CN119923558A

CN119923558A - Temperature detection device for food and control circuit board thereof

Info

Publication number: CN119923558A
Application number: CN202380069146.9A
Authority: CN
Inventors: 黄战彬
Original assignee: Shenzhen Typhur Technology Co Ltd
Current assignee: Shenzhen Typhur Technology Co Ltd
Priority date: 2023-02-17
Filing date: 2023-02-17
Publication date: 2025-05-02
Also published as: WO2024168894A1

Abstract

A temperature detection device for food materials and a control circuit board thereof, the control circuit board having a main body and an extension portion, the antenna and the onboard conductive wire are respectively fixedly arranged on the extension portion, the antenna and the onboard conductive wire can be kept in a fixed relative position, the consistency of the positions of the antenna and the onboard conductive wire is improved, and the interference to the antenna communication signal caused by the shaking of the antenna and the onboard conductive wire is reduced. Moreover, compared with arranging the antenna and the onboard conductive wire on the same substrate layer, the extension portion has at least two layers of stacked and fixed substrate layers, and the antenna and the onboard conductive wire are further fixedly arranged on different substrate layers, making full use of the space in the stacking direction of the substrate layers, increasing the distance between the antenna and the onboard conductive wire, and improving the antenna communication effect. At the same time, the width of the substrate layer can also be reduced, so the width of the extension portion can be further reduced, reserving more space for other components in the temperature detection device.

Description

Temperature detection device for food materials and control circuit board thereof

Technical Field

The application relates to the field of food material cooking, in particular to a temperature detection device for detecting the temperature of food materials.

Background

With advances in technology and increased demand for food material taste and nutrition, it is desirable to more precisely control the temperature elements during cooking, such as more precisely controlling the temperature of the food material.

In meat or other similar food products, it is often the case that the surface temperature differs considerably from the internal temperature, especially in the centre of the food product, which is usually the lowest. In order to be able to detect the temperature near the central area of the food material, the temperature detection means is usually designed as a structure into which the food material can be inserted, for example as a needle-like structure, so as to be able to be inserted into the interior of the food material in order to obtain the temperature inside the food material (such as the central area).

Generally, in order to continuously obtain the temperature of the food material, the temperature detecting device maintains a state of inserting the food material during cooking of the food material while being retained in a cooking space (e.g., an oven, a steamer, a fryer, etc.) together with the food material. The temperature detecting device is in wireless communication with external equipment (such as a cooking host machine, a mobile terminal and the like) through an antenna therein. The antenna is usually electrically connected to the control circuit board of the temperature detecting device in the form of a cable, and other movable conductive cables are arranged around the antenna in the structure, for example, a connecting cable of a temperature sensor (such as an NTC) for detecting the ambient temperature of the cooking space, a charging cable and the like, and the conductive cables interfere with communication signals of the antenna, so that communication is not smooth or information transmission is not accurate.

Technical problem

The application mainly provides a temperature detection device for food materials and a control circuit board thereof, which are used for improving the communication effect of an antenna.

Technical solution

In view of the above object, an embodiment of the present application provides a temperature detecting device for food materials, including:

A housing having a front end insertable into a food material and a rear end opposite the front end, the housing forming a mounting cavity;

the control circuit board is arranged in the mounting cavity;

The control circuit board is provided with a main body part and an extension part extending backwards from the main body part, the main body part is provided with a control circuit, the control circuit is provided with an antenna signal processing unit, the extension part is provided with at least two base material layers which are fixedly arranged in layers, the extension part is provided with an antenna and an on-board conductive wire, the antenna and the on-board conductive wire are respectively fixedly arranged on different base material layers, the antenna is electrically connected with the antenna signal processing unit, and the on-board conductive wire is used for electrically connecting the control circuit with other components.

In one embodiment, the substrate layer provided with the antenna is an antenna layer, and the antenna layer is located at the outermost side in the lamination direction of the substrate layer.

In one embodiment, the substrate layers are at least three layers, in the lamination direction of the substrate layers, two substrate layers located at the outermost side are all the antenna layers, and antennas on the two antenna layers are electrically connected with each other;

the substrate layer provided with the on-board conductive wire is positioned between the two antenna layers.

In one embodiment, the substrate layer between the two antenna layers is provided with first conductive vias, and the first conductive vias are electrically connected to each other to electrically connect the antennas on the two antenna layers.

In one embodiment, one antenna layer is a first antenna layer, and the other antenna layer is a second antenna layer, and on the first antenna layer, an antenna of the first antenna layer is electrically connected with the antenna signal processing unit through a conductive wire.

In one embodiment, the first antenna layer is provided with a first impedance matching structure, and the first impedance matching structure is arranged at two sides of the conductive wire.

In one embodiment, a second impedance matching structure is disposed on the second antenna layer, and the second impedance matching structure corresponds to the first impedance matching structure in position and is electrically connected to the first impedance matching structure through a second conductive via.

In one embodiment, the cooking device further comprises an ambient temperature detection unit, wherein the ambient temperature detection unit is arranged on the shell and is used for detecting the temperature of the cooking environment of the food;

The on-board conducting wire is provided with a first detection unit conducting wire and a second detection unit conducting wire, the first detection unit conducting wire and the second detection unit conducting wire are used for electrically connecting the ambient temperature detection unit with the control circuit, the substrate layer where the first detection unit conducting wire and the second detection unit conducting wire are located is located on the inner side of the antenna layer, the antenna layer is provided with a first contact and a second contact which are used for electrically connecting the ambient temperature detection unit, the first contact is electrically connected with the first detection unit conducting wire, and the second contact is electrically connected with the second detection unit conducting wire.

In one embodiment, the first detecting unit wire and the second detecting unit wire are fixed on the same substrate layer or fixed on different substrate layers respectively, the first detecting unit wire is electrically connected with the first contact through a third conductive via hole, and the second detecting unit wire is electrically connected with the second contact through a fourth conductive via hole.

In one embodiment, the substrate layer provided with the first detecting unit wire is a first detecting unit wire layer, the substrate layer provided with the second detecting unit wire is a second detecting unit wire layer, and the first detecting unit wire layer and the second detecting unit wire layer are different substrate layers and are stacked.

In one embodiment, the first detection unit wire layer has a third impedance matching structure disposed on both sides of the first detection unit wire, and/or the second detection unit wire layer has a fourth impedance matching structure disposed on both sides of the second detection unit wire.

In one embodiment, the on-board conductive wire is provided with a charging wire, the control circuit is provided with a charging circuit, the charging wire is electrically connected with the charging circuit, the substrate layer provided with the charging wire is a charging wire layer, the charging wire layer is positioned on the inner side of the antenna layer, the antenna layer is provided with a charging connecting end, and the charging connecting end is electrically connected with the charging wire.

In one embodiment, the housing includes a metal section and an insulating section, the insulating section is provided with a metal conductive member, the metal conductive member is electrically connected with the charging connection end, the metal section is electrically connected with the charging circuit, and the metal conductive member and the metal section are respectively used as one of a positive electrode and a negative electrode of the charging circuit to realize charging.

In one embodiment, the metal conductive piece is exposed out of the insulation section, extends to the charging connection end of the antenna layer and is electrically connected with the charging connection end.

