CN120320152B - Inorganic fluorescent conversion element for laser illumination and display, and preparation and application thereof - Google Patents
Inorganic fluorescent conversion element for laser illumination and display, and preparation and application thereofInfo
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- CN120320152B CN120320152B CN202510795583.XA CN202510795583A CN120320152B CN 120320152 B CN120320152 B CN 120320152B CN 202510795583 A CN202510795583 A CN 202510795583A CN 120320152 B CN120320152 B CN 120320152B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/0607—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature
- H01S5/0608—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature controlled by light, e.g. optical switch
- H01S5/0609—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature controlled by light, e.g. optical switch acting on an absorbing region, e.g. wavelength convertors
- H01S5/0611—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature controlled by light, e.g. optical switch acting on an absorbing region, e.g. wavelength convertors wavelength convertors
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
- C03C4/12—Compositions for glass with special properties for luminescent glass; for fluorescent glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
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Abstract
The invention belongs to the technical field of laser illumination and laser display, and discloses an inorganic fluorescent conversion element for laser illumination and display, and preparation and application thereof, wherein the inorganic fluorescent conversion element comprises a fluorescent glass layer (1), a Ti/Cu seed layer (3), a composite plating layer (2) and a heat dissipation substrate (4), wherein the upper surface of the heat dissipation substrate (4) is covered by the fluorescent glass layer (1), the side surfaces and the upper surface of the heat dissipation substrate are covered by the Ti/Cu seed layer (3), the Ti/Cu seed layer (3) is of a laminated structure of the Ti layer and the Cu layer, and the composite plating layer (2) is a metal copper plating layer doped with nano-and/or micro-scale heat conducting particles (22). The invention improves the heat radiation performance of the fluorescent glass layer by utilizing the fully-coated heat conduction structure of the composite coating, and simultaneously improves the back extraction of photons by the Ti layer in the seed layer, thereby effectively improving the light-emitting brightness of the laser light source (especially the white laser light source).
Description
Technical Field
The invention belongs to the technical field of laser illumination and laser display, and particularly relates to an inorganic fluorescent conversion element for laser illumination and display, and preparation and application thereof.
Background
The laser lighting technology gradually replaces the traditional light source by the advantages of super high power (such as more than 30W/mm 2), super high brightness (such as more than 5000 lumens), high collimation, long irradiation distance, higher conversion efficiency under high current density and the like, and is widely applied to the fields of automobile headlamps, aviation illumination, medical health, special illumination, visible light communication and the like. The laser display technology is also a mainstream technology of future high-end display such as large-screen projection, automobile flat panel display, digital cinema, mobile phone projection and the like.
At present, a fluorescent conversion white light laser source, namely a blue light laser chip remotely excites a yellow fluorescent powder layer, is often adopted in the technical scheme of laser illumination and laser backlight display, and comprises a transmission type laser source and a reflection type laser source. Because the blue laser chip has small irradiation light spot and high laser power density, the fluorescent layer needs to bear higher laser radiation energy and fluorescence conversion heat, and the traditional organic fluorescent resin has poor heat resistance and low heat conductivity coefficient, has some problems of thermal corrosion and carbonization under the excitation of high-power density laser, and is difficult to meet the packaging requirement of a white light laser source. Therefore, fluorescent glass-based conversion materials are becoming an important issue.
The fluorescent glass is an inorganic composite material composed of glass and fluorescent powder, and has the advantages of high thermal stability, easy regulation and control of optical performance, simple preparation process, low cost and the like. However, because the thermal conductivity of the fluorescent glass layer is low, the traditional single-side heat dissipation structures such as a ceramic base and a sapphire base are easy to generate thermal deposition failure on the outer surface far away from the heat dissipation substrate under the excitation of high-power laser, so that the luminous brightness and the thermal stability of the white laser light source are greatly influenced (for example, the prior art already utilizes a Cu sheet to form fluorescent glass through medium-low temperature cofiring, but the fluorescent glass is damaged under the high-temperature condition of laser due to the difference of thermal expansion coefficients), and meanwhile, the reflective fluorescent conversion element has serious light absorption effect, so that the requirement of laser driving or excitation is difficult to be met, and the development of the laser lighting technology is limited. Therefore, it is needed to provide an inorganic fluorescent conversion element with high light saturation threshold (greater than 30W/mm 2) and high light extraction (light efficiency greater than 200 lm/W) to meet the requirements of high-power laser illumination and laser display.
