CN114420607B - Micro LED mass transfer and repair device, method and equipment - Google Patents
Micro LED mass transfer and repair device, method and equipment Download PDFInfo
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- CN114420607B CN114420607B CN202210060400.6A CN202210060400A CN114420607B CN 114420607 B CN114420607 B CN 114420607B CN 202210060400 A CN202210060400 A CN 202210060400A CN 114420607 B CN114420607 B CN 114420607B
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Abstract
本发明公开了Micro LED巨量转移和修复装置、方法及其设备；Micro LED巨量转移装置包括原始载台和标载台，及动力部件；微米级视觉传感器摄取原始载台中Micro LED颗粒的分布位置，转换成控制信号输出至ASIC驱动器，对紫外光可逆胶层进行照射，只让有Micro LED颗粒分布的位置具有黏力，其他的位置不具有黏力；然后动力部件带动黏取板至原始载台，直接黏取对应位置的Micro LED颗粒，再移送到目标基板的指定位置。本发明采用微米级视觉传感器，获得Micro LED颗粒的分布位置，再根据分布位置对黏取板中的紫外光可逆胶层进行定向投射曝光，获得精准的可黏贴区域，以此对Micro LED颗粒进行精准黏贴，实现Micro LED颗粒的巨量转移，也可以用于修复时的转移。
The invention discloses a Micro LED mass transfer and repair device, method and equipment; the Micro LED mass transfer device includes an original carrier, a standard carrier, and a power component; a micron-level visual sensor captures the distribution of Micro LED particles in the original carrier The position is converted into a control signal and output to the ASIC driver to irradiate the UV light reversible adhesive layer, so that only the positions where the Micro LED particles are distributed have adhesive force, and other positions have no adhesive force; then the power component drives the adhesive plate to the original position The stage directly sticks the Micro LED particles in the corresponding position, and then transfers them to the designated position of the target substrate. The present invention uses a micron-level vision sensor to obtain the distribution position of the Micro LED particles, and then directional projection exposure is performed on the UV reversible adhesive layer in the sticking plate according to the distribution position to obtain a precise stickable area, so that the Micro LED particles Precise pasting can achieve massive transfer of Micro LED particles, and can also be used for transfer during repair.
Description
Technical Field
The invention relates to a Micro LED bulk transfer device, in particular to a Micro LED bulk transfer and repair device, a method and equipment thereof.
Background
Due to the very small size of the micro leds (between 6 and 20 microns), transfer from the micro led wafer to the target substrate becomes very difficult, especially if the damaged or bad micro led chips are to be inspected and repaired on the same equipment.
According to the search keyword "name, abstract, claim + (micro and bad and repair)" there are 4 relevant patent documents. One of the methods is a Micro-LED chip dead pixel repairing method, which has a main groove and a backup groove in each sub-pixel region of a substrate, and is not always reliable in implementation.
Therefore, the present inventors considered necessary to develop a new micro led transfer device which can be used for both bulk transfer and small transfer for repair. Making it also useful for integrated Micro-LED production equipment.
Disclosure of Invention
The present invention is directed to solving the above-mentioned problems of the prior art, and provides a Micro LED bulk transfer and repair apparatus, method and device.
The purpose of the invention is realized by the following technical scheme:
the invention discloses a Micro LED bulk transfer device, which comprises an original carrying platform carrying Micro LED particles, a target carrying platform carrying a target substrate, and power parts arranged on the side edges of the original carrying platform and the target carrying platform; the original carrying platform is a huge carrying platform and is provided with a wafer of Micro LEDs or a storage disc with the arranged Micro LEDs; the system comprises an original carrying platform, a micro-scale vision sensor arranged above the original carrying platform, a transfer control circuit connected with the micro-scale vision sensor, an ASIC driver connected with the transfer control circuit, an LED array plate connected with the ASIC driver and a lens array arranged on the front side of the LED array plate; the movable end of the power component is provided with a sticking plate, and the sticking plate is provided with an ultraviolet reversible adhesive layer; the micron-scale vision sensor captures the distribution position of Micro LED particles in the original carrier, converts the distribution position into an image signal and transmits the image signal to the transfer control circuit; then the signal is converted into a control signal and output to the ASIC driver after being processed by the transfer control circuit; the ASIC driver drives the LED array plate to display the same image signals, and irradiates the ultraviolet reversible adhesive layer through the lens array, so that only the position where the Micro LED particles are distributed has adhesive force, and other positions do not have adhesive force; and then the power component drives the sticking plate to the original carrying platform, directly sticks the Micro LED particles at the corresponding position, transfers the Micro LED particles to the specified position of the target substrate, and is stuck by the anisotropic conductive film arranged on the surface of the target substrate, the adhesion force between the Micro LED particles and the anisotropic conductive film is larger than that between the Micro LED particles and the ultraviolet light reversible adhesive layer, the power component moves upwards, the separation of the ultraviolet light reversible adhesive layer and the Micro LED particles is realized, and the Micro LED particles are transferred to the target substrate.
Preferably, the movable end of power unit with glue and be equipped with the adhesion force sensor between getting the board, in glue when getting board and Micro LED granule separation, detect out glue the surface adhesion force of getting the board, when the detected value is less than the setting value, right glue the reversible glue film of ultraviolet ray on getting the board surface and change.
The invention discloses a Micro LED bulk transfer method, which adopts the Micro LED bulk transfer device and comprises the following steps of:
the step of reducing the adhesive force is to irradiate the area, which is not included by the distribution device of the previous huge transfer, of the distribution position of the Micro LED particles of the previous huge transfer by the ultraviolet light with the wavelength of 400nm at 280-;
and the step of replacing the ultraviolet reversible glue layer is that the movable end of the power component and the adhesive are provided with a viscous force sensor between the plates, the viscous force sensor detects the surface viscosity of the adhesive plate when the adhesive plate is separated from the Micro LED particles, and the adhesive plate is replaced by the ultraviolet reversible glue layer on the surface of the adhesive plate when the detection value is lower than the set value.