In one embodiment, the charging connection terminal has a fifth conductive via hole, the metal conductive member has a mounting hole, and the charging connection terminal and the metal conductive member are fixed and electrically connected through the fifth conductive via hole and the mounting hole by a conductive screw.

In one embodiment, the charging wire layer is located between the antenna layer and the first detection unit wire layer, or between the antenna layer and the second detection unit wire layer, and the charging connection end is electrically connected with the charging wire through a fifth conductive hole.

In one embodiment, the adjacent substrate layer of the antenna layer is a headroom layer, and the headroom layer is not provided with an antenna and an on-board conductive line.

In one embodiment, the antenna and the on-board conductive line are attached to a surface of the substrate layer.

In one embodiment, the antenna and the on-board conductive wire are affixed to the surface of the substrate layer by a printing or spraying process.

In one embodiment, the housing has a safety zone indicator, the control circuit is located at a front side of the safety zone indicator, and the antenna, the ambient temperature detecting unit and the charging connection terminal are located at a rear side of the safety zone indicator.

In one embodiment, the housing includes a metal section and an insulating section, the insulating section is located behind the metal section, the safe zone indicator is located on the metal section, and the antenna is located in the insulating section.

the control circuit board is arranged in the mounting cavity;

The control circuit board is provided with a main body part and an extension part extending backwards from the main body part, the main body part is provided with a control circuit, the control circuit is provided with an antenna signal processing unit, the extension part is provided with at least two base material layers which are fixedly arranged in layers, the extension part is provided with an antenna and an on-board conductive wire, the antenna and the on-board conductive wire are fixedly arranged on the extension part, the antenna is electrically connected with the antenna signal processing unit, and the on-board conductive wire is used for electrically connecting the control circuit with other components.

Based on the above object, in one embodiment of the present application, a control circuit board of a temperature detecting device is provided, which includes a main body portion and an extension portion extending backward from the main body portion, wherein the main body portion has a control circuit, the control circuit has an antenna signal processing unit, the extension portion has at least two base material layers which are fixedly stacked, the extension portion is provided with an antenna and an on-board conductive wire, the antenna and the on-board conductive wire are respectively fixedly arranged on different base material layers, the antenna is electrically connected with the antenna signal processing unit, and the on-board conductive wire is used for electrically connecting the control circuit with other components.

Advantageous effects

According to the temperature detection device of some embodiments, the control circuit board is provided with the main body part and the extension part, the antenna and the on-board conducting wire are respectively and fixedly arranged on the extension part, so that the antenna and the on-board conducting wire can be kept at fixed relative positions, the consistency of the positions of the antenna and the on-board conducting wire is improved, and interference on communication signals of the antenna caused by shaking of the antenna and the on-board conducting wire is reduced. In addition, compared with the situation that the antenna and the on-board conducting wire are arranged on the same substrate layer, the extension part is provided with at least two substrate layers which are fixedly arranged on each other, the antenna and the on-board conducting wire are further fixedly arranged on different substrate layers, the space in the stacking direction of the substrate layers is fully utilized, the distance between the antenna and the on-board conducting wire is pulled, and the antenna communication effect is improved. Meanwhile, the width of the substrate layer can be reduced, so that the width of the extension part can be further reduced, and more space is reserved for other components in the temperature detection device.

According to the temperature detection device of some embodiments, the control circuit board is provided with the main body part and the extension part, the antenna and the on-board conducting wire are respectively and fixedly arranged on the extension part, so that the antenna and the on-board conducting wire can be kept at fixed relative positions, the shaking of the antenna and the on-board conducting wire is avoided, the consistency of the positions of the antenna and the on-board conducting wire is improved, and the interference on the antenna communication signals caused by shaking of the antenna and the on-board conducting wire is reduced.

According to some of the embodiments described above, the control circuit board has a main body portion having a control circuit with an antenna signal processing unit and an extension portion extending rearward from the main body portion. The extension portion is provided with at least two layers of substrate layers which are fixedly arranged, the extension portion is provided with an antenna and an onboard conductive wire, the antenna and the onboard conductive wire are respectively fixedly arranged on different substrate layers so as to keep the antenna and the onboard conductive wire at fixed relative positions, meanwhile, the structure can also reduce the width dimension of the extension portion, and more installation spaces are reserved for other parts around the extension portion.

Drawings

FIG. 1 is a schematic view of an appearance structure of a temperature detecting device according to an embodiment of the present application;

FIG. 2 is an exploded view of a temperature sensing device according to an embodiment of the present application;

FIG. 3 is an exploded view of a control circuit board, an ambient temperature sensing unit, and a metal conductive member according to an embodiment of the present application;

FIG. 4 is a schematic diagram of a control circuit board according to an embodiment of the present application;

FIG. 5 is a schematic cross-sectional view of a housing, a control circuit board, an ambient temperature sensing unit, and a metallic conductive member according to an embodiment of the present application;

FIG. 6 is a schematic diagram of a laminated structure of substrate layers of an extension portion of a control circuit board according to an embodiment of the present application;

FIG. 7 is a schematic diagram of the circuit on each substrate layer on the extension portion, wherein the substrate layers are omitted and the circuits of the substrate layers are shown in the same plane, so as to facilitate the overall electrical connection between the temporary antenna and the on-board conductive line;

FIG. 8 is a schematic diagram of a circuit on a first antenna layer according to an embodiment of the present application;

FIG. 9 is a schematic diagram of a circuit on a clean layer according to an embodiment of the application;

FIG. 10 is a schematic diagram of a circuit on a first detecting unit conductive line layer according to an embodiment of the present application;

FIG. 11 is a schematic diagram of a circuit on a second detecting unit conductive line layer according to an embodiment of the present application;

FIG. 12 is a schematic diagram of a circuit on a charge line layer according to an embodiment of the application;

FIG. 13 is a schematic diagram of a circuit on a second antenna layer according to an embodiment of the present application;

Fig. 14 is a schematic diagram showing electrical connection between the antenna signal processing unit and the charging circuit and other structures in the control circuit according to an embodiment of the present application.

Embodiments of the invention

The application will be described in further detail below with reference to the drawings by means of specific embodiments. Wherein like elements in different embodiments are numbered alike in association. In the following embodiments, numerous specific details are set forth in order to provide a better understanding of the present application. However, one skilled in the art will readily recognize that some of the features may be omitted, or replaced by other elements, materials, or methods in different situations. In some instances, related operations of the present application have not been shown or described in the specification in order to avoid obscuring the core portions of the present application, and may be unnecessary to persons skilled in the art from a detailed description of the related operations, which may be presented in the description and general knowledge of one skilled in the art.

Furthermore, the described features, operations, or characteristics of the description may be combined in any suitable manner in various embodiments. Also, various steps or acts in the method descriptions may be interchanged or modified in a manner apparent to those of ordinary skill in the art. Thus, the various orders in the description and drawings are for clarity of description of only certain embodiments, and are not meant to be required orders unless otherwise indicated.

The numbering of the components itself, e.g. "first", "second", etc., is used herein merely to distinguish between the described objects and does not have any sequential or technical meaning. The term "coupled" as used herein includes both direct and indirect coupling (coupling), unless otherwise indicated.

