CN116529314A - Resin composition and molding - Google Patents
Resin composition and molding Download PDFInfo
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- CN116529314A CN116529314A CN202180075575.8A CN202180075575A CN116529314A CN 116529314 A CN116529314 A CN 116529314A CN 202180075575 A CN202180075575 A CN 202180075575A CN 116529314 A CN116529314 A CN 116529314A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L59/00—Compositions of polyacetals; Compositions of derivatives of polyacetals
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Abstract
本发明提供能够进行薄壁成型、并且遮光性优异的树脂组合物、以及使用了上述树脂组合物的成型体。在上述树脂组合物中，相对于聚缩醛树脂100质量份，以合计超过2.0质量份且为10.0质量份以下的比例包含炭黑及分散剂，炭黑及分散剂的总量中的炭黑的比例超过60质量％且小于100质量％，树脂组合物在190℃、负载2.16kg砝码的条件下测得的熔体体积流动速率超过50cm3/10分且小于100cm3/10分。The present invention provides a resin composition capable of thin-wall molding and having excellent light-shielding properties, and a molded article using the resin composition. In the above resin composition, carbon black and a dispersant are contained in a ratio of more than 2.0 parts by mass and 10.0 parts by mass or less in total with respect to 100 parts by mass of the polyacetal resin, and the carbon black in the total amount of the carbon black and the dispersant is The proportion is more than 60% by mass and less than 100% by mass, and the melt volume flow rate of the resin composition measured under the conditions of 190°C and a load of 2.16kg weight is more than 50cm 3 /10 minutes and less than 100cm 3 / 10 minutes.
Description
Technical Field
The present invention relates to a resin composition and a molded article. In particular, to resin compositions suitable for use in digital device component applications.
Background
Polyacetal resins of engineering plastics are excellent in mechanical properties, sliding properties, friction/wear properties, heat resistance, molding processability and the like. Accordingly, a resin composition containing a polyacetal resin is widely used for various mechanical parts, electrical parts, and the like of automobiles, OA equipment, and the like.
As an example of a resin composition using a polyacetal resin, patent document 1 discloses a polyacetal resin composition in which carbon black (B) and a dispersant (C) are blended in a proportion of more than 4 parts by mass and 10 parts by mass or less in total, based on 100 parts by mass of polyacetal resin (a), and the proportion of the carbon black in the total blending amount of the carbon black (B) and the dispersant (C) is more than 60% by mass and less than 100% by mass.
Prior art literature
Patent literature
Patent document 1: japanese patent application laid-open No. 2017-014304
Disclosure of Invention
Problems to be solved by the invention
However, in recent years, various mechanical parts and electrical parts using polyacetal resin are required to be light-weighted and have high light-shielding properties depending on the application. In order to reduce the weight, it is necessary to thin the molded article, but the light-shielding property tends to be inferior as the molded article is thinned. Therefore, in order to secure light-shielding properties, a dispersant containing carbon black together with carbon black may be considered for the thin-walled molded article. However, if the above-mentioned additives are blended in order to secure light-shielding properties, fluidity may be poor and thin-wall molding may be difficult.
The present invention has been made to solve the above problems, and an object thereof is to provide a resin composition which can be molded into thin walls and has excellent light shielding properties, and a molded article using the resin composition.
Means for solving the problems
Based on the above-mentioned problems, the present inventors have studied and found that the above-mentioned problems can be solved by adjusting the MVR of the resin composition itself while adjusting the blending amount of the carbon black and the dispersant.
Specifically, the above-described problem is solved in the following manner.
< 1 > a resin composition, wherein,
the resin composition contains carbon black and a dispersant in a total amount of more than 2.0 parts by mass and not more than 10.0 parts by mass per 100 parts by mass of the polyacetal resin,
the proportion of carbon black in the total amount of the carbon black and the dispersant is more than 60% by mass and less than 100% by mass,
the resin composition had a melt volume flow rate (melt volume rate) of more than 50cm measured at 190℃under a load of 2.16kg weight 3 10 minutes and less than 100cm 3 And/10 minutes.
< 2 > the resin composition according to < 1 >, wherein,
the melt volume flow rate of the resin composition exceeds 60cm measured at 190 ℃ under the condition of loading 2.16kg weight 3 10 minutes and less than 100cm 3 And/10 minutes.
< 3 > the resin composition according to < 1 > or < 2 >, wherein,
the content of the carbon black is more than 1.5 parts by mass and 9 parts by mass or less relative to 100 parts by mass of the polyacetal resin.
