CN112658968B - A laser in-situ assisted wafer grinding device - Google Patents
A laser in-situ assisted wafer grinding device Download PDFInfo
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- CN112658968B CN112658968B CN202011512275.5A CN202011512275A CN112658968B CN 112658968 B CN112658968 B CN 112658968B CN 202011512275 A CN202011512275 A CN 202011512275A CN 112658968 B CN112658968 B CN 112658968B
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Abstract
本发明属于超精密加工领域，并具体公开了一种基于激光原位辅助的晶圆磨削装置，其包括磨削模块和激光发生模块，磨削模块用于对晶圆进行磨削，其包括磨削主轴及设置在磨削主轴两端的透明磨削砂轮和主轴电机，该主轴电机用于带动磨削主轴及其上的透明磨削砂轮旋转以利用透明磨削砂轮的圆周面对晶圆进行磨削；激光发生模块安装在磨削模块的中部，用于发射与磨削主轴轴线重合的激光，并使激光透过透明磨削砂轮以沿其径向射出，进而使得激光始终聚焦于晶圆的待磨削部位，以此实现晶圆的激光原位辅助磨削加工。本发明可实现晶圆的激光原位辅助磨削加工，材料的高效去除，大大降低磨削力，提高磨削质量。
The invention belongs to the field of ultra-precision machining, and specifically discloses a laser in-situ assisted wafer grinding device, which comprises a grinding module and a laser generating module, the grinding module is used for grinding the wafer, and includes Grinding spindle, transparent grinding wheel and spindle motor arranged at both ends of the grinding spindle, the spindle motor is used to drive the grinding spindle and the transparent grinding wheel on it to rotate so as to use the circumference of the transparent grinding wheel to face the wafer. Grinding; the laser generating module is installed in the middle of the grinding module, which is used to emit the laser that is coincident with the axis of the grinding spindle, and the laser is emitted radially through the transparent grinding wheel, so that the laser is always focused on the wafer The part to be ground is realized by laser in-situ assisted grinding of the wafer. The invention can realize the laser in-situ auxiliary grinding process of the wafer, effectively remove the material, greatly reduce the grinding force, and improve the grinding quality.
Description
Technical Field
The invention belongs to the field of ultra-precision machining, and particularly relates to a wafer grinding device based on laser in-situ assistance.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, is high in demand and high in processing precision, and needs ultra-precision grinding such as scribing, edging and the like in the processing process. The ultra-precision grinding processing refers to processing such as grinding, lapping and polishing of workpieces by using a grinding wheel, the processing size and shape precision reach submicron level, and the processing surface roughness reaches nanometer level, and is one of important researches of the current ultra-precision processing.
Laser-assisted grinding refers to a processing technology for performing precision grinding by heating a region to be processed with laser to soften a material, and laser-assisted grinding is an effective processing method for processing difficult-to-process materials in the future due to excellent controllability and common application of grinding. The conventional laser-assisted grinding mainly comprises laser grinding processing by using an external laser head, wherein the laser head and a grinding wheel are separated from each other, for example, a laser heat-assisted hard and brittle material high-efficiency grinding experiment table disclosed in CN106737070A, a laser-assisted grinding device and a grinding method disclosed in CN110605642A, a device and a process for processing a transparent hard and brittle material by laser-assisted cutting and grinding disclosed in CN109454325A, and the like.
Based on these problems, those skilled in the art have further studied and proposed an embedded laser-assisted grinding process, for example, CN110449995A discloses a laser-assisted grinding process apparatus and method for free-form surface grinding, which uses a hollow grinding needle design and introduces an in-situ laser-assisted technique, so as to effectively improve the precision and efficiency of ultra-precise grinding process, however, the grinding needle head of the grinding apparatus is often used for processing free-form surface micro-disc and blade parts, and the grinding needle head only has a local area interacting with the workpiece for processing, so that it is not suitable for processing large-caliber wafers efficiently and in large quantities for a long time; CN109605138A discloses an embedded laser-assisted ultra-precise cylindrical grinding device and a working method thereof, wherein a spindle integrated design model is adopted, a laser system is introduced from the spindle center of a cylindrical grinding machine to the grinding wheel center, and then focused laser is introduced to the middle of a processing dead zone through the light splitting design of the grinding wheel center to improve the production efficiency, however, the device can only realize intermittent laser irradiation, the laser utilization efficiency is very low, and the intermittent laser irradiation can cause the grinding edge of the grinding wheel to have inconsistent grinding of a laser region and a non-laser region to a workpiece, which causes uneven grinding, greatly affects the grinding quality, and thus, the device is difficult to be applied to ultra-precise grinding of wafers. Therefore, further research is needed in the art to obtain a laser-assisted grinding technique suitable for wafer grinding.
