CN119987590B - A display substrate, its fabrication method, and a display device. - Google Patents
A display substrate, its fabrication method, and a display device.Info
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- CN119987590B CN119987590B CN202510111995.7A CN202510111995A CN119987590B CN 119987590 B CN119987590 B CN 119987590B CN 202510111995 A CN202510111995 A CN 202510111995A CN 119987590 B CN119987590 B CN 119987590B
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Abstract
The display substrate comprises a substrate, a light-emitting structure layer arranged on the substrate and a touch structure layer arranged on one side of the light-emitting structure layer far away from the substrate, wherein the touch structure layer comprises a first conductive layer and a second conductive layer which are sequentially stacked along the direction far away from the substrate, the first conductive layer comprises a first touch electrode and a first magnetic electrode, the second conductive layer comprises a second touch electrode and a second magnetic electrode, the first conductive layer is made of aluminum or copper, and the second conductive layer is made of copper so as to reduce resistance.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display substrate, a preparation method thereof and a display device.
Background
The market occupation rate of the passive electromagnetic pen is gradually increased, the scheme of an electromagnetic resonance (Electro-Magnetic Resonance, EMR) passive pen and a flexible printed circuit board (Flexible Printed Circuit, FPC) electromagnetic induction board is mostly adopted in the scheme of a handwriting pen of a display device (such as a mobile phone and a tablet personal computer), and the scheme of an electromagnetic resonance (Electro-Magnetic Resonance, EMR) passive pen and a printed circuit board (Printed Circuit Board, PCB) electromagnetic induction board is mostly adopted in the scheme of a handwriting pen of a painting display screen.
With the need for mobile phone products being upgraded, such as folding mobile phones, electromagnetic resonance (Electro-Magnetic Resonance, EMR) passive pens can be integrated inside the display device. However, the magnetron electrodes of electromagnetic resonance (Electro-Magnetic Resonance, EMR) passive pens do not meet the load requirements of the integrated circuit chip in the display device.
Disclosure of Invention
The embodiment of the application provides a display substrate, a preparation method thereof and a display device, which are used for reducing resistance.
The embodiment of the disclosure provides a display substrate, which comprises a substrate, a light-emitting structure layer arranged on the substrate, and a touch control structure layer arranged on one side of the light-emitting structure layer far away from the substrate, wherein the touch control structure layer comprises a first conductive layer and a second conductive layer which are sequentially stacked along the direction far away from the substrate, the first conductive layer comprises a first touch control electrode and a first magnetic control electrode, the second conductive layer comprises a second touch control electrode and a second magnetic control electrode, the material of the first conductive layer is aluminum or copper, and the material of the second conductive layer is copper.
In an exemplary embodiment, the first conductive layer has a thickness greater than or equal to 6000 angstroms and less than or equal to 9000 angstroms.
In an exemplary embodiment, the second conductive layer has a thickness greater than or equal to 9000 angstroms and less than or equal to 15000 angstroms.
In an exemplary embodiment, the first conductive layer is made of aluminum or copper, and the first conductive layer has a thickness of 6000 angstroms or more and 7000 angstroms or less, or copper, and the first conductive layer has a thickness of 7000 angstroms or more and 9000 angstroms or less.
In an exemplary embodiment, the orthographic projection of the second magnetic control electrode on the substrate overlaps at least part of the orthographic projection of the first touch control electrode on the substrate, the material of the first touch control electrode is aluminum, the material of the second magnetic control electrode is copper, or the material of the first touch control electrode and the material of the second magnetic control electrode are copper.
In an exemplary embodiment, the orthographic projection of the second touch electrode on the substrate overlaps at least part of the orthographic projection of the first magnetic electrode on the substrate, the material of the first magnetic electrode is aluminum, the material of the second touch electrode is copper, or the material of the second touch electrode and the material of the first magnetic electrode are both copper.
In an exemplary embodiment, the touch structure layer further includes a touch insulating layer disposed between the first conductive layer and the second conductive layer, and the touch insulating layer has a thickness greater than or equal to 3000 angstroms and less than or equal to 5000 angstroms.
In an exemplary embodiment, the material of the touch insulating layer is an inorganic material or an organic material.
The embodiment of the disclosure also provides a preparation method of the display substrate, which comprises the following steps:
sequentially forming a light-emitting structure layer on a substrate;
forming a touch control structure layer on one side of the light-emitting structure layer far away from the substrate;
the touch structure layer comprises a first conductive layer and a second conductive layer which are sequentially laminated along the direction far away from the substrate, wherein the first conductive layer comprises a first touch electrode and a first magnetic electrode, the second conductive layer comprises a second touch electrode and a second magnetic electrode, the first conductive layer is made of aluminum or copper, and the second conductive layer is made of copper;
the first touch electrode and the first magnetic electrode are prepared from the same conductive material through the same preparation process, and the second touch electrode and the second magnetic electrode are prepared from the same conductive material through the same preparation process.
