction nozzle of the mounting head 15 . The electronic component supply apparatus 100 is not limited to a holding tape feeder, and various chip component feeders that supply chip-type electronic components may be employed. As the chip component feeder, for example, a stick feeder and a bulk feeder can be used. In addition, a chip electronic component (mounted electronic component) is a leadless electronic component that does not have a lead inserted into an insertion hole (through hole) formed on a substrate. SOP, QFP, etc. are illustrated as a mount type electronic component. Chip-type electronic components are mounted on the substrate without inserting leads into the insertion holes.

In the component supply unit 14 , the plurality of component supply devices 100 held on the support table 102 are constituted by various types of component supply devices 100 having different types of electronic components to be mounted, mechanisms for holding electronic components, or supply mechanisms. In addition, the component supply unit 14 may have a plurality of components supply devices 100 of the same type. In addition, it is preferable that the component supply unit 14 is configured to be detachable from the apparatus main body. The component supply unit 14 may use various electronic component supply devices for supplying electronic components. For example, a stick feeder or a tray feeder may be provided as the electronic component supply apparatus 100 in the component supply unit 14 . In addition, a bowl feeder may be provided as an electronic component supply device in the component supply unit 14 .

The mounting head 15 holds (adsorbs or grips) the electronic components held on the component supply unit 14 (mountable electronic components held on the electronic component supply apparatus 100 ) by suction nozzles, and the electronic components held by the substrate transport unit 12 A mechanism for mounting electronic components on the substrate 8 that has been moved to a predetermined position. In addition, the structure of the mounting head 15 will be described later.

The XY moving mechanism 16 is a moving mechanism that moves the mounting head 15 in the X-axis direction and the Y-axis direction in FIG. Section 24. The X-axis driving unit 22 is connected to the mounting head 15 and moves the mounting head 15 in the X-axis direction. The X-axis driving unit 22 has a ball screw, and by rotating the ball screw, the support unit supporting the mounting head 15 moves in the X direction. In addition, the X-axis drive unit 22 further includes a linear guide that supports the mounting head 15 in a movable state in the X-axis direction so that the mounting head 15 does not rotate even when the ball screw rotates. The Y-axis driving unit 24 is connected to the mounting head 15 via the X-axis driving unit 22 , and moves the mounting head 15 in the Y-axis direction by moving the X-axis driving unit 22 in the Y-axis direction. The Y-axis driving unit 24 has a ball screw, and by rotating the ball screw, the support unit supporting the mounting head 15 moves in the Y direction. In addition, the Y-axis drive unit 24 also has a linear guide that supports the movement in the Y-axis direction so that the X-axis drive unit 22 is not rotated even when the ball screw is rotated. The XY moving mechanism 16 can move the mounting head 15 to a position facing the substrate 8 or to a position facing the component supply units 14 f and 14 r by moving the mounting head 15 in the XY axis direction. In addition, the XY moving mechanism 16 adjusts the relative position of the mounting head 15 and the substrate 8 by moving the mounting head 15 . Thereby, the electronic component held by the mounting head 15 can be moved to an arbitrary position on the surface of the substrate 8 , and the electronic component can be mounted on an arbitrary position on the surface of the substrate 8 . That is, the XY moving mechanism 16 moves the mounting head 15 on the horizontal plane (XY plane), and moves the electronic components in the electronic component supply device located in the component supply units 14f and 14r to predetermined positions (mounting positions, mounting positions) on the substrate 8 . Transfer unit for transfer. In addition, various mechanisms for moving the mounting head 15 in a predetermined direction can be used as the X-axis drive unit 22 . Various mechanisms for moving the X-axis drive unit 22 in a predetermined direction can be used as the Y-axis drive unit 24 . As the mechanism (X-axis drive unit 22 , Y-axis drive unit 24 ) that moves the object in a predetermined direction, a mechanism other than the conveyance mechanism using a ball screw and a linear guide may be used. As the mechanism of the X-axis driving unit 22 and the Y-axis driving unit 24 , for example, a linear motor, a rack and pinion, a conveyance mechanism using a belt, etc. can be used.

The VCS unit 17, the replacement nozzle holding mechanism 18, and the parts storage unit 19 are arranged at positions overlapping with the movable area of the mounting head 15 in the XY plane, and the position in the Z direction is closer to the vertical than the mounting head 15. The position on the lower side of the direction. In the present embodiment, the VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are arranged adjacently between the substrate transport unit 12 and the component supply unit 14r.

The VCS unit (component state detection unit, state detection unit) 17 is an image recognition device and includes a camera for imaging the vicinity of the suction nozzle of the mounting head 15 and an illumination unit for illuminating the imaging area. The VCS unit 17 recognizes the shape of the electronic component picked up by the suction nozzle of the mounting head 15 and the holding state of the electronic component on the suction nozzle. More specifically, when the mounting head 15 is moved to a position facing the VCS unit 17, the VCS unit 17 photographs the suction nozzles of the mounting head 15 from the lower side in the vertical direction, and analyzes the captured image, thereby The shape of the suction nozzle, the shape of the electronic component picked up by the suction nozzle, and the holding state of the electronic component on the suction nozzle are recognized. The VCS unit 17 transmits the obtained information to the control device 20 .

The replacement nozzle holding mechanism 18 is a mechanism for holding various types of nozzles. The replacement nozzle holding mechanism 18 holds various types of nozzles in a detachable and replaceable state with respect to the mounting head 15 . Here, the replacement nozzle holding mechanism 18 of this embodiment holds a suction nozzle which holds an electronic component by suction, and a gripping nozzle which holds an electronic component by gripping. The mounting head 15 changes the mounted nozzle by changing the nozzle holding mechanism 18, and is driven by supplying air pressure to the mounted nozzle, so that the electronic component to be held can be held under an appropriate condition (suction or gripping). .

The component storage unit 19 is a box for storing electronic components held by the mounting head 15 using suction nozzles and not mounted on the substrate 8 . That is, in the electronic component mounting apparatus 10, it becomes a waste box which discards the electronic component which is not mounted on the board|substrate 8. As shown in FIG. The electronic component mounting apparatus 10 moves the mounting head 15 to a position facing the component storage part 19 when there is an electronic component not to be mounted on the substrate 8 among the electronic components held by the mounting head 15, and the held electronic components release, and the electronic component is put into the component storage part 19 .

The load sensor 48 is arranged between the VCS unit 17 and the component storage unit 19 . In the load sensor 48 , the surface on the upper side in the vertical direction, that is, the surface on the side of the mounting head 15 serves as a measurement surface, and detects a load applied to the measurement surface. For example, the load sensor 48 detects the load generated when the suction nozzle of the mounting head 15 is pressed against the measurement surface. The load sensor 48 transmits the detected load to the control device 20 . By detecting the load using the load sensor 48, the load of the suction nozzle which will be described later can be measured with high precision. In addition, in this embodiment, although the load sensor 48 which detects the load which a suction nozzle presses against a measurement surface using a strain gauge etc. is used, it is not limited to this. In the electronic component mounting apparatus 10 , instead of the load sensor 48 , various load detection mechanisms capable of measuring the load generated by the suction nozzle may be used as the load detection unit.

The control device 20 controls each part of the electronic component mounting device 10 . The control device 20 is an aggregate of various control units. In addition, the control device 20 has a storage area for storing various data. The operation unit 40 is an input device for an operator to input an operation. As an input device, a keyboard, a mouse, a touch panel, etc. are illustrated. The operation unit 40 transmits various detected inputs to the control device 20 . The display unit 42 is a screen for displaying various information to an operator, and includes a touch panel, a visual display, and the like. The display unit 42 displays various images based on the image signal input from the control device 20 .

