CN104717876A - Heat transfer catalytic heat dissipation method - Google Patents

Abstract

A heat transfer catalytic heat dissipation method, which is provided with a heat transfer interface on a heat source, and is provided with a six-membered ring carbon-based nanocarbon heat dissipation film on at least one side of the heat transfer interface, so that after the heat transfer interface absorbs the heat source, the six-membered ring carbon-based nanocarbon heat dissipation film is Cyclic carbon-based nanocarbon heat dissipation film is used to dissipate heat. Through this, the six-membered cyclic carbon-based nanocarbon heat dissipation film can be used to effectively guide heat transfer to the air to avoid the heat transfer gap between the heat transfer interface and the air, thereby improving heat transfer. efficiency, effectively reducing heat transfer bottlenecks, eliminating the need for heat sink fins, significantly reducing heat dissipation costs, reducing volume and weight, reducing raw material consumption, and saving energy and reducing carbon emissions.

Description

Heat Transfer Catalytic Cooling Method

technical field

The invention relates to a heat transfer catalytic heat dissipation method, especially a method that can use a six-membered ring carbon-based nano-carbon heat dissipation film to effectively guide heat transfer to the air, so as to avoid the heat transfer gap between the heat transfer interface and the air, and achieve Improve heat transfer efficiency, effectively reduce heat transfer bottlenecks, eliminate the need for heat dissipation fins, greatly reduce heat dissipation costs, reduce volume and weight, reduce raw material consumption, and energy-saving and carbon-reducing heat transfer catalytic heat dissipation methods.

Background technique

The generally used heat dissipation mechanism is to use a heat dissipation glue or a high thermal conductivity layer, which is placed between a heat sink and a heat source, and further provided with heat dissipation fins on the heat sink, so as to use the heat sink to dissipate heat.

In terms of the above-mentioned used heat dissipation mechanism, since the thermal conductivity of the glue is small, the used method uses a high heat dissipation insulating layer (which has a large heat conductivity) to replace the glue, but due to the bottleneck of heat transfer and the The barrier does not occur at the interface between the heat source and the heat sink, but at the interface between the heat sink and the air. Since there is a very large heat transfer drop at this interface (that is, the heat transfer of the heat sink is large, but the heat transfer of the air is small), Although the used heat dissipation mechanism uses a high heat dissipation insulating layer with a large thermal conductivity to replace the glued body in an attempt to improve the heat transfer efficiency, but when the heat is transferred to the space between the heat sink and the air through the heat transfer path in the heat sink, the heat will be lost due to heat transfer. The huge drop in efficiency results in heat backflow in the heat transfer path within the heat sink, thus creating a bottleneck and barrier for heat transfer. Therefore, the heat dissipation mechanism that has been used is an ineffective method, because the placement of a high thermal conductivity layer between the two helps to improve heat transfer, but the effect is limited, because the fundamental heat transfer bottleneck and barrier, there is no Therefore, the problem of poor heat dissipation cannot be effectively improved; and in addition to the above-mentioned shortcomings, the arrangement of the heat dissipation fin body will simultaneously cause increased heat dissipation costs, increase the volume and weight of the equipment, and waste raw materials. .

In view of this, the inventor of this case made in-depth discussions on the aforementioned existing problems, and after long-term and rigorous actual tests, he found that the bottleneck and barrier of heat transfer is not between the radiator and the heat source, but exists in the Therefore, the applicant of this case actively seeks a solution through years of experience in research and development and manufacturing of related industries. After long-term research and development, he finally successfully developed the present invention. The most fundamental and direct way to eliminate or reduce heat dissipation bottlenecks and barriers, so as to improve various problems that have been used.

Contents of the invention

The main purpose of the present invention is to provide a heat transfer catalytic heat dissipation method, which can effectively guide the heat transfer to the air by using the six-membered ring carbon-based nano-carbon heat dissipation film, so as to avoid the heat transfer gap between the heat transfer interface and the air, and achieve the improvement Heat transfer efficiency, effectively reducing heat transfer bottlenecks, eliminating the need for heat dissipation fins, greatly reducing cooling costs, reducing volume and weight, reducing raw material consumption, and energy saving and carbon reduction.