< 4 > the resin composition according to < 1 > or < 2 >, wherein,
the content of the carbon black is more than 1.5 parts by mass and not more than 6 parts by mass relative to 100 parts by mass of the polyacetal resin.
< 5 > the resin composition according to < 1 > or < 2 >, wherein,
the content of the carbon black is more than 1.5 parts by mass and not more than 4 parts by mass relative to 100 parts by mass of the polyacetal resin.
A resin composition according to any one of < 1 > < 5 >,
the dispersant includes at least one selected from polyolefin wax, fatty acid amide, polyalkylene glycol, and silicone.
A resin composition according to any one of < 1 > < 5 >,
the dispersant includes at least two selected from polyolefin wax, fatty acid amide, polyalkylene glycol, and silicone.
< 8 > the resin composition according to < 6 > or < 7 >, wherein,
the dispersant comprises a fatty acid amide.
A resin composition according to any one of < 6 > < 8 >,
the dispersant contains silicone.
< 10 > the resin composition according to < 7 >, wherein,
the dispersant includes an aliphatic amide and a silicone.
A resin composition according to any one of < 1 > < 10 >,
the amount of the fatty acid amide in the dispersant is 40 mass% or less relative to the total amount of the dispersant.
A resin composition according to any one of < 1 > < 11 >,
the polyacetal resin had a melt volume flow rate of more than 45cm as measured at 190℃under a load of 2.16kg weight 3 10 minutes and less than 100cm 3 And/10 minutes.
A resin composition according to any one of < 1 > < 12 > which is a resin composition for an aperture blade of a digital camera.
A resin composition according to any one of < 1 > < 13 >,
when the resin composition is molded to a thickness of 0.05mm, the total light transmittance measured in accordance with JIS-K-7136 is 2% or less.
A resin composition according to any one of < 1 > < 13 >,
when the resin composition is molded to a thickness of 0.05mm, the total light transmittance measured in accordance with JIS-K-7136 is 1% or less.
A molded article of < 16 > which is formed from the resin composition of any one of < 1 > - < 15 >.
A shaped body according to < 17 > and < 16 >, wherein,
the molded article is a digital device component.
A shaped body according to < 18 > and < 16 >, wherein,
the molded body is a diaphragm blade of a digital camera.
A molded article according to any one of < 16 > < 18 >,
the thickness of the thinnest wall portion of the molded article is 0.1mm or less.
A molded article according to any one of < 16 > < 18 >,
the thickness of the thinnest wall portion of the molded article is 0.075mm or less.
ADVANTAGEOUS EFFECTS OF INVENTION
The present invention can provide a resin composition which can be molded into thin walls and has excellent light shielding properties, and a molded article using the resin composition.
Detailed Description
Hereinafter, a mode for carrying out the present invention (hereinafter, simply referred to as "present embodiment") will be described in detail. The present embodiment described below is an example for explaining the present invention, and the present invention is not limited to the present embodiment.
In the present specification, "to" is used in a sense including values described before and after the "to" as a lower limit value and an upper limit value.
In the present specification, unless otherwise specified, various physical property values and characteristic values are values at 23 ℃.
The standards shown in the present specification may differ depending on the method of measurement depending on the year, and unless otherwise specified, the standards are based on the time of application.
The resin composition of the present embodiment contains a polyacetal resin, and carbon black and a dispersant in a total amount of more than 2.0 parts by mass and 10.0 parts by mass or less based on 100 parts by mass of the polyacetal resin, wherein the carbon black and the dispersant are contained in a total amount of more than 60% by mass and less than 100% by mass, and the resin composition has a melt volume flow rate (hereinafter, sometimes referred to as "MVR") of more than 50cm measured under a weight of 2.16kg at 190 ℃ 3 10 minutes and less than 100cm 3/ 10 minutes.
With such a constitution, a resin composition which can be molded into a thin wall and has excellent light shielding properties can be provided.
< polyacetal resin >)
The resin composition of the present embodiment contains a polyacetal resin. By including the polyacetal resin, a molded article excellent in sliding properties can be obtained.
The polyacetal resin used in the present embodiment is a copolymer containing an oxymethylene group and an oxyalkylene group having 2 or more carbon atoms as structural units.
Examples of the oxyalkylene group having 2 or more carbon atoms include: ethylene oxide, propylene oxide, butylene oxide, and the like. Among them, the oxyethylene group is preferable from the viewpoint of more sufficiently suppressing the deterioration of the characteristics of the polyacetal resin.