The invention discloses a Micro LED repairing device, which comprises an original carrying platform carrying Micro LED particles, a target carrying platform carrying a target substrate, and power parts arranged on the side edges of the original carrying platform and the target carrying platform; the original carrying platform is a good product carrying platform and is provided with Micro LED good product particles; the target carrying platform is a repairing carrying platform and is used for repairing Micro LED particles; the target substrate is a substrate to be repaired; the system also comprises a micron-sized vision sensor arranged above the original carrying platform, a repair transfer control circuit connected with the micron-sized vision sensor, an ASIC driver connected with the repair transfer control circuit, an LED array plate connected with the ASIC driver and a lens array arranged on the front side of the LED array plate; the movable end of the power component is provided with a sticking plate, and the sticking plate is provided with an ultraviolet reversible adhesive layer; the micron-sized vision sensor captures the distribution position of Micro LED dead pixel particles in the repairing microscope carrier, converts the distribution position into an image signal and transmits the image signal to the repairing transfer control circuit; then the control signal is converted into a control signal and output to the ASIC driver after being processed by the repair transfer control circuit; the ASIC driver drives the LED array plate to display two same image signals, and the ultraviolet light reversible adhesive layer is irradiated through the lens array, so that only the positions where Micro LED dead pixel particles are distributed have adhesive force, and other positions do not have adhesive force; one of the image signals generates a viscosity distribution area for adhering Micro LED dead pixel particles, and the other image signal generates a viscosity distribution area for adhering Micro LED good product particles; then the power part drives the sticking plate to the repairing carrier, directly sticks Micro LED dead pixel particles at corresponding positions, transfers the particles to the upper side of the good product carrier, sticks the Micro LED good product particles to be sent to the positions of the Micro LED dead pixel particles of the repairing carrier, and is stuck by the nano conductive silver paste arranged on the surfaces of the Micro LED dead pixel particles, the adhesion force between the Micro LED good product particles and the nano conductive silver paste is larger than that between the Micro LED good product particles and the ultraviolet light reversible adhesive layer, the power part moves upwards to realize the separation of the ultraviolet light reversible adhesive layer and the Micro LED good product particles, and the Micro LED good product particles are transferred to the substrate to be repaired; the repairing carrying platform is also provided with a lighting fixture for lighting the substrate to be repaired.
Preferably, the repair transfer control circuit accumulates the adhesion force distribution area for adhering Micro LED dead pixel particles, and sends a signal for replacing the ultraviolet light reversible adhesive layer when the concentration of the adhesion force distribution area reaches a set value of the ultraviolet light reversible adhesive layer of the adhering plate.
The Micro LED repairing method adopts the repairing device; comprises a step of reducing the adhesive force, a step of removing and a step of moving the irradiation position:
the step of reducing the adhesive force is to irradiate the area, which is not included by the distribution device of the current restoration transfer, of the distribution position of the Micro LED particles of the previous restoration transfer by ultraviolet light with the wavelength of 280-400nm during the second restoration transfer, so that the adhesive force is reduced;
the removing step is that the provided micron-sized vision sensor for repairing shoots the position of Micro LED dead pixel particles to obtain dead pixel image signals, and then ultraviolet light generated by the LED array plate is used for correspondingly irradiating the ultraviolet light reversible adhesive layer according to the dead pixel image signals, so that the corresponding position obtains the adhesive force, the ultraviolet light reversible adhesive layer is attached to the substrate to be repaired, and the Micro LED dead pixel particles are adhered and removed;
and the irradiation position moving step is to perform irradiation on the ultraviolet light reversible glue layer at a position different from the position at which the Micro LED good product particles are picked up last time when the Micro LED good product particles are picked up for the second time.
The invention discloses Micro LED bulk transfer, detection and repair equipment, which comprises a bulk transfer device, a detection device and a repair device, wherein bases of the bulk transfer device, the detection device and the repair device are connected together; the huge transfer device is the Micro LED huge transfer device; the repairing device is the Micro LED repairing device.
Preferably, the detection device comprises a detection station arranged on the base, a lighting fixture arranged on the side edge of the detection station and used for lighting Micro LED particles arranged on the target substrate, and a micron-sized visual sensor for detection arranged above the detection station; the target substrate is taken away by a detection power component when the target substrate is qualified after being detected after sliding from the bulk transfer device to the detection station; when Micro LED dead pixel particles are detected, the target substrate is conveyed to the repairing carrying platform by the detection power component to become the substrate to be repaired.
Preferably, the repairing carrier is further provided with an ultralow temperature probe positioned below the substrate to be repaired, and the ultralow temperature probe is pressed and contacted with the Micro LED dead pixel particles to eliminate the adhesion of the anisotropic conductive adhesive film; the diameter of the ultra-low temperature probe is close to 20-30 μm; the Micro-scale repairing visual sensor is further arranged to shoot the positions of the Micro LED dead pixel particles to obtain dead pixel image signals, and then the ultraviolet light generated by the LED array plate is used for correspondingly irradiating the ultraviolet light reversible adhesive layer according to the dead pixel image signals, so that the corresponding positions obtain the adhesive force, the ultraviolet light reversible adhesive layer is used for being attached to the substrate to be repaired, and the Micro LED dead pixel particles are adhered and removed; the repairing device is further provided with a conductive silver paddle rod located above the to-be-repaired substrate, the tail end of the conductive silver paddle rod is stained with nano conductive silver paste, and the conductive silver paddle rod conducts smearing of the nano conductive silver paste on the position of the Micro LED dead pixel particles.