The application provides a temperature detection device for food materials, which can be inserted into the food materials during the cooking process of the food materials to detect the temperature of the inside of the food materials, and particularly to acquire the minimum temperature of the inside of the food materials as accurately as possible. The food material may be in any cooking state including, but not limited to, steaming, boiling, baking, frying, etc., or heat treated by any other means. Of course, the temperature detection device can be directly placed in the measured environment to perform temperature measurement. The measured environment includes, but is not limited to, a cooking environment, etc.

Referring to fig. 1-5, the temperature detecting device 1 includes a housing 100, a control circuit board 200, and an ambient temperature detecting unit 300. Of course, in some embodiments, the temperature detecting device 1 may also include other relevant components according to other functional needs, for example, having a food material temperature detecting unit 400 for detecting the temperature of the food material, or further for example, having a battery for supplying power, etc.

The housing 100 is used to protect and mount components (e.g., the food temperature detection unit 400, the control circuit board 200, the battery and/or the ambient temperature detection unit 300, etc.) that perform the functions of the temperature detection device 1. The housing 100 forms a mounting cavity for receiving and mounting other components. In some embodiments, the housing 100 may have a structure having a cavity therein, and the functional components of the temperature detecting device 1 may be disposed in the cavity inside the housing 100. In some embodiments, the cavity inside the casing 100 may be one, and the functional components of the temperature detecting device 1 may be disposed in the cavity, or the cavity inside the casing 100 may be a plurality of cavities, and one or more functional components of the temperature detecting device 1 may be disposed in each cavity. The cavity or cavities may be of any shape as long as they do not interfere with the mounting of the functional components of the temperature detecting device 1.

Referring to fig. 1-5, in some embodiments, the housing 100 may be assembled from a plurality of parts. In other embodiments, the housing 100 may be formed from one piece.

In some embodiments, the housing 100 may encapsulate the functional components of the temperature detecting device 1, i.e., the housing 100 may be located at the outermost layer of the temperature detecting device 1, blocking the outside from contacting the components inside the housing 100. In some embodiments, the housing 100 may not completely encase the functional components of the temperature detection device 1, for example, portions of the ambient temperature detection unit 300 may be located outside the housing 100 to facilitate temperature measurement.

Referring to fig. 1-5, in some embodiments, the housing 100 has a front end that can be inserted into the food material and a rear end opposite the front end. For example, the housing 100 has a pointed portion at one end thereof as a front end, and the pointed portion facilitates insertion of the temperature detecting device 1 into an object to be measured for temperature measurement. In some embodiments, the housing 100 may be formed as an elongated structure, such as a tubular structure. In some embodiments, the front end of the elongated structure of the housing 100 tapers in diameter until it approaches 0, forming a closed, sharp front end. In some embodiments, the housing 100 may be a hollow tubular structure with one end closed, and the functional components of the temperature detecting device 1 may be installed inside the hollow tubular structure. In some embodiments, the cross-section of the housing 100 may be circular, oval, triangular, rectangular, polygonal, or contoured. In some embodiments, to facilitate the temperature measurement by holding the temperature detecting device 1 in the hand, one end (e.g., the rear end) of the housing 100 may be provided with a handle portion that is convenient to grasp, and in some embodiments, the handle portion may be provided away from the front end. In some embodiments, the material of the housing 100 may have a certain hardness to maintain the shape of the housing 100, functioning as a certain protection for the internal functional components.

The control circuit board 200 is disposed in a mounting cavity of the housing 100, and may be directly or indirectly fixed to the housing 100. The control circuit board 200 has a control circuit 211, and the control circuit 211 is used to control part or all of the functions of the temperature detecting device 1, such as, but not limited to, control of each sensor, reception, processing and transmission of temperature signals, communication control with other devices, and/or charging of the device. The control circuit 211 may employ various circuits and/or structures capable of performing information processing and logic determination, e.g., devices having a processor, memory, etc.

The environmental temperature detection unit 300 is electrically connected to the control circuit 211, and the environmental temperature detection unit 300 is used for detecting the temperature of the detected environment (such as a cooking environment). The food material temperature detection unit 400 is electrically connected to the control circuit 211, and the food material temperature detection unit 400 is configured to detect the temperature of the food material. The measured ambient temperature may be used to help, but not limited to, the control circuit 211 to better determine the actual temperature of the food material, etc., which may be achieved by the prior art, and will not be described in detail herein. The ambient temperature detecting unit 300 is provided in the housing 100, and may be entirely built in the housing 100 or may be partially exposed from the housing 100 to detect the temperature of the cooking environment. The food temperature detecting unit 400 and the ambient temperature detecting unit 300 have a structure capable of directly or indirectly detecting temperature, and can detect temperature by any feasible scheme. For example, in some embodiments, the food temperature detection unit 400 and the ambient temperature detection unit 300 have elements for sensing heat to obtain temperature information. In some embodiments, the food temperature detection unit 400 and the ambient temperature detection unit 300 may detect a temperature or a temperature related signal and convert to a sensor of available output signals.

In some embodiments, the sensor may be a Thermocouple (TC), a Resistance Temperature Detector (RTD), a thermistor, or the like, or any combination thereof. In some embodiments, to make the temperature measurement fast, the sensor may be a thermocouple. The thermocouple is formed by connecting two ends of conductors with two different components into a loop, wherein one end which is directly used for measuring temperature is a temperature measuring end, and the other end is a compensation end. In some embodiments, the sensor may be a Negative Temperature Coefficient (NTC) type thermistor. The thermistor is composed of a thermo-sensitive probe (temperature measuring end), a conductive connection end, and a housing 100.

Referring to fig. 4, in some embodiments, the control circuit board 200 has a main body 210 and an extension 220 extending rearward from the main body 210. The body portion 210 and the extension portion 220 form a unitary structure, which includes both being fixedly connected (e.g., welded, glued, clamped, screwed, etc.) to each other, as well as a unitary structure in which the body portion 210 and the extension portion 220 are integrally manufactured (i.e., the body portion 210 and the extension portion 220 are different areas of the same circuit board).

The control circuit 211 is disposed on the main body 210, and the control circuit 211 can be used as a main control part of the entire control circuit board 200, for example, in some embodiments, referring to fig. 14, the control circuit 211 can have an antenna signal processing unit 2111, etc. to implement data processing and instruction transmission. The antenna signal processing unit 2111 can be used for controlling signal reception and transmission of an antenna, processing an antenna signal, and the like.

Referring to fig. 4 and 6, in some embodiments, the extension 220 has at least two substrate layers 221 stacked and fixed. Each substrate layer 221 is used to provide a corresponding circuit. The substrate layer 221 is made of an insulating material, for example, in some embodiments, a variety of materials that can be used as a circuit board substrate can be selected. Of course, the body portion 210 may also be made of the same material as the extension portion 220 to form the final body portion 210. In some embodiments, the body portion 210 may be laminated with the same substrate layer 221 as the extension portion 220. The same substrate layer 221 corresponding to each other on the main body 210 and the extension 220 may be the same complete substrate, that is, at least two substrate layers 221 are stacked to form the whole control circuit board 200, and each area on the control circuit board 200 is divided into the main body 210 and the extension 220 according to different circuit structures. Of course, in other embodiments, the body portion 210 and the extension portion 220 may be two separate components, manufactured separately. The main body 210 may not have the same laminated structure as the extension 220, and in some embodiments, the control circuit 211 of the main body 210 may be disposed on the same substrate layer 221, so long as the control circuit 211 on the main body 210 can perform related functions, for example, the functions of receiving and transmitting signals of an antenna, detecting ambient temperature, charging a device, and the like, and any feasible scheme may be adopted for the structure of the main body 210.