In the polyacetal resin, the proportion of the oxyalkylene group having 2 or more carbon atoms is preferably 0.3 to 6.0 mol% relative to 100 mol% of the oxymethylene group. When the amount is 0.3 mol% or more, the polyacetal resin has more sufficient heat stability. Further, by setting the amount to 6.0 mol% or less, the crystallinity of the polyacetal resin is further improved, and a significant decrease in the strength and a decrease in the creep fatigue property of the resin composition can be sufficiently suppressed. When the ratio is in the range of 0.3 to 6.0 mol%, the thermal stability of the polyacetal resin is further improved as compared with the case where the ratio is outside the range, and the resin composition can produce a molded article having more excellent impact resistance. The above ratio is more preferably 0.5 to 5.5 mol%, still more preferably 0.7 to 5.0 mol%, still more preferably 1.0 to 4.5 mol%.
In order to produce the polyacetal resin, three resins are generally usedAlkane is used as a main raw material. In addition, for introducing an oxyalkylene group having 2 or more carbon atoms into the polyacetal resin, for example, a cyclic formal or a cyclic ether may be used. Specific examples of the cyclic formal include: 1, 3-Dioxapentalene, 1, 3-Di +.>Specific examples of the cyclic ether include an alkane, 1, 3-dioxepane, 1,3, 5-trioxepane, 1,3, 6-trioxooctane, and the like: ethylene oxide, propylene oxide, butylene oxide, and the like. For introducing an oxyethylene group into a polyacetal resin, for example, 1, 3-dioxolane may be used, and for introducing an oxypropylene group, 1, 3-di +.>For introducing the oxybutylene, 1, 3-dioxepan may be used.
The polyacetal resin used in the present embodiment preferably has a high MVR. Specifically, the polyacetal resin used in the present embodiment preferably has an MVR of more than 45cm as measured at 190℃under a load of 2.16kg weight 3 10 minutes, more preferably 50cm 3 More preferably 60cm per 10 minutes 3 More preferably 65cm per 10 minutes 3 More preferably at least 10 minutes, still more preferably 70cm 3 And/or more than 10 minutes. When the fluidity is not less than the lower limit, fluidity tends to be high. The MVR of the polyacetal resin is preferably less than 100cm 3 10 minutes, more preferably 90cm 3 Less than 10 minutes, more preferably 80cm 3 Preferably less than 10 minutes, more preferably 76cm 3 And/or less than 10 minutes. When the upper limit value is less than or equal to the above, the thin shape tends to be more effectively maintained.
MVR was measured as described in examples to be described later.
The content of the polyacetal resin in the resin composition of the present embodiment is preferably 90% by mass or more, more preferably 93% by mass or more, and still more preferably 95% by mass or more in the resin composition. When the lower limit value is equal to or higher than the above, the thin shape tends to be more effectively maintained. The content of the polyacetal resin is preferably 99 mass% or less in the resin composition. When the upper limit value is less than or equal to the above, more excellent light shielding properties can be achieved with a thin wall.
The resin composition of the present embodiment may contain only one polyacetal resin, or may contain two or more polyacetal resins. When two or more types are contained, the total amount thereof is preferably within the above range.
< carbon black >
The resin composition of the present embodiment contains carbon black. By containing carbon black, a molded article excellent in light shielding properties can be obtained.
Examples of the carbon black used in the present embodiment include furnace black, acetylene black, channel black, and soot (lamp black).
The average particle diameter of the carbon black is not particularly limited, but is preferably 5nm or more, more preferably 10nm or more, and still more preferably 15nm or more. When the lower limit value is not less than the above, the dispersibility of carbon black tends to be further improved. The average particle diameter of the carbon black is preferably 50nm or less, more preferably 40nm or less, still more preferably 30nm or less, still more preferably 25nm or less. When the light shielding property is less than or equal to the upper limit, the light shielding property tends to be further improved. Here, the average particle diameter refers to an average of particle diameters of a plurality of carbon blacks observed using a scanning electron microscope.
The content of carbon black in the resin composition of the present embodiment is preferably more than 1.5 parts by mass relative to 100 parts by mass of the polyacetal resin. When the light shielding property is set to the lower limit value or more, the light shielding property tends to be further improved. The content of the carbon black is preferably 9 parts by mass or less, more preferably 6 parts by mass or less, further preferably 4 parts by mass or less, and further preferably 3 parts by mass or less, based on 100 parts by mass of the polyacetal resin. When the upper limit value is less than or equal to the above, fluidity required for thin-wall molding tends to be more effectively maintained.
