CN104330907B - TFT substrate spray equipment and etch system - Google Patents
TFT substrate spray equipment and etch system Download PDFInfo
- Publication number
- CN104330907B CN104330907B CN201410605977.6A CN201410605977A CN104330907B CN 104330907 B CN104330907 B CN 104330907B CN 201410605977 A CN201410605977 A CN 201410605977A CN 104330907 B CN104330907 B CN 104330907B
- Authority
- CN
- China
- Prior art keywords
- spray
- beam barrel
- nozzle
- nozzles
- tft substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000007921 spray Substances 0.000 title claims abstract description 121
- 239000000758 substrate Substances 0.000 title claims abstract description 42
- 238000007789 sealing Methods 0.000 claims abstract description 7
- 230000002093 peripheral effect Effects 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 9
- 238000005507 spraying Methods 0.000 claims description 5
- 238000012216 screening Methods 0.000 claims 1
- 238000002347 injection Methods 0.000 abstract description 3
- 239000007924 injection Substances 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000003814 drug Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Weting (AREA)
Abstract
The present invention provides a kind of TFT substrate spray equipment, and the injection apparatus includes spray beam barrel and at least two nozzles for being sprayed to the substrate；At least two nozzle sprays beam barrel internal run-through located at the spray shaft tube outer surface and with described, and at least two nozzles are located at the not homonymy of the spray beam barrel outer peripheral face；It is provided with axially extending along spray beam barrel inwall in the spray beam barrel and the area of at least two nozzles and spray beam barrel junction can be more than around the shelter wall of spray beam barrel axis rotation, the area that the shelter wall is contacted with spray beam barrel inwall；The spray beam barrel rotation makes the one kind of the shelter wall at least two kinds of nozzles described in the spray beam barrel inner sealing, and is sprayed another nozzle.The present invention provides a kind of TFT substrate spray system.
Description
Technical field
The present invention relates to a kind of TFT substrate spray equipment and etch system.
Background technology
In liquid crystal display panel manufacturing, wet etching technique application is quite varied, with the various processing procedures of liquid crystal panel
Continuous renewal regenerate, TFT substrate metal wire species is also more, from aluminum manufacturing procedure to copper wiring, silvery journey；Different metals is in system
When making the wet etching used during metal line pattern, liquid is uniformly sprayed at by substrate surface by nozzle, finally giving needs
The metal pattern wanted；But viscosity of the same board due to liquid when being etched using different liquids is different, nozzle
The spray size for gushing out will be different, can thus influence to etch homogeneity.
The content of the invention
It is an object of the invention to provide a kind of TFT substrate spray equipment, it is ensured that the spray that nozzle gushes out is identical, enters
And ensure etching homogeneity.
The present invention also provides a kind of TFT substrate etch system.
The present invention provides a kind of TFT substrate spray equipment, and the injection apparatus includes spray beam barrel and for the base
At least two nozzles of plate spray；At least two nozzle is sprayed in beam barrel located at the spray shaft tube outer surface and with described
Portion's insertion, and at least two nozzles are located at the not homonymy of the spray beam barrel outer peripheral face；Be provided with the spray beam barrel along
Spray beam barrel inwall is axially extending and can be connect with spray beam barrel inwall around the shelter wall of spray beam barrel axis rotation, the shelter wall
Tactile area is more than at least two nozzles and the area for spraying beam barrel junction；The spray beam barrel rotation makes the shelter wall exist
One kind at least two kinds of nozzles described in the spray beam barrel inner sealing, and sprayed another nozzle.
Wherein, at least two nozzle includes the quantity of first jet and second nozzle and first jet and second nozzle
Multiple is, the multiple first jet and multiple second nozzles are arranged in a linear each along the axial direction of the spray beam barrel and are located at
On the spray shaft tube outer surface, and straight line where the multiple first jet with multiple second nozzles places straight line described
Spray shaft tube outer surface not homonymy.
Wherein, the first jet sprays the etching liquid of different viscosityes from the second nozzle respectively.
Wherein, the nozzle diameter of the first jet is different from the nozzle diameter of the second nozzle.
Wherein, the shelter wall is tubular and section is semicircle.
Wherein, the first jet position is rectangular with second nozzle position.
Wherein, straight line where the several first jets with straight line where several second nozzles with the axle of the spray beam barrel
Line is line of symmetry.
Wherein, the spray equipment also includes the control piece of the control spray equipment spray of spray beam barrel connection.
The present invention provides a kind of TFT substrate etch system, and it includes fixing the plummer of substrate, control system and to described
The described spray equipment of substrate etch, spray beam barrel rotation makes the shelter wall be sprayed described in beam barrel inner sealing at least described
One kind in two kind nozzles, and make another nozzle to the substrate.
The spray equipment of TFT substrate of the invention is provided with different types of nozzle on spray beam barrel, and sprays beam barrel
Shelter wall is inside provided with, to the liquid rotation spray beam barrel pin of different viscosityes, is sprayed using different nozzles, produced
Spray size is identical, it is ensured that the uniformity consistency of etching, and spray equipment simple structure of the invention, it is easy to operate.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram of the TFT substrate etch system spray equipment of the embodiment of the present invention.