In order to achieve the above object, the present invention provides a heat transfer catalytic cooling method, which is provided with a heat transfer interface on the heat source, and at least one side of the heat transfer interface is provided with a six-membered ring carbon-based nano-carbon heat dissipation film, so as to make the heat transfer After the interface absorbs the heat source, it is dissipated by the six-membered ring carbon-based nano-carbon heat dissipation film.

In the above embodiment, one surface of the heat transfer interface is combined with the heat source, and the six-membered ring carbon-based nanocarbon heat dissipation film is combined with the other surface of the heat transfer interface.

In the above embodiments, the heat transfer interface and the heat source are bonded by glue.

In the above embodiments, a high heat dissipation insulating layer is combined between the heat transfer interface and the heat source.

In the above embodiments, the heat transfer interface includes but not limited to heat sinks, fans and water cooling radiators.

In the above embodiment, another six-membered ring carbon-based nanocarbon heat dissipation film may be further provided between the heat source and the heat transfer interface.

Description of drawings

Fig. 1 is a schematic cross-sectional view of the first embodiment of the present invention.

Fig. 2 is a schematic diagram of the heat transfer state of the first embodiment of the present invention.

Fig. 3 is a schematic cross-sectional view of the second embodiment of the present invention.

Fig. 4 is a schematic cross-sectional view of the third embodiment of the present invention.

Component label comparison:

heat source 1;

Heat transfer interface 2;

Glue 21;

Heat transfer pathways in the glue 211;

heat transfer path 212 in the heat transfer interface;

Heat transfer path 213 in the heat dissipation film;

Heat transfer path 214 in air after catalysis;

Six-membered ring carbon-based nanocarbon heat dissipation film 3, 3a;

High heat dissipation insulation layer 4.

Detailed ways

Please refer to FIG. 1 and FIG. 2 , which are respectively a schematic cross-sectional view of the first embodiment of the present invention and a schematic view of the heat transfer state of the first embodiment of the present invention. As shown in the figure: the present invention is a heat transfer catalytic heat dissipation method, which is provided with a heat transfer interface 2 on a heat source 1, and a six-membered ring carbon-based nano-carbon heat dissipation film 3 is provided on at least one side of the heat transfer interface 2 , so that after the heat transfer interface 2 absorbs the heat source, the six-membered ring carbon-based nano-carbon heat dissipation film 3 dissipates heat.

One surface of the heat transfer interface 2 is combined with the heat source 1, and the six-membered ring carbon-based nanocarbon heat dissipation film 3 is combined with the other surface of the heat transfer interface 2 (that is, the side of the heat transfer interface 2 in contact with the air), Wherein the heat transfer interface 2 includes but not limited to heat sinks, fans and water-cooled radiators, and the heat transfer interface 2 and the heat source 1 are bonded by an adhesive 21 .

When the present invention is in use, heat is produced by the heat source 1 and begins to transfer outward (the heat source 1 includes but not limited to processor CPU, graphics chip, LED chip, solar chip, and internal combustion of the engine, etc.), and the heat transfer interface 2 Absorb the heat energy from the heat source 1, and use the six-membered ring carbon-based nano-carbon heat dissipation film 3 to dissipate heat; and when the heat generated by the heat source 1 is transferred to the outside, because the thermal conductivity of the glued body 21 is small, the glued body 21 The heat transfer efficiency of the heat transfer path 211 is low. When the heat enters the heat transfer interface 2, the heat transfer efficiency of the heat transfer path 212 in the heat transfer interface 2 is relatively high due to the high thermal conductivity of the heat transfer interface 2. The medium heat transfer efficiency is extremely low, so at the interface, the highest heat transfer interface 2 and the lowest heat transfer drop formed in the air cause heat transfer obstacles. The six-membered ring carbon-based nano-carbon heat dissipation film 3 provided in the present invention can be As a heat transfer bottleneck or barrier between the heat transfer interface 2 and the air, the heat transfer channel 213 in the heat dissipation film effectively guides the heat transfer, and cooperates with the heat transfer interface 2 to transfer heat to the air to effectively improve the heat transfer efficiency effect, the heat transfer efficiency of the heat transfer path 214 in the air after catalysis is close to the heat conduction efficiency of the heat transfer interface 2, so there is no need to use cooling fins, which can greatly reduce the cooling cost and reduce the volume and weight of the equipment. In addition, it can reduce The consumption of raw materials meets the effect of energy saving and carbon reduction.