Disclosure of Invention
Aiming at the defects or the improvement requirements of the prior art, the invention provides a wafer grinding device based on laser in-situ assistance, which can realize laser in-situ assistance grinding processing of wafers through the design of an integral structure and has the advantages of high material removal efficiency, small required grinding force, high grinding quality and the like.
In order to achieve the above object, the present invention provides a wafer grinding device based on laser in-situ assistance, which includes a grinding module and a laser generation module, wherein:
the grinding module is used for grinding the wafer and comprises a grinding main shaft, and a transparent grinding wheel and a main shaft motor which are arranged at two ends of the grinding main shaft, wherein the main shaft motor is used for driving the grinding main shaft and the transparent grinding wheel thereon to rotate so as to grind the wafer by utilizing the circumference of the transparent grinding wheel;
the laser generating module is arranged in the middle of the grinding module and used for emitting laser which is superposed with the axis of the grinding spindle, enabling the laser to penetrate through the transparent grinding wheel to be emitted along the radial direction of the transparent grinding wheel and then focused on a part to be ground of the wafer, and therefore laser in-situ auxiliary grinding processing of the wafer is achieved.
Preferably, the laser generation module includes a laser, a laser path and a reflector, the laser is mounted on the spindle motor, the laser path passes through the spindle motor and the grinding spindle and extends into the transparent grinding wheel, one end of the laser path located at the spindle motor is connected to the laser, one end of the laser path extending to the transparent grinding wheel is connected to the reflector, and the laser emitted by the laser irradiates the reflector through the laser path and is reflected by the reflector and then is emitted along the radial direction of the transparent grinding wheel.
More preferably, the laser passage is preferably an elongated lightweight glass tube, and a hole is formed in a wall of the glass tube at a position corresponding to a laser emission position.
Preferably, the wafer grinding device further comprises a clamping module, the clamping module comprises a transparent locking bolt and an end cover, the transparent locking bolt is sleeved outside one end of the laser channel, the end cover extends to the outside of one end of the transparent grinding wheel, the transparent grinding wheel is connected with the grinding spindle, the transparent grinding wheel is sleeved outside the transparent locking bolt, and the end cover is located between the transparent locking bolt and the transparent grinding wheel and used for tightly pressing the transparent grinding wheel.
Further preferably, the transparent locking bolt is made of a transparent matrix resin doped with a high-strength resin, wherein the mass percentage of the transparent matrix resin is more than 98%, and the mass percentage of the high-strength resin is less than 2%.
More preferably, the transparent grinding wheel is made of a transparent matrix resin, the transparent matrix resin is doped with a high-strength resin, and the mass ratio of the transparent matrix resin to the high-strength resin is (95% -98%): (5% -2%), the transparent abrasive grain is also evenly distributed in the circumferential surface of the transparent grinding wheel.
Further preferably, the transparent matrix resin is one or more of polymethyl methacrylate, allyl diglycol carbonate and polycarbonate, and the high-strength resin is one or more of polyvinyl alcohol fiber resin and epoxy resin.
More preferably, the distribution thickness of the light-transmitting abrasive particles in the circumferential surface of the transparent grinding wheel is 2mm to 3mm, and the light-transmitting abrasive particles are made of artificial diamond.
Further preferably, a base is attached to the outside of the grinding spindle.
Generally, compared with the prior art, the above technical solution conceived by the present invention mainly has the following technical advantages:
1. according to the invention, through the design of the whole structure of the grinding device, laser emitted along the radial direction of the grinding wheel can be generated to focus on a grinding area to form laser in-situ auxiliary grinding, and the laser beam can not change along with the rotation of the grinding spindle and always irradiates on a designated position, so that the laser energy can be efficiently utilized, and the high-quality grinding of the wafer can be realized.