Preferably, a repair power component arranged on the repair device utilizes the adhesion plate to adhere corresponding Micro LED good-product particles from the original carrier according to the dead pixel image signal, and the particles are implanted to the position of the Micro LED dead pixel particles of the to-be-repaired substrate of the repair carrier; the repairing carrier is provided with a mesh layer for bearing the substrate to be repaired, the ultralow temperature probe penetrates through the mesh layer and is pressed below the Micro LED dead pixel particles at the temperature lower than-70 ℃ so as to remove the adhesive force between the Micro LED dead pixel particles and the substrate to be repaired; and a horizontal plane driving part for driving the mesh layer to avoid the blocking of the ultra-low-temperature probe by the solid portion of the mesh layer.
The invention also discloses another Micro LED bulk transfer, detection and repair device, which comprises a bulk transfer unit, a detection unit and a dead pixel repair unit;
the bulk transfer unit comprises a first machine table, a first mechanical arm, a bulk transfer device, a substrate transfer device, a silicon wafer fixing device, a precision positioning device and a substrate fixing device; the substrate is arranged on the substrate fixing device; the silicon wafer fixing device and the substrate fixing device are respectively arranged on the feeding end and the discharging end of the first machine table; the huge transfer device is arranged between the silicon wafer fixing device and the substrate fixing device, and an ultraviolet reversible adhesive layer capable of adjusting adhesive force is arranged on the huge transfer device; the precision positioning device is arranged on the massive transfer device; the first mechanical arm is arranged on one side of the silicon wafer fixing device and used for controlling incoming materials; the substrate transfer device is arranged on one side of the substrate fixing device and used for controlling discharging.
The detection unit comprises a machine table II, a mechanical arm II, a substrate to be detected, a lighting detection device, a lighting action device, a lighting position finding device, a lighting control device and a lighting capture device; the lighting control device and the lighting action device are arranged at the feeding end of the machine platform II; the substrate to be detected is arranged on the lighting control device; the lighting detection device is arranged on the lighting action device; the lighting position measuring device is arranged on the lighting detection device; the lighting capture device is arranged on the lighting position finding device; and the second mechanical arm is arranged at the discharge end of the second machine table and used for taking out qualified products.
The dead pixel repairing unit comprises a machine table III, a mechanical arm III, an upper heating device, a repairing action device, a defective substrate, an implanting device, a repairing transfer assembly, a repairing silicon wafer fixing device and a lower heating device; the lower heating device and the repairing action device are arranged on one side of the machine table III close to the machine table II; the defective substrate is arranged on the lower heating device; the upper heating device and the implantation device are arranged on the repair action device; the repairing silicon wafer fixing device is arranged on one side of the machine platform III, which is far away from the machine platform II; the repairing transfer assembly is arranged between the repairing silicon wafer fixing device and the repairing action device; and the third mechanical arm is arranged on one side of the silicon wafer repairing and fixing device and used for feeding the repaired silicon wafer.
Preferably, the mass transfer unit, the detection unit and the dead pixel repair unit are of an integrated structure.
Preferably, the first machine table is provided with a first sliding rail; the substrate fixing device is arranged on the first sliding rail in a sliding mode.
Preferably, a machine vision system is arranged on the precision positioning device and comprises a high-definition lens and a CCD camera, and the recognition precision reaches below 6 microns.
Preferably, the machine vision system is a system which is formed by identifying a wafer of Micro LEDs or a storage disc with the arranged Micro LEDs, converting an image distributed by LED chips into a digital signal after image signal processing and algorithm so as to match with an ASIC (application specific integrated circuit) driving chip, LED lenses arranged in an array, a rotating mirror and a scanning system.
Preferably, the bulk transfer device is projected through the machine vision system, so that the ultraviolet light reversible adhesive layer with the distribution area of the Micro LEDs has adhesive force, and the adhesive force does not exist at other positions.
Preferably, a second sliding rail is arranged on the second machine table; the second sliding rail is arranged between the first machine platform and the third machine platform; the lighting control device is arranged on the second slide rail in a sliding mode.
Preferably, the repairing and transferring assembly comprises a first repairing and transferring device, a second repairing and transferring device, a particle fixing device, a third sliding rail, a fourth sliding rail and a first mounting rack; the third sliding rail is arranged on the third machine table and is positioned below the repair action device; the first repairing and transferring device is arranged on the third sliding rail in a sliding mode; the first mounting frame is arranged above the second sliding rail and is positioned between the repairing action device and the third mechanical arm; the second sliding rail is arranged on the first mounting frame; the repairing and transferring device II is arranged on the sliding rail II in a sliding mode; and the first repairing and transferring device and the second repairing and transferring device are both provided with particle fixing devices.
Preferably, the repairing silicon wafer fixing device is provided with a repairing silicon wafer fixing action device.
Preferably, the first machine table is provided with a second mounting frame; a fourth sliding rail is arranged on the second mounting frame; the bulk transfer device and the substrate transfer device are arranged on the fourth slide rail in a sliding manner.
Compared with the prior art, the invention has the beneficial effects that: according to the Micro LED transfer device, the micron-sized vision sensor is adopted to obtain the distribution positions of the Micro LED particles, the ASIC driver is used for driving the LED array plate, the ultraviolet reversible adhesive layer in the sticking plate is subjected to directional projection exposure through the lens array to obtain a precise sticking area, and then the Micro LED particles are precisely stuck, so that the transfer of the Micro LED particles is realized, and the Micro LED transfer device can be used for transferring a large amount of carrier change and a small amount of carrier repair. Furthermore, the adhesive force of the ultraviolet light reversible adhesive layer is obtained by adopting an adhesive force sensor and utilizing the separation action, so that a new ultraviolet light reversible adhesive layer is replaced in time, and the production efficiency is improved. The Micro LED transfer integrated equipment provided by the invention utilizes a huge transfer device, a detection device and a repair transfer device which are connected together by a base to form compact equipment, so that the efficiency of the equipment is greatly improved; the efficiency and yield are higher, the cost is lower, and the process is simpler; and through material science and technology, the huge transfer, detection and repair work of the very difficult Micro LED can be completed very quickly and effectively, and the rapid and vigorous development of the Micro LED display industry can be promoted.
