CN212322992U - Welding structure of packaging substrate, packaging structure and circuit board - Google Patents
Welding structure of packaging substrate, packaging structure and circuit board Download PDFInfo
- Publication number
- CN212322992U CN212322992U CN202020902204.5U CN202020902204U CN212322992U CN 212322992 U CN212322992 U CN 212322992U CN 202020902204 U CN202020902204 U CN 202020902204U CN 212322992 U CN212322992 U CN 212322992U
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- substrate
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- packaging
- soldering tin
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- 239000000758 substrate Substances 0.000 title claims abstract description 143
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 64
- 238000003466 welding Methods 0.000 title claims abstract description 54
- 238000005476 soldering Methods 0.000 claims abstract description 51
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000007788 liquid Substances 0.000 claims abstract description 42
- 229910000679 solder Inorganic materials 0.000 claims description 82
- 239000004033 plastic Substances 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 14
- 239000000155 melt Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000004954 Polyphthalamide Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229920006375 polyphtalamide Polymers 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000002905 metal composite material Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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Abstract
The application discloses welded structure of packaging substrate, packaging structure and circuit board, packaging substrate are used for welding components and parts, and packaging substrate is used for welding components and parts's a side surface and is provided with a plurality of recesses, and the recess bottom is provided with the pad, and the pad corresponds the setting with the pin of components and parts, and the recess is used for acceping liquid soldering tin when the soldering tin of welding pin and pad melts. According to the packaging substrate, the packaging structure and the welding structure of the circuit board, the plurality of grooves are formed in the packaging substrate, the grooves can accommodate liquid soldering tin in a secondary backflow process, and short circuit of components caused by overflow of the liquid soldering tin is avoided; the whole part can be broken up into parts through setting up a plurality of recesses and the bubble that reduces liquid soldering tin unit area further avoids at the secondary backward flow in-process because gaseous expend with heat and contract with cold liquid soldering tin overflow with higher speed, and then effectively avoids encapsulating components and parts short circuit, has improved the goodness rate of product.
Description
Technical Field
The present application relates to the field of chip packaging technologies, and in particular, to a substrate, a package structure, and a circuit board welding structure.
Background
At present, in the process of packaging a chip, solder or conductive adhesive is coated on a pad of a substrate in a screen printing, spraying and other modes, then a pin of the chip is connected to the pad, and the chip is welded with the substrate in a hot pressing or reflow soldering mode and other modes. In the process of welding the packaged chip on the packaging substrate, the flowing liquid solder can connect the anode and the cathode of the chip due to the flowing solder or the flowing conductive adhesive in the packaged chip caused by the high temperature of soldering, and further cause short circuit to damage the packaging structure and the welding structure of the circuit board.
SUMMERY OF THE UTILITY MODEL
The technical problem that this application mainly solved provides a welded structure of packaging substrate, packaging structure and circuit board, solves the problem that the encapsulation chip flows tin and causes the short circuit in the secondary backward flow in-process.
In order to solve the above technical problem, the first technical solution adopted by the present application is: the utility model provides a packaging substrate, packaging substrate is used for welding components and parts, and packaging substrate is used for one side surface of welding components and parts to be provided with a plurality of recesses, and the recess bottom is provided with the pad, and the pad sets up with the pin correspondence of components and parts, and the recess is used for acceping liquid soldering tin when the soldering tin of welding pin and pad melts.
The packaging substrate is further provided with a solder mask, and the solder mask is arranged on the outer edge of the opening of the groove.
The packaging substrate is further provided with a solder mask, and the solder mask covers the other positions of the surface of one side of the packaging substrate, except the groove, where the packaging substrate is used for welding the component.
Wherein, the solder mask layer is a solder mask ink layer, the thickness of the solder mask ink layer is 10-35 μm, and the solder mask ink layer is photosensitive ink.
In order to solve the above technical problem, the second technical solution adopted by the present application is: the packaging structure comprises a first substrate, components and parts and a plastic packaging layer, wherein the first substrate is used for welding the components and parts, a plurality of grooves are formed in the surface of one side of the first substrate, which is used for welding the components and parts, the bottom of each groove is provided with a first bonding pad, the first bonding pads are arranged corresponding to pins of the components and parts, and the grooves are used for accommodating liquid soldering tin when the soldering tin for welding the pins and the first bonding pads is melted; the component is arranged on one side of the opening of the groove of the first substrate and is connected with a first bonding pad arranged on the first substrate through a first solder ball; wherein, the first tin ball is solid soldering tin, and the periphery of the component is provided with a plastic packaging layer.