The embodiment of the disclosure also provides a display device, which is characterized by comprising the display substrate.
According to the display substrate, metal aluminum or metal copper is adopted by the first touch electrode and the first magnetic electrode, the thicknesses of the first touch electrode and the first magnetic electrode are larger than or equal to 6000 angstroms and smaller than or equal to 7000 angstroms, breakage of the first touch electrode and the first magnetic electrode due to material stress is avoided, electrical connection of the first touch electrode and the first magnetic electrode is guaranteed, resistance of the first touch electrode and the first magnetic electrode is reduced, and the load requirement of an integrated circuit chip is met.
According to the display substrate, the first touch electrode and the first magnetic electrode are made of metal copper, the thicknesses of the first touch electrode and the first magnetic electrode are larger than 7000 angstroms and smaller than or equal to 9000 angstroms, breakage of the first touch electrode and the first magnetic electrode due to material stress is avoided, electrical connection of the first touch electrode and the first magnetic electrode is guaranteed, resistance of the first touch electrode and the first magnetic electrode is reduced, and the load requirement of an integrated circuit chip is met.
According to the display substrate, the thickness of the first touch electrode and the first magnetic electrode is larger than or equal to 6000 angstroms and smaller than or equal to 9000 angstroms, so that the first touch electrode and the first magnetic electrode can be covered by the touch insulating layer, and the insulativity of the first touch electrode and the first magnetic electrode is guaranteed.
According to the display substrate, the second touch electrode and the second magnetic electrode are made of metal copper, the thicknesses of the second touch electrode and the second magnetic electrode are larger than or equal to 9000 angstroms and smaller than or equal to 15000 angstroms, breakage of the second touch electrode and the second magnetic electrode due to material stress is avoided, electrical connection of the second touch electrode and the second magnetic electrode is guaranteed, resistance of the second touch electrode and the second magnetic electrode is reduced, and the load requirement of an integrated circuit chip is met.
According to the display substrate, orthographic projection of at least part of the second magnetic control electrode and the first touch control electrode on the substrate is overlapped, the second magnetic control electrode adopts metal copper, the first touch control electrode adopts metal aluminum, and the stress direction of the metal copper is opposite to that of the metal aluminum, so that the stress of the second magnetic control electrode on the upper layer can offset the stress of the first touch control electrode on the lower layer, and the first touch control electrode is prevented from being broken.
According to the display substrate, the second magnetic control electrode is made of metal copper, the resistance of copper is low, and the requirement of the load of an integrated circuit chip can be met.
According to the display substrate, orthographic projection of at least part of the second touch electrode and the first magnetic electrode on the substrate is overlapped, the second touch electrode is made of metal copper, the first magnetic electrode is made of metal aluminum, and the stress direction of the metal copper is opposite to that of the metal aluminum, so that the stress of the second touch electrode on the upper layer can offset the stress of the first magnetic electrode on the lower layer, and the first magnetic electrode is prevented from being broken.
According to the display substrate, the second touch electrode is made of metal copper, the resistance of copper is low, and the requirement of the load of an integrated circuit chip can be met.
Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application. Other advantages of the application may be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
The accompanying drawings are included to provide an understanding of the principles of the application, and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain, without limitation, the principles of the application.
FIG. 1 is a schematic cross-sectional view of a related display substrate;
fig. 2 is a schematic cross-sectional structure of a display substrate according to an embodiment of the disclosure;
FIG. 3 is a schematic cross-sectional view of another display substrate according to an embodiment of the disclosure;
fig. 4 is a schematic cross-sectional view of another display substrate according to an embodiment of the disclosure.
Detailed Description
The present application has been described in terms of several embodiments, but the description is illustrative and not restrictive, and it will be apparent to those of ordinary skill in the art that many more embodiments and implementations are possible within the scope of the described embodiments. Although many possible combinations of features are shown in the drawings and discussed in the detailed description, many other combinations of the disclosed features are possible. Any feature or element of any embodiment may be used in combination with or in place of any other feature or element of any other embodiment unless specifically limited.
The present application includes and contemplates combinations of features and elements known to those of ordinary skill in the art. The disclosed embodiments, features and elements of the present application may also be combined with any conventional features or elements to form a unique inventive arrangement. Any feature or element of any embodiment may also be combined with features or elements from other inventive arrangements to form another unique inventive arrangement. It is therefore to be understood that any of the features shown and/or discussed in the present application may be implemented alone or in any suitable combination. Accordingly, the embodiments are not to be restricted except in light of the attached claims and their equivalents. Further, various modifications and changes may be made within the scope of the appended claims.