Drawings
FIG. 1 is a schematic structural diagram of a first embodiment of the Micro LED transfer device (power components are a multi-axis rotary robot structure, and LED display boards are arranged on the side);
FIG. 2 is a schematic structural view of a second embodiment of the Micro LED transfer device of the present invention (the power unit is a slide rail type mechanical arm structure, and the LED display board is placed upward);
FIG. 3 is a block circuit diagram of the embodiment of FIGS. 1 and 2;
FIG. 4 is a schematic structural diagram of a first embodiment of a Micro LED bulk transfer, detection and repair apparatus according to the present invention;
FIG. 5 is an enlarged view of a portion of the prosthetic transfer device of FIG. 4;
FIG. 6 is a circuit block diagram of the embodiment of FIG. 4;
FIG. 7 is a front view of another embodiment of a Micro LED bulk transfer, inspection and repair apparatus of the present invention;
FIG. 8 is a top view of another embodiment of a Micro LED bulk transfer, inspection and repair apparatus of the present invention;
FIG. 9 is a schematic perspective view of another embodiment of a Micro LED bulk transfer, inspection and repair apparatus according to the present invention.
Reference numbers of fig. 1-6:
s transfer device S1 bulk transfer device
S2 prosthetic devices Q detection device
11 original stage 12 Micro LED particle
21 target stage 22 target substrate
31 power part 32 sticking plate
40 transfer control circuit 41 micron-scale vision sensor
42 ASIC driver 421 array plate
422 lens array 50 inspection station
51 lighting fixture 52 micron-scale detection vision sensor
53 detect slide rail 54 and detect power part
60 repair stage 61 substrate to be repaired
Visual sensor for 62 ultralow temperature probe 63 micron-scale repair
64 conductive silver paddle 65 repair power component
66 good product carrier 67 mesh layer
70 master controller 120 Micro LED original carrier
220 anisotropic conductive film 500 detection control circuit
600 repair transfer control circuit 69 Micro LED good product particles
31A power component
Reference numerals of fig. 7-9:
1. a bulk transfer unit; 2. a detection unit; 3. a dead pixel repairing unit; 4. a control system; 01. A first machine platform; 02. a second machine platform; 03. a third machine platform; 04. a first mechanical arm; 05. a second mechanical arm; 06. A mechanical arm III; 104. a bulk transfer device; 105. a substrate; 106. a substrate transfer device; 107. a silicon wafer fixing device; 108. a precision positioning device; 109. a substrate fixing device; 201. a substrate to be detected; 202. a lighting detection device; 203. a lighting operation device; 204. lighting the position measuring device; 205. a lighting control device; 206. illuminating the capture device; 301. an upper heating device; 302. a repair operation device; 303. a defective substrate; 304. an implant device; 305. repairing the first transfer device; 306. repairing and transferring the second device; 307. repairing the silicon wafer fixing device; 311. repairing the silicon chip fixing action device; 312. a lower heating device; 313. and (4) a particle fixing device.
Detailed Description
The technical solutions of the present invention will be described clearly and completely through the following embodiments, which are only some, but not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the embodiments of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the invention. As used in the description of the embodiments of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It is emphasized in particular that the construction shown in the figures is a schematic representation after enlargement, the enlargement scale of the individual parts differing from one another in order to more clearly show the principle of the construction of the device according to the invention in operation.
As shown in fig. 1-3, the Micro LED transfer device S of the present invention includes an original stage 11 carrying Micro LED particles 12, a target stage 21 carrying a target substrate 22, and a power component 31 disposed at the side of the original stage 11 and the target stage 21; the system also comprises a micron-scale vision sensor 41 arranged above the original carrier 11, a transfer control circuit 40 connected with the micron-scale vision sensor 41, an ASIC driver 42 connected with the transfer control circuit 40, an LED array plate 421 connected with the ASIC driver 42, and a lens array 422 arranged on the front side of the LED array plate 421; the movable end of the power component 31 is provided with an adhesion plate 32, and the adhesion plate 32 is provided with an ultraviolet reversible adhesive layer 321; the micron-sized vision sensor 41 captures the distribution position of Micro LED particles in the original carrier 11, converts the distribution position into an image signal and transmits the image signal to the transfer control circuit 40; then, the signal is processed by the transfer control circuit 40 and converted into a control signal to be output to the ASIC driver 42; the ASIC driver 42 drives the LED array board 421 to display the same image signal, and irradiates the ultraviolet reversible adhesive layer through the lens array 422, so that only the position where the Micro LED particles are distributed has adhesive force, and the other positions do not have adhesive force; then, the power component 31 drives the adhering plate 32 to the original carrying stage 11, Micro LED particles at corresponding positions are directly adhered and taken, the Micro LED particles are transferred to the specified position of the target substrate 22 and adhered by the anisotropic conductive film arranged on the surface of the target substrate 22, the adhesion force between the Micro LED particles and the anisotropic conductive film is greater than that between the Micro LED particles and the ultraviolet light reversible adhesive layer, the power component 31 moves upwards, separation of the ultraviolet light reversible adhesive layer and the Micro LED particles is achieved, and the Micro LED particles are transferred to the target substrate 22.
More specifically, the original carrier may be a bulk carrier, a wafer with Micro LEDs or a storage disk with Micro LEDs already arranged. So it is also called Micro LED bulk transfer device.