In addition, although the electronic component mounting apparatus 10 of this embodiment provided one mounting head, you may provide two mounting heads corresponding to each of component supply units 14f and 14r. In this case, two X-axis drive units are provided, and by moving the two mounting heads in the XY direction, the two mounting heads can be independently moved. The electronic component mounting apparatus 10 can alternately mount electronic components on one substrate 8 by having two mounting heads. As described above, by alternately mounting electronic components with the two mounting heads, while one mounting head is mounting the electronic components on the substrate 8, the other mounting head can hold the electronic components in the component supply apparatus. Thereby, the time during which electronic components are not mounted on the substrate 8 can be further shortened, and the electronic components can be mounted efficiently. Moreover, it is also preferable that the electronic component mounting apparatus 10 arranges two board|substrate conveyance parts 12 in parallel. If the electronic component mounting apparatus 10 uses the two substrate transfer units 12 to alternately move the two substrates to the electronic component mounting position, and alternately performs component mounting using the above-mentioned two mounting heads 15, the electronic components can be mounted on the substrate more efficiently. .

Next, the configuration of the mounting head 15 will be described using FIGS. 3 to 5 . 3 is a schematic diagram showing a schematic configuration of a mounting head of the electronic component mounting apparatus. 4 is a schematic diagram showing a schematic configuration of a mounting head of the electronic component mounting apparatus. 5 is a schematic diagram showing a schematic configuration of a mounting head of the electronic component mounting apparatus. In addition, in FIG. 3, various control parts which control the electronic component mounting apparatus 10, and one component supply apparatus 100 of the component supply unit 14r are shown together. The mounting head 15, as shown in FIGS. state detection unit) 38 , a special-purpose mounting head 70 , an imaging device (substrate state detection unit) 76 , and a height sensor (substrate state detection unit) 77 .

As shown in FIG. 3 , the electronic component mounting apparatus 10 includes a control unit 60 , a mounting head control unit 62 , and a component supply control unit 64 . The control unit 60 , the mounting head control unit 62 , and the component supply control unit 64 are part of the above-mentioned control device 20 . In addition, the electronic component mounting apparatus 10 is connected to a power source, and uses the control unit 60 , the mounting head control unit 62 , the component supply control unit 64 and various circuits to supply electric power supplied from the power source to each part. The control unit 60 , the mounting head control unit 62 , and the component supply control unit 64 will be described later.

The electronic component supply apparatus 100 exposes the main body of the electronic component 80 upward on the electronic component holding tape. The electronic component supply apparatus 100 moves the electronic component 80 held on the electronic component holding tape to the holding area (adsorption area, grip area) by pulling out and moving the electronic component holding tape. In the present embodiment, the vicinity of the front end in the Y-axis direction of the electronic component supply apparatus 100 serves as a holding area where the suction nozzles of the mounting head 15 hold the electronic component 80 held on the electronic component holding tape.

The mounting head main body 30 has a mounting head support body 31 supporting each part, a plurality of suction nozzles 32 , and a suction nozzle drive unit 34 . In the mounting head main body 30 of this embodiment, as shown in FIGS. 4 and 5 , six suction nozzles 32 are arranged in a row. Six suction nozzles 32 are arranged in a direction parallel to the X axis. In addition, the suction nozzle 32 shown in FIG. 4 and FIG. 5 is equipped with the suction nozzle which sucks and holds an electronic component.

The mounting head support body 31 is a support member connected to the X-axis drive unit 22 and supports the suction nozzle 32 and the suction nozzle drive unit 34 . In addition, the mounting head support 31 also supports an imaging device (substrate state detection unit) 36 , a height sensor (substrate state detection unit) 37 , a laser recognition device 38 , and a special-purpose mounting head 70 .

The suction nozzle 32 is a suction mechanism for suctioning and holding the electronic component 80 . The suction nozzle 32 has an opening 33 at the front end, and sucks and holds the electronic component 80 at the front end by sucking air from the opening 33 . Moreover, the suction nozzle 32 is connected with the shaft 32a. The shaft 32a is a rod-shaped member that supports the suction nozzle 32, and is arranged to extend in the Z-axis direction. An air pipe (pipe) connecting the opening 33 and the suction mechanism of the nozzle drive unit 34 is disposed inside the shaft 32 a.

The suction nozzle drive unit 34 moves the suction nozzle 32 in the Z-axis direction, and suctions the electronic component 80 through the opening 33 of the suction nozzle 32 . Here, the Z axis is an axis orthogonal to the XY plane. In addition, the Z axis is a direction perpendicular to the surface of the substrate 8 . In addition, the suction nozzle drive unit 34 rotates the suction nozzle 32 in the θ direction at the time of electronic component mounting or the like. The θ direction is a direction parallel to the circumferential direction of a circle centered on the Z-axis, where the Z-axis is an axis parallel to the direction in which the Z-axis driving unit moves the suction nozzle 32 . In addition, the θ direction becomes the rotation direction of the suction nozzle 32 .

In the nozzle drive unit 34 , as a mechanism for moving the nozzle 32 in the Z-axis direction, there is, for example, a mechanism including a linear motor whose driving direction is the Z-axis direction. The nozzle drive unit 34 moves the opening 33 at the tip of the nozzle 32 in the Z-axis direction by moving the shaft 32a of the nozzle 32 in the Z-axis direction by a linear motor. Moreover, in the nozzle drive part 34, as a mechanism which rotates the nozzle 32 in the (theta) direction, there exists a mechanism which consists of a motor and the transmission element connected with the shaft 32a, for example. The nozzle drive unit 34 transmits the driving force output from the motor to the shaft 32a by the transmission element, and rotates the shaft 32a in the θ direction, whereby the tip portion of the suction nozzle 32 also rotates in the θ direction.

In the suction nozzle drive unit 34, as a mechanism for suctioning the electronic component 80 through the opening 33 of the suction nozzle 32, that is, a suction mechanism, there is, for example, a mechanism having the following components: an air tube connected to the opening 33 of the suction nozzle 32; A pump is connected to the air pipe; and a solenoid valve switches the opening and closing of the air pipe. The suction nozzle drive unit 34 sucks air from the air pipe with a pump, and switches whether or not to suck air from the opening 33 by switching the solenoid valve on and off. The suction nozzle driver 34 sucks air from the opening 33 by opening the solenoid valve, so that the opening 33 absorbs (holds) the electronic component 80 , and closes the solenoid valve so that the opening 33 does not suck air, so that the electronic component adsorbed on the opening 33 80 is released, that is, it becomes a state where the electronic component 80 is not attracted by the opening 33 (a state where it is not held).

Moreover, the mounting head 15 of this embodiment has the pressure detection part for detecting pressure on each suction nozzle 32 or the shaft 32a. The mounting head 15 detects the pressure applied to the corresponding suction nozzle 32 , that is, the load applied to the suction nozzle 32 by the pressure detection unit.

In addition, the mounting head 15 can replace the nozzles 32 driven by the nozzle driving unit 34 by performing the replacement operation by moving the nozzles 32 by the nozzle driving unit 34 . For example, the mounting head 15 of the present embodiment changes the type of the suction nozzle 32 to be mounted based on the type of electronic component to be sucked (held). Moreover, when the mounting head 15 of this embodiment holds the main body of an electronic component, when the upper surface of a main body is a shape which cannot be sucked by the suction nozzle (suction nozzle) 32, a gripping nozzle is used. The gripping nozzle sucks and releases air in the same way as the suction nozzle, thereby opening and closing the movable piece with respect to the fixed piece, whereby the main body of the electronic component can be gripped and released from above.

The imaging device 36 is fixed to the head support body 31 of the head body 30 , and takes an image of a region facing the head 15 , for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The imaging device 36 has a camera and a lighting device, and obtains an image using the camera while illuminating the field of view with the lighting device. Thereby, images of positions facing the head main body 30 , for example, various images of the substrate 8 or the component supply unit 14 can be captured. For example, the imaging device 36 captures an image of a BOC mark (hereinafter abbreviated as BOC) or a through hole (insertion hole) as a reference mark formed on the surface of the substrate 8 . Here, when a fiducial mark other than the BOC mark is used, an image of the fiducial mark is captured.