Furthermore, in describing representative embodiments, the specification may have presented the method and/or process as a particular sequence of steps. However, to the extent that the method or process does not rely on the particular order of steps set forth herein, the method or process should not be limited to the particular sequence of steps described. Other sequences of steps are possible as will be appreciated by those of ordinary skill in the art. Accordingly, the particular order of the steps set forth in the specification should not be construed as limitations on the claims. Furthermore, the claims directed to the method and/or process should not be limited to the performance of their steps in the order written, and one skilled in the art can readily appreciate that the sequences may be varied and still remain within the spirit and scope of the embodiments of the present application.
Fig. 1 is a schematic cross-sectional structure of a related display substrate. As shown in fig. 1, the related display substrate includes a substrate 101', a driving circuit layer 102' disposed on the substrate 101', a light emitting structure layer 103' disposed on a side of the driving circuit layer 102 'away from the substrate 101', a packaging structure layer 104 'disposed on a side of the light emitting structure layer 103' away from the substrate 101', a buffer layer 107' disposed on a side of the packaging structure layer 104 'away from the substrate 101', a touch structure layer 105 'disposed on a side of the buffer layer 107' away from the substrate 101', and a color film structure layer 106' disposed on a side of the touch structure layer 105 'away from the substrate 101'. The touch structure layer 105 'includes a first touch electrode 11' disposed on a side of the package structure layer 104 'away from the substrate 101', a touch insulating layer disposed on a side of the first touch electrode 11 'away from the substrate 101', and a second touch electrode 12 'disposed on a side of the touch insulating layer away from the substrate 101'. The first touch electrode 11 'and the second touch electrode 12' generally include a first sub-electrode, a second sub-electrode and a third sub-electrode, which are sequentially disposed along a direction far away from the substrate, wherein the first sub-electrode and the third sub-electrode are both made of metal titanium, have a thickness of 500 angstroms, and the second sub-electrode is made of metal aluminum, and have a thickness of 6500 angstroms.
Through the research of the inventor, the application discovers that the thickness of the display substrate is not increased by integrating an electromagnetic resonance (Electro-Magnetic Resonance, EMR) passive pen in the touch control structure layer of the display substrate in an externally hung mode. However, an electromagnetic resonance (Electro-Magnetic Resonance, EMR) passive pen is integrated in a touch control structure layer of a display substrate, and the magnetic control electrode resistance of the electromagnetic resonance (Electro-Magnetic Resonance, EMR) passive pen is large, so that the load requirement of an integrated circuit chip in the display substrate cannot be met.
The embodiment of the disclosure provides a display substrate, which comprises a substrate, a light-emitting structure layer arranged on the substrate, and a touch control structure layer arranged on one side of the light-emitting structure layer far away from the substrate, wherein the touch control structure layer comprises a first conductive layer and a second conductive layer which are sequentially stacked along the direction far away from the substrate, the first conductive layer comprises a first touch control electrode and a first magnetic control electrode, the second conductive layer comprises a second touch control electrode and a second magnetic control electrode, the first conductive layer is made of aluminum or copper, and the second conductive layer is made of copper.
In an exemplary embodiment, the first conductive layer is made of aluminum or copper, and the first conductive layer has a thickness of 6000 angstroms or more and 7000 angstroms or less, or copper, and the first conductive layer has a thickness of 7000 angstroms or less and 9000 angstroms or less.
In an exemplary embodiment, the second conductive layer has a thickness greater than or equal to 9000 angstroms and less than or equal to 15000 angstroms.
In an exemplary embodiment, the orthographic projection of the second magnetic control electrode on the substrate overlaps at least part of the orthographic projection of the first touch control electrode on the substrate, the material of the first touch control electrode is aluminum, and the material of the second magnetic control electrode is copper.
In an exemplary embodiment, the orthographic projection of the second touch electrode on the substrate overlaps at least part of the orthographic projection of the first magnetic electrode on the substrate, the material of the first magnetic electrode is aluminum, and the material of the second touch electrode is copper.
The touch structure in the display substrate is stacked on the packaging structure layer to form a flexible multilayer cover surface (Flexible Multi Layer On Cell, FMLOC for short) structure. In a plane parallel to the display substrate, the display substrate includes an Active Area (AA), a binding area located at one side of the active area, and an edge area located at the other side of the active area. The effective area may be either a touch area or a display area, and both the touch area and the display area in the following description refer to the effective area.
