CN107660319A - Antenna structure for radio communication - Google Patents
Antenna structure for radio communication Download PDFInfo
- Publication number
- CN107660319A CN107660319A CN201680029706.8A CN201680029706A CN107660319A CN 107660319 A CN107660319 A CN 107660319A CN 201680029706 A CN201680029706 A CN 201680029706A CN 107660319 A CN107660319 A CN 107660319A
- Authority
- CN
- China
- Prior art keywords
- wireless telecom
- telecom equipment
- chamber
- antenna
- antenna oscillator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/02—Waveguide horns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/064—Two dimensional planar arrays using horn or slot aerials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
- H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
- H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Telephone Set Structure (AREA)
- Support Of Aerials (AREA)
- Transceivers (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
Abstract
Description
交叉引用cross reference
本专利申请要求由Ou等人于2016年2月3日提交的题为“Antenna Structures forWireless Communications(用于无线通信的天线结构)”的美国专利申请No.15/014,602、以及由Ou等人于2015年5月26日提交的题为“Antenna Structures for WirelessCommunications(用于无线通信的天线结构)”的美国临时专利申请No.62/166,496的优先权,其中每一件申请均被转让给本申请受让人。This patent application claims U.S. Patent Application No. 15/014,602, filed February 3, 2016, by Ou et al., entitled "Antenna Structures for Wireless Communications," and filed by Ou et al. Priority to U.S. Provisional Patent Application No. 62/166,496, entitled "Antenna Structures for Wireless Communications," filed May 26, 2015, each of which is assigned to the present application assignee.
背景background
公开领域public domain
本公开例如涉及无线通信系统,尤其涉及用于无线通信的天线结构。The present disclosure relates, for example, to wireless communication systems, and more particularly to antenna structures for wireless communication.
相关技术描述Related technical description
无线通信系统被广泛部署以提供诸如语音、视频、分组数据、消息接发、广播等各种类型的通信内容。这些系统可以是能够通过共享可用系统资源(例如,时间、频率和功率)来支持与多个用户通信的多址系统。此类多址系统的示例包括码分多址(CDMA)系统、时分多址(TDMA)系统、频分多址(FDMA)系统、以及正交频分多址(OFDMA)系统。Wireless communication systems are widely deployed to provide various types of communication content such as voice, video, packet data, messaging, broadcast, and others. These systems may be multiple-access systems capable of supporting communication with multiple users by sharing available system resources (eg, time, frequency, and power). Examples of such multiple-access systems include Code Division Multiple Access (CDMA) systems, Time Division Multiple Access (TDMA) systems, Frequency Division Multiple Access (FDMA) systems, and Orthogonal Frequency Division Multiple Access (OFDMA) systems.
作为示例,无线多址通信系统可包括数个基站,每个基站同时支持多个通信设备(或称为用户装备(UE))的通信。基站可在下行链路信道(例如,用于从基站至UE的传输)和上行链路信道(例如,用于从UE至基站的传输)上与UE进行通信。As an example, a wireless multiple-access communication system may include several base stations, each base station simultaneously supporting communication for multiple communication devices (or referred to as user equipment (UE)). A base station may communicate with UEs on downlink channels (eg, for transmission from the base station to the UE) and uplink channels (eg, for transmission from the UE to the base station).
通信系统可以采用有执照频谱、无执照频谱、或这两者。高千兆赫兹(GHz)频带中的无执照毫米波长mmW频谱正成为一种颇具前景的技术,例如用于多千兆比特无线通信。与其他较低频率系统相比,约60GHz的频谱拥有若干优势,包括增大的无执照带宽、因较小波长(约5mm)而导致的收发机的紧凑尺寸、以及因较高大气吸收而导致的较小干扰。然而,存在与这种频谱相关联的若干挑战,诸如反射和散射损耗、高穿透损耗和高路径损耗,这限制了60GHz处的覆盖范围。为了克服这个问题,可以采用定向传输。由此,已知为利用多振子天线阵列的波束成形的技术可被用于mmW无线通信。Communication systems may employ licensed spectrum, unlicensed spectrum, or both. Unlicensed millimeter-wavelength mmW spectrum in the high gigahertz (GHz) band is emerging as a promising technology, for example for multi-gigabit wireless communications. Spectrum around 60 GHz has several advantages over other lower frequency systems, including increased unlicensed bandwidth, compact size of transceivers due to smaller wavelengths (about 5 mm), and increased atmospheric absorption due to higher atmospheric absorption. minor interference. However, there are several challenges associated with this spectrum, such as reflection and scattering loss, high penetration loss and high path loss, which limit the coverage at 60 GHz. To overcome this problem, directional transmission can be employed. Thus, a technique known as beamforming using a multi-element antenna array can be used for mmW wireless communication.
然而,即使使用波束成形,使用mmW频谱的通信也可以从尤其针对此类波长设计的天线结构中获益。针对较低频率(例如,800MHz、900MHz、1800MHz、1900MHz、2100MHz等)设计的常规天线结构可包括单个全向天线(有时针对分集包括两个或三个),并且可能不适用于mmW频谱应用。However, even with beamforming, communications using mmW spectrum can benefit from antenna structures designed especially for such wavelengths. Conventional antenna structures designed for lower frequencies (eg, 800MHz, 900MHz, 1800MHz, 1900MHz, 2100MHz, etc.) may include a single omnidirectional antenna (sometimes two or three for diversity) and may not be suitable for mmW spectrum applications.
概述overview
所描述的特征一般涉及用于使用mmW频谱进行无线通信的一种或多种改进的系统、方法和/或装置。具体而言,天线结构可被设计成与无线通信设备的外部外壳集成。例如,该外部外壳可包括促成天线结构的天线振子接收和/或发射射频通信信号的腔。此类天线结构可被设计为相对紧凑以应对现代无线通信设备(例如,蜂窝电话)上可用的有限占用空间。The described features generally relate to one or more improved systems, methods, and/or apparatuses for wireless communications using mmW spectrum. In particular, the antenna structure can be designed to be integrated with the external housing of the wireless communication device. For example, the outer housing may include a cavity that enables the antenna elements of the antenna structure to receive and/or transmit radio frequency communication signals. Such antenna structures can be designed to be relatively compact to cope with the limited footprint available on modern wireless communication devices (eg, cellular telephones).
描述了一种无线通信设备。该无线通信设备可包括外部外壳。支撑天线振子的基板可毗邻于外部外壳的内表面布置。可在外部外壳中形成腔。该腔可与天线振子对准以使得该天线振子在无线通信设备的操作期间通过该腔接收和发射射频通信信号。A wireless communication device is described. The wireless communication device can include an external housing. A substrate supporting the antenna element may be disposed adjacent to an inner surface of the outer housing. A cavity may be formed in the outer housing. The cavity may be aligned with the antenna element such that the antenna element receives and transmits radio frequency communication signals through the cavity during operation of the wireless communication device.
外部外壳可至少部分地由金属材料制成。替换地或附加地,外部外壳可由塑料材料制成。在此类情形中,可在至少一个腔的壁上布置金属材料。The outer housing may be at least partially made of metallic material. Alternatively or additionally, the outer housing may be made of plastic material. In such cases, metallic material may be arranged on the walls of at least one cavity.
腔的壁可被锥形化以朝天线振子倾斜。The walls of the cavity may be tapered to slope towards the antenna element.
该腔可具有矩形横截面并且可限定被锥形化以朝天线振子倾斜的第一对相对的壁。在此类情形中,该腔可限定被锥形化以朝天线振子倾斜的第二对相对的壁。The cavity may have a rectangular cross-section and may define a first pair of opposing walls that are tapered to slope toward the antenna element. In such cases, the cavity may define a second pair of opposing walls that are tapered to slope towards the antenna element.
电介质材料可以填充腔。在此类情形中,该电介质材料可以是塑料材料。A dielectric material may fill the cavity. In such cases, the dielectric material may be a plastic material.
辅助腔可被形成在基板中并且与天线振子和腔对准。An auxiliary cavity may be formed in the substrate and aligned with the antenna element and the cavity.
天线振子可被实现为天线阵列的多个天线振子。在此类情形中,该腔可被实现为对应的多个腔。多个腔中的每一者可与多个天线振子之一对准。An antenna element may be realized as a plurality of antenna elements of an antenna array. In such cases, the cavity may be realized as a corresponding plurality of cavities. Each of the plurality of cavities can be aligned with one of the plurality of antenna elements.
外部外壳可包括第一部分和第二部分,其中腔被形成在该外部外壳的第一部分中。在此类情形中,该第一部分可插入到第二部分中以形成外部外壳。The outer housing may include a first part and a second part, wherein the cavity is formed in the first part of the outer housing. In such cases, the first part may be inserted into the second part to form the outer housing.
可以在外部外壳的外表面上布置材料层。材料层可以覆盖形成在外部外壳中的腔。A layer of material may be arranged on the outer surface of the outer housing. A layer of material may cover a cavity formed in the outer housing.
天线振子可以是毫米波长天线振子。The antenna element may be a millimeter wavelength antenna element.
描述了另一种无线通信设备。该无线通信设备可包括:用于容纳该无线通信设备的装置;用于支撑天线振子的装置,该用于支撑的装置毗邻于该用于容纳的装置的内表面布置;以及形成在该用于容纳的装置中的腔,该腔与该天线振子对准以使得该天线振子在该无线通信设备的操作期间通过该腔接收和发射射频通信信号。该装置可包括以上及本文中进一步描述的这些和其他特征。Another wireless communication device is described. The wireless communication device may include: means for accommodating the wireless communication device; means for supporting the antenna element, the means for supporting is arranged adjacent to the inner surface of the means for accommodating; and formed on the A cavity in the housing is aligned with the antenna element such that the antenna element receives and transmits radio frequency communication signals through the cavity during operation of the wireless communication device. The device may include these and other features described above and further herein.
描述了一种制造无线通信设备的方法。该方法可涉及:提供用于无线通信设备的外部外壳;在该外部外壳中形成腔;以及将支撑天线振子的基板组装到该外部外壳,其中该基板毗邻于该外部外壳的内表面布置,并且该天线振子与该腔对准以使得该天线振子在该无线通信设备的操作期间通过该腔接收和发射射频通信信号。该方法可包括制造以上及本文中进一步描述的这些和其他特征。A method of manufacturing a wireless communication device is described. The method may involve: providing an external housing for the wireless communication device; forming a cavity in the external housing; and assembling a substrate supporting an antenna element to the external housing, wherein the substrate is disposed adjacent an inner surface of the external housing, and The antenna element is aligned with the cavity such that the antenna element receives and transmits radio frequency communication signals through the cavity during operation of the wireless communication device. The method can include fabricating these and other features described above and further herein.
前述内容已较宽泛地勾勒出根据本公开的示例的特征和技术优势以力图使下面的详细描述可以被更好地理解。附加的特征和优势将在此后描述。所公开的概念和具体示例可容易地被用作修改或设计用于实施与本公开相同的目的的其他结构的基础。此类等效构造并不背离所附权利要求书的范围。本文所公开的概念的特性在其组织和操作方法两方面以及相关联的优势将因结合附图来考虑以下描述而被更好地理解。每一附图是仅出于解说和描述目的来提供的,且并不定义对权利要求的限定。The foregoing has broadly outlined the features and technical advantages of examples according to the present disclosure in an attempt to enable a better understanding of the following detailed description. Additional features and advantages will be described hereinafter. The conception and specific examples disclosed may be readily utilized as a basis for modifying or designing other structures for carrying out the same purposes of the present disclosure. Such equivalent constructions do not depart from the scope of the appended claims. The nature of the concepts disclosed herein, both in their organization and method of operation, and associated advantages will be better understood from consideration of the following description in conjunction with the accompanying drawings. Each drawing is provided for purposes of illustration and description only, and does not define the limitations of the claims.
附图简述Brief description of the drawings
通过参照以下附图可获得对本发明的本质和优点的进一步理解。在附图中,类似组件或特征可具有相同的附图标记。此外,相同类型的各个组件可通过在附图标记后跟随短划线以及在类似组件之间进行区分的第二标记来加以区分。如果在说明书中仅使用第一附图标记,则该描述可应用于具有相同的第一附图标记的类似组件中的任何一个组件而不论第二附图标记如何。A further understanding of the nature and advantages of the present invention may be obtained by reference to the following drawings. In the figures, similar components or features may have the same reference label. Further, various components of the same type may be distinguished by following the reference label by a dash and a second label that distinguishes between similar components. If only the first reference numeral is used in the specification, the description is applicable to any one of similar components having the same first reference numeral regardless of the second reference numeral.
图1示出根据本公开的各个方面的无线通信系统的框图;1 shows a block diagram of a wireless communication system according to various aspects of the present disclosure;
图2示出了根据本公开的各个方面的天线设计的示例的横截面视图;2 shows a cross-sectional view of an example of an antenna design according to various aspects of the present disclosure;
图3示出了根据本公开的各个方面的天线设计的另一示例的横截面视图;3 illustrates a cross-sectional view of another example of an antenna design according to various aspects of the present disclosure;
图4示出了根据本公开的各个方面的天线设计的又一示例的横截面视图;4 illustrates a cross-sectional view of yet another example of an antenna design according to various aspects of the present disclosure;
图5示出了根据本公开的各个方面的天线设计的再一示例的分解透视图;5 shows an exploded perspective view of yet another example of an antenna design according to various aspects of the present disclosure;
图6示出了根据本公开的各个方面的天线阵列的示例的分解透视图;6 shows an exploded perspective view of an example of an antenna array according to various aspects of the present disclosure;
图7示出了根据本公开的各个方面的用于无线通信设备的外部外壳的示例;7 illustrates an example of an external housing for a wireless communication device according to various aspects of the present disclosure;
图8示出了解说根据本公开的各个方面的用于供在无线通信中使用的设备的架构的示例的框图;8 shows a block diagram illustrating an example of an architecture for a device for use in wireless communications in accordance with various aspects of the present disclosure;
图9示出了解说根据本公开的各个方面的用于无线通信设备的天线设计的制造的示例的一系列横截面视图;9 shows a series of cross-sectional views illustrating an example of fabrication of an antenna design for a wireless communication device in accordance with various aspects of the present disclosure;
图10示出了解说根据本公开的各个方面的用于无线通信设备的天线设计的制造的另一示例的一系列横截面视图;10 shows a series of cross-sectional views illustrating another example of fabrication of an antenna design for a wireless communication device in accordance with various aspects of the present disclosure;
图11是解说根据本公开的各个方面的制造用于无线通信设备的天线设计的方法的示例的流程图;以及11 is a flowchart illustrating an example of a method of manufacturing an antenna design for a wireless communication device in accordance with various aspects of the present disclosure; and
图12是解说根据本公开的各个方面的制造用于无线通信设备的天线设计的方法的另一示例的流程图。12 is a flowchart illustrating another example of a method of fabricating an antenna design for a wireless communication device in accordance with various aspects of the present disclosure.