In other embodiments, a viscosity sensor is disposed between the movable end of the power unit and the adhesion plate, when the adhesion plate is separated from the Micro LED particles, the surface viscosity of the adhesion plate is detected, and when the detection value is lower than a predetermined value, the ultraviolet light reversible adhesive layer on the surface of the adhesion plate is replaced.
The invention also discloses a Micro LED bulk transfer method, which comprises the following steps of:
a step of reducing the adhesive force, in which the adhesive force is reduced when the distribution position of the Micro LED particles which are transferred in the previous huge amount is irradiated by the ultraviolet light with the wavelength of 280-400nm in the area which is not included by the distribution device which is transferred in the current huge amount during the second huge amount transfer;
and (3) replacing the ultraviolet reversible adhesive layer, namely, arranging a viscous force sensor between the movable end of the power component and the sticky plate, detecting the surface viscous force of the sticky plate when the sticky plate is separated from the Micro LED particles, and replacing the ultraviolet reversible adhesive layer on the surface of the sticky plate when the detection value is lower than the set value.
In the embodiment of fig. 1-3, the original carrier may also be a good product carrier, provided with Micro LED good product particles, when used for repair. Become Micro LED prosthetic devices, the concrete structure is:
the target microscope stage is a repairing microscope stage and is used for repairing Micro LED particles; the target substrate is a substrate to be repaired; the system also comprises a micron-sized vision sensor arranged above the original carrying platform, a repair transfer control circuit connected with the micron-sized vision sensor, an ASIC driver connected with the repair transfer control circuit, an LED array plate connected with the ASIC driver and a lens array arranged on the front side of the LED array plate; the movable end of the power component is provided with a sticking plate which is provided with an ultraviolet reversible glue layer; the micron-sized vision sensor captures the distribution position of Micro LED dead pixel particles in the repairing carrier, converts the distribution position into an image signal and transmits the image signal to the repairing transfer control circuit; then the signal is processed by a repair transfer control circuit and is converted into a control signal to be output to an ASIC driver; the ASIC driver drives the LED array plate to display two same image signals, and the ultraviolet reversible adhesive layer is irradiated through the lens array, so that only the positions where Micro LED dead pixel particles are distributed have adhesive force, and other positions do not have adhesive force; one of the image signals generates a viscosity distribution area for adhering Micro LED dead pixel particles, and the other image signal generates a viscosity distribution area for adhering Micro LED good product particles; then the power part drives the adhesion plate to the repair carrier, directly adheres the Micro LED dead pixel particles at the corresponding positions, transfers the particles to the upper part of the good product carrier, adheres the Micro LED good product particles to the Micro LED dead pixel particle positions of the repair carrier, and is adhered by the nano conductive silver paste arranged on the surfaces of the Micro LED dead pixel particle positions, the adhesion force between the Micro LED good product particles and the nano conductive silver paste is larger than that between the Micro LED good product particles and the ultraviolet light reversible adhesive layer, the power part moves upwards to realize the separation of the ultraviolet light reversible adhesive layer and the Micro LED good product particles, and the Micro LED good product particles are transferred to a substrate to be repaired; the repairing carrying platform is also provided with a lighting fixture for lighting the substrate to be repaired.
That is, the structure shown in fig. 1-3 is utilized, but the ultraviolet light reversible glue layer has double functions, and one part of the ultraviolet light reversible glue layer is used for Micro LED dead pixel particles; the other part is used for sticking Micro LED good-product particles. More specifically, the repairing transfer control circuit accumulates the adhesion force distribution area for adhering Micro LED dead pixel particles, and sends out a signal for replacing the ultraviolet light reversible adhesive layer when the concentration of the adhesion force distribution area reaches a set value of the ultraviolet light reversible adhesive layer of the adhering plate.
The Micro LED repairing method adopts the repairing device; comprises a step of reducing the adhesive force, a step of removing and a step of moving the irradiation position:
the step of reducing the adhesive force, which is to irradiate the distribution position of the Micro LED particles which are subjected to the previous restoration transfer and are not contained in the distribution device subjected to the current restoration transfer by ultraviolet light with the wavelength of 280-400nm during the second restoration transfer, so that the adhesive force is reduced;
the method comprises the following steps that a removing step is carried out, wherein a micron-sized vision sensor for repairing is arranged for shooting the position of Micro LED dead pixel particles to obtain dead pixel image signals, then ultraviolet light generated by an LED array plate is utilized for carrying out corresponding irradiation on an ultraviolet light reversible adhesive layer according to the dead pixel image signals, and the corresponding position obtains the adhesive force, so that the ultraviolet light reversible adhesive layer is close to a substrate to be repaired, and the Micro LED dead pixel particles are adhered and removed;
and moving the irradiation position, namely when the particles good for the Micro LED are picked up for the second time, the irradiation position of the ultraviolet light reversible glue layer is different from the position when the particles good for the Micro LED are picked up for the last time.
4-6, the Micro LED bulk transfer, inspection and repair apparatus of the present invention includes a bulk transfer device S1, an inspection device Q and a repair device S2 with bases coupled together; the bulk transfer device S1 is the Micro LED bulk transfer device described above, and the repair device S2 is the Micro LED repair device described above.
More specifically, the detecting device Q includes a detecting station 50 disposed on the base, a lighting fixture 51 disposed on a side of the detecting station 50 and configured to light Micro LED particles disposed on the target substrate, and a micron-level visual sensor 52 disposed above the detecting station 50 for detection.
More specifically, the device further comprises a detection slide rail 53 connected between the bulk transfer device S1 and the detection device Q, and after the target substrate slides to the detection station 50 from the target stage of the bulk transfer device, the target substrate is taken away by the detection power component 54 when the target substrate is qualified through detection; when Micro LED defective particles are detected, the detection power unit 54 is provided to transport the target substrate to the repair stage 60, and the target substrate becomes a substrate to be repaired 61.