In an exemplary embodiment, the active area at least comprises a first touch electrode, a second touch electrode, a first magnetic electrode and a second magnetic electrode, the edge area at least comprises a first touch lead, a second touch lead, a first magnetic lead and a second magnetic lead, the binding area at least comprises an integrated circuit chip, one end of the first touch lead is connected with the first touch electrode, the other end of the first touch lead is connected with the integrated circuit chip, one end of the second touch lead is connected with the second touch electrode, the other end of the second touch lead is connected with the integrated circuit chip, one end of the first magnetic lead is connected with the first magnetic electrode, the other end of the first magnetic lead is connected with the integrated circuit chip, one end of the second magnetic lead is connected with the second magnetic electrode, and the other end of the second touch lead is connected with the integrated circuit chip.
In an exemplary embodiment, the first touch electrode and the second touch electrode are located in different film layers to form a mutual capacitance type touch structure, and the first touch electrode and the second touch electrode are used for determining a touch position by utilizing the change of mutual capacitance when touch occurs. The first touch electrode may be a driving (Tx) electrode and the second touch electrode may be a sensing (Rx) electrode. Or the first touch electrode may be a sense (Rx) electrode and the second touch electrode may be a drive (Tx) electrode.
In an exemplary embodiment, the first magnetic control electrode and the second magnetic control electrode are located on different film layers, the first magnetic control electrode may be located on the same film layer as the first touch control electrode, and the second magnetic control electrode may be located on the same film layer as the second touch control electrode. The first magnetic control electrode and the second magnetic control electrode are used for determining coordinates of a touch point when electromagnetic touch is generated.
Fig. 2 is a schematic cross-sectional structure of a display substrate according to an embodiment of the disclosure. In an exemplary embodiment, as shown in fig. 2, in a plane perpendicular to the display substrate, the display substrate includes a base 101, a driving circuit layer 102 disposed on the base 101, a light emitting structure layer 103 disposed on a side of the driving circuit layer 102 remote from the base 101, a package structure layer 104 disposed on a side of the light emitting structure layer 103 remote from the base 101, a buffer layer 107 disposed on a side of the package structure layer 104 remote from the base 101, a touch structure layer 105 disposed on a side of the buffer layer 107 remote from the base 101, and a color film structure layer 106 disposed on a side of the touch structure layer 105 remote from the base 101.
In an exemplary embodiment, the substrate 101 may be a flexible substrate, or may be a rigid substrate. The flexible substrate may include a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic material layer stacked, the materials of the first flexible material layer and the second flexible material layer may be Polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer film, the materials of the first inorganic material layer and the second inorganic material layer may be silicon nitride (SiNx) or silicon oxide (SiOx), etc., for improving the water-oxygen resistance of the substrate, and the materials of the semiconductor layer may be amorphous silicon (a-si).
In an exemplary embodiment, the driving circuit layer 102 may include a plurality of transistors and storage capacitors constituting a pixel driving circuit. In some possible implementations, the driving circuit layer 102 may include a first insulating layer disposed on the substrate, an active layer disposed on the first insulating layer, a second insulating layer covering the active layer, a gate electrode and a first capacitor electrode disposed on the second insulating layer, a third insulating layer covering the gate electrode and the first capacitor electrode, a second capacitor electrode disposed on the third insulating layer, a fourth insulating layer covering the second capacitor electrode, via holes formed on the second insulating layer, the third insulating layer and the fourth insulating layer, the via holes exposing the active layer, a source electrode and a drain electrode disposed on the fourth insulating layer, the source electrode and the drain electrode being connected to the active layer through the via holes, respectively, a flat layer covering the foregoing structure, the flat layer being provided with via holes exposing the drain electrode. The active layer, the gate electrode, the source electrode and the drain electrode form a driving transistor, and the first capacitor electrode and the second capacitor electrode form a storage capacitor.
In an exemplary embodiment, the light emitting structure layer 103 includes a plurality of light emitting devices, and the light emitting devices may include a first electrode, a pixel defining layer, an organic light emitting layer, and a second electrode, which are sequentially stacked in a direction away from the substrate. The pixel definition layer is arranged on the first electrode and the flat layer, pixel openings are arranged on the pixel definition layer, the pixel openings expose the first electrode, the organic light-emitting layer is at least partially arranged in the pixel openings and connected with the first electrode, the second electrode is arranged on the organic light-emitting layer and connected with the organic light-emitting layer, and the organic light-emitting layer emits light rays with corresponding colors under the drive of the first electrode and the second electrode. The first electrode may be an anode, and the second electrode may be a cathode.
In an exemplary embodiment, the light emitting device may be an Organic LIGHT EMITTING Diode (OLED) device, and the Organic light emitting Layer of the Organic light emitting Diode device may include a light emitting Layer (EMITTING LAYER, EML) and one or more film layers including a Hole injection Layer (Hole Injection Layer, HIL), a Hole transport Layer (Hole Transport Layer, HTL), a Hole Blocking Layer (HBL), an electron blocking Layer (Electron Block Layer, EBL), an electron injection Layer (Electron Injection Layer, EIL), and an electron transport Layer (Electron Transport Layer, ETL). The organic material emits light according to a desired gray scale by using the light emission characteristics of the organic material under the voltage driving of the first electrode and the second electrode.