The height sensor 37 is fixed on the head support body 31 of the head body 30 , and measures the distance between the head 15 and an opposing area, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. As the height sensor 37, a laser sensor can be used. This laser sensor has: a light-emitting element that emits laser light; Measure the distance to the opposite part. In addition, the height sensor 37 processes the distance to the facing part using its own position and the position of the substrate 8 at the time of measurement, thereby detecting the height of the facing part, specifically, the electronic component. In addition, the process of detecting the height of the electronic component 80 based on the measurement result of the distance with respect to an electronic component may be performed by the control part 60.

The laser recognition device (laser sensor and nozzle shape detection unit) 38 has a light source 38 a and a light receiving element 38 b. The laser recognition device 38 is built in the bracket 50 . As shown in FIG. 3 , the bracket 50 is connected to the lower side of the head support body 31 , the substrate 8 , and the component supply device 100 side. The laser recognition device 38 is a device that detects the state of the electronic component 80 and the shape of the suction nozzle 32 by irradiating laser light on the electronic component 80 sucked by the suction nozzle 32 of the head main body 30 . Here, the state of the electronic component 80 refers to the shape of the electronic component 80 , whether or not the electronic component 80 is sucked in a correct posture by the suction nozzle 32 , and the like. The shape of the suction nozzle 32 refers to the external shape of the suction nozzle. The light source 38a is a light emitting element that outputs laser light. The position in the Z-axis direction of the light receiving element 38b is arranged at a position facing the light source 38a, that is, at a position having the same height.

The special-purpose mounting head 70 is connected to the mounting head main body 30 . The special-purpose mounting head 70 has the same structure as the mounting head main body 30 except that the number of suction nozzles is one. The special-purpose mounting head 70 has a mounting head support body 71 that supports each part, a single suction nozzle 72 , and a suction nozzle drive unit 74 . On the special-purpose mounting head 70 of this embodiment, as shown in FIG. Arranged in a direction parallel to the X axis. A suction nozzle for suctioning and holding the electronic component 80 is arranged in the suction nozzle 72 .

The mounting head support body 71 is a support member connected to the mounting head support body 31 and supports the suction nozzle 72 and the suction nozzle drive unit 74 . Furthermore, the mounting head support body 71 supports the suction nozzle 72 at a position away from the mounting head support body 31 by a certain distance.

The suction nozzle 72 is a suction mechanism for suctioning and holding the electronic component 80 . The suction nozzle 72 has an opening at the front end, and sucks and holds the electronic component 80 at the front end by sucking air from the opening. Moreover, the suction nozzle 72 has the shaft 72a connected to the front-end|tip part in which the opening was formed and the electronic component 80 is sucked. The shaft 72a is a rod-shaped member that supports the front end, and is arranged to extend in the Z-axis direction. An air pipe (pipe) connecting the opening to the suction mechanism of the nozzle drive unit 74 is arranged inside the shaft 72 a.

The suction nozzle drive unit 74 moves the suction nozzle 72 in the Z-axis direction, and suctions the electronic component 80 through the opening of the suction nozzle 72 . In addition, the suction nozzle drive unit 74 rotates the suction nozzle 72 in the θ direction when the electronic component 80 is mounted or the like. In the nozzle driving unit 74 , as a mechanism for moving the nozzle 72 in the Z-axis direction, there is, for example, a mechanism including a linear motor whose driving direction is the Z-axis direction. The nozzle drive unit 74 moves the opening of the tip portion of the nozzle 72 in the Z-axis direction by using a linear motor to move the shaft 72 a of the nozzle 72 in the Z-axis direction. Moreover, in the nozzle drive part 74, as a mechanism which rotates the nozzle 72 in the (theta) direction, there exists a mechanism which consists of a motor and the transmission element connected to the shaft 72a, for example. The nozzle driving unit 74 transmits the driving force output from the motor to the shaft 72a through the transmission element, and rotates the shaft 72a in the θ direction, whereby the tip portion of the suction nozzle 72 also rotates in the θ direction.

In the suction nozzle driving part 74, as a mechanism for suctioning the electronic component 80 through the opening of the suction nozzle 72, that is, a suction mechanism, there is, for example, a mechanism having the following components: an air tube connected to the opening of the suction nozzle 72; a pump, It is connected with the air pipe; and the electromagnetic valve switches the opening and closing of the pipeline of the air pipe. The suction nozzle drive unit 74 sucks the air in the air pipe with a pump, and switches whether or not to suck air from the opening by switching the solenoid valve on and off. The suction nozzle driver 74 sucks air from the opening by opening the electromagnetic valve, thereby making the opening absorb (hold) the electronic component 80 , and closing the electromagnetic valve so that the opening does not attract air, thereby releasing the electronic component 80 adsorbed on the opening, that is, , the electronic component 80 is not attracted by the opening (state not held).

The imaging device 76 is fixed to the head support body 71 of the head body 30 , and takes an image of a region facing the head 15 , for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The imaging device 76 has the same function as that of the imaging device 36 . The height sensor 77 is fixed on the head support body 71 of the head body 30 , and measures the distance between the head 15 and an opposing area, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The height sensor 77 has the same function as the height sensor 37 . The imaging device 76 and the height sensor 77 differ only in the arrangement positions, have the same functions as the imaging device 36 and the height sensor 37, and are used for the same purpose.

The mounting head 15 has a special-purpose mounting head 70 in which a suction nozzle 72 is arranged at a position far away from the mounting head main body 30, so that the electronics mounted by the mounting head 15 with one reciprocating motion between the component supply unit 14 and the substrate 8 can be The selection of components is wider. For example, it is possible to hold small electronic components with six adjacent suction nozzles 32 while holding large electronic components (electronic components arranged at a larger interval than the suction nozzles 32 ) with the suction nozzles 72 located far away. That is, even if there is a large electronic component that cannot be held by other suction nozzles 32 after being sucked by the suction nozzle 32, the operation can be performed by using the suction nozzle 72, and the holding of other suction nozzles 32 will not be affected. make an impact.

The mounting head 15 has the above-mentioned structure. In addition, although the mounting head 15 of the above-mentioned embodiment has been described as a case where suction nozzles are attached to the suction nozzles 32 and 72 , it is possible to use a gripper that holds electronic components by gripping the nozzles 32 and 72 . nozzle. When the mounting head 15 uses gripping nozzles as the suction nozzles 32, 72, by adjusting the air pressure supplied to the suction nozzles 32, 72, the driving part of the gripping nozzles is operated to control the gripping nozzles. The state of the electronic part and the released state are switched. In addition, it is preferable that the mounting head 15 has imaging devices (substrate state detection unit) 36, 76, height sensors (substrate state detection unit) 37, 77, laser recognition device 38, and special-purpose mounting head 70, but may not have these components.

Next, the control function of the device configuration of the electronic component mounting device 10 will be described. As shown in FIG. 3 , the electronic component mounting apparatus 10 includes a control unit 60 , a mounting head control unit 62 , and a component supply control unit 64 as the control device 20 . Each of the various control units is composed of a CPU, ROM, RAM, and other components having arithmetic processing functions and storage functions (storage areas). In addition, in this embodiment, a plurality of control units are provided for convenience of explanation, but one control unit may be provided. In addition, when the control function of the electronic component mounting apparatus 10 is set as one control part, it may implement|achieve by one arithmetic unit, and may implement|achieve it by several arithmetic units. In addition, in each control unit, as a storage area, it may be stored in one ROM or RAM, or a plurality of storage media may be provided. Each control unit stores programs for arithmetic processing, various setting data, and conditions in a storage area.