2. The laser irradiation device can enable laser to be emitted according to a specified path through the design of the laser generation module and irradiate at a specified position all the time, and can realize the adjustment of a laser irradiation area through the adjustment of the installation angle of the reflector.
3. The laser passage is designed into a slender light glass tube, the weight is light, the dynamic force generated during high-speed rotation is small, and the small holes are formed in the tube wall, so that laser can be directly emitted conveniently without loss.
4. Through the design of the clamping module, the grinding wheel can be conveniently and effectively assembled, and meanwhile, the grinding wheel can be conveniently replaced.
5. According to the invention, the grinding wheel is a transparent grinding wheel, the locking bolt is a transparent bolt, and through the design, laser from the laser generation module can penetrate through the transparent bolt and the transparent grinding wheel and focus on the grinding area of the grinding wheel to heat workpiece materials, so that laser in-situ auxiliary grinding processing is formed, diamond abrasive particle grinding of the workpiece is promoted, the grinding force is greatly reduced, the material removal rate is improved, and the grinding quality is improved.
6. The invention also researches and designs the preparation material and the material proportion of the grinding wheel, and the grinding wheel has high transparency, low laser loss and better strength, thereby realizing the effective grinding of the wafer.
7. The invention also researches and designs the preparation material and the material proportion of the locking bolt, and the locking bolt has higher transmittance, reduces the laser loss, improves the toughness and prolongs the service life through the design.
8. The grinding device has the characteristics of small overall volume, miniaturization and light weight, can keep dynamic balance under the high-speed rotation of 20000rpm-30000rpm, and is very suitable for the ultra-precise grinding processing of hard and brittle wafers.
Drawings
Fig. 1 is a schematic structural diagram of a wafer grinding apparatus based on laser in-situ assistance according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a wafer grinding device (removing a transparent grinding wheel) based on laser in-situ assistance according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view of a wafer grinding apparatus based on laser in-situ assist according to an embodiment of the present invention;
FIG. 4 is a cross-sectional view of a laser generating module provided by an embodiment of the present invention;
fig. 5 is an assembly diagram of a wafer grinding apparatus and an ultra-precision machine tool according to an embodiment of the present invention.
The same reference numbers will be used throughout the drawings to refer to the same or like elements or structures, wherein:
101-transparent locking bolt, 102-end cover, 103-grinding spindle, 104-base, 105-spindle motor, 106-laser generation module, 106 a-laser, 106 b-laser channel, 106 c-reflector, 2-transparent grinding wheel, 3-wafer, M-ultra-precision machine tool and L-laser.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
As shown in fig. 1, an embodiment of the present invention provides a wafer grinding apparatus based on laser in-situ assistance, which includes a grinding module and a laser generation module, wherein the grinding module is configured to grind a wafer, and the laser generation module is configured to emit laser and enable the laser to be emitted in a radial direction of a grinding wheel. Through the mutual cooperation of the modules, the surface quality of the wafer can be improved in the wafer grinding process, the laser in-situ auxiliary grinding processing of the wafer can be realized, the material removal can be efficiently realized, the grinding force is greatly reduced, and the grinding quality is improved.
The modules are explained in detail below.
Referring to fig. 1 to 3, the grinding module includes a grinding spindle 103, and a transparent grinding wheel 2 and a spindle motor 105 disposed at two ends of the grinding spindle 103, wherein the spindle motor 105 is configured to drive the grinding spindle 103 and the transparent grinding wheel 2 thereon to rotate so as to grind a wafer, such as ultra-precision grinding, such as scribing, edging, etc., by using a circumference of the transparent grinding wheel 2. Specifically, an output shaft of the spindle motor 105 is connected to the grinding spindle 103 to rotate the grinding spindle 103. The grinding spindle is the core of the whole wafer grinding device, can rotate at a high speed under the drive of a spindle motor, generates laser emitted along the radial direction of the transparent grinding wheel through a laser generating module, focuses on a grinding area to form laser in-situ auxiliary grinding, and laser beams cannot change along with the rotation of the spindle, so that the laser energy can be efficiently utilized, and the high-quality grinding of workpieces is realized.