In an exemplary embodiment, the package structure layer 104 may include a first package layer, a second package layer, and a third package layer stacked, where the first package layer and the third package layer may be made of an inorganic material, the second package layer may be made of an organic material, and the second package layer is disposed between the first package layer and the third package layer, so that external moisture may not enter the light emitting device.
In an exemplary embodiment, the buffer layer 107 may employ any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may be a single layer, a multi-layer, or a composite layer.
In an exemplary embodiment, the touch structure layer 105 may include a first conductive layer disposed on a side of the buffer layer 107 remote from the substrate 101, a touch insulation layer 201 disposed on a side of the first conductive layer remote from the substrate 101, a second conductive layer disposed on a side of the touch insulation layer 201 remote from the substrate 101, and a protective layer 202 disposed on a side of the second conductive layer remote from the substrate 101.
In an exemplary embodiment, the first conductive layer includes the first touch electrode 11 and the first magnetic electrode 21, and the first touch electrode 11 and the first magnetic electrode 21 are located on the same film layer and are manufactured by the same manufacturing process using the same conductive material, so that the process is simplified and the production cost is reduced.
In some embodiments, the first touch electrode and the first magnetic electrode are located on the same film layer, and the first touch electrode and the first magnetic electrode may be made of the same or different conductive materials through different preparation processes, which is not described herein.
In the exemplary embodiment, the thickness of the first touch electrode 11 is substantially equal to the thickness of the first magnetic control electrode 21.
In an exemplary embodiment, the thickness of the first touch electrode 11 is h1, and the thickness of the first touch electrode 11 ranges from 6000 A≤h1≤9000A. The thickness of the first touch electrode 11 is an average size of the first touch electrode 11 in a direction perpendicular to the substrate.
According to the display substrate disclosed by the embodiment of the disclosure, the thickness of the first touch electrode 11 and the first magnetic electrode 21 is larger than or equal to 6000 angstroms and smaller than or equal to 9000 angstroms, so that the touch insulating layer 201 can cover the first touch electrode 11 and the first magnetic electrode 21, and the insulativity of the first touch electrode 11 and the first magnetic electrode 21 is ensured.
In an exemplary embodiment, the material of the first touch electrode 11 may be metal aluminum or metal copper, and the thickness of the first touch electrode 11 may be in a range of 6000A. Ltoreq.h1. Ltoreq.7000A.
According to the display substrate, the first touch electrode 11 is made of metal aluminum or metal copper, the thickness of the first touch electrode 11 is larger than or equal to 6000 angstroms and smaller than or equal to 7000 angstroms, breakage of the first touch electrode 11 caused by material stress is avoided, electrical connection of the first touch electrode 11 is guaranteed, the resistance of the first touch electrode 11 is reduced, and the requirement of integrated circuit chip load is met.
In an exemplary embodiment, the material of the first touch electrode 11 may be copper metal, and the thickness of the first touch electrode 11 may be in a range of 70000A < h1≤9000A.
According to the display substrate, the first touch electrode 11 is made of metal copper, the thickness of the first touch electrode 11 is larger than 7000 angstroms and smaller than or equal to 9000 angstroms, breakage of the first touch electrode 11 caused by material stress is avoided, electrical connection of the first touch electrode 11 is guaranteed, the resistance of the first touch electrode 11 is reduced, and the requirement of integrated circuit chip load is met.
In an exemplary embodiment, the thickness of the first magnetron electrode 21 is h2, and the thickness of the first magnetron electrode 21 ranges from 6000 A≤h2≤9000A. The thickness of the first magnetic electrode 21 is the average size of the first magnetic electrode 21 in the direction perpendicular to the substrate.
In an exemplary embodiment, the material of the first magnetic control electrode 21 may be metallic aluminum or metallic copper, and the thickness of the first magnetic control electrode 21 may be in the range of 6000A < h2 < 7000A.
According to the display substrate, the first magnetic control electrode 21 is made of metal aluminum or metal copper, the thickness of the first magnetic control electrode 21 is larger than or equal to 6000 angstroms and smaller than or equal to 7000 angstroms, breakage of the first magnetic control electrode 21 caused by material stress is avoided, electrical connection of the first magnetic control electrode 21 is guaranteed, the resistance of the first magnetic control electrode 21 is reduced, and the requirement of integrated circuit chip load is met.
In an exemplary embodiment, the material of the first magnetic control electrode 21 may be metallic copper, and the thickness of the first magnetic control electrode 21 may be in the range of 70000A < h2≤9000A.