The control unit 60 is connected to each part of the electronic component mounting apparatus 10, and executes a stored program based on an input operation signal and information detected in each part of the electronic component mounting apparatus 10 to control the operation of each part. The control unit 60 controls, for example, the conveying operation of the substrate 8 , the driving operation of the mounting head 15 by the XY moving mechanism 16 , the shape detection operation by the laser recognition device 38 , and the like. In addition, the control unit 60 sends various instructions to the mounting head control unit 62 as described above, and controls the control operation of the mounting head control unit 62 . The control unit 60 also controls the control operations of the mounting head control unit 62 and the component supply control unit 64 .

The mounting head control unit 62 is connected to the nozzle driving unit 34, 74, various sensors disposed on the mounting head support body 31, and the control unit 60 to control the nozzle driving unit 34, 74 and control the suction nozzle 32, 72. actions are controlled. The mounting head control unit 62 controls the adsorption (holding)/release operation of the electronic component 8 by the suction nozzles 32 and 72 based on the operation instructions supplied from the control unit 60 and the detection results of various sensors (for example, distance sensors), and each suction nozzle 32 , 72 rotation action, Z-axis direction movement action is controlled.

The component supply control part 64 controls the supply operation|movement of the electronic component 80 by component supply means 14f, 14r. The component supply control unit 64 may be provided for each component supply apparatus 100 , or all the component supply apparatuses 100 may be controlled by one component supply control unit 64 . For example, the component supply control unit 64 controls the operation of replacing and moving the trays of the electronic component supply apparatus 100 . In addition, the component supply control unit 64 controls the pulling operation (moving operation) of the electronic component holding tape realized by the component supply device 100 . The component supply control unit 64 executes various operations based on instructions from the control unit 60 . The component supply control unit 64 controls the movement of the electronic component holding tape or the electronic component holding tape by controlling the pulling operation of the electronic component holding tape or the electronic component holding tape.

In addition, the control device 20 stores characteristic data of suction nozzles in a storage area. In addition, the control device 20 may store the characteristic data of the suction nozzles in the storage area of any one of the control unit 60 , the head control unit 62 , and the component supply control unit 64 . In addition, the control device 20 may provide storage areas (ROM, etc.) in the control unit 60 , the head control unit 62 , and the component supply control unit 64 respectively, and store characteristic data of suction nozzles in the storage areas provided separately. In the control device 20 , the operation of the head control unit 62 and the component supply control unit 64 is controlled by the control unit 60 , whereby the operation for detecting the characteristics of the nozzle is executed. In addition, the control device 20 controls the operation of the mounting head by the mounting head control unit 62 , specifically, the movement operation of the suction nozzles 32 and 72 in the Z-axis direction, based on the detected nozzle characteristics. This point will be described later.

Next, the operation of each part of the electronic component mounting apparatus will be described. In addition, the operation|movement of each part of the electronic component demonstrated below is executed by controlling the operation|movement of each part by the control apparatus 20. As shown in FIG.

FIG. 6 is a flowchart showing an example of the operation of the electronic component mounting device. The outline of the overall processing operation of the electronic component mounting apparatus 10 will be described using FIG. 6 . In addition, the process shown in FIG. 6 is executed by controlling each part by the control device 20 . In the electronic component mounting apparatus 10, the production program is read as step S52. The production program is generated by a dedicated production program generation device, or by the control device 20 based on various input data.

After reading the production program in step S52, the electronic component mounting apparatus 10 detects the state of the apparatus as step S54. Specifically, the configuration of the component supply units 14f and 14r, the type of the filled electronic component 80, the type of the prepared suction nozzles 32, 72, and the like are detected. After the electronic component mounting apparatus 10 detects the state of the apparatus in step S54 and completes the preparation, as step S56 , the board 8 is carried in. The electronic component mounting apparatus 10 carries in a board|substrate in step S56, arrange|positions a board|substrate to the position to mount an electronic component, and as a step S58, mounts an electronic part on a board|substrate. The electronic component mounting apparatus 10 carries out the board|substrate as step S60 after completion|finish of mounting of an electronic component in step S58. After the electronic component mounting apparatus 10 unloads the substrate in step S60, it is determined in step S62 whether or not the production has been completed. When the electronic component mounting apparatus 10 determines in step S62 that production has not been completed (No), it proceeds to step S56 and executes the processing from step S56 to step S60 . That is, a process of mounting electronic components on a substrate based on a production program is performed. When the electronic component mounting apparatus 10 determines in step S62 that the production has been completed (YES), it ends this process.

The electronic component mounting apparatus 10 reads the production program and performs various settings as described above, and then mounts the electronic component on the substrate, thereby manufacturing the substrate on which the electronic component is mounted. In addition, in the electronic component mounting apparatus 10, as an electronic component, a lead type electronic component having a main body and a lead connected to the main body is mounted on a substrate, specifically, by inserting the lead into a hole (insertion hole) formed on the substrate. Inserted in, so that the electronic components can be mounted on the substrate.

FIG. 7 is a flowchart showing an example of the operation of the electronic component mounting device. In addition, the processing operation shown in FIG. 7 is an operation|movement from carrying in a board|substrate to completion of mounting an electronic component on a board|substrate. In addition, the processing operation shown in FIG. 7 is executed by controlling the operation of each part by the control unit 60 .

As step S102, the control unit 60 carries in the substrate. Specifically, the control unit 60 uses the substrate transport unit 12 to transport the target substrate on which the electronic component is mounted to a predetermined position. After the control unit 60 carries in the substrate in step S102, it performs holding movement in step S104. Here, the holding movement (suction movement) refers to a processing operation of moving the head body 30 to a position where the suction nozzle 32 faces the electronic component 80 located in the holding area of the component supply unit 14 .

After the control unit 60 performs suction movement in step S104, the suction nozzle 32 is lowered as step S106. That is, the control unit 60 moves the suction nozzle 32 downward to a position where the electronic component 80 can be held (adsorbed, grasped). After the control unit 60 lowers the suction nozzle 32 in step S106, the component is held by the suction nozzle 32 in step S108, and the suction nozzle 32 is raised in step S110. After the control unit 60 raises the suction nozzle to a predetermined position in step S110, specifically, after moving the electronic component 80 to the measurement position of the laser recognition device 38, as step S112, the electronic component 80 sucked by the suction nozzle 32 is The shape is detected. After detecting the shape of the electronic component in step S112, the control part 60 raises a suction nozzle as step S114. In addition, the control unit 60 detects the component shape in step S112 as described above, and when it determines that the held electronic component is unmountable, discards the electronic component and adsorbs the electronic component again. After the control unit 60 raises the suction nozzle to a predetermined position, as step S116, it performs mounting movement, that is, a process of moving the electronic component sucked by the suction nozzle 32 to a position facing the mounting position (mounting position) of the substrate 8 . The action is to lower the suction nozzle 32 as step S118, perform component mounting (component mounting) as step S120, that is, perform a processing operation of releasing the electronic component 80 from the suction nozzle 32, and lift the suction nozzle 32 as step S122. That is, the control unit 60 executes the processing operations from step S112 to step S120 to execute the above-mentioned installation processing.

When the control unit 60 raises the suction nozzle in step S122, as step S124, it is determined whether the mounting of all components is completed, that is, whether the mounting process of the electronic components to be mounted on the substrate 8 is completed. When the control unit 60 determines in step S124 that the mounting of all components has not been completed (No), that is, when there are remaining electronic components that are scheduled to be mounted, the control unit 60 proceeds to step S104 and executes the process of mounting the next electronic component on the substrate 8. Handle actions. As described above, the control unit 60 repeats the above-mentioned processing operations until all the components are mounted on the substrate 8 . When it is determined in step S124 that the mounting of all components has been completed (Yes), the control unit 60 ends this process.