详细描述Detailed Description
当无线通线设备中包括mmW天线时,该mmW天线可被配置成通过该无线通信设备的外部外壳来接收和/或发射通信信号。该外部外壳常规地可形成设备的后盖,其中显示屏被布置在该设备的前侧。由于显示屏的电磁屏蔽,通信信号的接收/发射可被限制为通过后盖。此外,电磁屏蔽可能禁止由金属材料制成的后盖布置在mmW天线上。When a mmW antenna is included in a wireless communication device, the mmW antenna may be configured to receive and/or transmit communication signals through an external housing of the wireless communication device. The external housing may conventionally form the rear cover of the device, with the display screen being arranged on the front side of the device. Due to the electromagnetic shielding of the display, the reception/transmission of communication signals can be restricted to pass through the back cover. Furthermore, electromagnetic shielding may prohibit the placement of back covers made of metallic materials on mmW antennas.
针对至少在mmW天线上的后盖可使用塑料材料以允许通过mmW天线接收/发射通信信号。然而,此类通信信号的辐射仍然可能因mmW天线上的后盖引起的反射和/或折射而畸变。A plastic material may be used for the back cover at least on the mmW antenna to allow reception/transmission of communication signals through the mmW antenna. However, the radiation of such communication signals may still be distorted by reflections and/or refractions caused by the back cover on the mmW antenna.
因此,天线结构可被设计成与无线通信设备的外部外壳集成。该外部外壳可包括促成天线结构的天线振子接收和/或发射射频通信信号的腔。如此,金属材料或非金属(例如,塑料)材料可被用于外部外壳。天线结构的天线振子可与腔对准以经由该腔来接收和/或发射通信信号。Accordingly, the antenna structure can be designed to be integrated with the external housing of the wireless communication device. The outer housing may include a cavity that enables the antenna element of the antenna structure to receive and/or transmit radio frequency communication signals. As such, metallic or non-metallic (eg, plastic) materials may be used for the outer housing. An antenna element of the antenna structure may be aligned with the cavity to receive and/or transmit communication signals via the cavity.
以下描述提供示例而并非限定权利要求中阐述的范围、适用性或者示例。可以对所讨论的要素的功能和布置作出改变而不会脱离本公开的范围。各种示例可恰适地省略、替代、或添加各种规程或组件。例如,可以按不同于所描述的次序来执行所描述的方法,并且可以添加、省去、或组合各种步骤。同样,参照一些示例所描述的特征可在其他示例中被组合。The following description provides examples and does not limit the scope, applicability or examples set forth in the claims. Changes may be made in the function and arrangement of elements discussed without departing from the scope of the disclosure. Various examples may omit, substitute, or add various procedures or components as appropriate. For example, the methods described may be performed in an order different from that described, and various steps may be added, omitted, or combined. Likewise, features described with reference to some examples may be combined in other examples.
图1解说了根据本公开的各种方面的无线通信系统100的示例。无线通信系统100包括基站105、UE 115和核心网130。核心网130可提供用户认证、接入授权、跟踪、网际协议(IP)连通性、以及其他接入、路由、或移动性功能。基站105通过回程链路132(例如,S1等)与核心网130对接并且可为与UE 115的通信执行无线电配置和调度,或者可在基站控制器(未示出)的控制下操作。在各种示例中,基站105可以直接或间接地(例如,通过核心网130)在回程链路134(例如,X1等)上彼此通信,回程链路134可以是有线或无线通信链路。1 illustrates an example of a wireless communication system 100 in accordance with various aspects of the present disclosure. The wireless communication system 100 includes a base station 105 , a UE 115 and a core network 130 . Core network 130 may provide user authentication, access authorization, tracking, Internet Protocol (IP) connectivity, and other access, routing, or mobility functions. Base station 105 interfaces with core network 130 via backhaul link 132 (eg, S1, etc.) and may perform radio configuration and scheduling for communication with UE 115, or may operate under the control of a base station controller (not shown). In various examples, base stations 105 can communicate with each other directly or indirectly (eg, through core network 130 ) over backhaul link 134 (eg, X1 , etc.), which can be a wired or wireless communication link.
基站105可经由一个或多个基站天线与UE 115进行无线通信。这些基站105站点中的每一者可为各自相应的地理覆盖区域110提供通信覆盖。在一些示例中,基站105可被称为基收发机站、无线电基站、接入点、无线电收发机、B节点、演进型B节点(eNB)、家用B节点、家用演进型B节点、或其他某个合适的术语。基站105的地理覆盖区域110可被划分成仅构成该覆盖区域的一部分的扇区(未示出)。无线通信系统100可包括不同类型的基站105(例如,宏和/或小型蜂窝小区基站)。可能存在不同技术的交叠的地理覆盖区域110。Base station 105 may communicate wirelessly with UE 115 via one or more base station antennas. Each of these base station 105 sites may provide communication coverage for a respective respective geographic coverage area 110 . In some examples, base station 105 may be referred to as a base transceiver station, radio base station, access point, radio transceiver, Node B, evolved Node B (eNB), Home Node B, home eNode B, or other some suitable term. The geographic coverage area 110 of the base station 105 may be divided into sectors (not shown) that constitute only a portion of the coverage area. The wireless communication system 100 may include different types of base stations 105 (eg, macro and/or small cell base stations). There may be overlapping geographic coverage areas 110 of different technologies.
在一些示例中,无线通信系统100是LTE/LTE-A网络。在LTE/LTE-A网络中,术语演进型B节点(eNB)可一般用于描述基站105,而术语UE可一般用于描述UE 115。无线通信系统100可以是异构LTE/LTE-A网络,其中不同类型的eNB提供对各种地理区划的覆盖。例如,每个eNB或基站105可提供对宏蜂窝小区、小型蜂窝小区、和/或其他类型的蜂窝小区的通信覆盖。取决于上下文,术语“蜂窝小区”是可被用于描述基站、与基站相关联的载波或分量载波、或者载波或基站的覆盖区域(例如,扇区等)的3GPP术语。In some examples, wireless communication system 100 is an LTE/LTE-A network. In LTE/LTE-A networks, the term evolved Node B (eNB) may be used generally to describe base station 105 and the term UE may be generally used to describe UE 115 . The wireless communication system 100 may be a heterogeneous LTE/LTE-A network where different types of eNBs provide coverage for various geographic regions. For example, each eNB or base station 105 may provide communication coverage for macro cells, small cells, and/or other types of cells. Depending on the context, the term "cell" is a 3GPP term that can be used to describe a base station, a carrier or component carrier associated with a base station, or a coverage area (eg, sector, etc.) of a carrier or base station.
宏蜂窝小区一般覆盖相对较大的地理区域(例如,半径数千米),并且可允许无约束地由具有与网络供应商的服务订阅的UE接入。与宏蜂窝小区相比,小型蜂窝小区是可在与宏蜂窝小区相同或不同的(例如,有执照、无执照等)频带中操作的低功率基站。根据各种示例,小型蜂窝小区可包括微微蜂窝小区、毫微微蜂窝小区、以及微蜂窝小区。微微蜂窝小区可覆盖相对较小的地理区域并且可允许无约束地由与网络供应商具有服务订阅的UE接入。毫微微蜂窝小区也可覆盖相对较小的地理区域(例如,家庭)且可提供有约束地由与该毫微微蜂窝小区有关联的UE(例如,封闭订户群(CSG)中的UE、该家庭中的用户的UE、等等)的接入。用于宏蜂窝小区的eNB可被称为宏eNB。用于小型蜂窝小区的eNB可被称为小型蜂窝小区eNB、微微eNB、毫微微eNB或家用eNB。eNB可支持一个或多个(例如,两个、三个、四个,等等)蜂窝小区(例如,分量载波)。A macro cell typically covers a relatively large geographic area (eg, several kilometers in radius) and may allow unfettered access by UEs with a service subscription with a network provider. In contrast to a macro cell, a small cell is a low power base station that can operate in the same or a different (eg, licensed, unlicensed, etc.) frequency band than the macro cell. According to various examples, small cells may include pico cells, femto cells, and micro cells. A picocell may cover a relatively small geographic area and may allow unfettered access by UEs with a service subscription with a network provider. A femtocell may also cover a relatively small geographic area (e.g., a home) and may provide for restricted access by UEs associated with the femtocell (e.g., UEs in a Closed Subscriber Group (CSG), the home) access of the UE in the user, etc.). An eNB for a macro cell may be referred to as a macro eNB. An eNB for a small cell may be referred to as a small cell eNB, a pico eNB, a femto eNB, or a home eNB. An eNB may support one or more (eg, two, three, four, etc.) cells (eg, component carriers).
无线通信系统100可支持同步或异步操作。对于同步操作,各基站可具有相似的帧定时,并且来自不同基站的传输可以在时间上大致对齐。对于异步操作,各基站可以具有不同的帧定时,并且来自不同基站的传输可以不在时间上对齐。本文中所描述的技术可被用于同步或异步操作。Wireless communication system 100 may support synchronous or asynchronous operation. For synchronous operation, base stations may have similar frame timing, and transmissions from different base stations may be approximately aligned in time. For asynchronous operation, base stations may have different frame timings, and transmissions from different base stations may not be aligned in time. The techniques described herein can be used for synchronous or asynchronous operations.
可容适各种所公开的示例中的一些示例的通信网络可以是根据分层协议栈进行操作的基于分组的网络。在用户面,承载或分组数据汇聚协议(PDCP)层的通信可以是基于IP的。无线电链路控制(RLC)层可执行分组分段和重装以在逻辑信道上通信。媒体接入控制(MAC)层可执行优先级处置并将逻辑信道复用成传输信道。MAC层还可使用混合ARQ(HARQ)以提供MAC层的重传,从而提高链路效率。在控制面,无线电资源控制(RRC)协议层可以提供UE 115与基站105或核心网130之间支持用户面数据的无线电承载的RRC连接的建立、配置和维护。在物理(PHY)层,传输信道可被映射到物理信道。A communication network accommodating some of the various disclosed examples may be a packet-based network operating according to a layered protocol stack. On the user plane, communications at the bearer or Packet Data Convergence Protocol (PDCP) layer may be IP-based. A radio link control (RLC) layer can perform packet segmentation and reassembly for communication on logical channels. A Medium Access Control (MAC) layer may perform prioritization and multiplexing of logical channels into transport channels. The MAC layer can also use hybrid ARQ (HARQ) to provide retransmission of the MAC layer, thereby improving link efficiency. On the control plane, a radio resource control (RRC) protocol layer may provide establishment, configuration and maintenance of RRC connections between UE 115 and base station 105 or core network 130 supporting radio bearers for user plane data. At the physical (PHY) layer, transport channels may be mapped to physical channels.
UE 115分散遍及无线通信系统100,并且每个UE 115可以是驻定的或移动的。UE115也可包括或被本领域技术人员称为移动站、订户站、移动单元、订户单元、无线单元、远程单元、移动设备、无线设备、无线通信设备、远程设备、移动订户站、接入终端、移动终端、无线终端、远程终端、手持机、用户代理、移动客户端、客户端、或其他某个合适的术语。UE115可以是蜂窝电话、个人数字助理(PDA)、无线调制解调器、无线通信设备、手持式设备、平板计算机、膝上型计算机、无绳电话、无线本地环路(WLL)站、等等。UE可以能够与各种类型的基站和网络装备(包括宏eNB、小型蜂窝小区eNB、中继基站等)通信。UEs 115 are dispersed throughout wireless communication system 100, and each UE 115 may be stationary or mobile. UE 115 may also include or be referred to by those skilled in the art as a mobile station, subscriber station, mobile unit, subscriber unit, wireless unit, remote unit, mobile device, wireless device, wireless communication device, remote device, mobile subscriber station, access terminal , mobile terminal, wireless terminal, remote terminal, handset, user agent, mobile client, client, or some other suitable term. UE 115 may be a cellular telephone, a personal digital assistant (PDA), a wireless modem, a wireless communication device, a handheld device, a tablet computer, a laptop computer, a cordless telephone, a wireless local loop (WLL) station, or the like. A UE may be capable of communicating with various types of base stations and network equipment, including macro eNBs, small cell eNBs, relay base stations, etc.
无线通信系统100中示出的通信链路125可包括从UE 115到基站105的上行链路(UL)传输、和/或从基站105到UE 115的下行链路(DL)传输。下行链路传输也可被称为前向链路传输,而上行链路传输也可被称为反向链路传输。每条通信链路125可包括一个或多个载波,其中每个载波可以是由根据以上描述的各种无线电技术来调制的多个副载波构成的信号(例如,不同频率的波形信号)。每个经调制信号可在不同的副载波上被发送并且可携带控制信息(例如,参考信号、控制信道等)、开销信息、用户数据等。通信链路125可以使用FDD(例如,使用配对频谱资源)或TDD操作(例如,使用未配对频谱资源)来传送双向通信。可以定义FDD的帧结构(例如,帧结构类型1)和TDD的帧结构(例如,帧结构类型2)。Communication link 125 shown in wireless communication system 100 may include uplink (UL) transmissions from UE 115 to base station 105 and/or downlink (DL) transmissions from base station 105 to UE 115 . Downlink transmissions can also be referred to as forward link transmissions, and uplink transmissions can also be referred to as reverse link transmissions. Each communication link 125 may include one or more carriers, where each carrier may be a signal (eg, a waveform signal of a different frequency) composed of multiple subcarriers modulated according to the various radio techniques described above. Each modulated signal may be sent on a different subcarrier and may carry control information (eg, reference signal, control channel, etc.), overhead information, user data, etc. Communication link 125 may communicate bidirectional communications using FDD (eg, using paired spectral resources) or TDD operation (eg, using unpaired spectral resources). A frame structure of FDD (for example, frame structure type 1) and a frame structure of TDD (for example, frame structure type 2) can be defined.