Fig. 2 is the TFT substrate etch system spray beam barrel schematic cross-section described in Fig. 1.
Fig. 3 is the schematic diagram of the TFT substrate etch system of the embodiment of the present invention.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Fig. 1 and Fig. 3 is referred to, good implementation method of the invention provides a kind of TFT substrate spray equipment and TFT substrate etching system
System.Metal line chart is formed in TFT substrate wet etching for being adapted to different metal.The TFT substrate etch system includes TFT
Baseplate spraying device 10, the plummer 20 of fixed substrate 21 and control system；The spray equipment 10 and the phase of the plummer 20
To setting.
Also referring to Fig. 2, the injection apparatus 10 includes spray beam barrel 12 and for being sprayed at least to the substrate
Two kinds of nozzles；At least two nozzle sprays the internal run-through of beam barrel 12 located at the spray outer surface of beam barrel 12 and with described,
And at least two nozzles are located at the not homonymy of the spray outer peripheral face of beam barrel 12.It is provided with along spray in the spray beam barrel 12
The inwall of beam barrel 12 it is axially extending and can around spray the axis rotation of beam barrel 12 shelter wall 14, the shelter wall 14 with spray beam barrel 12
The area of inwall contact is more than at least two nozzles and the area for spraying the junction of beam barrel 12；Spray beam barrel 12 rotation makes institute
The one kind of shelter wall 14 at least two kinds of nozzles described in the spray inner sealing of beam barrel 12 is stated, and carries out another nozzle
Spray.
Further, at least two nozzle includes first jet 16 and second nozzle 17 and first jet 16 and second
The quantity of nozzle 17 is multiple.The multiple first jet 16 and multiple second nozzles 17 are each along the spray beam barrel 12
Axially it is arranged in a linear on spray beam barrel 12 outer surface, and the place straight line of the multiple first jet 16 and multiple
The place straight line of second nozzle 17 sprays the outer surface of beam barrel 12 not homonymy described.In the present embodiment, several first jets 16
Place straight line is with the place straight line of several second nozzles 17 with the axis of the spray beam barrel 12 as line of symmetry.The spray beam barrel 12
Rotate the position of the 180 convertible first jets 16 and second nozzle 17.In other embodiments, the institute of the first jet 16
In position and the position of second nozzle 17 at right angles, the spray beam barrel 12 rotates the 90 convertible first jets 16 and the
The position of two nozzles 17.
Further, the nozzle diameter of first jet 16 is different from the nozzle diameter of the second nozzle 17.Described first
Nozzle 16 sprays the etching liquid of different viscosityes from the second nozzle 17 respectively.In the present embodiment, the first jet 16
And second nozzle 17 is hollow cone, and the nozzle diameter of first jet 16 is straight more than the spout of the second nozzle 17
Footpath.The first jet 16 is used to spray viscosity etching liquid high, and the second nozzle 17 is low for spraying viscosity
Etching liquid.
Further, the area that the shelter wall 14 is contacted with the spray inwall of beam barrel 12 is more than the first jet 16 and institute
State the area of second nozzle 17 and spray beam barrel 12 junction；In the present embodiment, the shelter wall 14 is tubular and section is half
It is circular.In other embodiments, the section of the shelter wall 14 can also be less than or more than semicircle.The shelter wall 14 is tight
The inwall for pressing close to the spray beam barrel 12 is set.The spray beam barrel 12 makes the shelter wall 14 in the spray beam barrel after rotating
First jet 16 described in 12 inner sealings or the second nozzle 17, the corresponding second nozzle 17 or first jet 16 pairs
The substrate is sprayed.
Further, the spray equipment 10 also includes the control piece of the control spray equipment spray of the spray connection of beam barrel 12
(not shown).In the present embodiment, the control piece can be the electrically-controlled valve for controlling liquid medicine to enter inside spray beam barrel 12.Can
To understand, it is also possible to carry out being respectively provided with electrically-controlled valve for each nozzle.
When being etched operation using the spray equipment 10 of the invention, control system control spray beam barrel 12 rotates,
Needed to spray viscosity regulation spray beam barrel 12 direction of medicine according to the substrate 21, be with the liquid that viscosity is low
Example, the second nozzle 17 is rotated to towards substrate, i.e., downward, then the first jet 16 is just towards opposite side
To while the shelter wall 14 seals first jet 16 inside the spray beam barrel 12, the liquid enters the spray
Make to be sprayed by the second nozzle 17 inside beam barrel 12, can't be flowed out from first jet 16.For the medicine of different viscosityes
Liquid is sprayed using different nozzles, produces spray size identical, it is ensured that the uniformity consistency of etching, and of the invention
Spray equipment simple structure, it is easy to operate.
Above disclosed is only present pre-ferred embodiments, can not limit the right model of the present invention with this certainly
Enclose, one of ordinary skill in the art will appreciate that all or part of flow of above-described embodiment is realized, and will according to right of the present invention
Made equivalent variations are sought, the covered scope of invention is still fallen within.