The resin composition of the present embodiment may contain only one kind of carbon black, or may contain two or more kinds. When two or more types are contained, the total amount thereof is preferably within the above range.
< dispersant >)
The resin composition of the present embodiment contains a dispersant. By including the dispersant, the carbon black is dispersed more effectively, and a molded article having more excellent light shielding properties can be obtained.
The dispersant is not particularly limited as long as it can disperse the carbon black in the polyacetal resin, and preferably contains at least one selected from the group consisting of polyolefin wax, fatty acid amide, polyalkylene glycol and silicone.
One embodiment of the above dispersant comprises a fatty acid amide.
Another embodiment of the above dispersant comprises a silicone.
Another embodiment of the dispersant comprises an aliphatic amide and a silicone.
By using the above-mentioned dispersant, the slidability of the molded article can be further improved. In the present embodiment, a combination of at least two or more (preferably 2 to 4, more preferably 3) selected from polyolefin waxes, fatty acids, fatty acid amides, polyalkylene glycols, and silicones is preferable. By combining two or more kinds, a molded article having more excellent slidability tends to be obtained. In the resin composition of the present embodiment, the dispersant preferably contains at least two selected from the group consisting of polyolefin wax, fatty acid amide, polyalkylene glycol and silicone, and more preferably a mixture of polyolefin wax, fatty acid amide and silicone is used.
Examples of the polyolefin wax include polyethylene wax and polypropylene wax.
Examples of the fatty acid include: higher fatty acids such as stearic acid, oleic acid, caprylic acid, lauric acid, ricinoleic acid, and behenic acid.
The fatty acid amide is a compound obtained by dehydration reaction of a higher fatty acid and/or a polybasic acid with a diamine. The higher fatty acid is preferably a saturated aliphatic monocarboxylic acid having 16 or more carbon atoms, for example, 16 to 30 carbon atoms, and specifically includes: palmitic acid, stearic acid, behenic acid, montanic acid, and the like. Examples of the polybasic acid include carboxylic acids of a dibasic acid or more, for example, aliphatic dicarboxylic acids such as malonic acid, succinic acid, adipic acid, sebacic acid, pimelic acid, azelaic acid, and the like, aromatic dicarboxylic acids such as phthalic acid, terephthalic acid, and the like, and alicyclic dicarboxylic acids such as cyclohexyl dicarboxylic acid, cyclohexyl succinic acid, and the like. Examples of the diamine include: ethylenediamine, 1, 3-diaminopropane, 1, 4-diaminobutane, hexamethylenediamine, m-xylylenediamine, toluenediamine, p-xylylenediamine, phenylenediamine, isophoronediamine, and the like. Specific examples of the fatty acid amide include stearic acid amide, behenic acid amide, montanic acid amide, methylene distearic acid amide, ethylene distearic acid amide, and the like.
Examples of the polyalkylene glycol include polymethylene glycol, polyethylene glycol, polypropylene glycol, polytetramethylene glycol, polypentadiol, polyhexamethylene glycol, polyheptanediol, polyoctanediol, polynonadiol, and polydecanediol.
Examples of the silicone include silicone oils having properties of oil, rubber, resin, etc., silicone rubbers, silicone resins, silicone greases containing metal soaps, etc. Specific examples of the silicone include: the polydimethylsiloxane, an organosiloxane in which a part of methyl groups of the polydimethylsiloxane is substituted with phenyl groups, an organosiloxane in which a part of methyl groups of the polydimethylsiloxane is substituted with hydrogen or an alkyl group having 2 or more carbon atoms, an organosiloxane in which a part of methyl groups of the polydimethylsiloxane is substituted with a halophenyl group, an organosiloxane in which a part of methyl groups of the polydimethylsiloxane is substituted with a fluoroester group, an epoxy-modified organosiloxane, an amino-modified organosiloxane, an alcohol-modified organosiloxane, an alkyl aralkyl organosiloxane, a polyether-modified organosiloxane, or the like.
Preferably, the silicone has a kinematic viscosity of 50 ten thousand cSt or more at 25 ℃. By using a silicone having a kinematic viscosity of 50 ten thousand cSt or more at 25 ℃, the appearance of the obtained molded article becomes more excellent, and higher sliding characteristics can be maintained. The upper limit of the kinematic viscosity is not particularly limited, but is preferably 200 ten thousand cSt or less, for example.