The first substrate is further provided with a first solder mask layer, and the first solder mask layer is arranged on the outer edge of the opening of the groove.
The first substrate is further provided with a first solder mask layer, and the first solder mask layer covers the other positions, except the groove, of the surface of one side, used for welding the component, of the first substrate.
Wherein, the distance between the component and the first solder mask layer is 40 +/-10 μm.
The component comprises a second substrate, a chip and a packaging body, wherein the second substrate is used for welding the chip, a plurality of blind holes are formed in the surface of one side, used for welding the chip, of the second substrate, a second bonding pad is arranged at the bottom of each blind hole, the second bonding pad is arranged corresponding to pins of the chip, and the blind holes are used for containing liquid soldering tin when the soldering tin for welding the pins and the second bonding pad is melted; the chip is arranged on one side of the blind hole opening of the second substrate and is connected with a second bonding pad arranged on the second substrate through a second solder ball; the packaging body is at least coated on the outer side of the chip.
In order to solve the above technical problem, the third technical solution adopted by the present application is: the welding structure of the circuit board comprises a packaging substrate, components, a plastic package layer and the circuit board, wherein one side of the packaging substrate is used for welding the components, a plurality of grooves are formed in the surface of one side of the packaging substrate, which is used for welding the components, the bottom of each groove is provided with a bonding pad, the bonding pad is arranged corresponding to a pin of the components, and the grooves are used for accommodating liquid soldering tin when the soldering tin for welding the pin and the bonding pad is melted; the component is arranged on one side of the packaging substrate, which is provided with the groove opening, and the component is connected with a bonding pad arranged on the packaging substrate through a solder ball; the plastic packaging layer is arranged on one side of the packaging substrate, which is used for welding the components, and is used for packaging the components on the packaging substrate, and the plastic packaging layer is fixedly connected with the packaging substrate; the circuit board is arranged on one side of the packaging substrate far away from the component, and the circuit board is welded with the packaging substrate.
The beneficial effect of this application is: different from the situation of the prior art, the welding structure of the packaging substrate, the packaging structure and the circuit board provided by the application has the advantages that the plurality of grooves are formed in one side of the packaging substrate, so that the bonding pads arranged in the grooves correspond to pins of the components to be welded, the grooves can accommodate liquid soldering tin for welding the components in the secondary backflow process, and the phenomenon that the liquid soldering tin overflows to cause short circuits of the positive electrode and the negative electrode of the components is avoided; the liquid soldering tin unit area bubbles can be reduced by arranging the grooves, the overflow of the liquid soldering tin due to the expansion with heat and contraction with cold of the gas in the secondary backflow process is avoided, the short circuit of the anode and the cathode of the packaged component is further effectively avoided, and the excellent rate of products is improved.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of a substrate according to the present invention;
fig. 2 is a schematic structural diagram of an embodiment of a welding structure of a circuit board according to the present invention;
fig. 3 is a schematic structural diagram of an embodiment of a component in the soldering structure of the circuit board of fig. 2.
Detailed Description
In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
The terms "first," "second," "third," and the like in the description and in the claims, and in the drawings described above, are used for distinguishing between different objects and not necessarily for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements but may alternatively include other steps or elements not expressly listed or inherent to such process, system, article, or apparatus.
The present invention will be described in detail with reference to the accompanying drawings and examples.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a substrate according to the present invention.
