CN110098346A - The encapsulating structure and its packaging method of display panel - Google Patents
The encapsulating structure and its packaging method of display panel Download PDFInfo
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- CN110098346A CN110098346A CN201910345816.0A CN201910345816A CN110098346A CN 110098346 A CN110098346 A CN 110098346A CN 201910345816 A CN201910345816 A CN 201910345816A CN 110098346 A CN110098346 A CN 110098346A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000000945 filler Substances 0.000 claims abstract description 47
- 238000010521 absorption reaction Methods 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 229920000642 polymer Polymers 0.000 claims abstract description 15
- 229920002678 cellulose Polymers 0.000 claims abstract description 11
- 239000001913 cellulose Substances 0.000 claims abstract description 11
- 238000002156 mixing Methods 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 163
- 230000000903 blocking effect Effects 0.000 claims description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- 239000010409 thin film Substances 0.000 claims description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000002274 desiccant Substances 0.000 claims description 3
- 239000003230 hygroscopic agent Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims 1
- 239000003292 glue Substances 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 abstract description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002121 nanofiber Substances 0.000 description 2
- 230000027756 respiratory electron transport chain Effects 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a kind of encapsulating structure of display panel and its packaging method, the encapsulating structure of display panel includes substrate, has viewing area and the non-display area around viewing area；Frame glue-line is set to the non-display area and surrounds the viewing area；Filler is filled in the interval range that the frame glue-line is surrounded and forms filled layer；Including the transparent polymer of gumminess and cellulose nano-fibrous in the filler；Cover plate lid is connected on the filled layer and the frame glue-line.Display panel package structure of the invention; pass through the filler of blending epoxy and cellulose nano-fibrous preparation; there is stronger intensity compared to traditional filler; weaker mobility and better stability; the filled layer that display panel packaging method through the invention is formed; it will not react with moisture absorption layer, display panel can be realized and be effectively protected.
Description
Technical field
The present invention relates to field of display technology, the encapsulating structure and its packaging method of specially a kind of display panel.
Background technique
Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display is spontaneous due to having
Light, it is excellent not need that backlight, contrast are high, colour gamut is wide, thickness is thin, visual angle is wide, reaction speed is fast and can be used for bending panel etc.
Point, it is considered to be next-generation plane shows new technique.
But in OLED display, the service life of display panel is easy to be influenced by steam, and therefore, it is necessary to display panel
Effectively encapsulated.Currently, each packaging method has its benefit and limitation.Such as it is suitable by frame adhesive, filler etc.
The encapsulation of display panel for emission structure at top, the introducing of filler can effectively less Newton's ring phenomenon, but it is existing
Filler still suffer from certain mobility after hardening, therefore be easy to be in contact with other glue-lines, and existing filler
Alcohols material can be produced after same moisture absorption layer contacts for a long time panel is caused to deteriorate.Therefore, it is necessary to existing packaging method
It improves, so that its encapsulation for being more applicable for OLED display panel.
Summary of the invention
To solve above-mentioned technical problem: the present invention provides the encapsulating structure and its packaging method of a kind of display panel, changes
The ingredient of filler provides new filler, and solidification filler and packaging plastic etc. flows after packaging to avoid filler, with
Other glue-lines such as moisture absorption layer reacts, and influences packaging effect.
The technical solution to solve the above problems is: the present invention provides a kind of encapsulating structure of display panel, including substrate, tool
There are viewing area and the non-display area around viewing area；Frame glue-line is set to the non-display area and surrounds the viewing area；Filling
Agent is filled in the interval range that the frame glue-line is surrounded and forms filled layer；Including gumminess in the filler
Transparent polymer and cellulose nano-fibrous；Cover board, lid are connected on the filled layer and the frame glue-line.
In an embodiment of the present invention, in the filler, the quality of the transparent polymer of the gumminess is accounted for entirely
The 80-90% of filler；The cellulose nano-fibrous quality accounts for the 3%-10% of entire filler；In the filler also
Including desiccant, quality accounts for the 3%-10% of entire filler.
In an embodiment of the present invention, the transparent polymer of the gumminess includes acrylic resin, in epoxy resin
It is at least one.
In an embodiment of the present invention, the substrate includes thin-film transistor structure layer；And OLED device, it is set to described
On thin-film transistor structure layer and it is located at the viewing area；Water blocking layer is completely covered by the OLED device；The filled layer
It is completely covered by the water blocking layer.