The content of the dispersant in the resin composition of the present embodiment is preferably 0.5 parts by mass or more, more preferably 0.7 parts by mass or more, and still more preferably 0.8 parts by mass or more, based on 100 parts by mass of the polyacetal resin. When the lower limit value is not less than the above, the dispersibility of carbon black tends to be further improved. The content of the dispersant is preferably 7.0 parts by mass or less, more preferably 6.0 parts by mass or less, still more preferably 4.0 parts by mass or less, and still more preferably 2.0 parts by mass or less, based on 100 parts by mass of the polyacetal resin. When the upper limit value is less than or equal to the above, the strength inherent in the polyacetal resin tends to be maintained efficiently.
The resin composition of the present embodiment may contain only one kind of dispersant, or may contain two or more kinds. When two or more types are contained, the total amount thereof is preferably within the above range.
The total content of the carbon black and the dispersant in the resin composition of the present embodiment exceeds 2.0 parts by mass, preferably 2.5 parts by mass or more, and more preferably 2.8 parts by mass or more, based on 100 parts by mass of the polyacetal resin. When the light shielding property is set to the lower limit value or more, the light shielding property tends to be further improved. The total content of the carbon black and the dispersant is 10.0 parts by mass or less, preferably 8.0 parts by mass or less, more preferably 6.0 parts by mass or less, still more preferably 5.0 parts by mass or less, and still more preferably 4.0 parts by mass or less, based on 100 parts by mass of the polyacetal resin. By setting the upper limit value or less, the strength inherent in the polyacetal resin can be more effectively exhibited.
In the resin composition of the present embodiment, the proportion of carbon black in the total amount of carbon black and dispersant exceeds 60 mass%, and is preferably 61 mass% or more, and more preferably 62 mass% or more. When the light shielding property is set to the lower limit value or more, the light shielding property tends to be further improved. The ratio of carbon black to the total amount of the carbon black and the dispersant is less than 100% by mass, preferably 90% by mass or less, more preferably 80% by mass or less, and still more preferably 75% by mass or less. When the upper limit value is less than or equal to the above, the light-shielding property is ensured and the thin shape is more effectively maintained.
< other Components >
The resin composition of the present embodiment may contain other components than the above components. Specifically, examples of the other components include inorganic fillers, heat stabilizers, antioxidants, weather stabilizers, light stabilizers, ultraviolet absorbers, crystal nucleating agents, antistatic agents, antibacterial agents, and the like. These components may be used singly or in combination of two or more.
The resin composition in the present embodiment may be substantially free of an inorganic filler. By substantially free, it is meant that the content of the inorganic filler in the resin composition in the present embodiment is less than 1% by mass of the resin composition.
The resin composition of the present embodiment is blended so that the total of the polyacetal resin, the carbon black and the dispersant, and other components blended as needed, reaches 100 mass%. The total amount of the polyacetal resin, the carbon black and the dispersing agent is preferably 95 to 100% by mass, more preferably 99 to 100% by mass, of the resin composition.
Method for producing resin composition
The method for producing the resin composition of the present embodiment is not particularly limited, and the resin composition can be produced by various methods known heretofore as a method for producing a resin composition. For example, it is possible to employ: (1) A method of mixing all the components constituting the resin composition, feeding the mixture to an extruder, and melt-kneading the mixture to obtain a granular composition; (2) A method in which a part of the components constituting the resin composition is fed from a main feed port of an extruder, and the remaining components are fed from a side feed port, and melt-kneaded to obtain a granular composition; (3) A method of temporarily preparing particles having different compositions by extrusion or the like, mixing the particles, and adjusting the mixture to a given composition; (4) A method of obtaining a predetermined resin composition by mixing a predetermined amount of compounding ingredients with or coating a predetermined amount of compounding ingredients on the surface of the particles or pulverized polyacetal resin; etc.
Properties/physical Properties of the resin composition
The resin composition of the present embodiment has a high MVR. Specifically, the MVR of the resin composition measured at 190℃under a load of 2.16kg weight exceeds 50cm 3 10 minutes, preferably 55cm 3 More preferably more than 60cm per 10 minutes 3 10 minutes, more preferably 61cm 3 More preferably at least 10 minutes, still more preferably 62cm 3 And/or more than 10 minutes. When the fluidity is set to the lower limit value or more, fluidity tends to be further improved. The MVR is less than 100cm 3/ 10 minutes, preferably 90cm 3 Less than 10 minutes, more preferably 80cm 3 And/or less than 10 minutes. When the upper limit value is less than or equal to the above, the thin shape tends to be more effectively maintained.