In this embodiment, a plurality of grooves 13 are formed on one surface of the package substrate 11, pads 14 are fixed to bottoms of the grooves 13, the pads 14 are disposed corresponding to pins of a component (not shown) to be soldered, and solder resist layers 12 are cured along outer edges of openings of the grooves 13 of the package substrate 11. Specifically, the number of the grooves 13 may be 2 or 4, which is not limited herein, and only the number of the grooves 13 is required to be matched with the number of pins on the component to be soldered. The groove 13 is used for accommodating liquid soldering tin when the soldering tin for welding the pin and the pad 14 is melted, and short circuit of a welding component caused by overflow of the liquid soldering tin is avoided. In another alternative embodiment, the package substrate 11 is provided with the solder resist layer 12 cured on the surface of the opening side of the groove 13 except for the groove 13. In order to avoid the overflow of the solder melting at the welding position of the pad 14 and the pin of the component to be welded, the solder mask layer 12 can be a solder mask ink layer, the thickness of the solder mask ink layer is 10-35 μm, and the solder mask ink layer is photosensitive ink. The material of the package substrate 11 may be copper, and the thickness of the package substrate 11 may be 0.1-4.0 mm. In another alternative embodiment, the package substrate 11 may also be a plate made of other metal materials, ceramic materials or PPA (polyphthalamide) and metal composite materials, and the package substrates 11 made of different materials have different thermal conductivities, insulations and temperature resistances, and may be made of suitable materials according to specific requirements and applications of different products.
In the package substrate provided in the embodiment, the plurality of grooves are formed in the package substrate, so that the bonding pads arranged in the grooves are arranged corresponding to the pins of the components to be welded, the grooves can accommodate liquid soldering tin for welding the components in a secondary backflow process, and short circuit of the positive electrode and the negative electrode of the components caused by overflow of the liquid soldering tin is avoided; the whole part can be broken up into parts through setting up a plurality of recesses and the bubble that reduces liquid soldering tin unit area avoids at the secondary backward flow in-process because gaseous expend with heat and contract with cold liquid soldering tin overflow with higher speed, further effectively avoids welding components and parts short circuit, has improved the goodness rate of product.
Referring to fig. 2 and 3, fig. 2 is a schematic structural diagram of an embodiment of a welding structure of a circuit board according to the present invention; fig. 3 is a schematic structural diagram of an embodiment of a component in the circuit board soldering structure of fig. 2. A soldering structure 2 of a circuit board includes a first substrate 21, a component 23, a molding layer 24, and a circuit board 28 (see fig. 2).
The surface of one side of the first substrate 21 is provided with a plurality of grooves 26, the bottom of each groove 26 is fixed with a first pad 25, the first pads 25 are arranged corresponding to the pins of the component 23, and the outer edge of the opening of the groove 26 of the first substrate 21 is solidified with a first solder mask layer 22. Specifically, the number of the grooves 26 may be 2 or 4, which is not limited herein, and only the number of the grooves 26 is required to be matched with the number of the pins on the component 23. The groove 26 is used for accommodating liquid solder when the solder for welding the pin and the first pad 25 is melted at high temperature, so as to prevent the liquid solder from overflowing to cause short circuit of the welding component 23. In another alternative embodiment, the first substrate 21 is provided with the first solder resist layer 22 cured on the surface of the opening side of the groove 26 except for the groove 26. In order to avoid the overflow of the first solder balls 27 at the pin welding positions of the first pad 25 and the component 23 due to high-temperature melting, the first solder mask layer 22 may be a solder mask ink layer, the thickness of the solder mask ink layer is 10-35 μm, and the solder mask ink layer is photosensitive ink. In this embodiment, the material of the first substrate 21 can be copper, and the thickness of the first substrate 21 is 0.1-4.0 mm. In another alternative embodiment, the first substrate 21 may also be a plate made of other metal materials, ceramic materials or PPA and metal composite materials, and the first substrate 21 made of different materials has different thermal conductivity, insulation property and temperature resistance, and may be made of a suitable material according to the specific requirements and applications of different products.
The component 23 may be a package on package device, the component 23 is fixed on the side of the first substrate 21 where the first solder resist layer 22 is disposed, and the leads of the component 23 are connected to the first pads 25 in the grooves 26 disposed on the first substrate 21 through the first solder balls 27. In this embodiment, in order to facilitate the sealing material to be filled into the gap between the component 23 and the first solder resist layer 22 provided on the first substrate 21 to form the molding layer 24, the distance between the side of the component 23 close to the first substrate 21 and the first solder resist layer 22 provided on the first substrate 21 is 40 ± 10 μm.
The plastic package layer 24 is arranged on one side of the first substrate 21 close to the component 23, the plastic package layer 24 is distributed in a gap between the component 23 and the first solder mask layer 22 and also covers the component 23, and the plastic package layer 24 is closely attached to the surface of one side of the first substrate 21 close to the component 23. In another alternative embodiment, the molding compound layer 24 is closely attached to the first substrate 21 and is flush with a surface of the first substrate 21 away from the component 23. The molding layer 24 in this embodiment is an insulating sealing resin.