In an embodiment of the present invention, the encapsulating structure of the display panel further includes moisture absorption layer, in the frame adhesive
In the interval range that layer is surrounded, the moisture absorption layer is set to the non-display area and surrounds the viewing area；The filler is filled out
It fills in the interval range that the moisture absorption layer is surrounded.
In an embodiment of the present invention, the water blocking layer includes in silicon oxide layer, silicon nitride layer or silicon oxynitride layer
It is at least one layer of.
The present invention also provides a kind of packaging methods of display panel, comprising the following steps: provides a substrate and a lid
Plate；The substrate has viewing area and the non-display area around viewing area；Frame adhesive is coated on to the four of the one side of the cover board
Week, and frame glue-line corresponding with the non-display area is formed in the surrounding of the one side of the cover board；It is enclosed in the frame glue-line
At interval range in, print gumminess transparent polymer and simultaneously spray fiber element nanofiber formed filler；Vacuum
Cover board and the substrate of the fitting with the filler, wherein the frame adhesive layer is located at the non-display area, by pressing
The filler forms uniformly mixed filled layer afterwards；Solidify the frame glue-line, filled layer.
It in an embodiment of the present invention, further include in the frame before the transparent polymer step of printing gumminess
In the interval range that glue-line surrounds, hygroscopic agent is coated on to the surrounding of the one side of the cover board, and in the one side of the cover board
Surrounding forms moisture absorption layer corresponding with the non-display area, in the transparent polymer step of printing gumminess, the filler
In the interval range that the moisture absorption layer surrounds.
It in an embodiment of the present invention, include production thin-film transistor structure layer in a step of substrate is provided；Production
OLED device is on the thin-film transistor structure layer；Water blocking layer is formed on thin-film transistor structure layer and the water blocking layer is complete
All standing is in the OLED device.
It in an embodiment of the present invention, include being irradiated by ultraviolet light in the solidification frame glue-line, filled layer step
Or the heating frame glue-line, the moisture absorption layer and the mixing glue-line, then cool and solidify the frame glue-line, the moisture absorption
Layer and the mixing glue-line.
The invention has the advantages that display panel package structure of the invention, passes through blending epoxy and cellulose nanometer
The filler of fiber preparation, cellulose nano-fibrous intensity with higher, preferable hydrophobicity, and can be carried out with epoxy resin
Preferable crosslinking；There is stronger intensity, weaker mobility and better stability compared to traditional filler, by this hair
The filled layer that bright display panel packaging method is formed, will not react with moisture absorption layer, can realize to display panel effective
Ground protection.
Detailed description of the invention
The present invention is further explained with reference to the accompanying drawings and examples.
Fig. 1 is the top view of the substrate of the embodiment of the present invention, major embodiment viewing area and non-display area and OLDE device
Distributed areas.
Fig. 2 is the top view that the formation of the embodiment of the present invention has the substrate of water blocking layer, the distributed areas of major embodiment water blocking layer.
Fig. 3 be the embodiment of the present invention formation have frame glue-line, moisture absorption layer cover board bottom view, major embodiment frame adhesive
The distributed areas of layer, moisture absorption layer.
Fig. 4 is the bottom view that the formation of the embodiment of the present invention has the cover board of filled layer, the distributed areas of major embodiment filled layer.
Fig. 5 is the schematic diagram of display panel package structure of the invention.
Appended drawing reference:
1 encapsulating structure；
101 viewing areas；102 non-display areas；
11 substrates；12 cover boards；
13 water blocking layers；14 frame glue-lines；
15 filled layers；16 moisture absorption layers；
111 thin-film transistor structure layers；112 OLED device.
Specific embodiment
The explanation of following embodiment is to can be used to the particular implementation of implementation to illustrate the present invention with reference to additional schema
Example.Direction term that the present invention is previously mentioned, such as "upper", "lower", "front", "rear", "left", "right", "top", "bottom" etc. are only
With reference to the direction of annexed drawings.Therefore, the direction term used is to illustrate and understand the present invention, rather than to limit this hair
It is bright.
As shown in figure 5, in one embodiment, the encapsulating structure 1 of display panel of the invention, including substrate 11, cover board 12,
Water blocking layer 13, frame glue-line 14, filled layer 15 and moisture absorption layer 16.Wherein the substrate 11 includes thin-film transistor structure layer
111 and OLED device 112, the OLED device 112 is set on the thin-film transistor structure layer 111.