Disclosure of Invention
Aiming at the defects or improvement demands of the prior art, the invention aims to provide an inorganic fluorescent conversion element for laser illumination and display, and preparation and application thereof, wherein the heat dissipation performance of a fluorescent glass layer is improved by utilizing a fully-coated heat conduction structure of a composite coating, and simultaneously, the back extraction of photons is also improved by a Ti layer in a seed layer, so that the light-emitting brightness of a laser light source (especially a white laser light source) is effectively improved. The inorganic fluorescent conversion element does not use an organic bonding material, so that the failure or even carbonization of the organic material under high-power laser excitation and high temperature is avoided, the long-term reliability of the inorganic fluorescent conversion element is improved, and the problem that the traditional single-side heat dissipation structure fails under high-power laser excitation can be solved.
In order to achieve the above object, according to one aspect of the present invention, there is provided an inorganic fluorescent conversion element for reflection type laser lighting or laser display, comprising a fluorescent glass layer, a Ti/Cu seed layer, a composite plating layer and a heat dissipation substrate, wherein,
When part of the upper surface of the heat dissipation substrate is covered by the fluorescent glass layer, the side surface and the upper surface of the fluorescent glass layer are both covered by the Ti/Cu seed layer, and when the whole upper surface of the heat dissipation substrate is covered by the fluorescent glass layer, the side surface and the upper surface of the fluorescent glass layer are both covered by the Ti/Cu seed layer;
The upper surface and the side surface of the Ti/Cu seed layer are completely covered by the composite plating layer, the Ti/Cu seed layer is of a laminated structure of the Ti layer and the Cu layer, wherein the Cu layer is in direct contact with the composite plating layer, and the composite plating layer is a metal copper plating layer doped with nano-scale and/or micro-scale heat conducting particles.
As a further preferable mode of the invention, the transmittance of the heat dissipation substrate in a wave band of 430-480nm is not lower than 60%, and the heat dissipation substrate is made of transparent sapphire or diamond.
As a further preferable aspect of the present invention, the reflectance of the composite plating layer as a whole is not less than 90% in a wavelength band of 430 to 480 nm.
As a further preferable aspect of the invention, the thickness of the fluorescent glass layer is 60-200 μm;
the thickness of the Ti/Cu seed layer is 100-200 nm;
the thickness of the composite coating is 100-250 mu m.
As a further preferred aspect of the present invention, the thermally conductive particles are made of a material satisfying a thermal conductivity of more than 30W/(m·k);
In the composite coating, the volume ratio of the heat conducting particles is 10% -50%.
As a further preferred aspect of the present invention, the material used for the heat conductive particles is one or more of diamond, boron nitride or aluminum oxide.
According to another aspect of the present invention, there is provided a method for producing the above-mentioned inorganic fluorescent conversion element for reflection type laser illumination or laser display, comprising the steps of:
S1, preparing fluorescent glass slurry, coating the fluorescent glass slurry on a heat dissipation substrate to form a fluorescent glass slurry layer, and then co-firing to finish glass melting, so that a fluorescent glass layer is formed on part of the upper surface of the heat dissipation substrate in a covering manner;
S2, depositing a Ti layer and a Cu layer on the side surface and the upper surface of the fluorescent glass layer, the side surface of the heat dissipation substrate and the upper surface uncovered by the fluorescent glass layer through a magnetron sputtering process to obtain a Ti/Cu seed layer;
S3, preparing a composite plating layer on the upper surface and the side surface of the Ti/Cu seed layer by using copper plating solution doped with nano-scale and/or micro-scale heat conducting particles through a plating process, thereby obtaining the inorganic fluorescent conversion element for reflection type laser illumination or laser display.