By executing the processing operation shown in FIG. 7 , the electronic component mounting apparatus 10 can mount electronic components on a substrate and produce a substrate on which electronic components are mounted.

Next, the control operation of the suction nozzle 32 by the electronic component mounting apparatus 10 , specifically, the operation when the electronic component is sucked by the suction nozzle and the operation when mounting the electronic component on a substrate, will be described with reference to FIGS. 8 to 18 .

First, an example of a suction nozzle will be described using FIG. 8 . Fig. 8 is an explanatory diagram showing a schematic configuration of a suction nozzle. In the electronic component mounting apparatus 10 of the present embodiment, there are standard type suction nozzles and load control type suction nozzles as suction type suction nozzles for suctioning and holding electronic components. The suction nozzle 120 shown in FIG. 8 is a load control type suction nozzle, and has a base 130 , a front end support 132 , a front end 134 , a spring 136 , and a stopper 138 . The base portion 130 is a portion connected to the shaft 32a. The nozzle 120 can move integrally with the shaft 32a by supporting the base 130 on the front end of the shaft 32a. The front end support portion 132 is a rod-shaped member extending along the Z-axis direction, and is connected to the base portion 130 in a slidable state. The front end portion 134 is connected to the front end of the front end support portion 132 . The surface of the front end portion 134 that is farthest from the base portion 130 is a surface in contact with electronic components. One end of the spring 136 is connected to the base 130 and the other end is connected to the stopper 138 . The spring 136 applies a force to the stopper 138 in a direction to move the stopper 138 to the original position when the stopper 138 moves to the base 130 side. The stopper 138 is fixed at a certain distance from the front end support portion 132 .

The suction nozzle 120 has the above-mentioned structure, and the base 130 and the stopper 138 are separated in a no-load state. When a load is applied to the tip portion 134 from this state, the tip support portion 132 , the tip portion 134 , and the stopper 138 move toward the base portion 130 to contract the spring 136 . And, when a load greater than or equal to a certain amount is applied to the front end portion 134, the stopper 138 and the base portion 130 come into contact as indicated by the suction nozzle 120a. Moreover, when the stopper 138 moves to the position where it contacts the base part 130, even if the load applied to the front-end part 134 of the suction nozzle 120a increases, the front-end|tip part 134 will be in the state which does not move substantially. In addition, for the suction nozzle 120a, if the load applied to the front end portion 134 becomes smaller and the reaction force of the spring 136 is larger than the load, the front end portion 134 is moved away from the base portion 130 by the reaction force of the spring 136. If When the load becomes 0, it becomes the state of the suction nozzle 120 .

The suction nozzle 120 has the above-mentioned structure. By installing the stopper 138 on the front end support part 132 and connecting it to the spring 136, compared with connecting the spring to the front end support part 132, the movement of the spring 136 and the front end support part 132 can be reduced. scope. By narrowing the movement range of the front-end support part 132, the displacement of the front-end support part 132 can be suppressed, and an electronic component can be easily adsorbed. In addition, the suction nozzle 120 has a structure in which the surface of the base 130 presses the stopper 138 at the time of squeezing, that is, when the stopper 138 contacts the base 130 . Thereby, it is possible to suppress the concentration of force on the front end support portion 132, the front end portion 134, etc., and it is possible to improve the durability of the suction nozzle 120, and it is difficult to break even when a high load is applied thereto. When the electronic component mounting apparatus performs load control using the suction nozzle 120 , the spring 136 is fully pressed and squeezed, and the load generated by various units of the mounting head 15 is transmitted to the electronic component at a high transmission rate. Thereby, the difference between the detected pressure and the load applied to the electronic component can be reduced. In addition, the electronic component mounting apparatus 10 has suction nozzles having the same shape but having different spring constants, that is, suction nozzles having different loads (specified loads) until pressing.

The relationship between the operation of the suction nozzle and the load will be described using FIGS. 9 and 10 . Fig. 9 is an explanatory diagram showing the relationship between the operation of the suction nozzle and the detected load. Fig. 10 is an explanatory diagram showing an example of the operation of the suction nozzle. In addition, in FIGS. 9 and 10 , the load is detected by the load sensor 48 by bringing the front end portion 134 of the suction nozzle 120 into contact with the load sensor 48 . In addition, the vertical axis shown in FIG. 9 represents two of the Z-axis movement and the load. The Z-axis motion represents the moving speed when the moving speed in the downward direction in the vertical direction is assumed to be positive, that is, the downward movement is assumed to be in the positive direction. Load is the load detected by the load sensor. In addition, the same control is performed also when the load is detected by the load detection unit provided on the mounting head. In this case, the load in the state where the suction nozzle is in contact with the electronic component, and the load in the state in which the suction nozzle holding the electronic component is in contact with the substrate are detected. The contact detection load is a reference load for determining that the nozzle is in contact, and the specified load is set as a load applied to the nozzle when the electronic component is picked up or when the electronic component is mounted on the substrate.

The mounting head 15 descends from a state where the suction nozzle 120 is located at a predetermined height in the Z-axis direction, decelerates after descending to a predetermined height, and stops once at time t1 after descending to a predetermined height. Then, it starts to descend again at a speed (substrate contact speed) lower than that at the time of descending to a predetermined height. In addition, the electronic component mounting apparatus starts load detection by the load sensor 48 after the board contact speed starts to decrease at time t1. Then, the suction nozzle is continuously lowered, and when a load equal to or greater than the contact detection load is detected by the load sensor at time t2, it is determined that the electronic component is in contact with the load sensor. That is, it is determined that the state of the suction nozzle 120b is shifted from the state of the suction nozzle 120 in FIG. 10 .

After detecting the contact at time t2, the mounting head 15 temporarily stops the lowering of the suction nozzle at time t3 after a fixed time elapses, and starts lowering at a speed (load control speed) lower than the substrate contact speed. Here, the fixed time from time t2 to time t3 is the switching waiting time. In addition, since the mounting head is also lowered during the period from time t2 to time t3, starting from the mounting head 120b shown in FIG. Lowering the base 130 compresses the spring. Then, after the mounting head 15 starts descending again at time t3, the suction nozzle 120 is brought into a squeezed state at time t4. That is, as shown in suction nozzle 120d of FIG. 10, the stopper 138 and the base part 130 are in contact.

After the suction nozzle 120 is in the squeezed state, the mounting head 15 continues to descend, thereby increasing the load applied from the front end portion 134 to the load sensor 48 as shown from time t4 to time t5 in FIG. 9 . The loading head 15 starts to decelerate the descending speed and stops at time t5 when it is determined to be at the specified load after it is determined to be stopped, thereby stopping the movement of the nozzle with the specified load. In addition, the loading head 15 starts raising the suction nozzle at time t6 after the predetermined operation is completed.

The operation of the suction nozzle for load control is controlled by the above operation. In addition, the electronic component mounting apparatus 10 has a plurality of suction nozzles with different characteristics to mount various electronic components. In addition, since the spring stroke, abutment load, and specified load differ depending on the type of suction nozzle, appropriate control cannot be performed if the control is performed under the same conditions.

The electronic component mounting apparatus 10 of the present embodiment stores characteristic data of suction nozzles in the storage area of the control device 20 , and controls the operation of each suction nozzle, especially the operation of the load control nozzle, based on the stored data.

Here, FIG. 11 is an explanatory diagram showing an example of nozzle characteristics. As shown in FIG. 11 , the storage area stores information for each suction nozzle: front end width in X direction, front end width in Y direction, nozzle type, contact load, spring travel and other information. As the nozzle characteristics, the upper limit value of the specified load may also be included. In addition, information input to the operation unit 40 by the operator may be used for the width of the front end in the X direction, the width of the front end in the Y direction, the type of the nozzle, and the like among the nozzle characteristics. The electronic component mounting apparatus 10 may detect the shape using the laser recognition device 38 and the VCS unit 17, and may specify the nozzle type based on various measurement results. In addition, the electronic component mounting apparatus 10 can detect the contact load and the spring stroke by measurement.