Shown in Figure 1, the substrate 11 has viewing area 101 and the non-display area 102 around viewing area 101.
Please referring also to shown in Fig. 2, Fig. 5, the OLED device 112 is located at the viewing area 101.It is described thin due to constituting
The layer structure of film transistor structure sheaf 111 is not this case invention emphasis, so its layer of structure of non-specific manifestation in figure.Herein, only
The structure for constituting the thin-film transistor structure layer 111 is briefly described.Such as: in viewing area 101, the thin film transistor (TFT)
The specific structure of structure sheaf 111 generally comprises active layer, gate insulating layer, grid, interlevel dielectric layer, source electrode and drain electrode, connects
Contact hole.Wherein, the active layer is set on the buffer layer, and the active layer has source area and drain region；The grid is exhausted
Edge layer is overlying on the active layer and the buffer layer；The grid is set on the gate insulating layer；The interlayer electricity is situated between
Matter layer is overlying on the grid and the gate insulating layer；The contact hole is through to described active from the interlevel dielectric layer
On layer, and wherein a contact hole corresponds to source area, wherein another contact hole corresponds to the drain region；The source
Pole and drain electrode are set on the interlevel dielectric layer, and the source electrode is connected to the source area, institute from the corresponding contact hole
It states drain electrode and is connected to the drain region from the corresponding contact hole；In certain the present embodiment, substrate 11 may also include flatness layer.
The flatness layer is overlying on the source electrode, the drain electrode and the interlevel dielectric layer.The pixel defining layer is set to described
On flatness layer.There is fluting in the pixel defining layer.
The OLED device 112 is provided on the thin-film transistor structure layer 111 of the viewing area 101.Have again
It says to body, the OLED device 112 is set on the flatness layer of the substrate 11 and is located in the fluting.The OLED device
The specific structure of part 112 successively includes first electrode, hole transmission layer, luminescent layer, electron transfer layer and second electrode.This reality
It applies in example, the first electrode is anode, is arranged on flatness layer and connects with drain electrode.The hole transmission layer, the hair
Photosphere, the electron transfer layer and the second electrode are set gradually on the first electrode.The second electrode is yin
Pole.
Shown in Figure 2, the water blocking layer 13 is completely covered by the OLED device 112, to obstruct steam.This reality
It applies in example, the water blocking layer 13 includes at least one layer in silicon oxide layer, silicon nitride layer or silicon oxynitride layer.It is specific again
It says, in the present embodiment, one layer of silicon oxide layer or one layer of silicon nitride layer or one layer of nitrogen oxidation is can be set in the water blocking layer 13
Silicon layer.Also two layers or two layers or more of laminated construction, such as one layer of silicon oxide layer and one layer of silicon nitride layer can be set.It can also
Multilayer is arranged, such as one layer of silicon oxide layer, one layer of silicon nitride layer and one layer of silicon oxide layer, etc..
Shown in Figure 3, the frame glue-line 14 is set to the non-display area 102 and surrounds the viewing area 101；Institute
It states in the interval range that frame glue-line 14 is surrounded, the moisture absorption layer 16 is set to the non-display area 102 and surrounds the display
Area 101.
Shown in Figure 4, the filled layer 15 is completely covered by the water blocking layer 13.In the present embodiment, filler is filled out
Fill in the interval range that the moisture absorption layer 16 is surrounded and formed filled layer 15.It is transparent including gumminess in the filler
Polymer and cellulose nano-fibrous；In the filler, the quality of the transparent polymer of the gumminess accounts for entire filling
The 80-90% of agent；The cellulose nano-fibrous quality accounts for the 3%-10% of entire filler；Further include in the filler
Desiccant, quality account for the 3%-10% of entire filler.The cellulose nano-fibrous quality accounting cannot be excessively high, excessively high
It is then easy to influence the translucency of display panel, further influences the display effect of display panel.The transparent polymeric of the gumminess
Object includes at least one of acrylic resin, epoxy resin.
The cover board 12 covers on the filled layer 15 and the frame glue-line 14.In the present embodiment, the frame glue-line
14, the moisture absorption layer 16 and the filled layer 15 are arranged on cover board 12, pass through the cover board 12 and the substrate later
11 are bonded.Below by display panel packaging method come the present invention will be described in more detail.
The packaging method of display panel of the invention, includes the following steps.
Referring to shown in Fig. 1, Fig. 3, providing a substrate 11 and a cover board 12；The substrate 11 has viewing area 101 and encloses
Non-display area 102 around viewing area 101.