According to the display substrate, the first magnetic control electrode 21 is made of metal copper, the thickness of the first magnetic control electrode 21 is larger than 7000 angstroms and smaller than or equal to 9000 angstroms, breakage of the first magnetic control electrode 21 caused by material stress is avoided, electrical connection of the first magnetic control electrode 21 is guaranteed, the resistance of the first magnetic control electrode 21 is reduced, and the requirement of integrated circuit chip load is met.
In an exemplary embodiment, the touch insulating layer 201 may employ any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may be a single layer, a multi-layer, or a composite layer. The thickness of the touch insulating layer 201 is h3, and the thickness of the touch insulating layer 201 is in the range of 3000 A≤h3≤5000A. The thickness of the touch insulating layer 201 is an average dimension of the touch insulating layer 201 in a direction perpendicular to the substrate.
In an exemplary embodiment, the second conductive layer includes the second touch electrode 12 and the second magnetic electrode 22, and the second touch electrode 12 and the second magnetic electrode 22 are located on the same film layer and are made of the same conductive material through the same manufacturing process, so that the process is simplified and the production cost is reduced.
In some embodiments, the second touch electrode and the second magnetic electrode are located on the same film layer, and the second touch electrode and the second magnetic electrode may be made of the same or different conductive materials through different preparation processes, which is not described herein.
In an exemplary embodiment, the thickness of the second touch electrode 12 is approximately equal to the thickness of the second magnetic electrode 22.
In an exemplary embodiment, the material of the second touch electrode 12 may be copper metal, the thickness of the second touch electrode 12 is h4, and the thickness of the second touch electrode 12 is 9000 a≤h4≤15000A. The thickness of the second touch electrode 12 is an average size of the second touch electrode 12 in a direction perpendicular to the substrate.
According to the display substrate, the second touch electrode 12 is made of metal copper, the thickness of the second touch electrode 12 is larger than or equal to 9000 angstroms and smaller than or equal to 15000 angstroms, breakage of the second touch electrode 12 caused by material stress is avoided, electrical connection of the second touch electrode 12 is guaranteed, resistance of the second touch electrode 12 is reduced, and the requirement of integrated circuit chip load is met.
In an exemplary embodiment, the material of the second magnetic control electrode 22 may be copper metal, and the thickness of the second magnetic control electrode 22 is h5, and the thickness of the second magnetic control electrode 22 is 9000 A≤h5≤15000A. The thickness of the second magnetic electrode 22 is the average size of the second magnetic electrode 22 in the direction perpendicular to the substrate.
According to the display substrate, the second magnetic control electrode 22 is made of metal copper, the thickness of the second magnetic control electrode 22 is larger than or equal to 9000 angstroms and smaller than or equal to 15000 angstroms, breakage of the second magnetic control electrode 22 caused by material stress is avoided, electrical connection of the second magnetic control electrode 22 is guaranteed, resistance of the second magnetic control electrode 22 is reduced, and the requirement of integrated circuit chip load can be met.
In an exemplary embodiment, the orthographic projection of the second magnetron electrode 22 on the substrate 101 overlaps at least part of the orthographic projection of the first touch electrode 11 on the substrate 101. The first touch electrode 11 is made of metal aluminum, the thickness of the first touch electrode 11 is in the range of 6000A < h1< 7000A, or the thickness of the first touch electrode 11 is made of metal copper, and the thickness of the first touch electrode 11 is in the range of 70000A < h1< 9000A. The second magnetic control electrode 22 is made of metal copper, and the thickness of the second magnetic control electrode 22 is 9000 A≤h5≤15000A. The thickness of the second magnetic control electrode 22 and the thickness of the first touch control electrode 11 satisfy the relation h1< h5.
According to the embodiment of the disclosure, the display substrate is overlapped with the orthographic projection of at least part of the first touch electrode 11 on the substrate 101 through the second magnetic control electrode 22, the second magnetic control electrode 22 adopts metal copper, the first touch electrode 11 adopts metal aluminum, the metal aluminum is easy to break relative to the metal copper, the crystallization orientations of the metal aluminum and the metal copper are opposite, so that the stress direction of the metal copper is opposite to that of the metal aluminum, when the thickness of the first touch electrode 11 at the lower layer is larger than or equal to 6000 angstrom and smaller than or equal to 7000 angstrom, the second magnetic control electrode 22 at the upper layer can offset the stress generated by the first touch electrode 11 at the lower layer, and the first touch electrode 11 is prevented from breaking. When the thickness of the first touch electrode 11 is smaller than 6000 angstroms, the thickness of the first touch electrode 11 is too thin and the resistance is high, and when the thickness of the first touch electrode 11 is larger than 7000 angstroms, the thickness of the first touch electrode 11 is too thick, and the stress generated by the first touch electrode 11 at the lower layer cannot be effectively counteracted by the second magnetic electrode 22 at the upper layer, so that the first touch electrode 11 at the lower layer is easy to break.