Specifically, the spindle motor is a high-performance motor suitable for high-speed rotation, the grinding spindle can be driven to rotate at a high speed, and a through hole is formed in the motor so that laser emitted by the laser module can penetrate through the through hole. Further, the middle part of the grinding module is used for installing the laser generation module, so a through hole is arranged in the middle part of the grinding spindle 103, the output shaft of the spindle motor 105 is a hollow shaft, and the through hole is arranged in the middle part of the transparent grinding wheel 2, so that an assembly channel of the laser generation module is formed.
Furthermore, the binder material of the transparent grinding wheel 2 is transparent resin, and the commonly used resin materials mainly include polymethyl methacrylate (PMMA), Allyl Diglycol Carbonate (ADC), Polycarbonate (PC), and the like, wherein the polymethyl methacrylate resin has good light transmittance, and has the characteristics of good machinability, good glossiness, and the like, so that the binder material of the transparent grinding wheel 2 is preferably polymethyl methacrylate. Meanwhile, in order to improve the strength of the grinding wheel, a small amount of high-strength resin materials such as polyvinyl alcohol fiber resin, epoxy resin and the like are doped in the binder material. The transparent grinding wheel of the invention adopts fibrous polyvinyl alcohol resin, the transmittance of the grinding wheel is not influenced while the strength of the grinding wheel is improved, the mass ratio of transparent matrix resin is 95-98%, and the mass ratio of high-strength resin is 2-5%. The abrasive particles are made of artificial diamonds and have light transmittance, the abrasive particles are mainly distributed on the grinding edge of the outer layer of the grinding wheel, and the number of the diamond meshes can be set to be 1500 meshes, 2000 meshes, 3000 meshes and other types according to actual requirements. Specifically, 1% of methyl ethyl ketone peroxide is added into a transparent grinding wheel to serve as a catalyst, reaction combination of polymethyl methacrylate transparent resin and polyvinyl alcohol resin is carried out, the grinding wheel is shaped in a pouring mode, and then the components in the transparent grinding wheel are enabled to react fully by adopting a sintering process, so that diamond abrasive particles can be wrapped. The resin bond grinding wheel obtained in the mode has the characteristics of high transmittance, low heat resistance and good self-sharpening performance, and meanwhile, the diamond abrasive particles enhance the cutting performance of the grinding wheel. The transparent grinding wheel is arranged on the grinding main shaft and can rotate at a high speed along with the grinding main shaft, and when a workpiece is machined, laser from the laser generating module can penetrate through the transparent grinding wheel and focus on a grinding area of the grinding wheel to heat a workpiece material, so that laser in-situ auxiliary grinding machining is formed, diamond abrasive particle grinding of the workpiece is promoted, grinding force can be greatly reduced, material removal rate is improved, and grinding quality is improved.
Furthermore, the distribution thickness of the light-transmitting abrasive particles in the circumferential surface of the transparent grinding wheel is 2 mm-3 mm, namely, the light-transmitting abrasive particles are distributed in a circumferential area of 2 mm-3 mm from outside to inside along the radial direction of the transparent grinding wheel, namely, a grinding layer with the thickness of 2 mm-3 mm is distributed outside the circumference of the grinding wheel, and the rest part is not added with abrasive particles and is only resin, so that the grinding processing of the wafer can be realized by utilizing the circumferential surface of the grinding wheel distributed with the light-transmitting abrasive particles, and the whole grinding wheel can be only worn by 2-3 mm.
In order to facilitate the assembly of the grinding device on an external power machine tool, the grinding spindle 103 is also externally provided with a base 104, the base provides mounting support for the grinding spindle, the spindle motor and the laser generation module and can be connected with a power component such as an ultra-precision machine tool so as to mount the grinding device on a base of the ultra-precision machine tool, and further mount the whole laser auxiliary grinding spindle on the ultra-precision machine tool, and can control the rotation of the spindle motor through the ultra-precision machine tool so as to drive the whole laser auxiliary grinding spindle to rotate, and the grinding wheel is used for grinding wafers. The ultra-precision machine tool can adopt a nano-form series high-precision machine tool, including an Z, X, B, C four-axis system four-axis linkage machine tool, but is not limited to the nano-form ultra-precision machine tool, and other machine tools can be adopted according to actual conditions.