In some embodiments, the extension 220 is provided with an antenna 222 and an on-board conductive wire 223, the antenna 222 being electrically connected to the antenna signal processing unit 2111. The on-board conductive wire 223 refers to a conductive line fixedly provided on the extension 220 of such an on-board structure for electrically connecting the control circuit 211 with other components, such as, but not limited to, the ambient temperature detection unit 300 and/or the charging electrode, etc. The antenna 222 and the on-board conductive wire 223 are fixedly arranged on the extension part 220, so that the position stability of the antenna 222 is ensured, the position stability of the on-board conductive wire 223 is ensured, the antenna 222 and the on-board conductive wire 223 are respectively kept at fixed relative positions, the consistency of the positions of the antenna 222 and the on-board conductive wire 223 is improved, the shaking of the antenna 222 and the on-board conductive wire 223 is avoided, the interference on communication signals of the antenna 222 caused by shaking of the antenna 222 and the on-board conductive wire 223 is further reduced, and the communication effect of the antenna 222 is improved.

Meanwhile, compared to the case where the antenna 222 and the on-board conductive line 223 are disposed on the same substrate layer 221, in some embodiments, the antenna 222 and the on-board conductive line 223 are further fixedly disposed on different substrate layers 221, so that the space in the stacking direction (a 2 shown in fig. 6) of the substrate layers 221 is fully utilized, and not only the distance between the antenna 222 and the on-board conductive line 223 can be pulled apart, but also the communication effect of the antenna 222 can be improved. But also the width dimension of the substrate layer 221 (as shown by a1 in fig. 4 and 6) can be reduced, and the width of the entire extension 220 can be further reduced, so that more space is reserved for other components in the temperature detecting device 1, which is beneficial to reducing the dimension of the entire temperature detecting device 1 in the width direction.

Of course, in other embodiments, the antenna 222 and the on-board conductive line 223 may be disposed on the same substrate layer 221, so that the thickness of the extension 220 and the manufacturing difficulty may be reduced. For example, in some embodiments, the extension 220 has a substrate layer 221, and the antenna 222 and the on-board conductive line 223 are fixed on one or both surfaces of the substrate layer 221.

To achieve the securement of the antenna 222 and the on-board conductive line 223 to the substrate layer 221, in some embodiments, the antenna 222 and the on-board conductive line 223 are attached to a surface of the substrate layer 221. In some embodiments, the antenna 222 and the on-board conductive line 223 may be fixed to the surface of the substrate layer 221 by a printing or spraying process, thereby attaching the antenna 222 and the on-board conductive line 223 to the surface of the substrate layer 221. Of course, in other embodiments, other possible ways of fixing the antenna 222 and the on-board conductive line 223 on the surface of the substrate layer 221 may be used.

Further, the antenna 222 and the onboard conductive line 223 are disposed on different substrate layers 221, and when the lamination is specifically performed, the antenna 222 and the onboard conductive line 223 may be disposed on any of the different substrate layers 221. The antenna 222 may be disposed on the outermost substrate layer 221 or on the intermediate substrate layer 221, and the on-board conductive line 223 may be disposed on the outermost substrate layer 221 or the intermediate substrate layer 221. The on-board conductive wire 223 may be one or more types according to the connection object, for example, may be one or both of a charging wire and a wire of an ambient temperature detecting unit. When the on-board conductive lines 223 are two or more, the on-board conductive lines 223 of different types may be partially or entirely disposed on the same substrate layer 221, or the on-board conductive lines 223 of different types may be individually dispersed on different substrate layers 221.

Referring to fig. 6, 8 and 13, in some embodiments, the substrate layer 221 provided with the antenna 222 is an antenna layer (e.g. 2211, 2216), and the antenna layer is located at the outermost side in the lamination direction of the substrate layer 221. As shown in fig. 6, the outermost side may be the uppermost side (e.g., 2211) in the illustrated direction or the lowermost side (e.g., 2216) in the illustrated direction. When the antenna layer is disposed at the outermost side, the antenna 222 can be better ensured to be capable of receiving and transmitting signals more efficiently.

In some embodiments, the on-board conductive lines 223 may be disposed on one or more substrate layers 221 inside the antenna layer when the antenna layer is outermost. When the antenna layer is one of the outermost substrate layers (the uppermost substrate layer 221 shown in fig. 6), the on-board conductive line 223 may be disposed on the other outermost substrate layer (the lowermost substrate layer 221 shown in fig. 6).

Of course, in some embodiments, the on-board conductive lines 223 may also be disposed on the antenna layer.

Further, referring to fig. 6, 8 and 13, in some embodiments, the substrate layer 221 is at least three layers, and in the stacking direction of the substrate layers 221, two substrate layers 221 located at the outermost sides are antenna layers (e.g. 2211 and 2216), and the antennas 222 on the two antenna layers (e.g. 2211 and 2216) are electrically connected to each other. The provision of two antenna layers has the advantage that the area of the antenna 222 can be increased and thus the signal transmitting/receiving capability and communication effect of the antenna 222 can be improved by using the space in the lamination direction (shown as a2 in fig. 6) without changing the widths of the base layer 221 and the extension 220 (shown as a1 in fig. 4 and 6). In other embodiments, more substrate layers 221 may be provided as the antenna layer, such as one or more intermediate substrate layers 221 may also be used as the antenna layer.

Further, referring to fig. 8 and 13, in some embodiments, in order to further increase the area of the antenna 222 and further improve the communication effect, the antenna 222 may be configured as a planar antenna, and one end of the planar antenna is an arc surface, so as to facilitate signal transmission and radiation. Of course, in other embodiments, the antenna 222 may be configured in other planar structures besides those shown in fig. 8 and 13, and may be configured in other shapes and structures for enabling wireless signal reception and transmission.

Further, referring to fig. 6 and fig. 8-13, in order to achieve conductive connection of two or more antenna layers in the stacking direction, in some embodiments, the antenna layers (e.g. 2211, 2216) and the substrate layer 221 between the two antenna layers (e.g. 2211, 2216) are provided with a first conductive via 2251, and the first conductive via 2251 is electrically connected to each other to electrically connect the antennas 222 on the two antenna layers (e.g. 2211, 2216). Specifically, the first conductive vias 2251 on each substrate layer 221 are disposed on the substrate layer 221 in a penetrating manner, and the walls of the first conductive vias 2251 are provided with a conductive material, so that after the substrate layers 221 are stacked, the first conductive vias 2251 of adjacent substrate layers 221 can be electrically connected together in sequence.

Of course, in other embodiments, the antenna layer may be electrically connected in other ways, such as by a cable electrical connection or the like.

Further, referring to fig. 6, 8, 13 and 14, in some embodiments, one antenna layer is a first antenna layer 2211, and the other antenna layer is a second antenna layer 2216. The first antenna layer 2211 may be the uppermost layer shown in fig. 6 or the lowermost layer shown in fig. 6. On the first antenna layer 2211, its antenna 222 is electrically connected to an antenna signal processing unit 2111 through a conductive line 2221. The antenna 222 on the second antenna layer 2216 can be electrically connected to the antenna signal processing unit 2111 through the conductive line 2221 and the first antenna layer 2211 at the same time.