According to the display substrate, the second magnetic control electrode 22 overlaps with at least part of the front projection of the first touch control electrode 11 on the substrate 101, when the thickness of the first touch control electrode 11 at the lower layer is large (for example, more than 7000 angstrom), and when the first touch control electrode 11 at the lower layer adopts metal aluminum, the second magnetic control electrode 22 at the upper layer cannot effectively counteract stress generated by the first touch control electrode 11 at the lower layer, so that the first touch control electrode 11 at the lower layer is easy to break, and therefore, when the thickness of the first touch control electrode 11 at the lower layer is more than 7000 angstrom and less than or equal to 9000 angstrom, the first touch control electrode 11 at the lower layer adopts metal copper, the resistance of copper is low, the resistance of the first touch control electrode 11 can be reduced, and the first touch control electrode 11 is not easy to break.
In an exemplary embodiment, the orthographic projection of the second touch electrode 12 on the substrate 101 overlaps at least part of the orthographic projection of the first magnetic electrode 21 on the substrate 101. The first magnetic control electrode 21 is made of metal aluminum, the thickness of the first magnetic control electrode 21 is in the range of 6000A < h2< 7000A, or the thickness of the first magnetic control electrode 21 is made of metal copper, and the thickness of the first magnetic control electrode 21 is in the range of 70000A < h1< 9000A. The second touch electrode 12 is made of metal copper, and the thickness of the second touch electrode 12 is 9000 A≤h4≤15000A. The thickness of the second touch electrode 12 and the thickness of the first magnetic electrode 21 satisfy the relation h2< h4.
According to the embodiment of the disclosure, the display substrate is overlapped with the orthographic projection of at least part of the first magnetic control electrode 21 on the substrate 101 through the second touch control electrode 12, the second touch control electrode 12 adopts metal copper, the first magnetic control electrode 21 adopts metal aluminum, the metal aluminum is easy to break relative to the metal copper, the crystallization orientations of the metal aluminum and the metal copper are opposite, so that the stress direction of the metal copper is opposite to that of the metal aluminum, and when the thickness of the first magnetic control electrode 21 at the lower layer is larger than or equal to 6000 angstrom and smaller than or equal to 7000 angstrom, the second touch control electrode 12 at the upper layer can offset the stress generated by the first magnetic control electrode 21 at the lower layer, and the first magnetic control electrode 21 is prevented from breaking. When the thickness of the first magnetic control electrode 21 is smaller than 6000 angstroms, the thickness of the first magnetic control electrode 21 is too thin and the resistance is high, and when the thickness of the first magnetic control electrode 21 is larger than 7000 angstroms, the thickness of the first magnetic control electrode 21 is too thick, and the second touch control electrode 12 on the upper layer cannot effectively counteract the stress generated by the first magnetic control electrode 21 on the lower layer, so that the first magnetic control electrode 21 on the lower layer is easy to break.
According to the display substrate, the second touch electrode 12 overlaps with at least part of the front projection of the first magnetic control electrode 21 on the substrate 101, when the thickness of the first magnetic control electrode 21 at the lower layer is larger than 7000 angstroms and the first magnetic control electrode 21 at the lower layer adopts metal aluminum, the second touch electrode 12 at the upper layer cannot effectively counteract stress generated by the first magnetic control electrode 21 at the lower layer, so that the first magnetic control electrode 21 at the lower layer is easy to break, and therefore, when the thickness of the first magnetic control electrode 21 at the lower layer is larger than 7000 angstroms and smaller than or equal to 9000 angstroms, the first magnetic control electrode 21 at the lower layer adopts metal copper, the resistance of copper is low, the resistance of the first magnetic control electrode 21 can be reduced, and the first magnetic control electrode 21 is difficult to break.
And measuring deformation values of the copper film and the aluminum film under the action of stress by adopting a feeler gauge measurement method. The method comprises the following specific steps:
Respectively applying stress to a 9000A thick copper film and a 6000A thick aluminum film, wherein the deformation value of the copper film is 1.2mm, and the deformation value of the aluminum film is-1 mm;
formula 1 (6000/(6000+9000)) (-1) + (9000/(6000+9000)) (1.2) =0.2 mm, and the deformation value after the copper thin film and the aluminum thin film are laminated can be obtained to be 0.2mm according to formula 1. From this, it is clear that the metal copper and the metal aluminum are laminated to each other to cancel each other out the stress and reduce the strain.
In an exemplary embodiment, the protective layer 202 may be an organic material, such as optically clear adhesive (Optically CLEAR ADHESIVE, OC). The thickness of the protective layer 202 is greater than or equal to 1.5 microns and less than or equal to 3 microns.