MVR was measured by the description of examples described below.
The resin composition of the present embodiment is preferably excellent in light-shielding property. Specifically, the total light transmittance measured in accordance with JIS-K-7136 when the resin composition is molded to a thickness of 0.05mm is preferably 2% or less, more preferably 1.5% or less, and still more preferably 1% or less. The lower limit of the total light transmittance is preferably 0%.
The total light transmittance was measured as described in examples described below.
Use of resin composition and molded article
The present embodiment also includes a molded article formed from the resin composition of the present embodiment. The molded article of the present embodiment has excellent light-shielding properties, and can be formed into a thin-walled molded article. The thickness of the thinnest wall portion of the molded article according to this embodiment may be 0.1mm or less, and may be 0.075mm or less. The lower limit of the thickness of the thinnest wall portion may be substantially 0.01mm or more, or may be substantially 0.02mm or more.
The resin composition of the present embodiment can be molded by a known molding method such as injection molding, extrusion molding, compression molding, blow molding, and vacuum molding.
The resin composition and the molded article of the present embodiment can be suitably used for automobile parts, electric/electronic parts, precision machine parts, building material/piping parts, daily necessities, cosmetic parts, medical equipment parts, and the like, and can be preferably used for digital equipment parts, particularly preferably used for diaphragm blades of digital cameras.
Examples
The present invention will be described in more detail with reference to examples. The materials, amounts, proportions, treatment contents, treatment steps and the like shown in the following examples may be appropriately changed without departing from the gist of the present invention. Accordingly, the scope of the present invention is not limited to the specific examples shown below.
When the measurement apparatus and the like used in the examples are difficult to obtain due to production stoppage and the like, the measurement may be performed using other apparatuses having the same performance.
1. Raw materials
Polyacetal resin (A1):
the content of oxyethylene groups was adjusted to 1.4 mol% relative to 100 mol% of oxymethylene groupsOxymethylene copolymer obtained by copolymerizing an alkane with 1, 3-dioxolane, wherein the MVR (190 ℃ C., weight of 2.16 kg) was 75cm 3 10 minutes
Polyacetal resin (A2):
the content of oxyethylene groups was adjusted to 1.4 mol% relative to 100 mol% of oxymethylene groupsOxymethylene copolymer obtained by copolymerizing an alkane with 1, 3-dioxolane, wherein the MVR (190 ℃ C., weight of 2.16 kg) was 45cm 3 10 minutes
Carbon black (B):
furnace black, trade name "Raven PFEB", dispersing agent (C) made by Columbian Carbon company, average particle diameter 21nm
Ethylene bis-stearamide (C1):
trade name "EB-FF", manufactured by Kagaku Co., ltd
Polyethylene wax (C2):
trade name "HI-WAX 720P", sanjing chemical Co., ltd
Organosilicon (C3):
kinematic viscosity at 25 ℃): 100 ten thousand cSt of organosilicon 2. Examples 1-4, comparative examples 1-4
< Complex >)
The polyacetal resin (A), the carbon black (B) and the dispersant (C) were uniformly mixed in the mixing ratio shown in Table 1 using a high-speed mixer manufactured by Chuan field Co., ltd., and then melt-kneaded using a twin-screw extruder (PCM-29 manufactured by Mitsui iron Co., ltd., screw diameter 29 mm) at a screw rotation speed of 120rpm and a cylinder setting temperature of 190℃to extrude a strand, and the strand was cut by a pelletizer, whereby a resin composition (pellet) was produced.
MVR of resin and resin composition
Polyacetal resin and MVR (unit: cm) of the resin composition (pellet) obtained as described above 3 10 minutes) was measured according to ISO1133 at 190℃under a load of 2.16kg weight. The results of MVR of the resin composition (pellet) are shown in Table 1.
< light-shielding (total light transmittance) >, and
after drying the resin composition (pellets) obtained above at 80℃for 3 hours, press working was performed using a press machine, and test pieces 0.05 mm. Times.20 mm thick were prepared. The total light transmittance (unit:%) of the obtained test piece was measured in accordance with JIS-K-7136 using a haze meter. The results are shown in Table 1.
The Press machine was manufactured by Toyo Seiko Co., ltd. The haze meter used was NDH4000 manufactured by Nippon Denshoku Co., ltd.