Referring to fig. 8, in some embodiments, in order to facilitate better transmission of the signal from the antenna 222 to the set direction, the first antenna layer 2211 is provided with a first impedance matching structure 2241, and the first impedance matching structure 2241 is disposed on two sides of the conductive line. The first impedance matching structure 2241 can assist in the signal transfer of the antenna 222 to a set direction, such as to the rear end of the housing 100, etc.

Referring to fig. 13, in some embodiments, in order to better restrict the signal transmission of the antenna 222, when the second antenna layer 2216 is provided, a second impedance matching structure 2242 is disposed on the second antenna layer 2216, where the second impedance matching structure 2242 corresponds to the position of the first impedance matching structure 2241, for example, on a plane perpendicular to the stacking direction (as shown in a2 of fig. 6) of the substrate layer 221, and the second impedance matching structure 2242 overlaps with a projection of the first impedance matching structure 2241 partially or completely. The second impedance matching structure 2242 and the first impedance matching structure 2241 can be electrically connected to the first impedance matching structure 2241 through the second conductive via 2252.

Further, referring to fig. 6 and fig. 8-13, in some embodiments, the substrate layer 221 with the on-board conductive line 223 is located between two antenna layers (e.g. 2211, 2216), so as to facilitate the use of the outermost substrate layer 221 as an antenna layer. First conductive vias 2251 may be disposed on the substrate layer 221 where the on-board conductive lines 223 are located to electrically connect the antenna layers.

Referring to fig. 6 and fig. 8-13, in some embodiments, the on-board conductive wire 223 has a first detecting unit wire 2231 and a second detecting unit wire 2232 (i.e., wires of an ambient temperature detecting unit). The first and second sensing unit wires 2231 and 2232 electrically connect the ambient temperature sensing unit 300 with the control circuit 211. The substrate layer 221 where the first and second sensing element wires 2231 and 2232 are located is located inside an antenna layer having first and second contacts 2261 and 2262 for electrically connecting the ambient temperature sensing element 300. As shown in fig. 8, in one embodiment, the first contact 2261 and the second contact 2262 are disposed on the first antenna layer 2211. In other embodiments, the first and second contacts 2261, 2262 may also be provided on the second antenna layer 2216. The first contact 2261 is electrically connected to the first detection unit wire 2231, and the second contact 2262 is electrically connected to the second detection unit wire 2232.

Referring to fig. 3 and 8, in some embodiments, the ambient temperature detecting unit 300 may be electrically connected to the first contact 2261 and the second contact 2262 on the first antenna layer 2211, for example, by soldering or other fixing method, the conductive connection end of the ambient temperature detecting unit 300 is electrically connected to the first contact 2261 and the second contact 2262.

Referring to fig. 2-5, in some embodiments, the conductive connection end 310 of the ambient temperature detecting unit 300 is soldered and electrically connected to the first contact 2261 and the second contact 2262 (collectively referred to as conductive contacts). Considering that the welding points of the conductive connection end 310 of the ambient temperature detecting unit 300 and the first and second contacts 2261 and 2262 are located in the cooking environment during the use of the present device, it is necessary to withstand high temperature test in the cooking environment. While materials commonly used for circuit soldering tend to melt at high temperatures, resulting in failure of the electrical connection, such as when the cooking environment is above 300 ℃, the electrical connection between the conductive connection end 310 of the ambient temperature sensing unit 300 and the first and second contacts 2261 and 2262 tends to be broken and failed. Therefore, in some embodiments, the solder joints between the conductive connection terminal 310 and the first contact 2261 and the second contact 2262 are covered by the adhesive layer 500, and the failure temperature of the adhesive layer 500 is higher than the failure temperature of the solder joints between the conductive connection terminal 310 and the first contact 2261 and the second contact 2262, so that the solder joints are prevented from being damaged in a high-temperature environment, and the reliability of the electrical connection is ensured.

In some embodiments, the material of the adhesive layer 500 is a high temperature inorganic adhesive or a high temperature organic adhesive.

In some embodiments, the high temperature organic glue has a failure temperature threshold greater than or equal to 300 ℃.

In some embodiments, the high temperature inorganic glue has a failure temperature threshold greater than or equal to 400 ℃.

In some embodiments, the high temperature inorganic gums may specifically employ, but are not limited to, phosphate and aluminate mixtures.

Further, referring to fig. 8-13, in some embodiments, the first detecting unit conductive line 2231 and the second detecting unit conductive line 2232 are respectively fixed on different substrate layers 221. The first sensing element wire 2231 is electrically connected to the first contact 2261 through a third conductive via 2253 and the second sensing element wire 2232 is electrically connected to the second contact 2262 through a fourth conductive via 2254. Of course, in other embodiments, the first detecting unit wire 2231 and the second detecting unit wire 2232 can be fixed on the same substrate layer 221.

In fig. 11, the routing of the first detecting unit wire 2231 on the substrate layer 221 is shown. The routing of the second sense element wire 2232 on the substrate layer 221 is shown in fig. 12. In other embodiments, the on-board conductive line 223 shown in fig. 11 may be provided as the second detection unit conductive line 2232, and the on-board conductive line 223 shown in fig. 12 may be provided as the first detection unit conductive line 2231.

In some embodiments, the substrate layer 221 provided with the first detection unit wire 2231 is referred to as a first detection unit wire layer 2214, and the substrate layer 221 provided with the second detection unit wire 2232 is referred to as a second detection unit wire layer 2215. As shown in fig. 6, in some embodiments, the first detection unit conductive line layer 2214 and the second detection unit conductive line layer 2215 are different substrate layers 221 and are stacked on each other.

To better constrain the signal transmission of the antenna 222, in some embodiments, referring to fig. 11, the first detection unit conductive line layer 2214 has a third impedance matching structure 2243, and the third impedance matching structure 2243 is disposed on two sides of the first detection unit conductive line 2231. And/or, referring to fig. 12, the second detecting unit conductive line layer 2215 has a fourth impedance matching structure 2244, and the fourth impedance matching structure 2244 is disposed on two sides of the second detecting unit conductive line 2232. The third impedance matching structure 2243 and the fourth impedance matching structure 2244 are electrically connected with the second impedance matching structure 2242 and the first impedance matching structure 2241 through the second conductive via 2252, so as to form an integral impedance matching structure on the multi-layer substrate layer 221 structure, and better restrict the transmission direction of the antenna 222 signal.

Further, the on-board conductive line 223 may be a conductive line for other purposes, for example, when the device has a charging requirement, the on-board conductive line 223 may also have a charging line. Referring to fig. 14, the control circuit 211 has a charging circuit 2112, and the charging line 2233 may be one or two, so as to electrically connect at least one of a positive charging electrode and a negative charging electrode for charging with the charging circuit 2112 for charging.

Referring to fig. 6 and 10, in some embodiments, the substrate layer 221 provided with the charge line 2233 is referred to as a charge line layer 2213, and the charge line layer 2213 is located inside the antenna layer. The antenna layer has at least one charging connection 2263. As shown in fig. 8, in one embodiment, the charging connection terminal 2263 is disposed on the first antenna layer 2211. In other embodiments, the charging connection terminal 2263 may also be disposed on the second antenna layer 2216. The charging connection terminal 2263 is electrically connected to the charging wire 2233, and the charging connection terminal 2263 may be used to make electrical connection with at least one of the charging positive electrode and the charging negative electrode, for example, with a metal conductive member 130 described later. The charging connection 2263 has a conductive structure, such as a conductive contact or other structure.