Claims (9)
1. a kind of TFT substrate spray equipment, it is characterised in that the TFT substrate spray equipment includes spray beam barrel and for right
At least two nozzles of the substrate spray；At least two nozzle located at the spray shaft tube outer surface and with the spray
Beam barrel internal run-through, and at least two nozzles are located at the not homonymy of the spray beam barrel outer peripheral face；Set in the spray beam barrel
Have along spray beam barrel inwall it is axially extending and can around spray beam barrel axis rotation shelter wall, the shelter wall with spray beam barrel
The area of inwall contact is more than at least two nozzles and the area for spraying beam barrel junction；The spray beam barrel rotation makes the screening
The one kind of retaining wall at least two nozzles described in the spray beam barrel inner sealing, and sprayed another nozzle.
2. TFT substrate spray equipment as claimed in claim 1, it is characterised in that at least two nozzle includes the first spray
The quantity of mouth and second nozzle and first jet and second nozzle is multiple, the multiple first jet and multiple second nozzles
Axial direction each along the spray beam barrel is arranged in a linear on the spray shaft tube outer surface, and the multiple first spray
Straight line where mouth and straight lines where multiple second nozzles are in the spray shaft tube outer surface not homonymy.
3. TFT substrate spray equipment as claimed in claim 2, it is characterised in that the first jet and the second nozzle
The etching liquid of different viscosityes is sprayed respectively.
4. TFT substrate spray equipment as claimed in claim 3, it is characterised in that the nozzle diameter of the first jet and institute
The nozzle diameter for stating second nozzle is different.
5. TFT substrate spray equipment as claimed in claim 4, it is characterised in that the shelter wall is tubular and section is half
It is circular.
6. TFT substrate spray equipment as claimed in claim 5, it is characterised in that the first jet position and second
Nozzle position is rectangular.
7. TFT substrate spray equipment as claimed in claim 5, it is characterised in that straight lines where several first jets with
Straight line where several second nozzles is with the axis of the spray beam barrel as line of symmetry.
8. the TFT substrate spray equipment as described in claim any one of 1-7, it is characterised in that the spray equipment also includes
The control piece of the control spray equipment spray of spray beam barrel connection.
9. a kind of TFT substrate etch system, it is characterised in that it includes fixing the plummer of substrate, control system and to described
The spray equipment as described in claim any one of 1-8 of substrate etch, spray beam barrel rotation makes the shelter wall in the spray
The one kind drenched at least two nozzles described in beam barrel inner sealing, and make another nozzle to the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410605977.6A CN104330907B (en) | 2014-10-30 | 2014-10-30 | TFT substrate spray equipment and etch system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410605977.6A CN104330907B (en) | 2014-10-30 | 2014-10-30 | TFT substrate spray equipment and etch system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104330907A CN104330907A (en) | 2015-02-04 |
| CN104330907B true CN104330907B (en) | 2017-06-06 |
Family
ID=52405663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410605977.6A Expired - Fee Related CN104330907B (en) | 2014-10-30 | 2014-10-30 | TFT substrate spray equipment and etch system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104330907B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105651501B (en) * | 2015-12-25 | 2018-04-20 | 广州兴森快捷电路科技有限公司 | The detection method of condition of nozzles under a kind of horizontal line |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07211683A (en) * | 1994-01-25 | 1995-08-11 | Shibaura Eng Works Co Ltd | Substrate cleaning equipment |
| CN101113523A (en) * | 2006-07-28 | 2008-01-30 | 富葵精密组件(深圳)有限公司 | Etching liquid injection device and etching method |
| CN203036010U (en) * | 2012-11-28 | 2013-07-03 | 海尔集团公司 | Motor-driven shunt valve and washing machine with motor-driven shunt valve |
| CN203295607U (en) * | 2013-05-22 | 2013-11-20 | 北京京东方光电科技有限公司 | Spraying system and a wet etching device |
-
2014
- 2014-10-30 CN CN201410605977.6A patent/CN104330907B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07211683A (en) * | 1994-01-25 | 1995-08-11 | Shibaura Eng Works Co Ltd | Substrate cleaning equipment |
| CN101113523A (en) * | 2006-07-28 | 2008-01-30 | 富葵精密组件(深圳)有限公司 | Etching liquid injection device and etching method |
| CN203036010U (en) * | 2012-11-28 | 2013-07-03 | 海尔集团公司 | Motor-driven shunt valve and washing machine with motor-driven shunt valve |
| CN203295607U (en) * | 2013-05-22 | 2013-11-20 | 北京京东方光电科技有限公司 | Spraying system and a wet etching device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104330907A (en) | 2015-02-04 |
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| C10 | Entry into substantive examination | ||
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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Address after: 518132 No. 9-2 Ming Avenue, Guangming New District, Guangdong, Shenzhen Patentee after: TCL China Star Optoelectronics Technology Co.,Ltd. Address before: 518132 No. 9-2 Ming Avenue, Guangming New District, Guangdong, Shenzhen Patentee before: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170606 |
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| CF01 | Termination of patent right due to non-payment of annual fee |