在系统100的一些实施例中,基站105和/或UE 115可包括多个天线,用于采用天线分集方案来改进基站105与UE 115之间的通信质量和可靠性。附加地或替换地,基站105和/或UE 115可采用多输入多输出(MIMO)技术,该MIMO技术可利用多径环境来传送携带相同或不同经编码数据的多个空间层。In some embodiments of system 100, base station 105 and/or UE 115 may include multiple antennas for employing an antenna diversity scheme to improve communication quality and reliability between base station 105 and UE 115. Additionally or alternatively, base station 105 and/or UE 115 can employ multiple-input multiple-output (MIMO) techniques that can exploit a multipath environment to transmit multiple spatial layers carrying the same or different encoded data.
无线通信系统100可支持多个蜂窝小区或载波上的操作,这是可被称为载波聚集(CA)或多载波操作的特征。载波也可被称为分量载波(CC)、层、信道等。术语“载波”、“分量载波”、“蜂窝小区”以及“信道”在本文中被可互换地使用。UE 115可配置有用于载波聚集的多个下行链路CC以及一个或多个上行链路CC。载波聚集可与FDD和TDD分量载波两者联用。The wireless communication system 100 may support operation over multiple cells or carriers, a feature that may be referred to as carrier aggregation (CA) or multi-carrier operation. A carrier may also be called a component carrier (CC), layer, channel, and so on. The terms "carrier," "component carrier," "cell," and "channel" are used interchangeably herein. UE 115 may be configured with multiple downlink CCs and one or more uplink CCs for carrier aggregation. Carrier aggregation can be used with both FDD and TDD component carriers.
基站105中的一者或多者可以是mmW基站。在一些情形中,无线通信系统100可以是配置成经由mmW射频通信信号与UE 115进行通信的mmW通信系统。在其他情形中,无线通信系统100可以是异构的,诸如涉及可以使用LTE/LTE-A频率与UE 115进行通信的LTE/LTE-A基站以及可以经由mmW频率与UE 115进行通信的mmW基站的网络。One or more of base stations 105 may be mmW base stations. In some cases, wireless communication system 100 may be a mmW communication system configured to communicate with UE 115 via mmW radio frequency communication signals. In other cases, the wireless communication system 100 may be heterogeneous, such as involving LTE/LTE-A base stations that may communicate with UE 115 using LTE/LTE-A frequencies and mmW base stations that may communicate with UE 115 via mmW frequencies network of.
如上所述,使用mmW频谱的无线通信可以从尤其针对那种频谱设计的天线结构中获益。因此,无线通信系统100的mmW基站105和配置成用于mmW通信的UE 115可具有特定天线设计。为了清楚起见,以下关于无线通信设备(诸如蜂窝电话)描述了针对mmW通信的天线设计。然而,如恰适或所期望的,此类天线设计也可适用于mmW基站。As noted above, wireless communications using the mmW spectrum can benefit from antenna structures designed specifically for that spectrum. Accordingly, the mmW base stations 105 of the wireless communication system 100 and the UEs 115 configured for mmW communication may have specific antenna designs. For clarity, antenna designs for mmW communications are described below with respect to wireless communications devices, such as cellular telephones. However, such antenna designs may also be applicable to mmW base stations as appropriate or desired.
现在转到图2,示出了根据本公开的各个方面的用于无线通信设备的天线设计200的示例的横截面视图。天线设计200可包括外部外壳205。可以在外部外壳205中形成一个或多个腔210。在图2的横截面视图中,作为示例,示出了两个腔210。外部外壳205的厚度/腔210的深度可以是可针对给定应用定制的设计参数。Turning now to FIG. 2 , shown is a cross-sectional view of an example of an antenna design 200 for a wireless communication device in accordance with various aspects of the present disclosure. Antenna design 200 may include an outer housing 205 . One or more cavities 210 may be formed in outer housing 205 . In the cross-sectional view of Fig. 2, two cavities 210 are shown as an example. The thickness of outer housing 205/depth of cavity 210 may be a design parameter that may be customized for a given application.
天线设计200还可包括天线结构215,天线结构215包括一个或多个天线振子220和支撑(诸)天线振子220的基板225。虽然天线振子220被示为布置在基板225的顶部上,但是应理解,天线振子220可以如恰适或所期望的与基板225共面或凹陷。例如,基板225可以是印刷电路板(PCB)。基板225可以毗邻于(例如,沿着)外部外壳205的内表面布置。由此,基板225可被放置成使得基板225与外部外壳205之间不存在间隙,这可以防止因反射而导致的信号损耗。The antenna design 200 may also include an antenna structure 215 including one or more antenna elements 220 and a substrate 225 supporting the antenna element(s) 220 . While the antenna element 220 is shown disposed on top of the substrate 225, it should be understood that the antenna element 220 may be coplanar or recessed from the substrate 225 as appropriate or desired. For example, substrate 225 may be a printed circuit board (PCB). Substrate 225 may be disposed adjacent to (eg, along) an inner surface of outer housing 205 . Thus, the substrate 225 can be placed such that there is no gap between the substrate 225 and the outer housing 205, which can prevent signal loss due to reflection.
在图2的横截面视图中,作为示例,示出了两个天线振子220。天线振子220可以与外部外壳205中相应的腔210对准以使得天线振子220可以经由相应的腔210接收和/或发射通信信号。由此,根据特定天线设计,腔210的数目和布置可以与天线振子220的数目和布置相对应。例如,图2的横截面视图可以表示包括2X1、2X2、2X3、2X4、2X5或2X6等天线振子220的阵列与外部外壳205中对应的腔210的阵列的天线设计。In the cross-sectional view of Fig. 2, two antenna elements 220 are shown as an example. Antenna elements 220 may be aligned with corresponding cavities 210 in outer housing 205 such that antenna elements 220 may receive and/or transmit communication signals via corresponding cavities 210 . Thus, depending on the particular antenna design, the number and arrangement of cavities 210 may correspond to the number and arrangement of antenna elements 220 . For example, the cross-sectional view of FIG. 2 may represent an antenna design including a 2X1, 2X2, 2X3, 2X4, 2X5, or 2X6 array of antenna elements 220 with a corresponding array of cavities 210 in outer housing 205 .
天线结构215还可包括可经由基板225电连接到天线振子220的射频集成电路(RFIC)230。RFIC 230可以为天线振子220提供操作控制(例如,为经由天线振子220接收/发射通信信号)。Antenna structure 215 may also include a radio frequency integrated circuit (RFIC) 230 that may be electrically connected to antenna element 220 via substrate 225 . RFIC 230 may provide operational control for antenna element 220 (eg, for receiving/transmitting communication signals via antenna element 220 ).
为了理解,天线设计200被解说为包括提供无线通信设备的操作控制(包括但不限于通信控制)的主控板235(例如,另一PCB)。主控板235可以经由基板225电连接到RFIC 230和天线振子220以促成无线通信设备的mmW通信。For purposes of understanding, antenna design 200 is illustrated as including a main control board 235 (eg, another PCB) that provides operational control of the wireless communication device, including but not limited to communication controls. The main control board 235 may be electrically connected to the RFIC 230 and the antenna element 220 via the substrate 225 to facilitate mmW communication of the wireless communication device.
如所示的,腔210中的每一者可包括被锥形化以朝相应的天线振子220倾斜的壁240。壁240的锥度可以分别促成收集给相应的天线振子220的通信信号和/或从相应的天线振子220辐射通信信号以供接收和/或发射。如恰适或所期望的,壁240的锥度可以是固定斜率或者可以是可变的(例如,曲线的)。在腔210具有曲线横截面周界(例如,在图2中从上方看时为圆形或椭圆形)的情形中,每个腔210可具有单个壁240。在腔210具有矩形横截面周界(例如,在图2中从上方看时为矩形或正方形)的情形中,每个腔210可具有两对相对的壁240。As shown, each of cavities 210 may include walls 240 that are tapered to slope toward the respective antenna element 220 . The taper of walls 240 may facilitate collection of communication signals to and/or radiation of communication signals from corresponding antenna elements 220 for reception and/or transmission, respectively. The taper of the wall 240 may be a fixed slope or may be variable (eg, curvilinear) as appropriate or desired. Where the cavities 210 have curved cross-sectional perimeters (eg, circular or elliptical when viewed from above in FIG. 2 ), each cavity 210 may have a single wall 240 . Where the cavities 210 have rectangular cross-sectional perimeters (eg, rectangular or square when viewed from above in FIG. 2 ), each cavity 210 may have two pairs of opposing walls 240 .
外部外壳205可以由塑料材料(或其他非金属材料,诸如玻璃)制成。在此类情形中,腔210的壁240可具有布置在其上的一层金属材料245(例如,金镀敷),如图2中腔的右侧所表示的。金属材料245可以通过反射相应的天线振子220的通信信号来收集/辐射此类信号。The outer housing 205 may be made of plastic material (or other non-metallic material such as glass). In such cases, the wall 240 of the cavity 210 may have a layer of metallic material 245 (eg, gold plating) disposed thereon, as represented on the right side of the cavity in FIG. 2 . The metallic material 245 may collect/radiate communication signals of the corresponding antenna elements 220 by reflecting such signals.
替换地,外部外壳205可以由金属材料制成。在此类情形中,腔210的壁240可以通过反射相应的天线振子220的通信信号来收集/辐射此类信号,而无需附加材料层,如图2中腔的左侧所表示的。Alternatively, the outer housing 205 may be made of a metallic material. In such cases, the walls 240 of the cavity 210 may collect/radiate the communication signals of the corresponding antenna elements 220 by reflecting such signals without additional layers of material, as represented on the left side of the cavity in FIG. 2 .
外部外壳205可在其外表面上提供有涂层250(诸如保护层)。如所示的,涂层250可以在腔210上延伸。涂层250可以是出于美观的目的而掩盖腔210的视觉外观的相对薄的有色材料层,而不会不利地影响通过其接收/发射mmW通信信号。The outer housing 205 may be provided with a coating 250 (such as a protective layer) on its outer surface. As shown, coating 250 may extend over cavity 210 . Coating 250 may be a relatively thin layer of colored material that conceals the visual appearance of cavity 210 for aesthetic purposes without adversely affecting reception/transmission of mmW communication signals therethrough.
替换地或附加地,腔210可被填充有合适的电介质或非金属材料255以提供与外部外壳205的外表面共面的表面。在包括涂层250的情形中,材料255可以在腔210上为涂层250提供支撑,这与使腔210被抽空或填充有空气或其他气体相反(其不能为涂层提供合适的支撑)。对于mmW通信信号,材料255可以是透射(例如,透明)的,从而不会不利地影响通过其接收/发射mmW通信信号。例如,针对材料255可以使用塑料材料,诸如树脂(例如,(改性))或聚碳酸酯(例如, )。Alternatively or additionally, cavity 210 may be filled with a suitable dielectric or non-metallic material 255 to provide a surface coplanar with the outer surface of outer housing 205 . Where coating 250 is included, material 255 may provide support for coating 250 on cavity 210 as opposed to having cavity 210 evacuated or filled with air or other gas (which would not provide suitable support for the coating). For mmW communication signals, material 255 may be transmissive (eg, transparent) so as not to adversely affect reception/transmission of mmW communication signals therethrough. For example, a plastic material such as a resin (eg, (modified )) or polycarbonate (for example, ).
图3示出了根据本公开的各个方面的天线设计300的另一示例的横截面视图。天线设计300可包括外部外壳305。可以在外部外壳305中形成一个或多个腔310。在图3的横截面视图中,作为示例,示出了三个腔310。3 illustrates a cross-sectional view of another example of an antenna design 300 in accordance with various aspects of the present disclosure. Antenna design 300 may include an outer housing 305 . One or more cavities 310 may be formed in outer housing 305 . In the cross-sectional view of Fig. 3, three cavities 310 are shown as an example.
天线设计300还可包括天线结构315,天线结构315包括一个或多个天线振子320和支撑(诸)天线振子320的基板325。在图3的横截面视图中,作为示例,示出了三个天线振子320。天线振子320可以与外部外壳305中相应的腔310对准以使得天线振子320可以经由相应的腔310接收和/或发射通信信号。由此,根据特定天线设计,腔310的数目和布置可以与天线振子320的数目和布置相对应。例如,图3的横截面视图可以表示包括3X1、3X2、3X3、3X4、3X5或3X6等天线振子320的阵列与外部外壳305中对应腔310的阵列的天线设计。Antenna design 300 may also include antenna structure 315 including one or more antenna elements 320 and a substrate 325 supporting antenna element(s) 320 . In the cross-sectional view of Fig. 3, three antenna elements 320 are shown as an example. Antenna elements 320 may be aligned with corresponding cavities 310 in outer housing 305 such that antenna elements 320 may receive and/or transmit communication signals via corresponding cavities 310 . Thus, depending on the particular antenna design, the number and arrangement of cavities 310 may correspond to the number and arrangement of antenna elements 320 . For example, the cross-sectional view of FIG. 3 may represent an antenna design including a 3X1, 3X2, 3X3, 3X4, 3X5, or 3X6 array of antenna elements 320 and an array of corresponding cavities 310 in outer housing 305 .
天线结构315还可包括可经由基板325电连接到天线振子320的RFIC 330。为了理解,天线设计300被解说为包括可以经由基板325电连接到RFIC 330和天线振子320以促成无线通信设备的mmW通信的主控板335。Antenna structure 315 may also include RFIC 330 that may be electrically connected to antenna element 320 via substrate 325 . For purposes of understanding, antenna design 300 is illustrated as including main control board 335 that may be electrically connected to RFIC 330 and antenna element 320 via substrate 325 to facilitate mmW communication of the wireless communication device.
如所示的,右侧和左侧的腔310可各自包括被锥形化以朝相应的天线振子320倾斜的壁340。右侧和左侧的腔310可各自包括相对的较不锥形化(例如,如所示的不被锥形化)的壁345。类似地,中间的腔310可以具有一个或多个较不锥形化(例如,如所示的不被锥形化)的壁。与根据图2的具有相同数目的天线振子和各自具有(诸)锥形化壁的腔的天线设计相比,这种布置可以允许天线设计300更为紧凑。例如,在腔310具有矩形横截面周界的情况下,腔310中的每一者的外壁340可被锥形化,而内壁345(例如,腔中与毗邻的另一腔的壁相对面对的每个壁)可以较不锥形化或不被锥形化。As shown, the right and left cavities 310 may each include walls 340 that are tapered to slope toward the respective antenna elements 320 . The right and left cavities 310 may each include opposing less tapered (eg, not tapered as shown) walls 345 . Similarly, the intermediate lumen 310 may have one or more walls that are less tapered (eg, not tapered as shown). This arrangement may allow the antenna design 300 to be more compact compared to the antenna design according to FIG. 2 having the same number of antenna elements and cavities each with tapered wall(s). For example, where the cavities 310 have a rectangular cross-sectional perimeter, the outer wall 340 of each of the cavities 310 may be tapered, while the inner wall 345 (e.g., one of the cavities facing oppositely to the wall of the adjacent another cavity) Each wall of ) may be less tapered or not tapered.