Referring to fig. 2-5, in some embodiments, to form a charging positive electrode and a charging negative electrode that facilitate charging, the housing 100 includes a metal section 110 and an insulating section 120. The metal section 110 and the insulating section 120 are both in a cylindrical structure, the insulating section 120 can be abutted to the rear end of the metal section 110, and the metal section 110 and the insulating section 120 can be used to jointly enclose at least a portion of the accommodating cavity of the housing 100. The metal segment 110 may be a metal material such as copper or nickel or an alloy material such as stainless steel. The insulating segment 120 may be made of ceramic or other insulating material. The insulating section 120 is provided with a metal conductive member 130, and the metal conductive member 130 is electrically connected to the charging connection terminal 2263. The metal segment 110 is electrically connected to a charging circuit 2112. The metal conductive member 130 and the metal segment 110 are respectively used as one of a charging positive electrode and a charging negative electrode of the charging circuit 2112, for example, the metal conductive member 130 is used as the charging positive electrode, the metal segment 110 is used as the charging negative electrode, or the metal conductive member 130 is used as the charging negative electrode, and the metal segment 110 is used as the charging positive electrode, so as to realize charging.

Referring to fig. 2-5, in some embodiments, the control circuit board 200 is provided with an elastic thimble 212, and the elastic thimble 212 is made of a conductive material, and one end of the elastic thimble is electrically connected to the charging circuit 2112, and the other end of the elastic thimble is electrically connected to the inner wall of the metal segment 110, so as to electrically connect the metal segment 110 of the housing 100 with the charging circuit 2112. Of course, the elastic ejector pin 212 may be replaced by other materials, such as a conductive spring.

Referring to fig. 2-5, in some embodiments, the metal conductive member 130 is exposed out of the insulating section 120, wherein the metal conductive member 130 extends to the charging connection end 2263 of the antenna layer and is electrically connected to the charging connection end 2263, and further electrically connected to the charging circuit 2112 through the charging wire 2233. The metal conductive member 130 may be fixed to the charging connection terminal 2263 by welding, clamping, bonding, or the like, and remain electrically connected.

During use of the device, when the device is inserted into the food material, the insulating section 120 is usually located outside the food material and needs to be subjected to high temperature in a cooking environment, and in some cooking environments, the temperature in the space can reach 300 ℃ or more. For example, the cooking environment temperature in the oven may reach 200 ℃ or more and the cooking environment temperature in the BBQ oven may reach 500 ℃ or more. In order to ensure reliable electrical connection between the metal conductive member 130 and the charging connection terminal 2263, in some embodiments, referring to fig. 2-5 and fig. 7 and 8, the charging connection terminal 2263 has a fifth conductive via 2255, the metal conductive member 130 has a mounting hole 131, and the charging connection terminal 2263 and the metal conductive member 130 are fixed and electrically connected by a conductive screw 133 passing through the fifth conductive via 2255 and the mounting hole 131. The conductive screw 133 performs a conductive function while locking and fixing the charging connection terminal 2263 and the metal conductive member 130. The conductive screw 133 itself can withstand high temperature, so that the connection structure is not only firm and reliable, but also can withstand high temperature, for example, at 300 ℃, the conductive screw 133 can still ensure good electrical connection between the charging connection terminal 2263 and the metal conductive member 130.

Referring to fig. 2-5, in some embodiments, the metal conductive member 130 extends from the rear end to the rear end of the insulating section 120, and since the metal conductive member 130 is made of conductive metal and has good thermal conductivity, in these embodiments, the ambient temperature detecting unit 300 is at least partially disposed in the metal conductive member 130, and heat is transferred by using the metal conductive member 130 to achieve temperature detection. The metallic conductive member 130 may be directly exposed to the cooking environment for better sensing and communicating temperature information within the cooking environment. Of course, the metal conductive member 130 may also indirectly contact with the hot air in the cooking environment to form a heat conduction structure.

Referring to fig. 2-5, in some embodiments, the metal conductive member 130 has an inner cavity, and the rear end of the extension portion 220 extends into the inner cavity, so that the connection between the ambient temperature detecting unit 300 and the extension portion 220 is facilitated, and the ambient temperature detecting unit 300 disposed in the metal conductive member 130 can be protected by using good strength of metal.

Referring to fig. 2-5, in some embodiments, the metal conductive member 130 is also part of the housing 100, and the outer wall thereof forms the outer wall of the housing 100 together with the metal segment 110 and the insulating segment 120. In some embodiments, the metallic conductive member 130 has a profile that matches the insulating section 120, such as a cylindrical shape or other shape, so as to form a rounded transition with the insulating section 120 in the axial direction of the housing 100. The inner cavity of the metallic conductive member 130 forms a mounting cavity with the cavities of the metallic segment 110 and the insulating segment 120.

In addition, referring to fig. 2-5, in some embodiments, the metal conductive member 130 may be screwed into the cavity of the insulating section 120, and is screwed and fixed with the internal thread of the cavity of the insulating section 120 by the external thread of the metal conductive member 130. Of course, in other embodiments, the metal conductive member 130 and the extension 220 may be fixed by other manners, such as welding, clamping, etc.

Referring to fig. 2-5, in some embodiments, a rear cover 140 may be further disposed at the rear end of the metal conductive member 130, and the rear cover 140 is fixed on the metal conductive member 130, for example, by screwing the threaded hole of the rear cover 140 with the protruding threaded portion 132 on the metal conductive member 130. Of course, in other embodiments, the metal conductive member 130 and the rear cover 140 may be fixed by other manners, such as welding, clamping, etc.

Further, referring to fig. 6, in some embodiments, the charging line layer 2213 is located between an antenna layer (e.g., the first antenna layer 2211) and the first detection unit conductive line layer 2214. Alternatively, in other embodiments, the charging line layer 2213 may also be located between the antenna layer (e.g., the second antenna layer 2216) and the second detection unit conductive line layer 2215. The charging connection terminal 2263 is electrically connected to the charging wire 2233 through the fifth conductive via 2255.

Further, referring to fig. 6, in some embodiments, the adjacent substrate layer 221 of the antenna layer is a clearance layer 2212, and the clearance layer 2212 is not provided with the antenna 222 and the on-board conductive line 223, so as to ensure that a sufficient space distance is formed between the substrate layer 221 where the on-board conductive line 223 is located and the first antenna layer 2211 in the stacking direction. Of course, the number of the headroom layers 2212 is more than one, and in other embodiments, the headroom layers 2212 may be more than two.

Of course, in other embodiments, the first antenna layer 2211, the headroom layer 2212, the charging line layer 2213, the first detection unit wire layer 2214, the second detection unit wire layer 2215 and the second antenna layer 2216 may be arranged in other lamination manners, and are not limited to the lamination sequence shown in fig. 6.