< fluidity >
After the resin composition pellets were dried at 80℃for 3 hours, they were injection molded using an injection molding machine (product of Sumitomo mechanical industries Co., ltd. "SE30 DUZ") at a cylinder temperature of 195℃and a mold temperature of 80℃to form a 145 mm. Times.13 mm. Times.0.3 mm thick plate, and the fluidity was confirmed at this time.
A: excellent in fluidity
B: at a practical level, but with fluidity inferior to that of A
C: poor fluidity (outside practical level)
< appearance after Heat treatment >
After the resin composition pellets were dried at 80℃for 3 hours, they were injection molded using an injection molding machine (EC 100SX, manufactured by Zhi Pu mechanical Co., ltd.) at a cylinder temperature of 195℃and a mold temperature of 90℃to form a flat plate having a thickness of 100 mm. Times.100 mm. Times.2.0 mm. For the obtained plate, heat treatment was performed at 80℃for 100 hours, and the appearance of the heat-treated plate was observed.
A: no foreign matter was observed on the surface of the plate
B: a small amount of foreign matter was observed on the surface of the plate
C: a large amount of foreign matter was observed on the surface of the plate
< slidability >
A cylindrical thrust test piece was produced by injection molding at a cylinder temperature of 200℃and a mold temperature of 80 ℃. The friction wear was measured at a surface pressure of 0.25MPa and a linear velocity of 0.1 m/s in a gas atmosphere having a temperature of 23℃and a humidity of 50% by using a thrust friction wear tester manufactured by ORIENTEC.
In the above table, "(C) total" means the total amount (unit: parts by mass) of (C1) to (C3). The "amount of (B) + (C)" refers to the total amount of (B) and (C1) to (C3), that is, the total amount of carbon black and dispersant (unit: parts by mass). Thus, "{ (B)/([ (B) + (C) ] } ×100" represents the proportion of carbon black (unit: mass%) in the total amount of carbon black and dispersant.
From the above results, it was found that the molded articles obtained from the resin compositions of the present invention (examples 1 to 4) were thin and excellent in light-shielding properties. The resin composition of the present invention is also excellent in fluidity and moldability of a thin-walled molded article.
On the other hand, when the content of the carbon black and the dispersant does not satisfy the range of the present invention (comparative example 1), the light-shielding property becomes low. In addition, when the MVR of the resin composition does not satisfy the range of the present invention, the fluidity is slightly inferior, and the fluidity is insufficient for a thin-walled molded body such as an aperture blade used for a digital camera (comparative example 2).
When (B)/(B) + (C) ×100 is 60 mass% or less, the total light transmittance is high (comparative example 3).
When the content of carbon black is large, fluidity is lowered (comparative example 4).
Claims (20)
1. A resin composition comprising a polyacetal resin and carbon black and a dispersant in a proportion of more than 2.0 parts by mass and 10.0 parts by mass or less in total relative to 100 parts by mass of the polyacetal resin,
the proportion of carbon black in the total amount of the carbon black and the dispersant is more than 60% by mass and less than 100% by mass,
the melt volume flow rate of the resin composition measured at 190 ℃ under a load of 2.16kg weight exceeds 50cm 3 10 minutes and less than 100cm 3 And/10 minutes.
2. The resin composition according to claim 1, wherein,
the melt volume flow rate of the resin composition measured at 190 ℃ under the condition of loading 2.16kg weight exceeds 60cm 3 10 minutes and less than 100cm 3 And/10 minutes.
3. The resin composition according to claim 1 or 2, wherein,
the content of the carbon black exceeds 1.5 parts by mass and is 9 parts by mass or less relative to 100 parts by mass of the polyacetal resin.
4. The resin composition according to claim 1 or 2, wherein,
the content of the carbon black exceeds 1.5 parts by mass and is 6 parts by mass or less relative to 100 parts by mass of the polyacetal resin.
5. The resin composition according to claim 1 or 2, wherein,
the carbon black content exceeds 1.5 parts by mass and is 4 parts by mass or less relative to 100 parts by mass of the polyacetal resin.
6. The resin composition according to any one of claims 1 to 5, wherein,
the dispersant comprises at least one selected from polyolefin wax, fatty acid amide, polyalkylene glycol and silicone.
7. The resin composition according to any one of claims 1 to 5, wherein,
the dispersant comprises at least two selected from polyolefin wax, fatty acid amide, polyalkylene glycol and silicone.
8. The resin composition according to claim 6 or 7, wherein,
the dispersant comprises a fatty acid amide.
9. The resin composition according to any one of claims 6 to 8, wherein,
the dispersant comprises silicone.