外部外壳305可在其外表面上提供有涂层350(诸如保护层)。替换地或附加地,腔310可被填充有合适的电介质或非金属材料355以提供与外部外壳305的外表面共面的表面。The outer housing 305 may be provided with a coating 350 (such as a protective layer) on its outer surface. Alternatively or additionally, cavity 310 may be filled with a suitable dielectric or non-metallic material 355 to provide a surface coplanar with the outer surface of outer housing 305 .
图4示出了根据本公开的各个方面的天线设计400的又一示例的横截面视图。如所示的,天线设计400可包括其中形成有腔410的外部外壳405、包括天线振子420和支撑天线振子420的基板425的天线结构415、RFIC 430、主控板435、以及涂层450,其各自可以如以上关于图2和/或3所描述的那样。4 illustrates a cross-sectional view of yet another example of an antenna design 400 in accordance with various aspects of the present disclosure. As shown, the antenna design 400 may include an outer housing 405 having a cavity 410 formed therein, an antenna structure 415 including an antenna element 420 and a substrate 425 supporting the antenna element 420, an RFIC 430, a main control board 435, and a coating 450, Each of these may be as described above with respect to FIGS. 2 and/or 3 .
如所示的,天线设计400还可包括用于相应的腔410的辅助腔440。辅助腔440中的每一者可被形成在基板425中并且与相应的腔410和对应的天线振子420对准。辅助腔440可被填充有合适的电介质材料,使得天线振子420被置于对应的腔410与辅助腔440的电介质材料之间。As shown, antenna design 400 may also include auxiliary cavities 440 for corresponding cavities 410 . Each of the auxiliary cavities 440 may be formed in the substrate 425 and aligned with the corresponding cavity 410 and the corresponding antenna element 420 . The auxiliary cavity 440 may be filled with a suitable dielectric material such that the antenna element 420 is placed between the corresponding cavity 410 and the dielectric material of the auxiliary cavity 440 .
可在基板425的顶部上布置第一金属层445,其中切口区域对应于天线振子420。可在基板425的底部上布置第二金属层460。辅助腔440可被金属镀敷贯穿通孔455围绕,金属镀敷贯穿通孔455可以在第一金属层445与第二金属层460之间延伸。替换地,辅助腔440的壁可以具有布置在其上的一层金属材料(例如,金镀敷,未示出)。第一金属层445和/或第二金属层460以及金属镀敷贯穿通孔455可以通过反射相应的天线振子420的通信信号来收集/辐射此类信号。尽管为了清楚起见未在图4中解说,但是用于每个天线振子420的馈送线(未示出)也可由附加金属镀敷贯穿通孔(未示出)围绕。A first metal layer 445 may be disposed on top of the substrate 425 , where the cutout area corresponds to the antenna element 420 . A second metal layer 460 may be disposed on the bottom of the substrate 425 . The auxiliary cavity 440 may be surrounded by a metal plated through hole 455 which may extend between the first metal layer 445 and the second metal layer 460 . Alternatively, the walls of the auxiliary cavity 440 may have a layer of metallic material (eg, gold plating, not shown) disposed thereon. The first metal layer 445 and/or the second metal layer 460 and the metal plated through hole 455 may collect/radiate communication signals of the corresponding antenna elements 420 by reflecting such signals. Although not illustrated in FIG. 4 for clarity, the feed lines (not shown) for each antenna element 420 may also be surrounded by additional metal plated through-holes (not shown).
图5示出了根据本公开的各个方面的天线设计500的再一示例的分解透视图。如所示的,天线设计500可包括其中形成有腔510的外部外壳505、以及包括天线振子520和支撑天线振子520的基板525的天线结构515,其各自可以如以上关于图2和/或3所描述的那样。如所解说的,腔510可以具有带四个锥状壁的椎体形状,尽管其他形状(例如,不同的横截面周界、非椎体、非对称等)也可被采用。此外,腔510可被填充有合适的电介质材料550,诸如本文中所描述的。尽管为了简明起见未示出,但是天线设计500可包括用于腔510的辅助腔,诸如关于图4所描述的。5 shows an exploded perspective view of yet another example of an antenna design 500 in accordance with various aspects of the present disclosure. As shown, the antenna design 500 may include an outer housing 505 having a cavity 510 formed therein, and an antenna structure 515 including an antenna element 520 and a substrate 525 supporting the antenna element 520, each of which may be as described above with respect to FIGS. 2 and/or 3. as described. As illustrated, lumen 510 may have a pyramidal shape with four tapered walls, although other shapes (eg, different cross-sectional perimeters, non-pyramidal, asymmetrical, etc.) may also be employed. Additionally, cavity 510 may be filled with a suitable dielectric material 550, such as described herein. Although not shown for clarity, antenna design 500 may include an auxiliary cavity for cavity 510 , such as described with respect to FIG. 4 .
图6示出了根据本公开的各个方面的天线阵列600的示例的分解透视图。如所示的,天线阵列可包括其中形成有多个腔610的外部外壳605、以及包括天线振子620和支撑天线振子620的基板625的天线结构615,其各自可以如以上关于图2和/或3所描述的那样。此外,腔610可被填充有合适的电介质材料650,诸如本文中所描述的。尽管为了简明起见未示出,但是天线阵列600可包括用于多个腔610中的每一者的辅助腔,诸如关于图4所描述的。虽然示出的天线阵列600是2X4阵列,但是应理解,不同数目的天线振子620和腔610的阵列也是可能的。FIG. 6 shows an exploded perspective view of an example of an antenna array 600 according to various aspects of the present disclosure. As shown, the antenna array may include an outer housing 605 with a plurality of cavities 610 formed therein, and an antenna structure 615 including an antenna element 620 and a substrate 625 supporting the antenna elements 620, each of which may be as described above with respect to FIG. 2 and/or 3 as described. Additionally, cavity 610 may be filled with a suitable dielectric material 650, such as described herein. Although not shown for clarity, antenna array 600 may include an auxiliary cavity for each of plurality of cavities 610, such as described with respect to FIG. 4 . Although the illustrated antenna array 600 is a 2X4 array, it should be understood that arrays of different numbers of antenna elements 620 and cavities 610 are also possible.
图7示出了根据本公开的各个方面的用于无线通信设备的外部外壳705的示例。如本文中所描述的,外部外壳705可以是用于mmW通信的天线设计的一部分。由此,尽管在图7中具体示出并且为了简化起见不再描述,但是应理解,外部外壳705可以与本文中所描述的各个其他特征一起被采用以实现特定天线设计。7 illustrates an example of an external housing 705 for a wireless communication device in accordance with various aspects of the present disclosure. As described herein, external housing 705 may be part of an antenna design for mmW communications. Thus, while specifically shown in FIG. 7 and not described for simplicity, it should be understood that the outer housing 705 may be employed with various other features described herein to achieve a particular antenna design.
外部外壳705可以形成无线通信设备(诸如蜂窝电话)的后盖。尽管外部外壳705被示为具有特定形状,但是示出的形状旨在是解说性的而不旨在是限定性的。External housing 705 may form the back cover of a wireless communication device, such as a cellular telephone. Although the outer housing 705 is shown as having a particular shape, the shape shown is intended to be illustrative and not limiting.
外部外壳705可包括第一部分705-a和第二部分705-b。第一部分705-a可具有形成在其中的多个腔710。如此,第一部分705-a一般可对应于图2-6中所解说的外部外壳205/305/405/505/605的各部分。The outer housing 705 may include a first portion 705-a and a second portion 705-b. The first portion 705-a may have a plurality of cavities 710 formed therein. As such, the first portion 705-a may generally correspond to the portions of the outer housing 205/305/405/505/605 illustrated in FIGS. 2-6.
第一部分705-a可插入到第二部分705-b中以形成外部外壳705。例如,第一部分705-a可与特定天线设计的其他组件(例如,(诸)天线振子、天线基板、RFIC等)组装,并且随后被插入到第二部分705-b中。第一和第二部分705-a和705-b可以按任何合适的方式嵌合(例如,摩擦嵌合、机械连接、粘合等)在一起。在一些情形中,可以在第一部分705-a被插入到第二部分705-b中之后在外部外壳705上布置涂层(未示出),该涂层还可用来相对于第二部分705-b固定第一部分705-a。替换地或附加地,天线设计的组件和无线通信设备的其他组件之间的各种连接可用来相对于第二部分705-b固定第一部分705-a,因为此类组件被组装以形成无线通信设备。The first part 705 - a can be inserted into the second part 705 - b to form the outer housing 705 . For example, the first part 705-a may be assembled with other components of a particular antenna design (eg, antenna element(s), antenna substrate, RFIC, etc.) and then inserted into the second part 705-b. The first and second portions 705-a and 705-b may be fitted together in any suitable manner (eg, friction fit, mechanically connected, glued, etc.). In some cases, a coating (not shown) may be disposed on the outer housing 705 after the first part 705-a is inserted into the second part 705-b, which coating may also serve to b fixes the first part 705-a. Alternatively or additionally, various connections between components of the antenna design and other components of the wireless communication device may be used to secure the first part 705-a relative to the second part 705-b as such components are assembled to form a wireless communication equipment.
尽管图7将外部外壳705示为具有分开的第一和第二部分705-a和705-b,但是应理解,此类部分可以彼此整合(例如,用于无线通信设备的单体或单片后盖)。在此类情形中,外部外壳705可能不需要组装(尽管外部外壳705可与用于无线通信设备的其他组件(例如,前盖)组装)。Although FIG. 7 shows the external housing 705 as having separate first and second portions 705-a and 705-b, it should be understood that such portions may be integrated with each other (e.g., a single body or single piece for a wireless communication device back cover). In such cases, the outer housing 705 may not require assembly (although the outer housing 705 may be assembled with other components for the wireless communication device (eg, the front cover)).
图8示出了解说根据本公开的各个方面的用于供在无线通信中使用的设备115-a的架构的示例的框图800。UE 115-a可具有各种配置,并且可被包括在个人计算机(例如,膝上型计算机、上网本计算机、平板计算机等)、蜂窝电话(例如,智能电话)、PDA、数字视频记录器(DVR)、因特网设备、游戏控制台、电子阅读器等中或是其一部分。在一些情形中,UE115-a可具有用于促成移动操作的内部电源(未示出),诸如小电池。设备115-a可以是参照图1描述的UE 115的一个或多个方面的示例。UE 115-a可实现参照图1-7描述的特征和/或功能中的至少一些。UE 115-a可与参照图1描述的mmW基站105进行通信。8 shows a block diagram 800 illustrating an example of an architecture for a device 115-a for use in wireless communications in accordance with various aspects of the present disclosure. UE 115-a may have various configurations and may be included in a personal computer (e.g., laptop computer, netbook computer, tablet computer, etc.), cellular phone (e.g., smart phone), PDA, digital video recorder (DVR ), Internet appliances, game consoles, e-readers, etc. In some cases, UE 115-a may have an internal power source (not shown), such as a small battery, to facilitate mobile operation. Device 115-a may be an example of one or more aspects of UE 115 described with reference to FIG. 1 . The UE 115-a may implement at least some of the features and/or functions described with reference to FIGS. 1-7. UE 115-a may communicate with mmW base station 105 described with reference to FIG. 1 .
设备115-a一般可包括用于双向语音和数据通信的组件,其包括用于传送通信的组件和用于接收通信的组件。如本文中所描述的,设备115-a可包括用于接收和/或发射mmW通信信号的一个或多个mmW天线830。设备115-a还可包括处理器模块805、存储器810(包括软件(SW)815)、通信管理模块820、以及一个或多个收发机模块825,它们各自可彼此直接或间接地通信(例如,经由一个或多个总线835)。Device 115-a may generally include components for two-way voice and data communications, including components for transmitting communications and components for receiving communications. Device 115-a may include one or more mmW antennas 830 for receiving and/or transmitting mmW communication signals, as described herein. Device 115-a may also include a processor module 805, memory 810 (including software (SW) 815), a communications management module 820, and one or more transceiver modules 825, each of which may communicate directly or indirectly with each other (e.g., via one or more buses 835).
设备115-a的组件可个体地或共同地使用适配成以硬件执行一些或所有适用功能的一个或多个专用集成电路(ASIC)来实现。替换地,这些功能可以由一个或多个集成电路上的一个或多个其他处理单元(或核)来执行。在其他示例中,可使用可按本领域已知的任何方式来编程的其他类型的集成电路(例如,结构化/平台ASIC、现场可编程门阵列(FPGA)、以及其他半定制IC)。每个模块的功能也可以整体或部分地用实施在存储器中的、被格式化成由一个或多个通用或专用处理器执行的指令来实现。The components of device 115-a may be implemented, individually or collectively, using one or more application-specific integrated circuits (ASICs) adapted to perform some or all applicable functions in hardware. Alternatively, these functions may be performed by one or more other processing units (or cores) on one or more integrated circuits. In other examples, other types of integrated circuits (eg, structured/platform ASICs, field programmable gate arrays (FPGAs), and other semi-custom ICs) that can be programmed in any manner known in the art may be used. The functionality of each module may also be implemented in whole or in part by instructions embodied in memory formatted for execution by one or more general or special purpose processors.
存储器810可包括随机存取存储器(RAM)和/或只读存储器(ROM)。存储器810可存储包含指令的计算机可读、计算机可执行软件(SW)代码815,这些指令在被执行时使处理器模块805执行用于无线通信的各种功能。替换地,软件代码815可能不能由处理器模块805直接执行,但可以(例如,在被编译和执行时)使设备115-a执行此类功能。Memory 810 may include random access memory (RAM) and/or read only memory (ROM). Memory 810 may store computer-readable, computer-executable software (SW) code 815 containing instructions that, when executed, cause processor module 805 to perform various functions for wireless communications. Alternatively, software code 815 may not be directly executable by processor module 805, but may (eg, when compiled and executed) cause device 115-a to perform such functions.