As a further preferred aspect of the present invention, in step S1, the coating is performed by screen printing;
The fluorescent glass slurry is formed by mixing raw materials including fluorescent powder, glass powder and an organic solvent;
The fluorescent powder is single-color fluorescent powder or multicolor fluorescent powder;
the mass ratio of the fluorescent powder to the glass powder is (0.3-2) 1;
the glass powder is low-temperature glass powder with the glass transition temperature not exceeding 700 ℃;
The temperature adopted by the co-firing is 550-700 ℃, and the sintering time is 40-90 min.
According to still another aspect of the present invention, there is provided the use of the above-mentioned inorganic fluorescent conversion element for reflection type laser illumination or laser display, for laser illumination or laser display, having a luminous flux of 5000 lm or more and a laser power density of 30W/mm 2 or more.
As a further preferred aspect of the invention, the laser illumination and the laser display are for a fluorescence converted white light laser light source.
Compared with the prior art, the technical scheme of the invention has the following beneficial effects:
(1) The inorganic fluorescent conversion element is of a reflection type structure, and the full-cladding heat dissipation of the fluorescent conversion element is realized through the composite coating and the heat dissipation substrate. When the inorganic fluorescent conversion element is used, laser is incident from the lower part of the heat dissipation substrate, enters the fluorescent glass layer and then encounters fluorescent powder particles to excite fluorescence, and meanwhile, light rays are reflected after encountering the Ti layer in the seed layer, so that the inorganic fluorescent conversion element is of a seed reflection type structure. In the laser field, the prior art utilizes Cu sheets to form fluorescent glass through medium-low temperature cofiring, but due to the difference of thermal expansion coefficients, the local temperature can be rapidly increased under the excitation condition of high-power laser, the fluorescent glass can be damaged, and the processing technology of electroplating is rarely used in the laser field; the invention electroplates the compound Cu layer on the heat radiation substrate-fluorescent glass sheet, realizes the full cladding heat radiation through the compound Cu layer on the upper part and the heat radiation substrate on the lower part, the compound plating layer can realize the heat conduction above and at the side of the fluorescent glass layer, improves the reliability, simultaneously, the Ti layer in the seed layer can also improve the light efficiency (because the photon absorption of the Cu layer is serious, the Ti layer in the seed layer has the reflecting function and can be used for the back light extraction of the fluorescent glass layer), and the heat radiation substrate can also realize the heat conduction below the fluorescent glass layer.
(2) The reflection type inorganic fluorescent conversion element obtained by the invention is an inorganic fluorescent conversion element with high luminous saturation threshold (more than 30W/mm 2) and high light extraction (the luminous efficiency is more than 200 lm/W), can be applied to a white laser source for fluorescent conversion of high laser saturation threshold, and can meet the requirements of high-power laser illumination and laser display. The inorganic fluorescence conversion element can be applied to a high-brightness fluorescence conversion white laser light source, can resist high-power density laser driving or excitation, so that the white laser light engine and equipment thereof have ultrahigh brightness and reliability, and promote the development of a laser illumination technology.
(3) The micron-sized heat conducting particles are doped in the composite coating of the reflective inorganic fluorescent conversion element, so that the problem of cracking caused by overlarge internal stress of an electroplated metal layer in the micron-sized thick film electroplating is effectively solved while the overall heat conductivity of the fluorescent conversion element is improved, the problem of insufficient heat conduction of a fluorescent glass layer is also solved, and the reliability of the element in long-term operation under high laser power input is also ensured.
Drawings
Fig. 1 is a schematic structural diagram of an inorganic fluorescent conversion element for laser illumination and display according to an embodiment of the present invention.
FIG. 2 is an enlarged schematic view of the composite coating according to an embodiment of the present invention.
Fig. 3 is a process flow diagram of a preparation process of an inorganic fluorescent conversion element for laser illumination and display according to an embodiment of the present invention.