Next, the acquisition process of nozzle characteristics (nozzle data) will be described. FIG. 12 is a flowchart showing an example of the operation of the electronic component mounting device. FIG. 13 is an explanatory diagram showing an example of the operation of the electronic component mounting device. FIG. 14 is a flowchart showing an example of the operation of the electronic component mounting device. The processing shown in FIGS. 12 and 14 can be realized by controlling the operation of each part by the control device 20 .

As step S200, the control device 20 installs the suction nozzle. Specifically, the target nozzle to acquire the nozzle characteristics is mounted on the mounting head. After the control device 20 attaches the suction nozzle in step S200, as step S202, the shape of the tip of the suction nozzle is obtained. Specifically, the shape of the suction nozzle is detected by the laser recognition device 38 . Specifically, by determining the tip of the nozzle (the end on the lower side in the vertical direction) and measuring the shape of the nozzle at this height, the size of the tip of the nozzle (width in the X direction and width in the Y direction) is detected .

After the control device 20 detects the shape of the tip in step S202, as step S204, classification based on the shape of the tip is performed. Specifically, the control device 20 extracts a suction nozzle having the same shape as the detected tip shape from the data stored in the storage area.

After the control device 20 performs the classification in step S204, as step S206, it is determined whether the nozzle classification is completed, that is, whether the target nozzle has been identified. Specifically, the control device 20 determines that nozzle sorting is completed when there is only one nozzle of the same shape extracted from the storage area, and determines that nozzle classification is completed when there are two or more or zero nozzles. Mouth classification does not end there. When the control apparatus 20 determines in step S206 that the nozzle sorting has not been completed (NO in step S206), it progresses to step S210.

When the number of nozzles extracted by the control device 20 in step S206 is greater than or equal to two, and the nozzles for normal use and the nozzles for load control are included, the stopper of the nozzle for load control may be The shape is measured at the height of the position to determine the type of nozzle. Specifically, as shown in FIG. 13 , by measuring the shape of the position where the stopper 150 is arranged on the nozzle for load control, it can be recognized that the nozzle to be measured is a load having a stopper 138 . The suction nozzle 120 for control is also the normal suction nozzle 140 without a stopper. Here, one end of the nozzle 140 is connected to the front end 134 , and the other end is provided with a spring 148 connected to the base 130 . In addition, the control device 20 may end the detection process of the nozzle characteristics when it determines that the nozzle is a nozzle for normal use.

When it is determined in step S206 that the nozzle sorting has been completed (YES in step S206 ), the control device 20 determines whether or not it is a nozzle for load control as step S208 . When the control device 20 determines in step S208 that it is a suction nozzle for load control (YES in step S208 ), it proceeds to step S210 . When the control device 20 determines in step S208 that it is not a suction nozzle for load control (NO in step S208 ), it proceeds to step S230 .

The control device 20 is no in step S206 or yes in step S208, that is, when more than or equal to 2 suction nozzles are extracted from the storage area or 1 suction nozzle is not extracted, or it is determined that the object is a load In the case of a suction nozzle for control, the mounting head 15 is moved onto the load sensor 48 as step S210. In addition, in this embodiment, although the load sensor 48 is used, when the mechanism (load detection part) for detecting the load of a suction nozzle is provided in the mounting head 15, you may load it on a horizontal platform (temporary placement platform of an electronic component, etc.) ) to move up, and perform load detection by the load detection unit on the mounting head.

After the control device 20 moves the mounting head 15 onto the load cell 48 in step S210 , it creates a vacuum in step S212 . That is, the suction operation of the suction nozzle is started. By suctioning with the nozzle, the inside of the nozzle becomes negative pressure, and the environment is the same as that of the actual component mounting. Specifically, by creating a negative pressure in the suction nozzle, the actual detected load becomes lower than the theoretical value detected based on the spring constant.

After forming a vacuum in step S212, the control device 20 detects the contact load as step S214. Specifically, the control device 20 gradually lowers the nozzle, that is, approaches the load sensor 48 , and moves the nozzle until the load sensor 48 detects a load determined to be in contact with the nozzle.

After acquiring the contact load in step S214, the control device 20 acquires the load value from the detection height up to 10 mm as step S216. That is, the control device 20 further lowers the suction nozzle by 10 mm from the position where the contact load is detected, and uses the load sensor 48 to detect the load when the suction nozzle is located at each position. The control device 20 lowers the suction nozzle at intervals of 0.1 mm, for example, and detects the load at each position. The relationship between the detected position and the load is stored in the storage area.

After the control device 20 acquires the load value in step S216, as step S218, it is determined whether or not there is an abnormality in the suction nozzle for load control. Next, the determination process of the suction nozzle for load control is demonstrated using FIG. 14. FIG.

The control device 20 sets the return value to no abnormality in step S240. That is, the value indicating the determination result described later is returned to the initial state. After the control device 20 initializes the return value in step S240, as step S242, substitutes the load value into A, specifically, substitutes the contact load detected in step S214, and substitutes the final load value into B as step S244. To obtain a value, specifically, the value detected last among the values detected in step S216 is substituted, and a comparison between A and B is performed as step S246.

When the control device 20 determines in step S246 that A>B, that is, when the load value is larger than the final acquired value, as step S248 , the return value is set to be abnormal, and this process is ended. That is, when the load value is larger than the final acquired value, it is determined that there is an abnormality in the measurement or the suction nozzle itself, and this process ends.

When the control device 20 determines in step S246 that A=B, that is, when the final obtained value is the same as the load value, it determines in step S250 that the nozzle type is a normal nozzle, and ends this process. In this case, the return value becomes no exception. In addition, the control device 20 may determine that the type of the nozzle is a normal nozzle when the difference between A and B is smaller than or equal to the threshold value, that is, the same or close to the value.

When the control device 20 determines in step S246 that A<B, that is, when the load value is smaller than the final obtained value, it determines in step S252 that the nozzle type is a load-controlled nozzle. After the control device 20 determines in step S252 that it is a load-controlled nozzle, as step S254, it substitutes the nozzle information table into C, that is, substitutes the corresponding nozzle information stored in the nozzle characteristic data stored in the storage area. The abutment load value of the nozzle. After substituting the value in step S254, the control device 20 determines whether or not the absolute value of (A-C) is smaller than a threshold value as step S256.

When the control device 20 determines in step S256 that the absolute value of (AC) is not smaller than the threshold value, that is, greater than or equal to the threshold value (NO in step S256 ), this process is directly terminated. When the control device 20 determines in step S256 that the absolute value of (A-C) is smaller than the threshold value (YES in step S256 ), as step S258 , the return value is set to be abnormal, and this process ends.

When the control device 20 determines that there is no abnormality by the processing shown in FIG. 14 (No in step S218), as step S220, the nozzle information is saved, that is, the detected information is saved as the nozzle characteristics, and the entry is entered. Step S230. Here, as the nozzle characteristic, in the case of the nozzle for load control, the contact load value acquired in step S214 is stored as the contact load, and the load value and position detected based on the step S216 are stored. The calculated relationship is stored as spring travel. In addition, the shape of the suction nozzle and the like are also stored as necessary. When the control device 20 determines that there is an abnormality by the processing shown in FIG. 14 (YES in step S218 ), it displays an error as step S222 and proceeds to step S230 . In addition, when an error display is performed, the detection of the nozzle characteristics is not performed normally, so the acquired data is not stored as the nozzle characteristics.