Referring to fig. 3, the laser generating module is installed in the middle of the grinding module, and is configured to emit laser light coinciding with the axis of the grinding spindle 103, and to enable the laser light to penetrate through the transparent grinding wheel 2 to be emitted along the radial direction of the transparent grinding wheel 2, so that the laser light is always focused on a portion of a wafer to be ground, and laser in-situ auxiliary grinding processing of the wafer is achieved.
Referring to fig. 4, the laser generating module includes a laser 106a, a laser path 106b and a reflecting mirror 106c, wherein the laser 106a is mounted on a spindle motor 105, the laser path 106b passes through the spindle motor 105 and the grinding spindle 103 and extends into the transparent grinding wheel 2, and the particular laser path 106b is fixed on a housing of the spindle motor, passes through a hollow shaft of the spindle motor and a central through hole of the grinding spindle 103, and then extends into the central through hole of the transparent grinding wheel 2. The laser path 106b is located at one end of the spindle motor 105 and connected to the laser 106a, the laser 106a is mounted on a housing of the spindle motor, the laser path 106b extends to one end of the transparent grinding wheel 2 and is connected to the reflecting mirror 106c, and laser light emitted by the laser 106a is irradiated on the reflecting mirror 106c through the laser path 106b and is emitted along the radial direction of the transparent grinding wheel 2 after being reflected by the reflecting mirror 106 c.
Specifically, the laser passage 106b is a thin and long light glass tube, which is light in weight and generates a small dynamic force during high-speed rotation, and a small hole is formed in the tube wall, so that laser can be directly emitted conveniently without loss. The reflector 106c is installed at the end of the laser path, and can reflect the laser emitted by the laser and emitted through the laser path by using a high-reflectivity reflector, and the reflected laser passes through a small hole formed in the laser path and acts on a grinding area through the transparent locking bolt and the transparent grinding wheel. The laser action area on the transparent grinding wheel can be changed by adjusting the installation angle of the reflecting mirror, and the laser intensity can be changed by adjusting the intensity of the laser source.
Referring to fig. 3, in order to ensure effective assembly of the transparent grinding wheel 2, the wafer grinding apparatus of the present invention is further provided with a clamping module, which includes a transparent locking bolt 101 and an end cover 102, wherein the transparent locking bolt 101 simultaneously serves as a shaft section for installing and fastening the transparent grinding wheel 2 and assisting passage of laser, after the laser generation module 106 is installed, the transparent grinding wheel 2, the end cover 102 and the transparent locking bolt 101 can be installed, the transparent locking bolt 101 fastens the transparent grinding wheel 2, and simultaneously, the transparent material can assist passage of laser. Specifically, transparent locking bolt 101 suit is in the outside that laser access 106b extends to transparent grinding wheel 2's one end to link to each other with grinding main shaft 103, specific and grinding main shaft 103's through-hole threaded connection, can realize the effective installation of emery wheel on the one hand through threaded connection, on the other hand can adjust the interval between transparent locking bolt 101 and grinding main shaft 103, and then the clamp force of adjustment emery wheel, and applicable in the assembly of multiple specification emery wheel, the dismantlement and the change of the emery wheel of also being convenient for simultaneously. Specifically, the transparent grinding wheel 2 is sleeved outside the transparent locking bolt 101, and the end cover 102 is located between the transparent locking bolt 101 and the transparent grinding wheel 2 and used for pressing the transparent grinding wheel 2 tightly.