In fig. 1 and 2, the reference numerals have the meanings of 1a fluorescent glass layer, 2a composite plating layer, 3a Ti/Cu seed layer, 4a heat dissipation substrate, 21 a copper matrix and 22 heat conduction particles.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention. In addition, the technical features of the embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
Example 1
An inorganic fluorescent conversion element for laser illumination and laser display, as shown in figure 1, comprises a fluorescent glass layer 1, a composite plating layer 2, a Ti/Cu seed layer 3 and a heat dissipation substrate 4, wherein the fluorescent glass layer 1 is positioned on the upper surface of the heat dissipation substrate 4, the Ti/Cu seed layer 3 is positioned on the upper surface and the side surface of the heat dissipation substrate 4 and the fluorescent glass layer 1, the composite plating layer 2 is arranged above and on the side surface of the Ti/Cu seed layer 3 (completely covers the Ti/Cu seed layer 3, wherein the Ti/Cu seed layer 3 is of a laminated structure of the Ti layer and the Cu layer, the Ti layer is in direct contact with the fluorescent glass layer 1, the Cu layer is in direct contact with the composite plating layer 2), the heat dissipation substrate 4 has a transmittance of more than 60% in a wave band of 430-480nm, the composite plating layer 2 has a reflectance of more than 90% in a wave band of 430-480nm, and the inorganic fluorescent conversion element is of a reflective structure, and high-power blue light (for example, 3W or other power settings can be used to excite yellow fluorescent powder from one side of the heat dissipation substrate to obtain white light for illumination or display).
The preparation method of the inorganic fluorescent conversion element, as shown in fig. 3, mainly comprises the following steps:
and step one, preparing a fluorescent body. Selecting a sapphire substrate with the thickness of 1mm, selecting a sapphire substrate with the length and the width of 15mm, mixing 0.5g of YAG fluorescent powder and 1.5g of Schottky glass powder (the chemical composition is 25B 2O3-10SiO2-35ZnO-6Li2O-12La2O3-12WO3, the Arabic numerals before each component in the chemical composition represent the mole percent of the component, the mole percent of B 2O3 in the glass powder is 25 percent for the example of 25B 2O3, the same applies below), 0.35g of turpentine is mixed into fluorescent glass slurry, the fluorescent glass slurry is coated on the surface of the sapphire heat dissipation substrate with the thickness of 1mm through a screen printing process, the area of a fluorescent glass layer is 20mm 2 (of course, other area arrangements can be adopted as long as part or all the upper surface of the heat dissipation substrate is covered by the fluorescent glass layer, for example, other areas within the interval of 20-40 mm 2), and then sintering at 700 ℃ for 90min to obtain the fluorescent glass film with the thickness of 0.1 mm.
Preparing a seed layer on the upper surface of the fluorescent glass layer and the side surface of the sapphire by a magnetron sputtering process, wherein the seed layer is made of Ti metal and Cu metal (the target materials are a titanium target and a copper target with the purity of 99.999 percent) and is used for back light extraction of the fluorescent glass layer. The magnetron sputtering process parameters are 3.0X10 −4 Pa, 25 ℃ substrate temperature, 6 cm target base distance, 1500 direct current power supply power, W argon flow, 30 mL/min, 0.5 Pa sputtering pressure, and 100 s sputtering time (sputtering Ti target first and then Cu target, wherein the sputtering time of Ti target is 50 s, and the sputtering time of Cu target is 50 s). The seed layer thickness was 100nm, wherein the Ti layer thickness was 50 nm and the Cu layer thickness was 50 nm.
And thirdly, electroplating copper on the outer surface of the seed layer. The working temperature of the electroplating additive is 25 ℃, the current density is 6.5A/cm 2, the electroplating speed is 100 mu m/h, and the electroplating solution comprises 187.5g/L of cupric sulfate pentahydrate, 60g/L of sulfuric acid, 50mg/L of sodium chloride, 300mg/L of polyethylene glycol and 6mg/L of thiazolinyl dithiopropane sodium sulfonate and the stirring speed is 400 revolutions per minute. The electroplating solution is doped with diamond micropowder, the grain size is 100 microns, and the doping amount is 50g/L.
Comparative example 1
The production process of comparative example 1 was substantially the same as that of example 1 except that no heat conductive particles were added to the plating solution in step three, and the corresponding obtained plated copper layer was cracked due to excessive internal stress, and a device of a desired structure could not be obtained.
Comparative example 2
This comparative example 2 is a conventional sapphire-based fluorescence conversion element prepared. The preparation method only comprises the step one of the embodiment 1 (the parameter conditions in the step one are consistent with those of the embodiment 1), and the step two and the step three are not carried out.