More specifically, the repairing carrier 60 is further provided with an ultra-low temperature probe 62 located below the substrate 61 to be repaired, and the ultra-low temperature probe is pressed on the Micro LED dead pixel particles to eliminate the adhesive force of the anisotropic conductive film; the diameter of the ultra-low temperature probe is close to 20-30 μm; the repair carrier 60 is further provided with a lighting jig (not shown) for lighting the substrate 61 to be repaired; the Micro-scale repairing vision sensor 63 is further arranged to shoot positions of Micro LED dead pixel particles to obtain dead pixel image signals, and then the ultraviolet light generated by the LED array plate is used for correspondingly irradiating the ultraviolet light reversible adhesive layer according to the dead pixel image signals, so that the corresponding positions obtain adhesive force, the ultraviolet light reversible adhesive layer is attached to the substrate 61 to be repaired, and the Micro LED dead pixel particles are adhered and removed; the repairing device S2 is further provided with a conductive silver paddle 64 located above the substrate 61 to be repaired, the tail end of the conductive silver paddle 64 is stained with nanometer conductive silver paste, and the conductive silver paddle 64 paints the nanometer conductive silver paste on the Micro LED dead pixel particles.
More specifically, the repair power unit 65 of the repair apparatus S2 picks up the corresponding Micro LED good particles from the original stage (also called the good particle stage 66) by using a pick-up plate according to the bad point image signal, and implants the Micro LED good particles to the position of the Micro LED bad particle on the substrate 61 to be repaired of the repair stage 60.
More specifically, the repairing carrier 60 is provided with a mesh layer 67 for bearing the substrate 61 to be repaired, and the ultra-low temperature probe 62 penetrates through the mesh layer 67 and is pressed below the Micro LED dead particles at a temperature lower than-70 ℃ to release the adhesion between the Micro LED dead particles and the target substrate. And a horizontal plane driving part for driving the mesh layer to avoid the blocking of the ultra-low temperature probe by the solid portion of the mesh layer. After the repaired substrate 61 is repaired, the substrate is sent back to the detection device, the lighting fixture is connected again, the lighting test is carried out to confirm that the repairing work is completed smoothly, and after the detection is correct, the substrate is transferred to the next qualified process by the detection power part.
In order to realize the integrated operation of the bulk transfer apparatus, the detection apparatus, and the repair apparatus, an overall controller 70 is further required to cooperatively control the bulk transfer apparatus, the detection apparatus, and the repair apparatus.
Fig. 7-9 also disclose other embodiments of a Micro LED bulk transfer, detection and repair device of the present invention, which are specifically described as follows:
example one
As shown in fig. 7, the Micro LED huge transferring, detecting and repairing apparatus provided by the present invention includes a huge transferring unit 1, a detecting unit 2, a dead pixel repairing unit 3 and a control system 4.
As shown in fig. 8-9, the bulk transfer unit 1 includes a first machine table 01, a first robot arm 04, a bulk transfer device 104, a substrate 105, a substrate transfer device 106, a silicon wafer fixing device 107, a precision positioning device 108, and a substrate fixing device 109; the substrate 105 is disposed on the substrate fixture 109; the silicon wafer fixing device 107 and the substrate fixing device 109 are respectively arranged on the feeding end and the discharging end of the first machine table 01; the bulk transfer device 104 is arranged between the silicon wafer fixing device 107 and the substrate fixing device 109, and an ultraviolet light reversible adhesive layer capable of adjusting adhesive force is arranged on the bulk transfer device 104; the precision positioning device 108 is disposed on the bulk transfer device 104; the mechanical arm I04 is arranged on one side of the silicon wafer fixing device 107 and used for controlling incoming materials; the substrate transfer device 106 is disposed at one side of the substrate fixing device 109 for controlling discharging.
As shown in fig. 8-9, the detection unit 2 includes a second machine station 02, a second robot arm 05, a substrate 201 to be detected, a lighting detection device 202, a lighting action device 203, a lighting position measurement device 204, a lighting control device 205, and a lighting capture device 206; the lighting control device 205 and the lighting action device 203 are arranged on the feeding end of the second machine station 02; the substrate 201 to be detected is arranged on the lighting control device 205; the lighting detection device 202 is provided in the lighting operation device 203; the lighting position detector 204 is provided in the lighting detector 202; the lighting capture device 206 is disposed on the lighting position finding device 204; the second mechanical arm 05 is arranged at the discharge end of the second machine table 02 and used for taking out qualified products.
As shown in fig. 8-9, the defective pixel repairing unit 3 includes a third machine table 03, a third robot arm 06, an upper heating device 301, a repairing action device 302, a defective substrate 303, an implanting device 304, a repairing transfer component, a repairing silicon wafer fixing device 307, and a lower heating device 312; the lower heating device 312 and the repair action device 302 are arranged on one side of the third machine platform 03 close to the second machine platform 02; the defective substrate 303 is disposed on the lower heating device 312; the upper heating device 301 and the implantation device 304 are arranged on the repair action device 302; the repairing silicon wafer fixing device 307 is arranged on one side, far away from the second machine station 02, of the third machine station 03; the repair transfer assembly is arranged between the repair silicon wafer fixing device 307 and the repair action device 302; and the mechanical arm III 06 is arranged on one side of the silicon wafer repairing fixing device 307 and is used for feeding the repaired silicon wafer.
Example two
As shown in fig. 7, the Micro LED bulk transfer, detection and repair device provided by the present invention includes a bulk transfer unit 1, a detection unit 2, a dead pixel repair unit 3 and a control system 4. The mass transfer unit 1, the detection unit 2 and the dead pixel repair unit 3 are of an integrated structure.