处理器模块805可包括智能硬件设备,例如CPU、微控制器、ASIC等。处理器模块805可处理通过(诸)收发机模块825接收到的信息和/或要发送给收发机模块825以供通过(诸)mmW天线830发射的信息。处理器模块805可单独地或与通信管理模块820相结合地处置经由(诸)mmW天线830的mmW通信。The processor module 805 may include intelligent hardware devices, such as CPU, microcontroller, ASIC, and the like. The processor module 805 may process information received through the transceiver module(s) 825 and/or to be sent to the transceiver module 825 for transmission through the mmW antenna(s) 830 . Processor module 805 may handle mmW communication via mmW antenna(s) 830 alone or in combination with communication management module 820 .
(诸)收发机模块825可被配置成经由(诸)mmW天线830和/或一条或多条有线或无线链路与一个或多个网络进行双向通信,如以上参照图1所描述的。例如,(诸)收发机模块825可被配置成与mmW基站105进行双向通信,如参照图1所描述的。(诸)收发机模块825可包括调制解调器,该调制解调器被配置成调制分组并将经调制分组提供给(诸)mmW天线830以供发射,以及解调从(诸)mmW天线830接收到的分组。虽然设备115-a可包括单个mmW天线830,但设备115-a可具有能够并发地发射和/或接收多个无线传输的多个mmW天线830(例如,天线阵列)。(诸)收发机模块825可以能够经由多个分量载波并发地与一个或多个基站105进行通信。Transceiver module(s) 825 may be configured to bi-directionally communicate with one or more networks via mmW antenna(s) 830 and/or one or more wired or wireless links, as described above with reference to FIG. 1 . For example, the transceiver module(s) 825 may be configured to communicate bi-directionally with the mmW base station 105, as described with reference to FIG. 1 . The transceiver module(s) 825 may include a modem configured to modulate packets and provide the modulated packets to the mmW antenna(s) 830 for transmission, and to demodulate packets received from the mmW antenna(s) 830 . While device 115-a may include a single mmW antenna 830, device 115-a may have multiple mmW antennas 830 (eg, an antenna array) capable of transmitting and/or receiving multiple wireless transmissions concurrently. The transceiver module(s) 825 may be capable of communicating with one or more base stations 105 concurrently via multiple component carriers.
通信管理模块820可以执行和/或控制参照图1描述的特征和/或功能中的一些或全部、以及如本领域中已知的用于无线通信的其他特征/功能。通信管理模块820或其各部分可包括处理器,和/或该通信管理模块820的功能性中的一些或全部可由处理器模块805执行和/或与该处理器模块805相结合地执行。The communication management module 820 may perform and/or control some or all of the features and/or functions described with reference to FIG. 1 , as well as other features/functions for wireless communications as known in the art. The communications management module 820 , or portions thereof, may include a processor, and/or some or all of the functionality of the communications management module 820 may be performed by and/or in conjunction with the processor module 805 .
图9示出了解说根据本公开的各个方面的用于无线通信设备的天线设计的制造的示例的一系列横截面视图900-a到900-e。制造可以开始于如横截面视图900-a中所示的外部外壳905。9 shows a series of cross-sectional views 900-a through 900-e illustrating an example of fabrication of an antenna design for a wireless communication device in accordance with various aspects of the present disclosure. Fabrication may begin with outer housing 905 as shown in cross-sectional view 900-a.
如横截面视图900-b中所示,可以在外部外壳905中形成一个或多个腔910。腔910可以按任何合适的方式来形成,诸如通过机械地或化学地形成(例如,切割、穿孔、蚀刻等)穿过外部外壳905的通孔。也可以采用其他技术,诸如铸造、模塑等。在此类情形中,腔910可以在形成外部外壳905时形成,使得制造可以开始于如横截面视图900-b中所示的外部外壳905。As shown in cross-sectional view 900 - b , one or more cavities 910 may be formed in outer housing 905 . Cavity 910 may be formed in any suitable manner, such as by mechanically or chemically forming (eg, cutting, perforating, etching, etc.) through-holes through outer housing 905 . Other techniques such as casting, molding, etc. may also be used. In such cases, cavity 910 may be formed when outer housing 905 is formed such that fabrication may begin with outer housing 905 as shown in cross-sectional view 900-b.
包括支撑一个或多个天线振子920(对应于腔910)的基板925的天线结构915可被组装到外部外壳905,如横截面视图900-c中所示。天线结构915可以按任何合适的方式(例如,机械连接、粘合、摩擦嵌合(friction fit)(例如协作功能)等)来相对于外部外壳905固定。Antenna structure 915 including a substrate 925 supporting one or more antenna elements 920 (corresponding to cavities 910) may be assembled to outer housing 905, as shown in cross-sectional view 900-c. Antenna structure 915 may be secured relative to outer housing 905 in any suitable manner (eg, mechanical connection, adhesive, friction fit (eg, cooperating functions), etc.).
在一些情形中,腔910可被填充有合适的材料955(例如,电介质,诸如本文中所描述的塑料材料)。在此类情形中,材料955可以与基板925和/或天线振子920接合或以其他方式附连,和/或可以封装天线振子920以帮助相对于外部外壳905固定天线结构915。替换地,腔910可被填充有气体(例如,空气或特定元素的成分)或被抽空。In some cases, cavity 910 may be filled with a suitable material 955 (eg, a dielectric, such as the plastic materials described herein). In such cases, material 955 may bond or otherwise attach to substrate 925 and/or antenna element 920 and/or may encapsulate antenna element 920 to help secure antenna structure 915 relative to outer housing 905 . Alternatively, cavity 910 may be filled with a gas (eg, air or a component of a specific element) or evacuated.
如横截面视图900-d中所示的,可以在外部外壳905的外表面上施加涂层950。涂层950可以例如取决于涂层950的材料而按任何合适的方式(例如,沉积、喷涂、粘合、层压等)来施加。涂层950可以与外部外壳905以及材料955(例如,在该情形中为塑料材料)接合或以其他方式附连。在腔被气体或真空填充的情形中,涂层950可以密封腔910。As shown in cross-sectional view 900 - d , coating 950 may be applied to the exterior surface of outer housing 905 . Coating 950 may be applied in any suitable manner (eg, deposition, spraying, bonding, lamination, etc.), eg, depending on the material of coating 950 . Coating 950 may bond or otherwise attach to outer housing 905 and material 955 (eg, in this case a plastic material). Coating 950 may seal cavity 910 where the cavity is filled with gas or vacuum.
应理解,将天线结构915组装到外部外壳905以及将涂层950施加到外部外壳的次序可如恰适或所期望的被颠倒。It should be understood that the order of assembling the antenna structure 915 to the outer housing 905 and applying the coating 950 to the outer housing may be reversed as appropriate or desired.
同样如横截面视图900-d中所示,RFIC 930可以与基板925电连接。此类电连接可以按任何合适的方式(诸如与RFIC 930和基板925上的迹线之间的电触点焊接或经由粘合剂)来实现。Also shown in cross-sectional view 900 - d , RFIC 930 may be electrically connected to substrate 925 . Such electrical connections may be made in any suitable manner, such as soldering to electrical contacts between the RFIC 930 and traces on the substrate 925 or via adhesives.
如横截面视图900-e中所示,无线通信设备的主控板935可以与基板925电连接。同样,此类电连接可以按任何合适的方式(诸如与主控板935和基板925上的迹线之间的电触点焊接或经由粘合剂)来实现。As shown in cross-sectional view 900-e, a main control board 935 of the wireless communication device may be electrically connected to the substrate 925. Again, such electrical connections may be made in any suitable manner, such as soldering to electrical contacts between the main control board 935 and traces on the substrate 925 or via adhesives.
图9中解说的前述制造可以在外部外壳905由金属材料制成的情况下执行。如本文中所描述的,在外部外壳905由非金属(例如,非导电)材料(诸如塑料材料)制成的情形中,作为制造的一部分,可将一层金属材料(未示出)添加到腔910的壁。The foregoing fabrication illustrated in FIG. 9 may be performed in a case where the outer housing 905 is made of a metallic material. As described herein, where the outer housing 905 is made of a non-metallic (eg, non-conductive) material such as a plastic material, a layer of metallic material (not shown) may be added to the The walls of cavity 910.
图10示出了解说根据本公开的各个方面的用于无线通信设备的天线设计的制造的另一示例的一系列横截面视图1000-a到1000-e。制造可以开始于如横截面视图1000-a中所示的外部外壳的第一部分1005-a。10 shows a series of cross-sectional views 1000-a through 1000-e illustrating another example of fabrication of an antenna design for a wireless communication device in accordance with various aspects of the present disclosure. Manufacturing may begin with a first portion 1005-a of the outer housing as shown in cross-sectional view 1000-a.
如横截面视图1000-b中所示,可以在第一部分1005-a中形成一个或多个腔1005。腔1010可以按任何合适的方式来形成,诸如通过机械地或化学地形成(例如,切割、穿孔、蚀刻等)穿过第一部分1005-a的通孔。也可以采用其他技术,诸如铸造、模塑等。在此类情形中,腔1010可以在形成第一部分1005-a时形成,使得制造可以开始于如横截面视图1000-b中所示的第一部分1005-a。As shown in cross-sectional view 1000-b, one or more cavities 1005 may be formed in first portion 1005-a. The cavity 1010 may be formed in any suitable manner, such as by mechanically or chemically forming (eg, cutting, perforating, etching, etc.) a through-hole through the first portion 1005-a. Other techniques such as casting, molding, etc. may also be used. In such cases, cavity 1010 may be formed when first portion 1005-a is formed such that fabrication may begin with first portion 1005-a as shown in cross-sectional view 1000-b.
包括支撑一个或多个天线振子1020(对应于腔1010)的基板1025的天线结构1015可被组装到第一部分1005-a,如横截面视图1000-c中所示。天线结构1015可以按任何合适的方式(例如,机械连接、粘合、摩擦嵌合(例如协作功能)等)来相对于第一部分1005-a固定。Antenna structure 1015 including a substrate 1025 supporting one or more antenna elements 1020 (corresponding to cavities 1010) may be assembled to first portion 1005-a, as shown in cross-sectional view 1000-c. The antenna structure 1015 may be secured relative to the first portion 1005-a in any suitable manner (eg, mechanical connection, adhesive, friction fit (eg, cooperating function), etc.).
在一些情形中,腔1010可被填充有合适的材料1055(例如,电介质,诸如本文中所描述的塑料材料)。在此类情形中,材料1055可以与基板1025和/或天线振子1020接合或以其他方式附连,和/或可以封装天线振子1020以帮助相对于第一部分1005-a固定天线结构1015。替换地,腔1010可被填充有气体(例如,空气或特定元素的成分)或被抽空。In some cases, cavity 1010 may be filled with a suitable material 1055 (eg, a dielectric, such as the plastic materials described herein). In such cases, material 1055 may bond or otherwise attach to substrate 1025 and/or antenna element 1020, and/or may encapsulate antenna element 1020 to help secure antenna structure 1015 relative to first portion 1005-a. Alternatively, cavity 1010 may be filled with a gas (eg, air or a component of a specific element) or evacuated.
如横截面视图1000-d中所示,RFIC 1030可以与基板1025电连接。此类电连接可以按任何合适的方式(诸如与RFIC 1030和基板1025上的迹线之间的电触点焊接或经由粘合剂)来实现。RFIC 1030 may be electrically connected to substrate 1025 as shown in cross-sectional view 1000-d. Such electrical connections may be made in any suitable manner, such as soldering to electrical contacts between the RFIC 1030 and traces on the substrate 1025 or via adhesives.
如横截面视图1000-e中所示,组装有天线结构1015和RFIC 1030的第一部分1005-a可被插入到外部外壳的第二部分1005-b中。例如,第一和第二部分1005-a和1005-b可被嵌合在一起以形成外部外壳(例如,无线通信设备的后盖),诸如以上关于图7所描述的。此外,可在外部外壳(通过将第一部分1005-a与第二部分1005-b组装形成)上布置涂层1050。As shown in cross-sectional view 1000-e, first part 1005-a assembled with antenna structure 1015 and RFIC 1030 may be inserted into second part 1005-b of the outer housing. For example, the first and second parts 1005-a and 1005-b may be fitted together to form an external housing (eg, the back cover of a wireless communication device), such as described above with respect to FIG. 7 . Additionally, a coating 1050 may be disposed on the outer housing (formed by assembling the first part 1005-a with the second part 1005-b).
应理解,将天线结构1015组装到第一部分1005-a可以在将第一部分1005-a与第二部分1005-b组装之后执行。此外,使用材料1055来填充腔1010可以在将第一部分1005-a与第二部分1005-b组装之后执行。It should be understood that assembling the antenna structure 1015 to the first part 1005-a may be performed after assembling the first part 1005-a with the second part 1005-b. Furthermore, filling cavity 1010 with material 1055 may be performed after assembling first part 1005-a with second part 1005-b.
尽管未示出,但是也可以执行无线通信设备的附加制造(例如,添加诸如关于图10所描述的主控板)。Although not shown, additive manufacturing of the wireless communication device (eg, adding a main control board such as described with respect to FIG. 10 ) may also be performed.
图10中解说的前述制造可以在外部外壳的第一部分1005-a由金属材料制成的情况下执行。如本文中所描述的,在外部外壳的第一部分1005-a由非金属(例如,非导电)材料(诸如塑料材料)制成的情形中,作为制造的一部分,可将一层金属材料(未示出)添加到腔1010的壁。The foregoing fabrication illustrated in FIG. 10 may be performed in a case where the first portion 1005-a of the outer housing is made of a metallic material. As described herein, where the first portion 1005-a of the outer housing is made of a non-metallic (eg, non-conductive) material, such as a plastic material, a layer of metallic material (not shown) is added to the wall of cavity 1010.
图11是解说根据本公开的各个方面的制造用于无线通信设备的天线设计的方法1100的示例的流程图。为了清楚起见,以下参照关于图2-10所描述的功能中的一者或多者的各方面描述了方法1100。应理解,纳入的各个特征将根据特定天线设计而变化。如此,方法1100应被理解为在本质上是代表性的而不是穷尽性的。11 is a flowchart illustrating an example of a method 1100 of fabricating an antenna design for a wireless communication device in accordance with various aspects of the present disclosure. For clarity, the method 1100 is described below with respect to aspects of one or more of the functions described with respect to FIGS. 2-10 . It should be understood that the various features incorporated will vary depending on the particular antenna design. As such, method 1100 should be understood to be representative in nature and not exhaustive.
在框1105,方法1100可涉及提供用于无线通信设备的外部外壳。如本文中所讨论的,这可涉及提供单体外壳,诸如无线通信设备的底盖。At block 1105, method 1100 can involve providing an external housing for a wireless communication device. As discussed herein, this may involve providing a unibody housing, such as the bottom cover of a wireless communication device.