Example 2
An inorganic fluorescent conversion element for laser illumination and display is shown in figure 1, and comprises a fluorescent glass layer 1, a composite plating layer 2, a Ti/Cu seed layer 3 and a heat dissipation substrate 4, wherein the fluorescent glass layer 1 is positioned on the upper surface of the heat dissipation substrate 4, the Ti/Cu seed layer 3 is positioned on the upper surface and the side surface of the heat dissipation substrate 4 and the fluorescent glass layer 1, the composite plating layer 2 is arranged above and on the side surface of the Ti/Cu seed layer 3 (completely covers the Ti/Cu seed layer 3, the Ti/Cu seed layer 3 is of a laminated structure of the Ti layer and the Cu layer, the Ti layer is in direct contact with the fluorescent glass layer 1, the Cu layer is in direct contact with the composite plating layer 2), the heat dissipation substrate 4 has a transmittance of more than 70% in a wave band of 430-480nm, the composite plating layer 2 has a reflectance of more than 90% in a wave band of 430-480nm, and the inorganic fluorescent conversion element is of a reflection type structure, and high-power blue light (such as power 3W) excites yellow fluorescent powder from one side of the heat dissipation substrate to obtain white light for laser illumination or display.
The preparation method of the inorganic fluorescent conversion element, as shown in fig. 3, mainly comprises the following steps:
And step one, preparing a fluorescent body. Selecting a sapphire substrate with the thickness of 1.5mm, selecting the sapphire substrate with the length and the width of 15mm, mixing 1g of YAG fluorescent powder, 0.5g of low-temperature glass powder (the chemical composition is 20Bi 2O3-60B2O3 -10ZnO-10 BaO) and 0.32g of turpentine to obtain fluorescent glass slurry, coating the fluorescent glass slurry on the surface of the sapphire heat dissipation substrate with the thickness of 1.5mm through a screen printing process, enabling the area of a fluorescent glass layer to be 40mm 2, and sintering the fluorescent glass slurry at 550 ℃ for 40min to obtain the fluorescent glass film with the thickness of 0.2 mm.
Preparing a seed layer on the upper surface of the fluorescent glass layer and the side surface of the sapphire by a magnetron sputtering process, wherein the seed layer is made of Ti metal and Cu metal (the target materials are a titanium target and a copper target with the purity of 99.999 percent) and is used for back light extraction of the fluorescent glass layer. The magnetron sputtering process parameters are that the vacuum degree is 3.5X10 −4 Pa, the substrate temperature is 30 ℃, the target base distance is 6.5 cm, the direct current power is 1200 and W, the argon flow is 45 mL/min, the sputtering pressure is 0.5 Pa, the sputtering time is 200 s (the Ti target is sputtered firstly and then the Cu target is sputtered, wherein the sputtering time of the Ti target is 100 s, and the sputtering time of the Cu target is 100 s). The seed layer thickness was 200nm, wherein the Ti layer thickness was 100 nm and the Cu layer thickness was 100 nm.
And thirdly, electroplating copper on the outer surface of the seed layer. The working temperature of the electroplating additive is 25 ℃, the current density is 8A/cm 2, the electroplating speed is 100 mu m/h, and the electroplating solution comprises 195.5g/L of copper sulfate pentahydrate, 75g/L of sulfuric acid, 45mg/L of sodium chloride, 300mg/L of polyethylene glycol and 8.5mg/L of thiazolinyl dithiopropane sodium sulfonate and the stirring speed is 500 revolutions per minute. The electroplating solution is doped with diamond micropowder with the particle size of 400 microns and the doping amount of 10g/L.
Comparative example 3
The production process of this comparative example 3 is substantially the same as that of example 2 except that no thermally conductive particles are added to the plating solution in step three, and the corresponding resultant electroplated copper layer is cracked due to excessive internal stress, failing to obtain a device of a desired structure.
Comparative example 4
This comparative example 4 is a conventional sapphire-based fluorescence conversion element prepared. The preparation method only comprises the step one of the embodiment 2 (the parameter conditions in the step one are consistent with those of the embodiment 2), and the step two and the step three are not carried out.