Referring to shown in Fig. 1 to Fig. 2, in 11 step of substrate is provided, thin-film transistor structure layer 111 is made first,
The specific structure of the thin-film transistor structure layer 111 has hereinbefore illustrated, and does not just repeat one by one herein；It makes again
OLED device 112 is on the thin-film transistor structure layer 111.
It is shown in Figure 2, water blocking layer 13 is formed on the thin-film transistor structure layer 111 and the water blocking layer 13 is complete
It is covered in the OLED device 112.In the present embodiment, one layer of silicon oxide layer or one layer of nitridation is can be set in the water blocking layer 13
Silicon layer or one layer of silicon oxynitride layer, also can be set two layers or two layers or more of laminated construction.Specifically forming water blocking layer 13
When, material water-proof material is deposited on in the present embodiment the surface of the OLED device 112 using sedimentation.
It is shown in Figure 3, frame adhesive is coated on the cover board 12, and the cover board 12 formed one circle with it is described non-
The corresponding frame glue-line 14 in viewing area 102.
It is shown in Figure 3, in the interval range that the frame glue-line 14 surrounds, hygroscopic agent is coated on the cover board 12
On, and circle moisture absorption layer 16 corresponding with the non-display area 102 is formed on the cover board 12.
It is shown in Figure 4, in the interval range that the moisture absorption layer 16 surrounds, print the transparent polymer of gumminess and same
When spray fiber element nanofiber formed filler
It is shown in Figure 5, the vacuum abutted cover board 12 with the filler and the substrate 11, wherein the frame adhesive
Layer 14 is located at the non-display area 102, and the filler forms uniformly mixed filled layer 15 after pressing.
Solidify the frame glue-line 14, filled layer 15.It include logical in the solidification frame glue-line 14,15 step of filled layer
It crosses ultraviolet light irradiation or heats the frame glue-line 14, the moisture absorption layer 16 and the mixing glue-line, then cool and solidify described
Frame glue-line 14, the moisture absorption layer 16 and the mixing glue-line.
The above is merely preferred embodiments of the present invention, be not intended to limit the invention, it is all in spirit of the invention and
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within principle.
Claims (10)
1. a kind of encapsulating structure of display panel, which is characterized in that including
Substrate has viewing area and the non-display area around viewing area；
Frame glue-line is set to the non-display area and surrounds the viewing area；
Filler is filled in the interval range that the frame glue-line is surrounded and forms filled layer；Include in the filler
The transparent polymer of gumminess and cellulose nano-fibrous；
Cover board covers the filled layer and the frame glue-line.
2. according to the encapsulating structure of display panel described in right 1, which is characterized in that in the filler,
The quality of the transparent polymer of the gumminess accounts for the 80-90% of entire filler；The cellulose nano-fibrous matter
Amount accounts for the 3%-10% of entire filler；It further include desiccant in the filler, quality accounts for the 3%- of entire filler
10%.
3. the encapsulating structure of display panel according to claim 1, which is characterized in that the transparent polymer of the gumminess
Including at least one of acrylic resin, epoxy resin.
4. the encapsulating structure of display panel according to claim 1, which is characterized in that the substrate includes thin film transistor (TFT)
Structure sheaf；And
OLED device is set on the thin-film transistor structure layer and is located at the viewing area；
Water blocking layer is completely covered by the OLED device；
The filled layer is completely covered by the water blocking layer.
5. the encapsulating structure of display panel according to claim 4, which is characterized in that further include moisture absorption layer, on the side
In the interval range that frame glue layer is surrounded, the moisture absorption layer is set to the non-display area and surrounds the viewing area；The filling
Agent is filled in the interval range that the moisture absorption layer is surrounded.
6. the encapsulating structure of display panel according to claim 4, which is characterized in that the water blocking layer includes silica
At least one layer in layer, silicon nitride layer or silicon oxynitride layer.
7. a kind of packaging method of display panel, which comprises the following steps:
One substrate and a cover board are provided；The substrate has viewing area and the non-display area around viewing area；Frame adhesive is applied
Cloth forms circle frame glue-line corresponding with the non-display area on the cover board on the cover board；
In the interval range that the frame glue-line surrounds, the transparent polymer of gumminess and simultaneously spray fiber element nanometer are printed
Fiber forms filler；
The vacuum abutted cover board with the filler and the substrate, wherein the frame adhesive layer is located at the non-display area,
The filler forms uniformly mixed filled layer after pressing；
Solidify the frame glue-line, the filled layer.