在框1100,方法1100可涉及在该外部外壳中形成腔。如本文中所讨论的,框1105和1100的操作可例如在外部外壳被形成(例如,模塑)为包括腔时被合并。At block 1100, method 1100 can involve forming a cavity in the outer housing. As discussed herein, the operations of blocks 1105 and 1100 may be combined, for example, when the outer housing is formed (eg, molded) to include a cavity.
随后,在框1115,可将支撑天线振子的基板组装到该外部外壳。可以执行此类组装,使得基板毗邻于外部外壳的内表面布置并且天线振子与腔对准。此类对准可以将天线振子配置成在无线通信设备的操作期间通过腔接收和/或发射射频通信信号(例如,mmW)。Subsequently, at block 1115, a substrate supporting the antenna elements may be assembled to the outer housing. Such assembly may be performed such that the substrate is disposed adjacent the inner surface of the outer housing and the antenna element is aligned with the cavity. Such alignment may configure the antenna elements to receive and/or transmit radio frequency communication signals (eg, mmW) through the cavity during operation of the wireless communication device.
由此,方法1100可以提供用于无线通信设备的天线设计。应注意,方法1100仅仅是一个实现并且方法1100的操作可被重新排列或以其他方式修改以使得其它实现是可能的。Thus, method 1100 can provide antenna design for a wireless communication device. It should be noted that method 1100 is but one implementation and that the operations of method 1100 may be rearranged or otherwise modified such that other implementations are possible.
图12是解说根据本公开的各个方面的制造用于无线通信设备的天线设计的方法1200的另一示例的流程图。为了清楚起见,以下参照关于图2-8和10所描述的功能中的一者或多者的各方面描述了方法1200。应理解,纳入的各个特征将根据特定天线设计而变化。如此,方法1200应被理解为在本质上是代表性的而不是穷尽性的。12 is a flowchart illustrating another example of a method 1200 of fabricating an antenna design for a wireless communication device in accordance with various aspects of the present disclosure. For clarity, the method 1200 is described below with respect to aspects of one or more of the functions described with respect to FIGS. 2-8 and 10 . It should be understood that the various features incorporated will vary depending on the particular antenna design. As such, method 1200 should be understood to be representative and not exhaustive in nature.
在框1205,方法1200可涉及提供用于无线通信设备的外部外壳的第一部分和第二部分。如本文中所描述的,这可涉及提供可与第二部分组装以形成外部外壳的第一部分。At block 1205, method 1200 can involve providing a first portion and a second portion of an external housing for a wireless communication device. As described herein, this may involve providing a first part that can be assembled with a second part to form the outer housing.
在框1210,方法1200可涉及在该第一部分中形成腔。如本文中所讨论的,框1205和1210的操作可例如在第一部分被形成(例如,模塑)为包括腔时被合并。At block 1210, method 1200 may involve forming a cavity in the first portion. As discussed herein, the operations of blocks 1205 and 1210 may be combined, for example, when the first part is formed (eg, molded) to include a cavity.
在框1215,可将支撑天线振子的基板组装到该外部外壳的该第一部分。例如,可以如以上关于图10所描述的那样执行这种组装。At block 1215, a substrate supporting an antenna element may be assembled to the first portion of the outer housing. For example, such assembly may be performed as described above with respect to FIG. 10 .
随后,在框1220,可将该第一部分和该第二部分组装在一起以形成该外部外壳。由此,方法1200也可以提供用于无线通信设备的天线设计。应注意,方法1200仅仅是一个实现并且方法1200的操作可被重新排列或以其他方式修改以使得其它实现是可能的。Subsequently, at block 1220, the first portion and the second portion may be assembled together to form the outer housing. Thus, method 1200 can also provide antenna design for a wireless communication device. It should be noted that method 1200 is but one implementation and that the operations of method 1200 may be rearranged or otherwise modified such that other implementations are possible.
本文中所描述的技术可用于各种无线通信系统,诸如CDMA、TDMA、FDMA、OFDMA、SC-FDMA和其它系统。术语“系统”和“网络”常被可互换地使用。CDMA系统可实现诸如CDMA2000、通用地面无线电接入(UTRA)等无线电技术。CDMA2000涵盖IS-2000、IS-95和IS-856标准。IS-2000版本0和A常被称为CDMA2000 1X、1X等。IS-856(TIA-856)常被称为CDMA20001xEV-DO、高速率分组数据(HRPD)等。UTRA包括宽带CDMA(WCDMA)和其它CDMA变体。TDMA系统可实现诸如全球移动通信系统(GSM)之类的无线电技术。OFDMA系统可实现诸如超移动宽带(UMB)、演进UTRA(E-UTRA)、IEEE 802.11(WiFi)、IEEE 802.16(WiMAX)、IEEE 802.20、Flash-OFDMTM等无线电技术。UTRA和E-UTRA是通用移动电信系统(UMTS)的部分。3GPP长期演进(LTE)和高级LTE(LTE-A)是使用E-UTRA的新UMTS版本。UTRA、E-UTRA、UMTS、LTE、LTE-A以及GSM在来自名为“第三代伙伴项目”(3GPP)的组织的文献中描述。CDMA2000和UMB在来自名为“第三代伙伴项目2”(3GPP2)的组织的文献中描述。本文中所描述的技术既可被用于以上提及的系统和无线电技术,也可用于其他系统和无线电技术,包括无执照和/或共享带宽上的蜂窝(例如,LTE)通信。然而,以上描述出于示例目的描述了LTE/LTE-A系统,并且在以上大部分描述中使用了LTE术语,但这些技术也可应用于LTE/LTE-A应用以外的应用。The techniques described herein may be used in various wireless communication systems such as CDMA, TDMA, FDMA, OFDMA, SC-FDMA, and others. The terms "system" and "network" are often used interchangeably. A CDMA system may implement a radio technology such as CDMA2000, Universal Terrestrial Radio Access (UTRA), and others. CDMA2000 covers IS-2000, IS-95 and IS-856 standards. IS-2000 Release 0 and A are often referred to as CDMA2000 1X, 1X, etc. IS-856 (TIA-856) is often referred to as CDMA2000 1xEV-DO, High Rate Packet Data (HRPD), etc. UTRA includes Wideband-CDMA (WCDMA) and other CDMA variants. A TDMA system can implement a radio technology such as Global System for Mobile Communications (GSM). An OFDMA system may implement radio technologies such as Ultra Mobile Broadband (UMB), Evolved UTRA (E-UTRA), IEEE 802.11 (WiFi), IEEE 802.16 (WiMAX), IEEE 802.20, Flash-OFDM ™ , and others. UTRA and E-UTRA are part of the Universal Mobile Telecommunications System (UMTS). 3GPP Long Term Evolution (LTE) and LTE-Advanced (LTE-A) are new UMTS releases that use E-UTRA. UTRA, E-UTRA, UMTS, LTE, LTE-A and GSM are described in documents from an organization named "3rd Generation Partnership Project" (3GPP). CDMA2000 and UMB are described in documents from an organization named "3rd Generation Partnership Project 2" (3GPP2). The techniques described herein may be used for the systems and radio technologies mentioned above as well as other systems and radio technologies, including unlicensed and/or cellular (eg, LTE) communications over shared bandwidth. However, the above description describes an LTE/LTE-A system for example purposes, and LTE terminology is used in most of the above description, but these techniques are also applicable to applications other than LTE/LTE-A applications.
以上结合附图阐述的详细说明描述了示例而不代表可被实现或者落在权利要求的范围内的仅有示例。术语“示例”和“示例性”在本说明书中使用时意指“用作示例、实例或解说”,并且并不意指“优于”或“胜过其他示例”。本详细描述包括具体细节以提供对所描述的技术的理解。然而,可以在没有这些具体细节的情况下实践这些技术。在一些实例中,众所周知的结构和装置以框图形式示出以避免模糊所描述的示例的概念。The detailed description set forth above in conjunction with the accompanying drawings describes examples and does not represent the only examples that can be implemented or that fall within the scope of the claims. The terms "example" and "exemplary" when used in this specification mean "serving as an example, instance, or illustration," and do not mean "advantageous" or "over other examples." This detailed description includes specific details to provide an understanding of the described technology. However, these techniques may be practiced without these specific details. In some instances, well-known structures and devices are shown in block diagram form in order to avoid obscuring the concepts of the examples being described.
信息和信号可使用各种各样的不同技艺和技术中的任一种来表示。例如,贯穿上面说明始终可能被述及的数据、指令、命令、信息、信号、比特、码元和码片可由电压、电流、电磁波、磁场或磁粒子、光场或光粒子、或其任何组合来表示。Information and signals may be represented using any of a variety of different techniques and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referred to throughout the above description may be composed of voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof. To represent.
结合本文中的公开所描述的各种解说性框以及组件可用设计成执行本文中描述的功能的通用处理器、数字信号处理器(DSP)、ASIC、FPGA或其他可编程逻辑器件、分立的门或晶体管逻辑、分立的硬件组件、或其任何组合来实现或执行。通用处理器可以是微处理器,但在替换方案中,处理器可以是任何常规的处理器、控制器、微控制器、或状态机。处理器还可以被实现为计算设备的组合,例如DSP与微处理器的组合、多个微处理器、与DSP核心协作的一个或多个微处理器、或任何其他此类配置。The various illustrative blocks and components described in connection with the disclosure herein may be implemented with a general purpose processor, digital signal processor (DSP), ASIC, FPGA or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof. A general-purpose processor can be a microprocessor, but in the alternative, the processor can be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors in cooperation with a DSP core, or any other such configuration.
本文中所描述的功能可以在硬件、由处理器执行的软件、固件、或其任何组合中实现。如果在由处理器执行的软件中实现,则各功能可以作为一条或多条指令或代码存储在计算机可读介质上或藉其进行传送。其他示例和实现落在本公开及所附权利要求的范围和精神内。例如,由于软件的本质,以上描述的功能可使用由处理器执行的软件、硬件、固件、硬连线或其任何组合来实现。实现功能的特征也可物理地位于各种位置,包括被分布以使得功能的各部分在不同的物理位置处实现。如本文中(包括权利要求中)所使用的,在两个或更多个项目的列表中使用的术语“和/或”意指所列出的项目中的任一者可单独被采用,或者两个或更多个所列出的项目的任何组合可被采用。例如,如果组成被描述为包含组成部分A、B和/或C,则该组成可包含仅A;仅B;仅C;A和B的组合;A和C的组合;B和C的组合;或者A、B和C的组合。同样,如本文中(包括权利要求中)所使用的,在项目列举中(例如,在接有诸如“中的至少一个”或“中的一者或多者”的短语的项目列举中)使用的“或”指示析取式列举,以使得例如“A、B或C中的至少一个”的列举意指A或B或C或AB或AC或BC或ABC(即,A和B和C)。The functions described herein may be implemented in hardware, software executed by a processor, firmware, or any combination thereof. If implemented in software executed by a processor, the functions may be stored on or transmitted over as one or more instructions or code on a computer-readable medium. Other examples and implementations are within the scope and spirit of the disclosure and appended claims. For example, due to the nature of software, functions described above can be implemented using software executed by a processor, hardware, firmware, hardwiring or any combination thereof. Features implementing functions may also be physically located at various locations, including being distributed such that portions of functions are implemented at different physical locations. As used herein, including in the claims, the term "and/or" used in a list of two or more items means that any of the listed items may be taken individually, or Any combination of two or more of the listed items may be employed. For example, if a composition is described as comprising components A, B, and/or C, the composition may contain only A; only B; only C; combinations of A and B; combinations of A and C; combinations of B and C; Or a combination of A, B and C. Likewise, as used herein, including in the claims, in a listing of items (eg, in a listing of items followed by a phrase such as "at least one of" or "one or more of") uses An "or" indicates a disjunctive enumeration such that a enumeration such as "at least one of A, B, or C" means A or B or C or AB or AC or BC or ABC (ie, A and B and C) .
计算机可读介质包括计算机存储介质和通信介质两者,包括促成计算机程序从一地向另一地转移的任何介质。存储介质可以是能被通用或专用计算机访问的任何可用介质。作为示例而非限定,计算机可读介质可包括RAM、ROM、EEPROM、闪存、CD-ROM或其它光盘存储、磁盘存储或其它磁存储设备、或能被用来携带或存储指令或数据结构形式的合需程序代码手段且能被通用或专用计算机、或者通用或专用处理器访问的任何其它介质。任何连接也被正当地称为计算机可读介质。例如,如果软件是使用同轴电缆、光纤电缆、双绞线、数字订户线(DSL)、或诸如红外、无线电、以及微波之类的无线技术从web网站、服务器、或其他远程源传送而来,则该同轴电缆、光纤电缆、双绞线、DSL、或诸如红外、无线电、以及微波之类的无线技术就被包括在介质的定义之中。如本文中所使用的盘(disk)和碟(disc)包括压缩碟(CD)、激光碟、光碟、数字多用碟(DVD)、软盘、和蓝光碟,其中盘(disk)常常磁性地再现数据,而碟(disc)用激光来光学地再现数据。以上介质的组合也被包括在计算机可读介质的范围内。Computer-readable media includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. Storage media may be any available media that can be accessed by a general purpose or special purpose computer. By way of example and not limitation, a computer-readable medium may include RAM, ROM, EEPROM, flash memory, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage device, or any other Any other medium that requires program code means and that can be accessed by a general purpose or special purpose computer, or general purpose or special purpose processor. Any connection is also properly termed a computer-readable medium. For example, if the software is transmitted from a web site, server, or other remote source using coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave , then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of media. Disk and disc, as used herein, include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disc, and blu-ray disc, where disks usually reproduce data magnetically , while a disc (disc) uses laser light to optically reproduce data. Combinations of the above should also be included within the scope of computer-readable media.