As shown in fig. 8-9, the bulk transfer unit 1 includes a first machine table 01, a first robot arm 04, a bulk transfer device 104, a substrate 105, a substrate transfer device 106, a silicon wafer fixing device 107, a precision positioning device 108, and a substrate fixing device 109; the substrate 105 is disposed on the substrate fixture 109; the silicon wafer fixing device 107 and the substrate fixing device 109 are respectively arranged on the feeding end and the discharging end of the first machine table 01; the huge transfer device 104 is arranged between the silicon wafer fixing device 107 and the substrate fixing device 109, and an ultraviolet reversible adhesive layer capable of adjusting adhesive force is arranged on the huge transfer device 104; the precision positioning device 108 is disposed on the bulk transfer device 104; the mechanical arm I04 is arranged on one side of the silicon wafer fixing device 107 and used for controlling incoming materials; the substrate transfer device 106 is disposed at one side of the substrate fixing device 109 for controlling discharging.
More specifically, a first slide rail is arranged on the first machine table 01; the substrate positioning device 109 is slidably disposed on the first slide rail.
More specifically, the precision positioning device 108 is provided with a machine vision system, which includes a high-definition lens and a CCD camera, and the recognition precision reaches below 6 microns. The machine vision system is a system which is formed by identifying a wafer of Micro LEDs or a storage disc with the arranged Micro LEDs, converting images distributed by LED chips into digital signals after image signal processing and algorithm so as to match with an ASIC (application specific integrated circuit) driving chip, LED lenses arranged in an array, a rotating mirror and a scanning system.
More specifically, the bulk transfer device 104 is projected through the machine vision system such that the UV-curable adhesive layer with Micro LED distribution areas has adhesive properties and no adhesive properties at other locations.
More specifically, a mounting frame II is arranged on the machine table I01; a fourth sliding rail is arranged on the second mounting rack; the bulk transfer device 104 and the substrate transfer device 106 are slidably disposed on the fourth slide rail.
As shown in fig. 8 to 9, the inspection unit 2 includes a second machine base 02, a second robot arm 05, a substrate 201 to be inspected, a lighting inspection device 202, a lighting operation device 203, a lighting position finding device 204, a lighting control device 205, and a lighting capture device 206; the lightening control device 205 and the lightening action device 203 are arranged on the feeding end of the second marble machine platform 02; the substrate 201 to be detected is arranged on the lighting control device 205; the lighting detection device 202 is provided in the lighting operation device 203; the lighting position detector 204 is provided in the lighting detector 202; the lighting capture device 206 is disposed on the lighting position finding device 204; the second mechanical arm 05 is arranged at the discharging end of the second machine table 02 and used for taking out qualified products.
More specifically, a second sliding rail is arranged on the second machine station 02; the second sliding rail is arranged between the first machine station 01 and the third machine station 03; the lighting control device 205 is slidably disposed on the second slide rail.
As shown in fig. 8-9, the defective pixel repairing unit 3 includes a third machine table 03, a third robot arm 06, an upper heating device 301, a repairing action device 302, a defective substrate 303, an implanting device 304, a repairing transfer component, a repairing silicon wafer fixing device 307, and a lower heating device 312; the lower heating device 312 and the repair action device 302 are arranged on one side of the third machine platform 03 close to the second machine platform 02; the defective substrate 303 is disposed on the lower heating device 312; the upper heating device 301 and the implantation device 304 are arranged on the repair action device 302; the repairing silicon wafer fixing device 307 is arranged on one side, far away from the second machine station 02, of the third machine station 03; the repairing transfer component is arranged between the repairing silicon chip fixing device 307 and the repairing action device 302; and the mechanical arm III 06 is arranged on one side of the repairing silicon wafer fixing device 307 and is used for feeding the repairing silicon wafer.
More specifically, the repair transfer assembly comprises a first repair transfer device 305, a second repair transfer device 306, a particle fixing device 313, a third slide rail, a fourth slide rail and a first mounting rack; the third sliding rail is arranged on the third machine table 03 and is positioned below the repair action device 302; the first repairing and transferring device 305 is arranged on the third sliding rail in a sliding mode; the first mounting rack is arranged above the second sliding rail and is positioned between the repairing action device 302 and the third mechanical arm 06; the second sliding rail is arranged on the first mounting frame; the second repairing and transferring device 306 is arranged on the second sliding rail in a sliding mode; particle fixing devices 313 are arranged on the first repair transfer device 305 and the second repair transfer device 306.
More specifically, the repair silicon wafer fixing device 307 is provided with a repair silicon wafer fixing actuator 311.
The invention firstly identifies the wafer of the Micro LED or the storage disc arranged with the Micro LED by a machine vision system (lens + CCD) with high resolution and clear identification below 6 microns, converts the image distributed by the LED chip into a digital signal after image signal processing and algorithm, and then projects the digital signal on the surface of ultraviolet reversible adhesive (also called as light reversible adhesive) of a bulk transfer device 104 by matching with a system formed by an ASIC driving chip, LED lenses arranged in an array, a rotating mirror and a scanning system, only the position where the Micro LED is distributed has adhesive force, and other positions have no adhesive force, then directly sticks the Micro LED at the corresponding position of a silicon chip fixing device 107, and moves to the specified position of a target substrate 105 after the adhesion is finished, so as to carry out bulk transfer. After the transfer is complete, the bulk transfer device 104 automatically returns to the home position to be ready to re-identify the next Micro LED wafer or aligned storage disk. At this moment, machine vision recognition is carried out again, if the distribution position of the Micro LEDs is different from the previous time, the equipment can adjust the adhesion force of the surface of the adhesion mechanism according to the corresponding position and by utilizing ultraviolet light with two different wavelengths, and then the chip is adhered and taken and a huge amount of transfer is completed.