8. the packaging method of display panel according to claim 7, which is characterized in that in the transparent polymeric of printing gumminess
Before object step, further include hygroscopic agent is coated on the cover board in the interval range that the frame glue-line surrounds, and
Circle moisture absorption layer corresponding with the non-display area is formed on the cover board, in the transparent polymer step of printing gumminess,
The filler is located in the interval range that the moisture absorption layer surrounds.
9. the packaging method of display panel according to claim 8, which is characterized in that in the step of providing the substrate
Including
Make thin-film transistor structure layer；
OLED device is made on the thin-film transistor structure layer；
Water blocking layer is formed on the thin-film transistor structure layer and the OLED device is completely covered in the water blocking layer.
10. the packaging method of display panel according to claim 9, which is characterized in that solidify the frame glue-line and
Include in the step of filled layer
It is irradiated by ultraviolet light or heats the frame glue-line, the moisture absorption layer, then cool and solidify the frame glue-line, described
Moisture absorption layer and the mixing glue-line.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910345816.0A CN110098346A (en) | 2019-04-26 | 2019-04-26 | The encapsulating structure and its packaging method of display panel |
| PCT/CN2019/086813 WO2020215396A1 (en) | 2019-04-26 | 2019-05-14 | Packaging structure of display panel and packaging method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910345816.0A CN110098346A (en) | 2019-04-26 | 2019-04-26 | The encapsulating structure and its packaging method of display panel |
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| CN110098346A true CN110098346A (en) | 2019-08-06 |
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ID=67446025
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| CN201910345816.0A Pending CN110098346A (en) | 2019-04-26 | 2019-04-26 | The encapsulating structure and its packaging method of display panel |
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| WO (1) | WO2020215396A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110828704A (en) * | 2019-10-28 | 2020-02-21 | 深圳市华星光电半导体显示技术有限公司 | Display panel packaging method and packaging structure |
| CN110993814A (en) * | 2019-11-15 | 2020-04-10 | 深圳市华星光电半导体显示技术有限公司 | Display device and method of making the same |
| CN112420961A (en) * | 2020-12-02 | 2021-02-26 | 深圳市华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and display device |
| WO2021072858A1 (en) * | 2019-10-16 | 2021-04-22 | Tcl华星光电技术有限公司 | Display panel and manufacturing method and detection method therefor |
| CN114023799A (en) * | 2021-10-29 | 2022-02-08 | 深圳市华星光电半导体显示技术有限公司 | Display panel, manufacturing method of display panel and display device |
| CN115440898A (en) * | 2021-06-02 | 2022-12-06 | Tcl科技集团股份有限公司 | Light-emitting diode, its manufacturing method and display device |
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| WO2021072858A1 (en) * | 2019-10-16 | 2021-04-22 | Tcl华星光电技术有限公司 | Display panel and manufacturing method and detection method therefor |
| CN110828704A (en) * | 2019-10-28 | 2020-02-21 | 深圳市华星光电半导体显示技术有限公司 | Display panel packaging method and packaging structure |
| WO2021082047A1 (en) * | 2019-10-28 | 2021-05-06 | 深圳市华星光电半导体显示技术有限公司 | Packaging method and packaging structure for display panel |
| US11309516B2 (en) | 2019-10-28 | 2022-04-19 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display panel packaging method and packaging structure each having laminated structure of water-blocking layer and light-absorbing adhesive layer |
| CN110993814A (en) * | 2019-11-15 | 2020-04-10 | 深圳市华星光电半导体显示技术有限公司 | Display device and method of making the same |
| US11417855B2 (en) | 2019-11-15 | 2022-08-16 | Shenzhen China Star Optoelectronics | Display device and manufacturing method thereof |
| CN112420961A (en) * | 2020-12-02 | 2021-02-26 | 深圳市华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and display device |
| WO2022116287A1 (en) * | 2020-12-02 | 2022-06-09 | 深圳市华星光电半导体显示技术有限公司 | Display panel and manufacturing method therefor, and display device |
| CN115440898A (en) * | 2021-06-02 | 2022-12-06 | Tcl科技集团股份有限公司 | Light-emitting diode, its manufacturing method and display device |
| CN114023799A (en) * | 2021-10-29 | 2022-02-08 | 深圳市华星光电半导体显示技术有限公司 | Display panel, manufacturing method of display panel and display device |
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