提供对本公开的先前描述是为使得本领域技术人员皆能够制作或使用本公开。对本公开的各种修改对于本领域技术人员将是显而易见的,并且本文中定义的普适原理可被应用于其他变形而不会脱离本公开的范围。由此,本公开并不限定于本文中所描述的示例和设计,而是应被授予与本文中公开的原理和新颖特征一致的最宽泛的范围。The previous description of the present disclosure is provided to enable any person skilled in the art to make or use the present disclosure. Various modifications to the present disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other modifications without departing from the scope of the present disclosure. Thus, the disclosure is not to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (30)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562166496P | 2015-05-26 | 2015-05-26 | |
| US62/166,496 | 2015-05-26 | ||
| US15/014,602 | 2016-02-03 | ||
| US15/014,602 US10361476B2 (en) | 2015-05-26 | 2016-02-03 | Antenna structures for wireless communications |
| PCT/US2016/028776 WO2016190999A1 (en) | 2015-05-26 | 2016-04-22 | Antenna structures for wireless communications |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107660319A true CN107660319A (en) | 2018-02-02 |
| CN107660319B CN107660319B (en) | 2020-01-21 |
Family
ID=55861278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680029706.8A Expired - Fee Related CN107660319B (en) | 2015-05-26 | 2016-04-22 | Wireless communication device and method of manufacturing wireless communication device |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10361476B2 (en) |
| EP (1) | EP3304646B1 (en) |
| JP (1) | JP6755265B2 (en) |
| KR (1) | KR20180011775A (en) |
| CN (1) | CN107660319B (en) |
| WO (1) | WO2016190999A1 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109193119A (en) * | 2018-09-28 | 2019-01-11 | 北京小米移动软件有限公司 | Terminal shell and terminal |
| CN109449568A (en) * | 2018-08-07 | 2019-03-08 | 瑞声科技(新加坡)有限公司 | Millimeter wave array antenna and mobile terminal |
| WO2020077617A1 (en) * | 2018-10-19 | 2020-04-23 | 华为技术有限公司 | Antenna packaging structure and manufacturing method thereof |
| CN111919429A (en) * | 2018-04-11 | 2020-11-10 | 三星电子株式会社 | Electronic device including a cover plate coupled with an antenna module |
| CN112005539A (en) * | 2018-04-03 | 2020-11-27 | 三星电子株式会社 | Communication device and electronic device comprising same |
| CN113644408A (en) * | 2020-05-11 | 2021-11-12 | 南京锐码毫米波太赫兹技术研究院有限公司 | Electronic equipment |
| CN114156641A (en) * | 2020-09-08 | 2022-03-08 | 京东方科技集团股份有限公司 | Antenna and manufacturing method thereof, antenna device and manufacturing method thereof |
| CN114760717A (en) * | 2022-04-19 | 2022-07-15 | 中国电信股份有限公司 | Equipment for suppressing wireless signal interference and communication base station |
| TWI857402B (en) * | 2022-11-21 | 2024-10-01 | 大陸商鵬鼎控股(深圳)股份有限公司 | Circuit board and method for fabricating the same |
Families Citing this family (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016120254A1 (en) * | 2015-01-27 | 2016-08-04 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with integrated antenna structure |
| US9667290B2 (en) | 2015-04-17 | 2017-05-30 | Apple Inc. | Electronic device with millimeter wave antennas |
| US10374315B2 (en) | 2015-10-28 | 2019-08-06 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
| US11367959B2 (en) | 2015-10-28 | 2022-06-21 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
| US10476164B2 (en) | 2015-10-28 | 2019-11-12 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
| WO2017122905A1 (en) * | 2016-01-11 | 2017-07-20 | Samsung Electronics Co., Ltd. | Wireless communication device with leaky-wave phased array antenna |
| EP3449532B1 (en) | 2016-04-28 | 2024-02-28 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with integrated antenna arrangement, electronic apparatus, radio communication method |
| KR102501935B1 (en) | 2016-08-31 | 2023-02-21 | 삼성전자 주식회사 | Antenna device and electronic device comprising the same |
| KR102599996B1 (en) * | 2016-11-11 | 2023-11-09 | 삼성전자 주식회사 | Beamforming antenna assembly including metal structure |
| US11329364B2 (en) * | 2017-03-15 | 2022-05-10 | Sony Mobile Communications Inc. | Communication apparatus |
| CN108736136B (en) * | 2017-04-20 | 2021-08-03 | 惠州硕贝德无线科技股份有限公司 | An antenna and antenna system applied to the metal casing of a mobile terminal |
| US11876295B2 (en) * | 2017-05-02 | 2024-01-16 | Rogers Corporation | Electromagnetic reflector for use in a dielectric resonator antenna system |
| US11283189B2 (en) * | 2017-05-02 | 2022-03-22 | Rogers Corporation | Connected dielectric resonator antenna array and method of making the same |
| KR102312067B1 (en) | 2017-06-07 | 2021-10-13 | 로저스코포레이션 | Dielectric Resonator Antenna System |
| CN109216875B (en) * | 2017-06-30 | 2020-11-13 | 惠州硕贝德无线科技股份有限公司 | A Broadband Antenna with Reflector and Antenna System |
| CN109216918B (en) * | 2017-06-30 | 2021-11-23 | 惠州硕贝德无线科技股份有限公司 | Antenna applied to metal shell and antenna system |
| KR102352592B1 (en) * | 2017-07-13 | 2022-01-19 | 삼성전자주식회사 | Electronic device comprising array antenna |
| CN109698400B (en) * | 2017-10-24 | 2020-12-15 | 惠州硕贝德无线科技股份有限公司 | A broadband 5G antenna integrated in the metal side frame of a mobile phone |
| CN111279548B (en) * | 2017-12-20 | 2021-08-20 | 华为技术有限公司 | Communication device |
| US10910722B2 (en) | 2018-01-15 | 2021-02-02 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
| US11616302B2 (en) | 2018-01-15 | 2023-03-28 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
| US10892544B2 (en) | 2018-01-15 | 2021-01-12 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
| CN110048219B (en) * | 2018-01-17 | 2022-08-16 | 惠州硕贝德无线科技股份有限公司 | Electronic equipment integrated with ultra-wideband 5G antenna |
| WO2019193530A1 (en) * | 2018-04-06 | 2019-10-10 | 3M Innovative Properties Company | Gradient permittivity film |
| US11139588B2 (en) | 2018-04-11 | 2021-10-05 | Apple Inc. | Electronic device antenna arrays mounted against a dielectric layer |
| US11108155B2 (en) * | 2018-07-16 | 2021-08-31 | Apple Inc. | Electronic devices having distributed millimeter wave antennas |
| KR102533667B1 (en) | 2018-08-24 | 2023-05-17 | 삼성전자주식회사 | Antenna assembly comprising antennas formed on inclined side surface of printed circuit board and electronic device comprising the same |
| CN111200191B (en) * | 2018-11-16 | 2022-02-18 | 荷兰移动驱动器公司 | Antenna structure and wireless communication device with same |
| KR102572820B1 (en) | 2018-11-19 | 2023-08-30 | 삼성전자 주식회사 | Antenna using horn structure and electronic device including the same |
| US11031697B2 (en) | 2018-11-29 | 2021-06-08 | Rogers Corporation | Electromagnetic device |
| CN113169455A (en) | 2018-12-04 | 2021-07-23 | 罗杰斯公司 | Dielectric electromagnetic structure and method of manufacturing the same |
| EP3670137B1 (en) * | 2018-12-21 | 2022-07-13 | Nokia Solutions and Networks Oy | An enclosure for an antenna arrangement, and a method of manufacturing an enclosure for an antenna arrangement |
| CN109728413B (en) * | 2018-12-27 | 2021-01-22 | 维沃移动通信有限公司 | Antenna structure and terminal |
| CN109728447B (en) | 2018-12-28 | 2023-01-13 | 维沃移动通信有限公司 | Antenna structure and high-frequency multi-band wireless communication terminal |
| CN109728405B (en) * | 2018-12-28 | 2022-03-01 | 维沃移动通信有限公司 | Antenna structure and high frequency wireless communication terminal |
| US10826196B1 (en) * | 2019-04-11 | 2020-11-03 | The Boeing Company | Dielectric lens antenna |
| CN116828092A (en) * | 2019-05-14 | 2023-09-29 | 三星电子株式会社 | Electronic devices and portable communication devices |
| US11128059B2 (en) * | 2019-06-17 | 2021-09-21 | The Boeing Company | Antenna assembly having one or more cavities |
| US11320517B2 (en) * | 2019-08-22 | 2022-05-03 | Qualcomm Incorporated | Wireless communication with enhanced maximum permissible exposure (MPE) compliance |
| US12158541B2 (en) | 2019-08-22 | 2024-12-03 | Qualcomm Incorporated | Wireless communication with enhanced maximum permissible exposure (MPE) compliance based on vital signs detection |
| US10749248B1 (en) * | 2019-09-23 | 2020-08-18 | Qualcomm Incorporated | Antenna module placement and housing for reduced power density exposure |
| KR102568702B1 (en) * | 2019-10-15 | 2023-08-21 | 삼성전자주식회사 | Antenna sturcture and electronic device including the same |
| KR102678592B1 (en) * | 2019-11-26 | 2024-06-27 | 엘지전자 주식회사 | Antenna system mounted on vehicle |
| CN113113764B (en) * | 2020-01-13 | 2023-07-25 | 北京小米移动软件有限公司 | Antenna and mobile terminal |
| US12218403B2 (en) * | 2020-02-26 | 2025-02-04 | Kyocera Corporation | Antenna |
| US11482790B2 (en) | 2020-04-08 | 2022-10-25 | Rogers Corporation | Dielectric lens and electromagnetic device with same |
| CN113675592B (en) * | 2020-05-13 | 2023-08-04 | 北京小米移动软件有限公司 | Antenna module and terminal equipment |
| KR102901992B1 (en) | 2021-01-07 | 2025-12-18 | 삼성전자주식회사 | Antenna structure including conductive layer and electronic device including same |
| EP4258472A4 (en) * | 2021-02-18 | 2024-05-22 | Samsung Electronics Co., Ltd. | ANTENNA AND ELECTRONIC DEVICE INCLUDING SAME |
| DE102021210122A1 (en) * | 2021-09-14 | 2023-03-16 | Robert Bosch Gesellschaft mit beschränkter Haftung | Waveguide assembly with foam |
| JP7655395B2 (en) * | 2021-09-28 | 2025-04-02 | 株式会社村田製作所 | Antenna device and communication device |
| WO2023101233A1 (en) * | 2021-11-30 | 2023-06-08 | 삼성전자 주식회사 | Electronic device including antenna |
| EP4418456A4 (en) * | 2021-11-30 | 2025-03-05 | Samsung Electronics Co., Ltd. | Electronic device including antenna |
| US12191558B2 (en) | 2021-11-30 | 2025-01-07 | Samsung Electronics Co., Ltd. | Electronic device including antenna |
| US20250219669A1 (en) * | 2023-12-29 | 2025-07-03 | Google Llc | Computing Device Having Sensor with Integrated Antenna |
| WO2026071833A1 (en) * | 2024-09-30 | 2026-04-02 | 삼성전자 주식회사 | Electronic device comprising antenna |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090251357A1 (en) * | 2008-04-04 | 2009-10-08 | Toyota Motor Engineering & Manufacturing North America, Inc. | Dual-band antenna array and rf front-end for mm-wave imager and radar |
| US20100321253A1 (en) * | 2009-06-17 | 2010-12-23 | Enrique Ayala Vazquez | Dielectric window antennas for electronic devices |
| US20120157175A1 (en) * | 2010-12-20 | 2012-06-21 | Golko Albert J | Peripheral Electronic Device Housing Members with Gaps and Dielectric Coatings |
Family Cites Families (76)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4761654A (en) * | 1985-06-25 | 1988-08-02 | Communications Satellite Corporation | Electromagnetically coupled microstrip antennas having feeding patches capacitively coupled to feedlines |
| FR2596585B1 (en) * | 1986-03-26 | 1988-09-16 | Alcatel Thomson Faisceaux | NETWORK ANTENNA ON PRINTED CIRCUIT |
| US5086304A (en) * | 1986-08-13 | 1992-02-04 | Integrated Visual, Inc. | Flat phased array antenna |
| JPH02214303A (en) * | 1989-02-15 | 1990-08-27 | Sharp Corp | Planar array antenna |
| US5426442A (en) * | 1993-03-01 | 1995-06-20 | Aerojet-General Corporation | Corrugated feed horn array structure |
| JP3316914B2 (en) * | 1993-03-12 | 2002-08-19 | 株式会社村田製作所 | Leaky NRD guide and planar antenna using leaky NRD guide |
| US5583524A (en) * | 1993-08-10 | 1996-12-10 | Hughes Aircraft Company | Continuous transverse stub element antenna arrays using voltage-variable dielectric material |
| JPH10224141A (en) * | 1997-02-10 | 1998-08-21 | Toshiba Corp | Monolithic antenna |
| US6081239A (en) * | 1998-10-23 | 2000-06-27 | Gradient Technologies, Llc | Planar antenna including a superstrate lens having an effective dielectric constant |
| EP1148583A1 (en) * | 2000-04-18 | 2001-10-24 | Era Patents Limited | Planar array antenna |
| KR20020061103A (en) | 2001-01-12 | 2002-07-22 | 후루까와덴끼고오교 가부시끼가이샤 | Antenna device and terminal with the antenna device |
| US6624787B2 (en) * | 2001-10-01 | 2003-09-23 | Raytheon Company | Slot coupled, polarized, egg-crate radiator |
| US6670930B2 (en) * | 2001-12-05 | 2003-12-30 | The Boeing Company | Antenna-integrated printed wiring board assembly for a phased array antenna system |
| JP3851842B2 (en) * | 2002-05-10 | 2006-11-29 | ミツミ電機株式会社 | Array antenna |
| DE10322803A1 (en) * | 2003-05-19 | 2004-12-23 | Otto-Von-Guericke-Universität Magdeburg | Microstrip- or patch antenna for modern high capacity communication systems, comprises radiator with resonant cavity at rear and miniature horn surrounding it |
| WO2005022689A1 (en) * | 2003-08-27 | 2005-03-10 | Matsushita Electric Industrial Co., Ltd. | Antenna and method for making the same |
| US7903040B2 (en) * | 2004-02-10 | 2011-03-08 | Telefonaktiebolaget L M Ericsson (Publ) | Tunable arrangements |
| EP2015396A3 (en) * | 2004-02-11 | 2009-07-29 | Sony Deutschland GmbH | Circular polarised array antenna |
| JP2005252474A (en) * | 2004-03-02 | 2005-09-15 | Hitachi Chem Co Ltd | Triplate planar array antenna |