When the control device 20 judges No in step S208, or in the case of performing the processing in step S220 or step S222, it is determined that the detection process of the nozzle characteristic for the target nozzle is completed, and the nozzle is turned on as step S230. Return to the original position, for example, return to the predetermined position where the nozzle holding mechanism 18 is replaced, and this process ends.

Preferably, the electronic component mounting apparatus 10 determines the state of the suction nozzle during the mounting operation of the electronic component based on the characteristics of the suction nozzle detected in the above processing. Here, the description will be made in conjunction with the inspection operation of the electronic component mounting apparatus 10 . In addition, since the production operation of the board|substrate is an operation which performs the above-mentioned process, detailed description is abbreviate|omitted, and the process related to the judgment of the nozzle state is demonstrated emphatically.

After the production of the substrate is started, the control device 20 refers to the designated production program data, detects the nozzles to be used based on the data of the electronic components to be mounted, and mounts the detected nozzles on the mounting head. After mounting the nozzle on the head, the controller 20 uses the laser recognition device 38 to detect the tip shape of the nozzle, compares it with the nozzle characteristic data in the storage area, and determines whether the type of the nozzle installed is correct. In addition, the control device 20 detects the shape of the predetermined height (height where the stopper is formed) by the laser recognition device 38, compares it with the nozzle characteristic data in the storage area, and determines whether the type of the mounted nozzle is correct.

When the suction nozzle to be mounted is a normal suction nozzle (when the electronic component to be mounted is an off-load production component), the control device 20 performs suction and mounting operations of the electronic component based on the production program. The electronic component mounting apparatus 10 also performs suction and mounting operations of the electronic component based on the production program when the suction nozzle to be mounted is a suction nozzle for load control (when the electronic component to be mounted is a load production component). At this time, during the mounting operation, the control device 20 carries out mounting of the electronic component according to the operation shown in FIG. 9 . That is, during mounting, the electronic components are pressed onto the substrate using suction nozzles until a specified load is reached. Here, the contact load value of the characteristic data of the nozzle is used as the contact load value, and the spring stroke/load control speed+boundary value of the characteristic data of the nozzle is used as the control switching waiting time. The control device 20 uses the contact detection load, controls the switching waiting time, and implements the load operation. When the specified load value reaches the specified load value and generates a load greater than or equal to the allowable range, the used nozzle is regarded as unusable. Nozzles, that is, are settings that cannot be used in production operations until the characteristic data of the nozzles are acquired again, and output an error message to warn the status confirmation of the nozzles.

The control device 20 executes the process shown in FIG. 15 in parallel with the mounting operation of the electronic component. FIG. 15 is a flowchart showing an example of the operation of the electronic component mounting device. In the control device 20, as step S270, it is set as spring stroke=the spring stroke stored in the storage area, as step S272, it is set as Time1=time when the control switching waiting time ends, as step S274, it is set as Time2=specified The time when the load is reached is set to Time3=Time2-Time1 as step S276, and is set to Time4=spring stroke/load control speed as step S278. Here, the load control speed is the nozzle moving speed (falling speed) during load control. Thus, the control device 20 calculates Time3, which is the elapsed time from the end of the control switching waiting time (Time1) to the time when the specified load is reached (Time2), and Time4, which is the theoretical time of the pushing speed (spring stroke/load control speed). calculate.

The control device 20 compares Time3 and Time4 as Step S280 after acquiring Time3 and Time4 through the processing from Step S270 to Step S278 . If the control device 20 determines in step S280 that there is no difference between Time3 and Time4, that is, if it determines that the theoretical value calculated from the characteristics of the nozzle matches the actual value, it directly ends the process.

If the control device 20 determines in step S280 that the difference between Time3 and Time4 is greater than or equal to the fixed range, then as step S282, it is determined that the use of the suction nozzle is unusable, and as step S284, it outputs a warning indicating that the spring travel is abnormal, and ends This processing.

If the control device 20 determines in step S280 that the difference between Time3 and Time4 is smaller than the fixed range, then as step S286, set the correction amount=the difference with the theoretical time/load control speed, that is, divide the difference between the actual time and the theoretical time Calculate the value obtained after controlling the speed with the load as the correction amount. After the control device 20 calculates the correction amount in step S286, it determines whether or not Time3>Time4 is as step S288.

When the control device 20 determines in step S288 that it is not Time3>Time4 (No), as step S290, it is set as spring stroke=spring stroke-correction amount, that is, the current spring stroke-correction amount is used as a new spring stroke , go to step S294. When the control device 20 determines in step S288 that Time3>Time4 (Yes), as step S292, set spring stroke=spring stroke+correction amount, that is, set the current spring stroke+correction amount as a new spring stroke , go to step S294. That is, when the actual measurement value is ahead of the theoretical value by a fixed value or more, the control device 20 determines that the waiting time for control switching is long, and shortens the spring stroke stored in the storage area by "the difference between the theoretical value and the theoretical value." Value Time/Load Control Speed". In addition, when the actual measurement value is delayed by a fixed value or more compared with the theoretical value, the control device 20 determines that the waiting time for control switching is short, and increases the spring stroke stored in the storage area by the difference between "the theoretical value" and the theoretical value. Value Time/Load Control Speed".

After the control device 20 performs the processing of steps S290 and S292, as step S294, the spring stroke in the storage area is updated, that is, the processing results of steps S290 and S292 are reflected, and this processing is ended.

By performing the above processing, the electronic component mounting apparatus 10 can correct the theoretical value so that it becomes the normal operation time at the time of the next load control operation. As described above, problems due to individual differences in suction nozzles or changes in springs over time can be found early by inspection during the process of mounting electronic components, and can be quickly dealt with. In addition, the electronic component mounting apparatus 10 can perform the inspection of the nozzle without improving the load detection accuracy of the nozzle by performing the inspection of the nozzle based on the processing time.

The electronic component mounting apparatus 10 detects the characteristic data of the suction nozzle, and executes the mounting operation of the electronic component based on the result, so that the control from the detection to the contact to the compression of the spring can be performed with high precision, and the load control operation can be suppressed. Beat loss and quality degradation.

Fig. 16 is an explanatory diagram showing the relationship between the operation of the suction nozzle and the detected load. When the load control operation in FIG. 16 is assumed to be a theoretical value (initial state), the operation of a suction nozzle with a short spring stroke or a case where the spring is shortened due to time-dependent changes is shown. The mounting head 15 lowers the suction nozzle 120 from a state at a predetermined height in the Z-axis direction, decelerates after descending to a predetermined height, and stops once at time t11 after descending to a predetermined height. Then, it starts to descend again at a lower speed (substrate contact speed) than when it descended to a predetermined height. In addition, after the electronic component mounting apparatus starts to descend at the substrate contact speed at time t11, load detection by the load sensor 48 is started. Then, the nozzle continues to descend, and when a load equal to or greater than the contact detection load is detected by the load sensor at time t12, it is determined that the electronic component is in contact with the load sensor. Then, when the spring stroke is short, the compression time of the spring (period from time t12 to time t13 ) is shortened, so the suction nozzle is in the squeezed state during the control switching waiting time. Since the Z-axis movement speed at this time is the substrate contact speed, the load applied to the component rises rapidly and exceeds the specified load at time t14. After the electronic component mounting apparatus determines that the load exceeds the predetermined load at time t14, the moving speed is changed in the negative direction and the suction nozzle is raised. When it is detected that the load becomes lower than a predetermined value at time t15 after raising the suction nozzle, the moving speed of the suction nozzle is decelerated, and the suction nozzle is stopped after reaching a predetermined load at time t16.