Further, referring to fig. 2-5, in some embodiments, the housing 100 has a safety zone indicator 101, and a region from the front end of the housing 100 to the safety zone indicator 101 is a safety zone, and the food temperature detecting unit 40030 is disposed within the safety zone. In some embodiments, the safety zone indicator 101 may be a line or a relief three-dimensional score line with a color that is significantly different from the surface color of other areas of the housing 100, for indicating to a user the depth to which the temperature detecting device 1 is inserted into an object (e.g., food). Since the safety zone is designed to be in a range that allows full insertion into food when in use, while the temperature in the food is lower than that of external cooking, it is possible to avoid damaging the electronic components of the temperature detection device 1 by high temperatures in the cooking environment (e.g., in an oven above 200 ℃, in a BBQ oven above 500 ℃, etc.). In addition, the safety zone indicator 101 can also avoid the damage to the casing 100 caused by the temperature detecting device 1 entering the object to be detected too deeply, and avoid the scalding of the operator. In some embodiments, the safe-zone indicator 101 may be disposed on an outer wall of the housing 100. In some embodiments, the safe-zone indicator 101 may be disposed around an outer wall of the housing 100.

In some embodiments, the battery may be a rechargeable battery or a disposable battery. The battery is disposed in the housing 100 and is located within the safety zone. The battery is used for supplying power to the electrical components in the temperature detection device 1.

Referring to fig. 1-5, in some embodiments, the control circuit board 200 is located within the safety zone, in the longitudinal direction of the housing 100. The battery is located at the front end of the control circuit board 200.

Further, referring to fig. 1-5, in some embodiments, in order to better acquire the signal of the antenna 222, the antenna 222 is disposed at the rear side of the security zone mark 101, that is, the antenna 222 is located outside the food material during the use of the temperature detecting device 1, so as to avoid the influence of the food material on the signal receiving and transmitting of the antenna 222. In some embodiments, the ambient temperature detecting unit 300 is disposed at the rear side of the safety zone indicator 101, i.e. the ambient temperature detecting unit 300 is located outside the food during use of the temperature detecting device 1, so as to better detect the temperature of the cooking environment. In some embodiments, the metal conductive member 130 is disposed behind the security area indicator 101 to prevent the metal conductive member 130 from being damaged by repeated insertion of food materials. The charging connection end 2263 is also disposed at the rear side of the safety line to facilitate docking of the metal conductive member 130.

Further, referring to fig. 1-5, in some embodiments, the safety zone mark 101 is located on the metal segment 110, that is, in this embodiment, a portion of the metal segment 110, the insulating segment 120, and the metal conductive member 130 are all located on the rear side of the safety zone mark 101. The antenna 222 is positioned within the insulating section 120 to ensure the communication effect of the antenna 222.

During use of the temperature detection device 1, the area of the device located behind the safety zone indicator 101 is typically exposed to a higher temperature. The extension 220 is also located at the rear side of the security area indicator 101, and since the antenna 222, the on-board conductive wire 223 and the conductive via on the extension 220 are only conductive parts disposed on the substrate layer 221, they deform less under the high temperature of the cooking environment, so that a stable electrical connection effect can be ensured.

On the other hand, the control circuit board 200 is applied to the temperature detecting device 1, and in other embodiments, the control circuit board 200 may be applied to other temperature detecting devices 1 that need to implement wireless communication, especially to temperature detecting devices 1 that need to be used at high temperatures.

Reference is made to various exemplary embodiments herein. However, those skilled in the art will recognize that changes and modifications may be made to the exemplary embodiments without departing from the scope herein. For example, the various operational steps and components used to perform the operational steps may be implemented in different ways (e.g., one or more steps may be deleted, modified, or combined into other steps) depending on the particular application or taking into account any number of cost functions associated with the operation of the system.

While the principles herein have been shown in various embodiments, many modifications of structure, arrangement, proportions, elements, materials, and components, which are particularly adapted to specific environments and operative requirements, may be used without departing from the principles and scope of the present disclosure. The above modifications and other changes or modifications are intended to be included within the scope of this document.

The foregoing detailed description has been described with reference to various embodiments. However, those skilled in the art will recognize that various modifications and changes may be made without departing from the scope of the present disclosure. Accordingly, the present disclosure is to be considered as illustrative and not restrictive in character, and all such modifications are intended to be included within the scope thereof. Also, advantages, other advantages, and solutions to problems have been described above with regard to various embodiments. The benefits, advantages, solutions to problems, and any element(s) that may cause any benefit, advantage, or solution to occur or become more pronounced are not to be construed as a critical, required, or essential feature. The terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, system, article, or apparatus. Furthermore, the term "couple" and any other variants thereof are used herein to refer to physical connections, electrical connections, magnetic connections, optical connections, communication connections, functional connections, and/or any other connection.

Those skilled in the art will recognize that many changes may be made to the details of the above-described embodiments without departing from the underlying principles of the application. Accordingly, the scope of the application should be determined from the following claims.

Claims

A temperature detection device for food materials, comprising:

A housing having a front end insertable into a food material and a rear end opposite the front end, the housing forming a mounting cavity;

the control circuit board is arranged in the mounting cavity;

The control circuit board is provided with a main body part and an extension part extending backwards from the main body part, the main body part is provided with a control circuit, the control circuit is provided with an antenna signal processing unit, the extension part is provided with at least two base material layers which are fixedly arranged in layers, the extension part is provided with an antenna and an on-board conductive wire, the antenna and the on-board conductive wire are respectively fixedly arranged on different base material layers, the antenna is electrically connected with the antenna signal processing unit, and the on-board conductive wire is used for electrically connecting the control circuit with other components.
The temperature detecting device according to claim 1, wherein the base material layer provided with the antenna is an antenna layer, and the antenna layer is located outermost in a lamination direction of the base material layer.
The temperature detecting device according to claim 2, wherein the base material layers are at least three layers, and in the lamination direction of the base material layers, two base material layers located at the outermost sides are the antenna layers, and antennas on the two antenna layers are electrically connected to each other;

the substrate layer provided with the on-board conductive wire is positioned between the two antenna layers.
A temperature sensing device according to claim 3, wherein the substrate layer between the two antenna layers is provided with first conductive vias, the first conductive vias being electrically connected to each other to electrically connect the antennas on the two antenna layers.
The temperature detecting device according to claim 3 or 4, wherein one antenna layer is a first antenna layer and the other antenna layer is a second antenna layer, and wherein an antenna of the first antenna layer is electrically connected to the antenna signal processing unit through a conductive wire.
The temperature sensing device of claim 5, wherein the first antenna layer is provided with a first impedance matching structure, the first impedance matching structure being disposed on both sides of the conductive line.
The temperature sensing device of claim 6, wherein a second impedance matching structure is disposed on the second antenna layer, the second impedance matching structure corresponding to the location of the first impedance matching structure and electrically connected to the first impedance matching structure through a second conductive via.
The temperature detecting device according to any one of claims 2 to 7, further comprising an ambient temperature detecting unit provided to the housing for detecting a temperature of a cooking environment of the food material;