The substrate transfer device 106 transfers the Micro LED chips on the substrate 105. The lighting detection device 202, the lighting operation device 203, the lighting position measuring device 204, and the lighting control device 205 cooperate to perform a lighting test. This in-process is through accurate optical measurement device and accurate mechanical transmission, grating positioner, control system, and it can light to reach the locating position, then fixes a position dead center and makes system position mark through optical detection device, and qualified product of lighting shifts to outside the equipment through second 05 arms, and bad product moves to on the bad base plate 303. The method comprises the steps of firstly, carrying out desoldering on bad Micro LED particles by using a tiny ultralow-temperature probe (which can reach a low temperature below-70 ℃), removing the adhesive force of an anisotropic conductive adhesive film, then, allowing the surface of an adhesion mechanism to have the adhesive force only on the position of a bad Micro LED through an ultraviolet light control system, and pulling out the bad Micro LED chip. The upper heating device 301 and the lower heating device 312 heat the precision holes. The repair transfer assembly transfers the good Micro LED particles from the repair wafer fixture 307 to the removed position, and then the conductive silver paste is applied again. So just accomplish Micro LED's repair work, connect the tool of lighting again after restoreing, light the test in order to confirm that repair work is accomplished smoothly.
In summary, according to the Micro LED transfer device of the present invention, the micron-sized vision sensor is adopted to obtain the distribution position of the Micro LED particles, the ASIC driver is then used to drive the LED array board, and the lens array is used to perform directional projection exposure on the ultraviolet reversible adhesive layer in the pasting board to obtain a precise pasting area, so as to precisely paste the Micro LED particles, thereby realizing the transfer of the Micro LED particles, which can be used for a large amount of transfer when the carrier changes, and can also be used for a small amount of transfer when the carrier is repaired. Furthermore, the adhesive force of the ultraviolet light reversible adhesive layer is obtained by adopting an adhesive force sensor and utilizing the separation action, so that a new ultraviolet light reversible adhesive layer is replaced in time, and the production efficiency is improved. The Micro LED transfer integrated equipment provided by the invention utilizes a huge transfer device, a detection device and a repair transfer device which are connected together by a base to form compact equipment, so that the efficiency of the equipment is greatly improved; the efficiency and yield are higher, the cost is lower, and the process is simpler; and through material science and technology, the huge transfer, detection and repair work of the very difficult Micro LED can be completed very quickly and effectively, and the rapid and vigorous development of the Micro LED display industry can be promoted.
The technical contents of the present invention are further illustrated by the examples only for the convenience of the reader, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation based on the present invention is protected by the present invention. The protection scope of the invention is subject to the claims.
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| WO2024092560A1 (en) * | 2022-11-02 | 2024-05-10 | 京东方科技集团股份有限公司 | Multi-coordinate-system calibration and device alignment method, and mass transfer device |
| CN116352738B (en) * | 2023-02-10 | 2023-10-24 | 中科合肥技术创新工程院 | Electrostatic adsorption device with custom shape and adsorption method thereof |
| CN120981901A (en) * | 2023-05-15 | 2025-11-18 | 深超光电（深圳）有限公司 | Mass transfer device and mass transfer method |
| CN117080106B (en) * | 2023-09-21 | 2024-02-06 | 北京海炬电子科技有限公司 | A real-time co-location detection device for mass transfer of LED chips and its use method |
| CN121078869A (en) * | 2024-05-30 | 2025-12-05 | 京东方科技集团股份有限公司 | Transfer apparatus for electronic component |
| CN118448551B (en) * | 2024-07-08 | 2024-09-24 | 迈为技术(珠海)有限公司 | Mass transfer processing equipment and mass transfer processing method |
| CN119794581B (en) * | 2025-03-12 | 2025-06-06 | 深圳奇立电子科技有限公司 | Laser mass transfer method and device for Micro-LED Micro display device |
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| US9162880B2 (en) * | 2012-09-07 | 2015-10-20 | LuxVue Technology Corporation | Mass transfer tool |
| CN108122814B (en) * | 2017-10-27 | 2021-04-23 | 江西乾照光电有限公司 | A sorting and transferring method of LED core particles in LED chips |
| CN108461439B (en) * | 2018-04-20 | 2020-03-31 | 同辉电子科技股份有限公司 | Preparation and transfer method of Micro-LED chip |
| CN108962789A (en) * | 2018-06-25 | 2018-12-07 | 开发晶照明（厦门）有限公司 | Micro element transfer method and micro element transfer equipment |
| CN109661122B (en) * | 2018-11-09 | 2020-01-21 | 华中科技大学 | A selective mass transfer method suitable for miniature light-emitting diodes |
| CN109599463A (en) * | 2018-12-07 | 2019-04-09 | 广东工业大学 | A kind of pick-up structure and transfer method for the transfer of Micro-LED flood tide |
| CN209983033U (en) * | 2019-02-01 | 2020-01-21 | 南昌大学 | Novel detection, repair and pasting equipment for Micro LED chips |
| CN112750741B (en) * | 2019-10-29 | 2023-01-03 | 成都辰显光电有限公司 | Transfer substrate and transfer method of micro-component |
| CN111128813B (en) * | 2020-01-20 | 2022-10-28 | 福州大学 | Mu LED mass transfer method |
| CN111477650B (en) * | 2020-04-16 | 2020-11-10 | 广东工业大学 | Micro-LED bulk transfer method and transfer device |
| CN111370541A (en) * | 2020-04-20 | 2020-07-03 | 武汉华星光电技术有限公司 | Micro-LED chip dead pixel repairing method |
| CN111489992B (en) * | 2020-04-23 | 2024-03-29 | 京东方科技集团股份有限公司 | Manufacturing method of display substrate, display substrate and display device |
| CN211858650U (en) * | 2020-04-23 | 2020-11-03 | 恩利克（浙江）智能装备有限公司 | Quantum dot full-color Micro/Mini-LED display screen structure |
| CN113488572B (en) * | 2021-07-13 | 2023-01-03 | 东莞市中麒光电技术有限公司 | Device transfer method and device |
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