| JP4541922B2 (en) * | 2005-02-21 | 2010-09-08 | 三菱電機株式会社 | Antenna device |
| US7283085B2 (en) * | 2005-03-24 | 2007-10-16 | Agilent Technologies, Inc. | System and method for efficient, high-resolution microwave imaging using complementary transmit and receive beam patterns |
| JP4822262B2 (en) * | 2006-01-23 | 2011-11-24 | 沖電気工業株式会社 | Circular waveguide antenna and circular waveguide array antenna |
| US7728772B2 (en) * | 2006-06-09 | 2010-06-01 | The Regents Of The University Of Michigan | Phased array systems and phased array front-end devices |
| US8279131B2 (en) * | 2006-09-21 | 2012-10-02 | Raytheon Company | Panel array |
| US7525498B2 (en) * | 2006-10-11 | 2009-04-28 | Raytheon Company | Antenna array |
| US8138977B2 (en) | 2007-08-07 | 2012-03-20 | Apple Inc. | Antennas for handheld electronic devices |
| EP2229599B1 (en) * | 2007-12-06 | 2017-10-11 | Telefonaktiebolaget LM Ericsson (publ) | A combined display and antenna arrangement |
| US8188932B2 (en) * | 2007-12-12 | 2012-05-29 | The Boeing Company | Phased array antenna with lattice transformation |
| WO2009124322A2 (en) | 2008-04-05 | 2009-10-08 | Henry Cooper | Device and method for modular antenna formation and configuration |
| US8467737B2 (en) * | 2008-12-31 | 2013-06-18 | Intel Corporation | Integrated array transmit/receive module |
| US8274445B2 (en) * | 2009-06-08 | 2012-09-25 | Lockheed Martin Corporation | Planar array antenna having radome over protruding antenna elements |
| US8780012B2 (en) * | 2009-06-30 | 2014-07-15 | California Institute Of Technology | Dielectric covered planar antennas |
| US8896487B2 (en) * | 2009-07-09 | 2014-11-25 | Apple Inc. | Cavity antennas for electronic devices |
| JP4988002B2 (en) * | 2010-03-25 | 2012-08-01 | シャープ株式会社 | Wireless communication device |
| US8988299B2 (en) * | 2011-02-17 | 2015-03-24 | International Business Machines Corporation | Integrated antenna for RFIC package applications |
| DE102011005145A1 (en) * | 2011-03-04 | 2012-09-06 | Rohde & Schwarz Gmbh & Co. Kg | Circuit board assembly for millimeter wave scanner |
| US9742077B2 (en) * | 2011-03-15 | 2017-08-22 | Intel Corporation | Mm-wave phased array antenna with beam tilting radiation pattern |
| US8638263B2 (en) * | 2011-03-31 | 2014-01-28 | Broadcom Corporation | Platform enhancements for planar array antennas |
| US8901688B2 (en) * | 2011-05-05 | 2014-12-02 | Intel Corporation | High performance glass-based 60 ghz / mm-wave phased array antennas and methods of making same |
| US8842046B2 (en) | 2011-07-22 | 2014-09-23 | Texas Instruments Incorporated | Loop antenna |
| ES2635130T3 (en) * | 2011-12-02 | 2017-10-02 | Huawei Technologies Co. Ltd. | Transceiver arrangement |
| US20130278468A1 (en) * | 2012-04-20 | 2013-10-24 | Wilocity | Arrangement of millimeter-wave antennas in electronic devices having a radiation energy blocking casing |
| KR101870760B1 (en) * | 2012-11-08 | 2018-06-25 | 삼성전자주식회사 | Multi band antenna apparatus and electronic apparatus having the same |
| US9537208B2 (en) * | 2012-11-12 | 2017-01-03 | Raytheon Company | Dual polarization current loop radiator with integrated balun |
| EP2947717A4 (en) * | 2013-01-21 | 2016-09-28 | Nec Corp | ANTENNA |
| JP5936719B2 (en) * | 2013-02-07 | 2016-06-22 | 三菱電機株式会社 | Antenna device and array antenna device |
| JP6234032B2 (en) * | 2013-02-08 | 2017-11-22 | シャープ株式会社 | Housing and wireless communication device |
| US9300036B2 (en) * | 2013-06-07 | 2016-03-29 | Apple Inc. | Radio-frequency transparent window |
| CN203482547U (en) | 2013-06-26 | 2014-03-12 | 惠州比亚迪实业有限公司 | Electronic-product metal housing and mobile phone |
| WO2015023299A1 (en) * | 2013-08-16 | 2015-02-19 | Intel Corporation | Millimeter wave antenna structures with air-gap layer or cavity |
| US9853359B2 (en) * | 2013-09-26 | 2017-12-26 | Intel Corporation | Antenna integrated in a package substrate |
| TWI552430B (en) * | 2013-09-26 | 2016-10-01 | 財團法人工業技術研究院 | Connector, antenna and electronic device |
| US9531087B2 (en) * | 2013-10-31 | 2016-12-27 | Sony Corporation | MM wave antenna array integrated with cellular antenna |
| US9773742B2 (en) * | 2013-12-18 | 2017-09-26 | Intel Corporation | Embedded millimeter-wave phased array module |
| US9887456B2 (en) * | 2014-02-19 | 2018-02-06 | Kymeta Corporation | Dynamic polarization and coupling control from a steerable cylindrically fed holographic antenna |
| US9692126B2 (en) * | 2014-05-30 | 2017-06-27 | King Fahd University Of Petroleum And Minerals | Millimeter (mm) wave switched beam antenna system |
| US9620464B2 (en) * | 2014-08-13 | 2017-04-11 | International Business Machines Corporation | Wireless communications package with integrated antennas and air cavity |
| US10665947B2 (en) * | 2014-10-15 | 2020-05-26 | Rogers Corporation | Array apparatus comprising a dielectric resonator array disposed on a ground layer and individually fed by corresponding signal feeds, thereby providing a corresponding magnetic dipole vector |
| CN204465618U (en) | 2015-01-30 | 2015-07-08 | 深圳市梦之坊通信产品有限公司 | The mobile phone metal shell of NFC function can be used |
| US9667290B2 (en) * | 2015-04-17 | 2017-05-30 | Apple Inc. | Electronic device with millimeter wave antennas |
| US9673916B2 (en) * | 2015-04-17 | 2017-06-06 | Apple Inc. | Electronic device with over-the-air wireless self-testing capabilities |
| KR102414328B1 (en) * | 2015-09-09 | 2022-06-29 | 삼성전자주식회사 | Antenna device and electronic device including the same |
| WO2017047396A1 (en) * | 2015-09-17 | 2017-03-23 | 株式会社村田製作所 | Antenna-integrated communication module and method for manufacturing same |
| WO2017122905A1 (en) * | 2016-01-11 | 2017-07-20 | Samsung Electronics Co., Ltd. | Wireless communication device with leaky-wave phased array antenna |
| US10116064B2 (en) * | 2016-02-16 | 2018-10-30 | National Chung Shan Institute Of Science And Technology | Millimeter-wave antenna device and millimeter-wave antenna array device thereof |
| US10516201B2 (en) * | 2016-04-11 | 2019-12-24 | Samsung Electronics Co., Ltd. | Wireless communication system including polarization-agile phased-array antenna |
| CN205595462U (en) * | 2016-04-12 | 2016-09-21 | 中国电子科技集团公司第五十四研究所 | Loudspeaker array antenna |
| US10103424B2 (en) * | 2016-04-26 | 2018-10-16 | Apple Inc. | Electronic device with millimeter wave yagi antennas |
| US9972892B2 (en) * | 2016-04-26 | 2018-05-15 | Apple Inc. | Electronic device with millimeter wave antennas on stacked printed circuits |
| US10418687B2 (en) * | 2016-07-22 | 2019-09-17 | Apple Inc. | Electronic device with millimeter wave antennas on printed circuits |
| US10249937B2 (en) * | 2016-09-06 | 2019-04-02 | Apple Inc. | Electronic device antenna with suppressed parasitic resonance |
| US20180090815A1 (en) * | 2016-09-28 | 2018-03-29 | Movandi Corporation | Phased Array Antenna Panel Having Quad Split Cavities Dedicated to Vertical-Polarization and Horizontal-Polarization Antenna Probes |
| AU2016426597B2 (en) * | 2016-10-18 | 2019-03-28 | Telefonaktiebolaget Lm Ericsson (Publ) | Conducted OTA test fixture |
| US10594019B2 (en) * | 2016-12-03 | 2020-03-17 | International Business Machines Corporation | Wireless communications package with integrated antenna array |
| US10541464B2 (en) * | 2017-01-17 | 2020-01-21 | Sony Corporation | Microwave antenna coupling apparatus, microwave antenna apparatus and microwave antenna package |
| US10396432B2 (en) * | 2017-01-23 | 2019-08-27 | Samsung Electro-Mechanics Co., Ltd. | Antenna-integrated radio frequency module |
-
2016
- 2016-02-03 US US15/014,602 patent/US10361476B2/en active Active
- 2016-04-22 JP JP2017560711A patent/JP6755265B2/en active Active
- 2016-04-22 KR KR1020177033855A patent/KR20180011775A/en not_active Withdrawn
- 2016-04-22 CN CN201680029706.8A patent/CN107660319B/en not_active Expired - Fee Related
- 2016-04-22 WO PCT/US2016/028776 patent/WO2016190999A1/en not_active Ceased
- 2016-04-22 EP EP16719714.4A patent/EP3304646B1/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090251357A1 (en) * | 2008-04-04 | 2009-10-08 | Toyota Motor Engineering & Manufacturing North America, Inc. | Dual-band antenna array and rf front-end for mm-wave imager and radar |
| US20100321253A1 (en) * | 2009-06-17 | 2010-12-23 | Enrique Ayala Vazquez | Dielectric window antennas for electronic devices |
| US20120157175A1 (en) * | 2010-12-20 | 2012-06-21 | Golko Albert J | Peripheral Electronic Device Housing Members with Gaps and Dielectric Coatings |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112005539B (en) * | 2018-04-03 | 2023-04-21 | 三星电子株式会社 | Communication device and electronic device comprising same |
| CN112005539A (en) * | 2018-04-03 | 2020-11-27 | 三星电子株式会社 | Communication device and electronic device comprising same |
| CN111919429A (en) * | 2018-04-11 | 2020-11-10 | 三星电子株式会社 | Electronic device including a cover plate coupled with an antenna module |
| CN109449568A (en) * | 2018-08-07 | 2019-03-08 | 瑞声科技(新加坡)有限公司 | Millimeter wave array antenna and mobile terminal |
| CN109449568B (en) * | 2018-08-07 | 2020-09-18 | 瑞声科技(新加坡)有限公司 | Millimeter wave array antenna and mobile terminal |
| US11158931B2 (en) | 2018-09-28 | 2021-10-26 | Beijing Xiaomi Mobile Software Co., Ltd. | Terminal housing and terminal |
| CN109193119A (en) * | 2018-09-28 | 2019-01-11 | 北京小米移动软件有限公司 | Terminal shell and terminal |
| CN112074989B (en) * | 2018-10-19 | 2021-10-26 | 华为技术有限公司 | Antenna packaging structure and manufacturing method thereof |
| CN112074989A (en) * | 2018-10-19 | 2020-12-11 | 华为技术有限公司 | Antenna packaging structure and manufacturing method thereof |
| WO2020077617A1 (en) * | 2018-10-19 | 2020-04-23 | 华为技术有限公司 | Antenna packaging structure and manufacturing method thereof |
| US11637381B2 (en) | 2018-10-19 | 2023-04-25 | Huawei Technologies Co., Ltd. | Antenna in package structure and manufacturing method therefor |
| CN113644408A (en) * | 2020-05-11 | 2021-11-12 | 南京锐码毫米波太赫兹技术研究院有限公司 | Electronic equipment |
| WO2021227681A1 (en) * | 2020-05-11 | 2021-11-18 | 南京锐码毫米波太赫兹技术研究院有限公司 | Electronic device |
| CN113644408B (en) * | 2020-05-11 | 2023-03-31 | 南京锐码毫米波太赫兹技术研究院有限公司 | Electronic device |
| CN114156641A (en) * | 2020-09-08 | 2022-03-08 | 京东方科技集团股份有限公司 | Antenna and manufacturing method thereof, antenna device and manufacturing method thereof |
| CN114156641B (en) * | 2020-09-08 | 2024-04-19 | 京东方科技集团股份有限公司 | Antenna and manufacturing method thereof, antenna device and manufacturing method thereof |
| CN114760717A (en) * | 2022-04-19 | 2022-07-15 | 中国电信股份有限公司 | Equipment for suppressing wireless signal interference and communication base station |
| TWI857402B (en) * | 2022-11-21 | 2024-10-01 | 大陸商鵬鼎控股(深圳)股份有限公司 | Circuit board and method for fabricating the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6755265B2 (en) | 2020-09-16 |
| KR20180011775A (en) | 2018-02-02 |
| WO2016190999A1 (en) | 2016-12-01 |
| US10361476B2 (en) | 2019-07-23 |
| JP2018523351A (en) | 2018-08-16 |
| US20160351996A1 (en) | 2016-12-01 |
| CN107660319B (en) | 2020-01-21 |
| EP3304646B1 (en) | 2025-11-12 |
| EP3304646A1 (en) | 2018-04-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107660319B (en) | Wireless communication device and method of manufacturing wireless communication device | |
| JP6379303B2 (en) | Antenna structure and configuration for millimeter wavelength wireless communication | |
| KR102566076B1 (en) | Resource partitioning between wireless backhaul and access communications in millimeter wave networks | |
| CN110521262B (en) | Method and apparatus for reference signal resource positioning in wireless communications | |
| CN110731111A (en) | Demodulation reference signal and channel state information reference signal resource indication system | |
| US11974266B2 (en) | Multiplexing synchronization signal blocks and data/control for wireless devices with digital beamforming capabilities | |
| US12309707B2 (en) | Early uplink transmit power control | |
| US12513604B2 (en) | Enhancement to system information block (SIB) validity check for non-public networks (NPNs) | |
| US11177553B2 (en) | Interface connector for supporting millimeter wave wireless communications | |
| JP2017538336A (en) | Antenna tuner control for WAN / WLAN antenna sharing | |
| CN116235418B (en) | Indication of digital beamforming capabilities of wireless devices | |
| US11733744B2 (en) | Display-side antenna | |
| US20230131254A1 (en) | Managing Beam Selection For A Multi-Subscription Wireless Device | |
| US20220167159A1 (en) | Systems and methods for authenticating a wireless device | |
| US11589327B2 (en) | Managing uplink timing advance configuration | |
| WO2022103548A1 (en) | Millimeter wave exposure control during voice calls |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200121 |