Specifically, the transparent locking bolt 101 is used for transmitting laser with low loss, and is combined with an end cover to fasten a transparent grinding wheel, the light transmittance requirement of the transparent locking bolt 101 is high, and the base material of the transparent locking bolt is made of a material similar to the transparent grinding wheel, such as polymethyl methacrylate (PMMA), Allyl Diglycol Carbonate (ADC), Polycarbonate (PC), and the like, wherein the light transmittance of polymethyl methacrylate resin is good, and the transparent locking bolt has the characteristics of good machinability, good glossiness, and the like, so that polymethyl methacrylate is preferably selected, and a small amount of high-strength resin material, such as polyvinyl alcohol fiber resin, epoxy resin, and the like, and fibrous polyvinyl alcohol resin is preferably selected, and since the transparent locking bolt only needs to transmit light and lock the grinding wheel, the strength requirement of the transparent locking bolt is not as high as that of the grinding wheel, and therefore, the content of the base resin is increased, the content of the high-strength resin is reduced, the content (mass percent) of the matrix resin is more than 98 percent, and the content (mass percent) of the high-strength resin is less than 2 percent. The transparency of the transparent locking bolt is improved by improving the content of the matrix resin, the laser loss is reduced, the content of the high-strength resin is properly reduced, and the toughness and the service life of the transparent locking bolt are improved. The laser emitted from the laser light path penetrates through the transparent locking bolt and is emitted along the radial direction of the transparent grinding wheel, and the emitting direction of the laser cannot be changed along with the rotation of the laser auxiliary grinding spindle, so that the in-situ laser auxiliary processing of workpiece materials is formed.
During operation, the spindle motor 105 drives the grinding spindle 103, the transparent grinding wheel 2 and the clamping module to rotate together, the laser generating module is fixed, laser emitted by the laser generating module is emitted along the radial direction of the transparent grinding wheel 2 and does not change along with the rotation of the transparent grinding wheel 2, and the laser is always irradiated on one position, so that the laser utilization rate and the grinding quality can be greatly improved.
The spindle motor 105 of the present invention may be a general spindle motor, and the laser generating module and other components may be mounted on the general spindle motor in combination, that is, the general spindle motor may be subjected to laser-assisted grinding. The grinding module (the spindle motor is removed), the laser generation module and the clamping module are designed in a modularized mode, the whole formed by the grinding module, the laser generation module and the clamping module is directly assembled on the existing spindle motor for wafer grinding, the ordinary grinding spindle motor can be used as the spindle motor for laser auxiliary grinding without modifying and specially designing the ordinary grinding spindle motor.
When a wafer is ground, a grinding wheel is generally required to rotate at a high speed of 20000rpm-30000rpm, and in order to guarantee grinding quality, a grinding device is required to meet the requirements of miniaturization and light weight so as to guarantee grinding balance.
The diameter of the wafer is generally 150mm and 300mm, the thickness is generally 0.7 mm-1 mm, have large and thin characteristics, the grinding process to the wafer is generally cutting and edging, while cutting and edging the grinding process of the wafer, etc., need the emery wheel to grind with the processing way perpendicular to surface of the wafer, adopt the miniaturized radial laser auxiliary grinding device designed in this invention, can act on the surface of the wafer vertically along the radial laser launched of the emery wheel, in order to realize the heating of the wafer, and realize the treatment such as scribing, edging of the wafer with the circumferential surface of the emery wheel.
When the grinding device is used, the grinding device can be arranged on a B-axis base of the ultra-precision machine tool M, the B-axis is controlled by the ultra-precision machine tool M to rotate, the grinding device is driven to integrally rotate, and therefore the contact mode of the grinding wheel and the wafer 3 is changed. The wafer grinding device for realizing laser in-situ auxiliary wafer grinding processing comprises the following procedures: firstly, determining the position of a processing area where the transparent grinding wheel 2 is contacted with a workpiece, and determining the position needing laser focusing; then, the laser 106a is started, at this time, the laser passes through the laser path 106b and is reflected by the reflecting mirror 106c, and then is focused at a certain point of the outer circumference of the transparent grinding wheel 2, the installation angle of the laser generation module 106 is adjusted to focus the laser at a target point, the spindle motor 105 is started to drive the grinding spindle 103 and the transparent grinding wheel 2 to rotate for grinding, so that the laser in-situ auxiliary wafer grinding processing is realized, and the wafer 3 can be fixed in the grinding process or can be driven to rotate by a numerical control machine.