The on-board conducting wire is provided with a first detection unit conducting wire and a second detection unit conducting wire, the first detection unit conducting wire and the second detection unit conducting wire are used for electrically connecting the ambient temperature detection unit with the control circuit, the substrate layer where the first detection unit conducting wire and the second detection unit conducting wire are located is located on the inner side of the antenna layer, the antenna layer is provided with a first contact and a second contact which are used for electrically connecting the ambient temperature detection unit, the first contact is electrically connected with the first detection unit conducting wire, and the second contact is electrically connected with the second detection unit conducting wire.
The temperature sensing device of claim 8, wherein the first sensing element wire and the second sensing element wire are fixed on the same substrate layer or on different substrate layers, respectively, the first sensing element wire is electrically connected to the first contact through a third conductive via, and the second sensing element wire is electrically connected to the second contact through a fourth conductive via.
The temperature detecting device according to claim 9, wherein the base material layer provided with the first detecting unit wire is a first detecting unit wire layer, the base material layer provided with the second detecting unit wire is a second detecting unit wire layer, and the first detecting unit wire layer and the second detecting unit wire layer are different base material layers and are laminated to each other.
The temperature detecting device according to any one of claims 2 to 10, wherein the first detecting unit wire layer has a third impedance matching structure provided on both sides of the first detecting unit wire, and/or the second detecting unit wire layer has a fourth impedance matching structure provided on both sides of the second detecting unit wire.
The temperature detecting device according to any one of claims 2 to 11, wherein the on-board conductive wire has a charging wire, the control circuit has a charging circuit, the charging wire is electrically connected to the charging circuit, the base material layer provided with the charging wire is a charging wire layer, the charging wire layer is located inside the antenna layer, the antenna layer has a charging connection end, and the charging connection end is electrically connected to the charging wire.
The temperature detecting device according to claim 12, wherein the housing includes a metal section and an insulating section, the insulating section is provided with a metal conductive member, the metal conductive member is electrically connected with the charging connection terminal, the metal section is electrically connected with the charging circuit, and the metal conductive member and the metal section respectively serve as one of a positive electrode and a negative electrode of the charging circuit to realize charging.
The temperature detecting device according to claim 13, wherein the metal conductive member is exposed from the insulating section, and extends to the charging connection end of the antenna layer and is electrically connected to the charging connection end.
The temperature sensing device of claim 14, wherein the charging connection terminal has a fifth conductive via, the metal conductive member has a mounting hole, and the charging connection terminal and the metal conductive member are secured and electrically connected by a conductive screw through the fifth conductive via and the mounting hole.
A temperature sensing device according to any one of claims 11-15, wherein the charging wire layer is located between the antenna layer and the first sensing element wire layer or between the antenna layer and the second sensing element wire layer, and the charging connection terminal is electrically connected to the charging wire through a fifth conductive aperture.
A temperature-sensing device according to any one of claims 2-16, wherein adjacent substrate layers of the antenna layers are headroom layers, the headroom layers being devoid of antennas and on-board conductive lines.
The temperature-sensing device of any one of claims 1-17, wherein the antenna and the on-board conductive wire are attached to a surface of the substrate layer.
The temperature-sensing device of any one of claims 1-18, wherein the antenna and the on-board conductive trace are affixed to the surface of the substrate layer by a printing or spraying process.
The temperature detection device according to any one of claims 1 to 19, wherein the housing has a safety zone indicator, the control circuit is located on a front side of the safety zone indicator, and the antenna, the ambient temperature detection unit, and the charging connection terminal are located on a rear side of the safety zone indicator.
The temperature-detecting device according to claim 20, wherein the housing includes a metal section and an insulating section, the insulating section being located behind the metal section, the safety zone indicator being located on the metal section, the antenna being located within the insulating section.
A temperature detection device for food materials, comprising:

A housing having a front end insertable into a food material and a rear end opposite the front end, the housing forming a mounting cavity;

the control circuit board is arranged in the mounting cavity;

The control circuit board is provided with a main body part and an extension part extending backwards from the main body part, the main body part is provided with a control circuit, the control circuit is provided with an antenna signal processing unit, the extension part is provided with at least two base material layers which are fixedly arranged in layers, the extension part is provided with an antenna and an on-board conductive wire, the antenna and the on-board conductive wire are fixedly arranged on the extension part, the antenna is electrically connected with the antenna signal processing unit, and the on-board conductive wire is used for electrically connecting the control circuit with other components.
The control circuit board of the temperature detection device is characterized by comprising a main body part and an extension part extending backwards from the main body part, wherein the main body part is provided with a control circuit, the control circuit is provided with an antenna signal processing unit, the extension part is provided with at least two base material layers which are fixedly arranged in layers, the extension part is provided with an antenna and an on-board conductive wire, the antenna and the on-board conductive wire are respectively fixedly arranged on different base material layers, the antenna is electrically connected with the antenna signal processing unit, and the on-board conductive wire is used for electrically connecting the control circuit with other components.
The control circuit board according to claim 23, wherein the base material layer provided with the antenna is an antenna layer, and the antenna layer is located outermost in a lamination direction of the base material layer.
The control circuit board of claim 24, wherein said base material layers are at least three layers, and in the lamination direction of said base material layers, two base material layers located at the outermost side are each said antenna layers, and antennas on two said antenna layers are electrically connected to each other;

the substrate layer provided with the on-board conductive wire is positioned between the two antenna layers.
The control circuit board of claim 24 or 25, wherein one antenna layer is a first antenna layer and the other antenna layer is a second antenna layer, wherein an antenna of the first antenna layer is electrically connected to the antenna signal processing unit through a conductive wire, and wherein the first antenna layer is provided with first impedance matching structures disposed on both sides of the conductive wire.
The control circuit board of claim 26, wherein a second impedance matching structure is disposed on the second antenna layer, the second impedance matching structure corresponding to the location of the first impedance matching structure and electrically connected to the first impedance matching structure through a second conductive via.
The control circuit board of any one of claims 24-27, wherein the on-board conductive trace has a first sensing element wire and a second sensing element wire, the first and second sensing element wires electrically connecting the ambient temperature sensing element to the control circuit, the substrate layer on which the first and second sensing element wires reside being located inside an antenna layer, the antenna layer having a first contact and a second contact, the first contact being electrically connected to the first sensing element wire, the second contact being electrically connected to the second sensing element wire.
The control circuit board of claim 28, wherein the substrate layer with the first sensing unit conductive lines is a first sensing unit conductive line layer, the substrate layer with the second sensing unit conductive lines is a second sensing unit conductive line layer, the first and second sensing unit conductive line layers are different substrate layers and are stacked with each other, the first sensing unit conductive line layer has a third impedance matching structure disposed on both sides of the first sensing unit conductive lines, and/or the second sensing unit conductive line layer has a fourth impedance matching structure disposed on both sides of the second sensing unit conductive lines.
The control circuit board of any one of claims 24-29, wherein the on-board conductive trace has a charging trace, the control circuit has a charging trace electrically connected to the charging trace, the substrate layer on which the charging trace is disposed is a charging trace layer, the charging trace layer is located inside the antenna layer, the antenna layer has a charging connection end, and the charging connection end is electrically connected to the charging trace.
The control circuit board of claim 30, wherein the charging connection terminal has a fifth conductive via for a conductive screw to pass through to secure and electrically connect the charging connection terminal and a corresponding metallic conductive member.
The control circuit board of any one of claims 24-31, wherein adjacent substrate layers of the antenna layer are headroom layers, the headroom layers being devoid of antennas and on-board conductive lines.
The control circuit board of any one of claims 23-31, wherein the antenna and the on-board conductive line are attached to a surface of the substrate layer.