Compared with the traditional sapphire-based fluorescence conversion element prepared in comparative example 2, the light-emitting efficiency of the fully-coated heat-dissipating inorganic fluorescence conversion element prepared in example 1 is only 186 lm/W under the irradiation of 3W laser, and the light-emitting efficiency is improved to 214 lm/W. The saturation threshold for withstanding laser power was raised from 10W/mm 2 to 36W/mm 2 for the device of comparative example 2, and the corresponding luminous flux at the saturation threshold was raised from 1836 lm to 5384 lm for the device of comparative example 2. Therefore, the fully-coated heat-dissipation inorganic fluorescent conversion element prepared in the embodiment 1 can meet the requirements of high heat conduction and high light extraction laser illumination application.
Compared with the traditional sapphire-based fluorescence conversion element prepared in comparative example 4, the light efficiency of the fully-coated heat-dissipation inorganic fluorescence conversion element prepared in example 2 is only 178 lm/W under the irradiation of 3W laser, and the light efficiency is improved to 205 lm/W. The saturation threshold for withstanding laser power was raised from 17W/mm 2 to 42W/mm 2 for the device of comparative example 4, and the corresponding luminous flux at the saturation threshold was raised from 2085 lm to 5983 lm for the device of comparative example 4. It can be seen that example 2 also meets the requirements of high thermal conductivity, high light extraction laser lighting applications.
Example 3
The preparation process of this example 3 is substantially identical to that of example 2, except that the sapphire substrate in step one is replaced with a diamond substrate of the same size. Due to the excellent thermal conductivity (> 500W m -1·K-1) of the diamond substrate, the prepared fluorescent conversion element was raised from 17W/mm 2 to 58W/mm 2 of the device obtained in comparative example 4 compared to the conventional sapphire-based fluorescent conversion element, which was tolerant to the laser power saturation threshold, and the corresponding luminous flux at the saturation threshold was raised from 2085 lm to 7856 lm of the device obtained in comparative example 4.
The above embodiment is merely an example, for example, the fluorescent glass layer may cover all the upper surface of the heat dissipation substrate except for a partial area of the upper surface of the heat dissipation substrate, for example, the length, width and thickness of the heat dissipation substrate 4 may be set in other ways (for example, the thickness of the heat dissipation substrate 4 may be other thickness within the range of 0.3mm to 3mm, the overall thickness of the inorganic fluorescent conversion element obtained by the above method may vary from 0.5mm to 3.5 mm), besides the sapphire substrate, a substrate with good thermal conductivity such as a diamond substrate may be used, as long as the entire heat dissipation substrate+glass layer has a certain rigidity, the thickness of the Ti layer and the thickness of the Cu layer in the seed layer may be independently adjusted, and the fluorescent glass paste may also be prepared according to other formulations reported in the prior art.
It will be readily appreciated by those skilled in the art that the foregoing description is merely a preferred embodiment of the invention and is not intended to limit the invention, but any modifications, equivalents, improvements or alternatives falling within the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (9)
1. An inorganic fluorescent conversion element for reflection type laser illumination or laser display is characterized by comprising a fluorescent glass layer (1), a Ti/Cu seed layer (3), a composite plating layer (2) and a heat dissipation substrate (4), wherein,
When part of the upper surface of the heat dissipation substrate (4) is covered by the fluorescent glass layer (1), the upper surface and the side surface of the fluorescent glass layer (1) are both covered by the Ti/Cu seed layer (3), and when the whole upper surface of the heat dissipation substrate (4) is covered by the fluorescent glass layer (1), the side surface and the upper surface of the fluorescent glass layer (1) are both covered by the Ti/Cu seed layer (3);
The upper surface and the side surface of the Ti/Cu seed layer (3) are completely covered by the composite plating layer (2), the Ti/Cu seed layer (3) is of a laminated structure of the Ti layer and the Cu layer, wherein the Cu layer is in direct contact with the composite plating layer (2), and the composite plating layer (2) is a metal copper plating layer doped with nano-scale and/or micro-scale heat conducting particles (22).