In an exemplary embodiment, the color film structure layer 106 includes a light filter and a black matrix, the light filter is disposed corresponding to the light emitting device, the light filter is configured to transmit light of a specific color, the black matrix is at least located between adjacent light filters, and the black matrix is configured to block light and prevent light of adjacent sub-pixels from cross-talk with each other.
The preparation process of the display substrate comprises the following steps:
Step (1), a driving circuit layer 102, a light emitting structure layer 103 and a packaging structure layer 104 are sequentially formed on a substrate;
Step (2), forming a buffer layer 107 on the packaging structure layer 104 through an atomic layer deposition process or a chemical vapor deposition process, wherein the material of the buffer layer 107 is silicon nitride (SiNx), and the thickness of the buffer layer 107 is greater than or equal to 1000 angstroms and less than or equal to 4000 angstroms;
a step (3) of depositing a first conductive film on the buffer layer 107 by a sputtering process, and then forming the first conductive film into a first conductive layer including the first touch electrode 11 and the first magnetic electrode 21 by a patterning process;
step (4), forming a touch insulating layer 201 on the first conductive layer by an atomic layer deposition process or a chemical vapor deposition process, wherein silicon nitride (SiNx) can be used as a material of the touch insulating layer 201;
a step (5) of depositing a second conductive film on the touch insulating layer 201 by a sputtering process, and then forming a second conductive layer including the second touch electrode 12 and the second magnetic electrode 22 by a patterning process;
Step (6), depositing a layer of optically transparent adhesive film on the second conductive layer, and forming a protective layer 202 by the optically transparent adhesive film through a patterning process, wherein the thickness of the protective layer 202 is more than or equal to 1.5 microns and less than or equal to 3 microns;
and (7) forming a color film structure layer 106 on the protective layer 202.
Fig. 3 is a schematic cross-sectional view of another display substrate according to an embodiment of the disclosure. As shown in fig. 3, the main structure of the display substrate of this embodiment may be substantially the same as that of the embodiment shown in fig. 2, except that the buffer layer 107 of the display substrate of this embodiment may be made of an organic material, for example, optically transparent adhesive (Optically CLEAR ADHESIVE, OC).
Fig. 4 is a schematic cross-sectional view of another display substrate according to an embodiment of the disclosure. As shown in fig. 4, the main structure of the display substrate of the present embodiment may be substantially the same as that of the embodiment shown in fig. 2, except that the buffer layer 107, the touch insulating layer 201 and the protective layer 202 of the touch structure layer 105 of the display substrate of the present embodiment may all be made of organic materials, for example, optically transparent adhesive (Optically CLEAR ADHESIVE, OC).
The embodiment of the disclosure also provides a preparation method of the display substrate, which comprises the following steps:
sequentially forming a light-emitting structure layer on a substrate;
forming a touch control structure layer on one side of the light-emitting structure layer far away from the substrate;
the touch structure layer comprises a first conductive layer and a second conductive layer which are sequentially laminated along the direction far away from the substrate, wherein the first conductive layer comprises a first touch electrode and a first magnetic electrode, the second conductive layer comprises a second touch electrode and a second magnetic electrode, the first conductive layer is made of aluminum or copper, and the second conductive layer is made of copper;
the first touch electrode and the first magnetic electrode are prepared from the same conductive material through the same preparation process, and the second touch electrode and the second magnetic electrode are prepared from the same conductive material through the same preparation process.
The embodiment of the disclosure also provides a display device, which comprises any one of the display substrates. The display device can be any product or component with display function such as a mobile phone, a tablet personal computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "first," "second," etc. can include at least one such feature, either explicitly or implicitly.
In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and for example, "connected" may be either permanently connected or removably connected or integrally formed, mechanically connected or electrically connected, directly connected or indirectly connected via an intervening medium, or may be in communication between two elements or in an interaction relationship between two elements, unless otherwise explicitly specified. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the direct contact of the first and second features, or the indirect contact of the first and second features through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the application.
Claims (7)
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| KR102413361B1 (en) * | 2018-02-23 | 2022-06-27 | 동우 화인켐 주식회사 | OLED Integrated Digitizer and Method of Preparing the Same |
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| CN111625145B (en) * | 2020-05-27 | 2024-01-09 | 京东方科技集团股份有限公司 | Touch display substrate and preparation method thereof, touch display device |
| CN112271197B (en) * | 2020-10-23 | 2024-03-08 | 京东方科技集团股份有限公司 | Display substrate and preparation method thereof, display device |
| CN117193551A (en) * | 2022-05-31 | 2023-12-08 | 京东方科技集团股份有限公司 | Touch structure, touch display panel and display device |
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