Please refer to FIG. 3 , which is a schematic cross-sectional view of the second embodiment of the present invention. As shown in the figure: In addition to the form mentioned in the above-mentioned first embodiment, the present invention can also be the form of the second embodiment, and the difference is that there is a joint between the heat transfer interface 2 and the heat source 1 High heat dissipation insulating layer 4; in this way, the heat generated by heat source 1 can be transferred to heat transfer interface 2 through high heat dissipation insulating layer 4. heat dissipation, and also achieve the effect of improving heat transfer performance and effectively reducing heat transfer bottlenecks.

Please refer to FIG. 4 , which is a schematic cross-sectional view of the third embodiment of the present invention. As shown in the figure: In addition to the forms mentioned in the first and second embodiments above, the present invention can also be in the form of the third embodiment, and the difference is that the heat source 1 and the heat transfer interface 2 Another six-membered ring carbon-based nanocarbon heat dissipation film 3a can be further provided between them; in this way, the heat generated by the heat source 1 can be transmitted to the heat transfer interface 2 through the first six-membered ring carbon-based nanocarbon heat dissipation film 3a. After the heat transfer interface 2 absorbs the heat source, it cooperates with the second six-membered ring carbon-based nano-carbon heat dissipation film 3 to dissipate heat, and also achieves the effect of improving heat transfer efficiency and effectively reducing heat transfer bottlenecks, so that the present invention can be more practical required for use.

In summary, the heat transfer catalytic heat dissipation method of the present invention can effectively improve the various shortcomings of the existing ones, and the six-membered ring carbon-based nano-carbon heat dissipation film can be used to effectively guide the heat transfer to the air, so as to avoid heat generation between the heat transfer interface and the air. transfer drop, so as to improve heat transfer efficiency, effectively reduce heat transfer bottlenecks, eliminate the need for heat dissipation fins, greatly reduce heat dissipation costs, reduce volume and weight, reduce raw material consumption, and save energy and reduce carbon; It is more progressive, more practical, and more in line with the needs of consumers. It has indeed met the requirements for patent application for inventions, and it is necessary to file a patent application in accordance with the law.

But the above is only a preferred embodiment of the present invention, and should not limit the scope of the present invention; therefore, all simple equivalent changes and modifications made according to the claims of the present invention and the content of the description of the invention should still be It belongs to the scope covered by the patent of the present invention.

Claims (6)

1. a heat trnasfer catalysis heat dissipating method, is characterized in that, is provided with heat transfer interface in thermal source, and is provided with hexatomic ring carbon-based nano carbon heat dissipation film at least one side of heat transfer interface.

2. heat trnasfer catalysis heat dissipating method according to claim 1, is characterized in that, this heat transfer interface is combined with thermal source with surface thereof, and this hexatomic ring carbon-based nano carbon heat dissipation film is incorporated on the another side of heat transfer interface.

3. heat trnasfer catalysis heat dissipating method according to claim 2, is characterized in that, combines between this heat transfer interface and thermal source with veneer.

4. heat trnasfer catalysis heat dissipating method according to claim 2, is characterized in that, is combined with a high radiating insulating layer between this heat transfer interface and thermal source.

5. heat trnasfer catalysis heat dissipating method according to claim 2, is characterized in that, this heat transfer interface includes but not limited to fin, fan and water-filled radiator.

6. heat trnasfer catalysis heat dissipating method according to claim 1, is characterized in that, is provided with another hexatomic ring carbon-based nano carbon heat dissipation film further between this thermal source and heat transfer interface.