10. The resin composition according to claim 7, wherein,
the dispersant comprises an aliphatic amide and a silicone.
11. The resin composition according to any one of claims 1 to 10, wherein,
the amount of fatty acid amide in the dispersant is 40 mass% or less relative to the total amount of the dispersant.
12. The resin composition according to any one of claims 1 to 11, wherein,
the polyacetal resin had a melt volume flow rate of more than 45cm as measured at 190℃under a load of 2.16kg weight 3 10 minutes and less than 100cm 3 And/10 minutes.
13. The resin composition according to any one of claims 1 to 12, which is a resin composition for an aperture blade of a digital camera.
14. The resin composition according to any one of claims 1 to 13, wherein,
the resin composition has a total light transmittance of 2% or less as measured in accordance with JIS-K-7136 when molded to a thickness of 0.05 mm.
15. The resin composition according to any one of claims 1 to 13, wherein,
the resin composition has a total light transmittance of 1% or less as measured in accordance with JIS-K-7136 when molded to a thickness of 0.05 mm.
16. A molded article formed from the resin composition according to any one of claims 1 to 15.
17. The shaped body according to claim 16, wherein,
the molded body is a digital equipment component.
18. The shaped body according to claim 16, wherein,
the molded body is an aperture blade of a digital camera.
19. The shaped body according to any one of claims 16 to 18, wherein,
the thickness of the thinnest wall part of the molded body is 0.1mm or less.
20. The shaped body according to any one of claims 16 to 18, wherein,
the thickness of the thinnest wall part of the molded body is 0.075mm or less.
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| JP2020187148 | 2020-11-10 | ||
| JP2020-187148 | 2020-11-10 | ||
| PCT/JP2021/040494 WO2022102488A1 (en) | 2020-11-10 | 2021-11-04 | Resin composition and molded body |
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| CN116529314A true CN116529314A (en) | 2023-08-01 |
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| JP (1) | JP7832117B2 (en) |
| CN (1) | CN116529314A (en) |
| WO (1) | WO2022102488A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009256446A (en) * | 2008-04-16 | 2009-11-05 | Asahi Kasei Chemicals Corp | Polyacetal resin composition |
| WO2014097808A1 (en) * | 2012-12-21 | 2014-06-26 | ポリプラスチックス株式会社 | Polyacetal resin composition |
| JP2017008254A (en) * | 2015-06-25 | 2017-01-12 | 三菱エンジニアリングプラスチックス株式会社 | Polyacetal resin composition, method for producing the same and resin molding prepared with polyacetal resin composition |
| JP2017014304A (en) * | 2015-06-26 | 2017-01-19 | 三菱エンジニアリングプラスチックス株式会社 | Polyacetal resin composition, molded body, and digital equipment part |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5951937A (en) * | 1982-09-16 | 1984-03-26 | Polyplastics Co | Polyacetal resin composition |
| JP7217113B2 (en) * | 2018-09-18 | 2023-02-02 | 旭化成株式会社 | Polyacetal resin composition and molded article thereof |
-
2021
- 2021-11-04 JP JP2022561851A patent/JP7832117B2/en active Active
- 2021-11-04 CN CN202180075575.8A patent/CN116529314A/en active Pending
- 2021-11-04 WO PCT/JP2021/040494 patent/WO2022102488A1/en not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009256446A (en) * | 2008-04-16 | 2009-11-05 | Asahi Kasei Chemicals Corp | Polyacetal resin composition |
| WO2014097808A1 (en) * | 2012-12-21 | 2014-06-26 | ポリプラスチックス株式会社 | Polyacetal resin composition |
| JP2017008254A (en) * | 2015-06-25 | 2017-01-12 | 三菱エンジニアリングプラスチックス株式会社 | Polyacetal resin composition, method for producing the same and resin molding prepared with polyacetal resin composition |
| JP2017014304A (en) * | 2015-06-26 | 2017-01-19 | 三菱エンジニアリングプラスチックス株式会社 | Polyacetal resin composition, molded body, and digital equipment part |
Non-Patent Citations (2)
| Title |
|---|
| 周青 等: "《塑料成型工艺与模具设计》", 31 December 2014, 合肥工业大学出版社, pages: 18 - 19 * |
| 王正远 主编: "《工程塑料实用手册》", 30 June 1994, 中国物质出版社, pages: 271 * |
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| JP7832117B2 (en) | 2026-03-17 |
| JPWO2022102488A1 (en) | 2022-05-19 |
| WO2022102488A1 (en) | 2022-05-19 |
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