2. The inorganic fluorescent conversion element for reflection type laser illumination or laser display according to claim 1, wherein the heat dissipation substrate (4) has a transmittance of not less than 60% in a wavelength band of 430 to 480nm, and the heat dissipation substrate (4) is made of transparent sapphire or diamond.
3. The inorganic fluorescent conversion element for reflection type laser light illumination or laser light display according to claim 1, wherein the reflectance of the composite plating layer (2) as a whole is not less than 90% in a wavelength band of 430 to 480 nm.
4. The inorganic fluorescent conversion element for reflection type laser light illumination or laser light display according to claim 1, wherein the thickness of the fluorescent glass layer (1) is 60 to 200 μm;
the thickness of the Ti/Cu seed layer (3) is 100-200 nm;
the thickness of the composite coating (2) is 100-250 mu m.
5. The inorganic fluorescent conversion element for reflection type laser light illumination or laser light display according to claim 1, wherein the heat conductive particles (22) are made of a material satisfying a thermal conductivity of more than 30W/(m·k);
In the composite coating (2), the volume ratio of the heat conducting particles (22) is 10% -50%.
6. The inorganic fluorescent conversion element for reflection type laser light illumination or laser light display as claimed in claim 5, wherein the material used for the heat conductive particles (22) is one or more of diamond, boron nitride or aluminum oxide.
7. The method for producing an inorganic fluorescent conversion element for reflection type laser illumination or laser display according to any one of claims 1 to 6, comprising the steps of:
S1, preparing fluorescent glass slurry, coating the fluorescent glass slurry on a heat dissipation substrate to form a fluorescent glass slurry layer, and then co-firing to finish glass melting, so that a fluorescent glass layer is formed on part of the upper surface of the heat dissipation substrate in a covering manner;
S2, depositing a Ti layer and a Cu layer on the side surface and the upper surface of the fluorescent glass layer, the side surface of the heat dissipation substrate and the upper surface uncovered by the fluorescent glass layer through a magnetron sputtering process to obtain a Ti/Cu seed layer;
S3, preparing a composite plating layer on the upper surface and the side surface of the Ti/Cu seed layer by using copper plating solution doped with nano-scale and/or micro-scale heat conducting particles through a plating process, thereby obtaining the inorganic fluorescent conversion element for reflection type laser illumination or laser display.
8. The method of claim 7, wherein in step S1, the coating is performed by screen printing;
The fluorescent glass slurry is formed by mixing raw materials including fluorescent powder, glass powder and an organic solvent;
The fluorescent powder is single-color fluorescent powder or multicolor fluorescent powder;
the mass ratio of the fluorescent powder to the glass powder is (0.3-2) 1;
the glass powder is low-temperature glass powder with the glass transition temperature not exceeding 700 ℃;
The temperature adopted by the co-firing is 550-700 ℃, and the sintering time is 40-90 min.
9. The use of the inorganic fluorescent conversion element for reflection type laser lighting or laser display according to any one of claims 1 to 6, wherein the luminous flux is 5000 lm or more and the laser power density is 30W/mm 2 or more for laser lighting or laser display.
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| CN104379987A (en) * | 2012-08-02 | 2015-02-25 | 日亚化学工业株式会社 | Wavelength conversion device |
| CN115978470A (en) * | 2022-12-08 | 2023-04-18 | 深圳市光粒子技术有限公司 | Transmission type wavelength conversion structure and application thereof |
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| JP2016058619A (en) * | 2014-09-11 | 2016-04-21 | パナソニックＩｐマネジメント株式会社 | Light emitting device |
| JP6512067B2 (en) * | 2015-10-30 | 2019-05-15 | 日本電気硝子株式会社 | Method of manufacturing wavelength conversion element |
| EP4286901A4 (en) * | 2021-01-28 | 2025-01-01 | Niterra Co., Ltd. | WAVELENGTH CONVERSION ELEMENT AND LIGHT SOURCE DEVICE THEREOF |
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| CN104379987A (en) * | 2012-08-02 | 2015-02-25 | 日亚化学工业株式会社 | Wavelength conversion device |
| CN115978470A (en) * | 2022-12-08 | 2023-04-18 | 深圳市光粒子技术有限公司 | Transmission type wavelength conversion structure and application thereof |
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