Next, FIG. 17 is an explanatory diagram showing the relationship between the operation of the suction nozzle and the detected load. Fig. 17 shows the case where a spring with a low contact load value is used for operation, and the contact detection load does not become a contact detection load even when the spring is compressed, and the contact is detected after being in a pressed state, and the contact speed of the substrate is different. state to reach the specified load, thereby exceeding the specified load. The mounting head 15 lowers the suction nozzle 120 from a state at a predetermined height in the Z-axis direction, decelerates after descending to a predetermined height, and stops once at time t21 when the nozzle 120 descends to a predetermined height. Then, it starts to descend again at a lower speed (substrate contact speed) than the speed when descending to a predetermined height. In addition, after the electronic component mounting apparatus starts to descend at the substrate contact speed at time t21, load detection by the load sensor 48 is started. Then, if the load sensor does not reach the contact detection load as indicated by time t22 even if the suction nozzle continues to descend, the descending at the substrate contact speed is continued. In this case, when the suction nozzle is brought into the squeezed state at time t23, the load rises rapidly and exceeds the specified load at time t24. When the electronic component mounting apparatus determines at time t24 that the load exceeds the predetermined load, the moving speed is changed in the negative direction and the suction nozzle is raised. After detecting that the load becomes lower than a predetermined value at time t25 when the suction nozzle is raised, the moving speed of the suction nozzle is decelerated, and the suction nozzle is stopped when the specified load is reached at time t26. Then, at time t27 when the process ends, the suction nozzle starts to rise.

The electronic component mounting apparatus 10 stores the characteristics of the suction nozzle in the storage area, and mounts the electronic component based on the detection result in the storage area, thereby suppressing the occurrence of the mounting operation shown in FIGS. The condition in which a load greater than or equal to a specified load is applied to an electronic component. Thereby, a high-quality substrate can be manufactured.

Next, FIG. 18 is an explanatory diagram showing the relationship between the operation of the suction nozzle and the detected load. Fig. 18 is a case where a load detection unit is provided on the mounting head, and the load of the suction nozzle is detected by the load detection unit, the sliding resistance (frictional force) of the Z axis is detected as the load of the suction nozzle and judged to be detected. Action when contacting a load. When the electronic component mounting apparatus 10 detects the force generated by the Z-axis sliding resistance as the contact load at time t31 by the load detection unit, it temporarily stops at time t32 after the control switching time elapses from time t31, and then, Start moving at load-controlled speed. Then, when moving at the load control speed, the nozzle is squeezed at time t33, the load is increased, and the movement of the nozzle is stopped after reaching the specified load at time t34. Then, when the process ends, the suction nozzle starts to rise. In FIG. 18 , the deceleration is advanced due to an erroneous detection of the contact, and specifically, the processing is delayed by the difference between the time t35 and the time t36 compared to the case of properly detecting the contact load. As described above, the electronic component mounting apparatus 10 detects a theoretical value based on the characteristic data of the suction nozzle, and compares it while using the result, so that the operation can be controlled with high precision.

In addition, the electronic component mounting apparatus 10 can easily discriminate between normal-use suction nozzles and load-control suction nozzles by detecting the shape of the suction nozzles at a predetermined height based on the characteristic data of the suction nozzles. In addition, even if the tip shape of the nozzle is detected, the type of the nozzle can be identified. Thereby, even when using the suction nozzle of various shapes, a suction nozzle can be specified suitably. In addition, by performing characteristic detection for each suction nozzle, it is possible to detect each characteristic with high precision even when the spring stroke is different for nozzles or the spring constant is different. Since the electronic component mounting apparatus 10 can specify the suction nozzle with high precision, it is possible to suppress the use of a normal suction nozzle when loading a load. Thereby, it is possible to prevent the spring stroke from becoming longer during mounting, the load control time becoming longer, and the tact being lowered. In addition, it is possible to reduce the possibility of nozzle damage due to the use of commonly used nozzles in high-load areas. In addition, it is possible to reduce the possibility of using nozzles with different spring constants at the time of loading the load, failing to accurately control the contact load, and producing defective substrates. It is possible to prevent the following situations, that is, when using the load control nozzle during normal mounting, the set suction operation cannot be completed, and the parts cannot be correctly adsorbed; and the mounting deviation cannot be completed due to the inability to complete the press-in process during mounting. Case.

In addition, in the case where the mounting head 15 of this embodiment has a plurality of suction nozzles in order to mount more types of electronic components with one mounting head, an automatic nozzle changer (in this embodiment, The mounting head replacement action is realized by replacing the combination of the nozzle holding mechanism and the mounting head body), and each nozzle is replaced with various suction nozzles and grip nozzles during installation and production. The electronic component mounting apparatus 10 specifies, for each component, according to component conditions such as the size and weight corresponding to the mountable electronic component and the lead type electronic component, whether the upper surface of the component body has a plane that can be sucked, and whether the component body can be gripped. Suction nozzles with suitable suction apertures or gripping nozzles with gripping parts of suitable shape and stored in the production program. The electronic component mounting apparatus 10 switches the nozzles to be mounted on the mounting head based on the correspondence between the electronic components and the nozzles stored in the production program, or specifies the nozzles holding the electronic components in the mounting head.

The electronic component mounting device may also be equipped with an electronic component supply device in which a plurality of radial lead type electronic components (radial lead components) are mounted and fixed on the holding tape main body in the component supply unit to form Electronic component holding tape (radial component holding tape), the lead wire of the radial lead type electronic component held by the electronic component holding tape is cut at the holding position, and the suction nozzle or the gripping nozzle of the mounting head can be used The radial lead type electronic component located at this holding position is held.

Claims (7)

1. An electronic component mounting device, characterized in that it has: an electronic component supply device that supplies electronic components to the holding area; The mounting head main body has a suction nozzle for holding the electronic components supplied from the electronic component supply device to the holding area, a suction nozzle drive unit, and a mounting head support body. The suction nozzle is driven up and down and rotated, and the air pressure for driving the suction nozzle is supplied to the suction nozzle, and the mounting head support supports the suction nozzle and the suction nozzle driving part; a mounting head moving mechanism that moves the mounting head body; a load detection unit that detects a load generated by pressing the tip of the suction nozzle against the measurement surface; a nozzle shape detection unit that detects the shape of the nozzle; and A control device, which controls the actions of each part, The control device uses the load detection unit and the nozzle shape detection unit to detect the shape of the suction nozzle, the presence or absence of a spring, and the stroke of the spring, and use the detected results as the characteristics of the suction nozzle. storing, and based on the stored characteristics of the nozzle, the up and down driving of the nozzle by the nozzle driving unit is controlled. 2. The electronic component mounting apparatus according to claim 1, wherein: The control device detects the presence or absence of a stopper on the nozzle using the nozzle shape detection unit, and determines that the nozzle is a load control nozzle when the stopper is present. 3. The electronic component mounting apparatus according to claim 1 or 2, wherein: The load detection unit is a load sensor. 4. The electronic component mounting apparatus according to claim 1 or 2, wherein: The nozzle shape detection unit is a laser sensor connected to the head support. 5. The electronic component mounting apparatus according to claim 1 or 2, wherein: The characteristics of the nozzle include contact load value and Z-axis movement speed, The control device is based on the spring stroke included in the characteristics of the suction nozzle, the contact load value, the Z-axis movement speed, and each operation during the mounting operation of mounting the electronic component with the suction nozzle. Execute time to judge the state of the suction nozzle. 6. The electronic component mounting apparatus according to claim 1 or 2, wherein: The control device detects the actual operation time when the electronic component is mounted by the suction nozzle, compares the theoretical value detected based on the characteristics of the suction nozzle with the actual operation time, and calculates the actual operation time for the electronic component. The change of the spring stroke of the suction nozzle is detected. 7. The electronic component mounting apparatus according to claim 6, wherein: The control device determines that it is normal when the difference between the theoretical value and the actual operating time is within a threshold value, and corrects the characteristics of the suction nozzle based on the actual operating time, When the difference between the theoretical value and the actual operating time is greater than or equal to a threshold value, it is determined to be abnormal, and the target nozzle is set to be prohibited from use.

Images