The invention can realize that the laser is fixedly focused at the grinding area to continuously assist the grinding processing, is not only suitable for the grinding processing of wafer workpieces, but also suitable for the grinding processing of other materials, greatly improves the grinding processing efficiency, shortens the processing time, can reduce the grinding force, improves the quality of processed surfaces, and effectively reduces the surface/sub-surface damage of the workpieces. The device can be used for carrying out laser in-situ auxiliary wafer grinding, thereby improving the temperature of a grinding area, reducing the hardness of materials, greatly reducing the grinding force, improving the grinding quality and realizing efficient material removal.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (9)
1. The utility model provides a wafer grinding device based on supplementary of laser normal position which characterized in that, includes grinding module and laser generation module, wherein:
the grinding module is used for grinding the wafer and comprises a grinding spindle (103), and a transparent grinding wheel (2) and a spindle motor (105) which are arranged at two ends of the grinding spindle (103), wherein the spindle motor (105) is used for driving the grinding spindle (103) and the transparent grinding wheel (2) thereon to rotate so as to grind the wafer by utilizing the circumference of the transparent grinding wheel (2); the transparent grinding wheel (2) is made of transparent matrix resin doped with high-strength resin, and the mass ratio of the transparent matrix resin to the high-strength resin is (95% -98%): (5% -2%);
the laser generating module is arranged in the middle of the grinding module and used for emitting laser coincident with the axis of the grinding spindle (103), the laser penetrates through the transparent grinding wheel (2) and then is emitted along the radial direction of the transparent grinding wheel, and is fixedly focused on a to-be-ground processing area of the wafer to realize heating of the area, so that the temperature of the grinding processing area is improved, the material hardness is reduced, the grinding force is reduced, the quality of a processed surface is improved, the surface/sub-surface damage of the wafer is reduced, and the laser in-situ auxiliary grinding processing of the wafer is realized.
2. The wafer grinding device based on laser in-situ assistance as claimed in claim 1, wherein the laser generation module comprises a laser (106 a), a laser path (106 b) and a reflecting mirror (106 c), the laser (106 a) is mounted on a spindle motor (105), the laser path (106 b) passes through the spindle motor (105) and the grinding spindle (103) and extends into the transparent grinding wheel (2), one end of the spindle motor (105) is connected with the laser (106 a), one end of the transparent grinding wheel (2) is connected with the reflecting mirror (106 c), and the laser emitted by the laser (106 a) irradiates the reflecting mirror (106 c) through the laser path (106 b) and is reflected by the reflecting mirror (106 c) and then is emitted along the radial direction of the transparent grinding wheel (2).
3. The wafer grinding device based on laser in-situ assistance as claimed in claim 2, wherein the laser passage (106 b) is an elongated light glass tube, and a hole is formed in the wall of the glass tube at a position corresponding to the laser emission position.
4. The wafer grinding device based on laser in-situ assistance as claimed in claim 2, further comprising a clamping module, wherein the clamping module comprises a transparent locking bolt (101) and an end cap (102), the transparent locking bolt (101) is sleeved outside one end of the laser passage (106 b) extending to the transparent grinding wheel (2) and is connected with the grinding spindle (103), the transparent grinding wheel (2) is sleeved outside the transparent locking bolt (101), and the end cap (102) is positioned between the transparent locking bolt (101) and the transparent grinding wheel (2) and is used for pressing the transparent grinding wheel (2).
5. The laser in-situ assistance-based wafer grinding device according to claim 4, wherein the transparent locking bolt (101) is made of a transparent matrix resin doped with a high-strength resin, wherein the mass percentage of the transparent matrix resin is more than 98%, and the mass percentage of the high-strength resin is less than 2%.
6. The laser in-situ assistance based wafer grinding device according to claim 5, wherein the transparent matrix resin is one or more of polymethyl methacrylate, allyl diglycol carbonate and polycarbonate, and the high-strength resin is one or more of polyvinyl alcohol fiber resin and epoxy resin.
7. The laser-based in-situ auxiliary wafer grinding device as claimed in claim 1, wherein light-transmitting abrasive grains are further uniformly distributed in the circumferential surface of the transparent grinding wheel (2).
8. The wafer grinding device based on laser in-situ assistance according to claim 7, wherein the distribution thickness of the light-transmitting abrasive particles in the circumferential surface of the transparent grinding wheel (2) is 2 mm-3 mm, and the light-transmitting abrasive particles are made of artificial diamond.
9. The laser in-situ assistance-based wafer grinding device according to any one of claims 1 to 8, wherein a pedestal (104) is further mounted on the outside of the grinding spindle (103).
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