The wiring board 28 is provided on a surface of the first substrate 21 on a side away from the component 23, and the first substrate 21 and the wiring board 28 are soldered by soldering, so that the leads on the first substrate 21 are connected to the wiring board 28. The material of the circuit board 28 in this embodiment is copper.
Specifically, when the component 23 is soldered to the first substrate 21, the component 23 is packaged, and then one surface of the first substrate 21 remote from the component 23 is soldered to the wiring board 28, the first substrate 21 on which the component 23 is packaged needs to be heated again to melt the solder paste between the wiring board 28 and the first substrate 21 on which the component 23 is packaged into a liquid, thereby connecting the wiring board 28 and the first substrate 21. When the first substrate 21 of the packaged component 23 is at a high temperature, the first solder balls 27 between the component 23 and the first substrate 21 are also melted into liquid solder, a part of the liquid solder is accommodated in the corresponding groove 26, the liquid solder is filled in the corresponding groove 26, the other part of the liquid solder protrudes out of the surface of the first solder mask 22, the first solder mask 22 on the outer edge of the groove 26 on the first substrate 21 can prevent the liquid solder from flowing, and further the first substrate 21 of the packaged component 23 is prevented from short circuit. Because in the high-temperature tin dissolving process, bubbles can appear in the liquid soldering tin, the component 23 is connected with the first welding discs 25 in the plurality of grooves 26 arranged on the first substrate 21, so that the grooves 26 contain small-volume corresponding liquid soldering tin, the content of the bubbles in unit area in the small-volume liquid soldering tin is reduced, the overflow of the liquid soldering tin caused by expansion with heat and contraction with cold of the bubbles can be avoided, the short circuit of the first substrate 21 of the packaged component 23 caused when the first substrate 21 is welded on the circuit board 28 is avoided, and the performance of the first substrate 21 of the packaged component 23 is not influenced when the first substrate 21 of the packaged component 23 is welded with the circuit board 28.
In the embodiment, the component 23 is a package on package device (see fig. 3), and the component 23 specifically includes a second substrate 231, a chip 233, and a package 234. The surface of one side of the second substrate 231 is provided with a plurality of blind holes 236, the bottom of the blind holes 236 is fixed with a second pad 235, the second pad 235 is connected with a straight plug-in pin (not marked) at the bottom of the blind holes 236 of the second substrate 231, the other end of the straight plug-in pin penetrates out of the surface of the second substrate 231 far away from the opening side of the blind holes 236, the end part of the pin is flush with the surface of the second substrate 231, the second pad 235 is arranged corresponding to the pin of the chip 233, and the second solder mask layer 232 is solidified at the outer edge of the opening of the blind holes 236 arranged on the second substrate. Specifically, the number of the blind holes 236 may be 2 or 4, which is not limited herein, and only the number of the blind holes 236 needs to be matched with the number of the pins on the chip 233. The blind holes 236 are used for accommodating liquid solder when the solder for soldering the pins and the second pads 235 is melted at a high temperature, so as to prevent the liquid solder from overflowing to cause the component 23.
And (4) short-circuiting. In another alternative embodiment, the second substrate 231 is provided with the second solder resist layer 232 cured on the surface of one side of the opening of the blind via 236 except the blind via 236. In order to avoid overflow of solder high-temperature melting at the pin welding position of the second pad 235 and the chip 233, the second solder mask layer 232 may be a solder mask ink layer, the thickness of the solder mask ink layer is 10-35 μm, and the solder mask ink layer is photosensitive ink. In this embodiment, the material of the second substrate 231 may be copper, and the thickness of the second substrate 231 is 0.1-4.0 mm. In another alternative embodiment, the second substrate 231 may also be a plate made of other metal materials, ceramic materials or PPA and metal composite materials, and the second substrate 231 made of different materials has different thermal conductivity, insulation property and temperature resistance, and may be made of suitable materials according to specific requirements and applications of different products.
The chip 233 is fixed on the side of the second substrate 231 provided with the second solder resist layer 232, and the leads of the chip 233 are connected with the second pads 235 in the blind holes 236 provided on the second substrate 231 through the second solder balls 237. In order to facilitate the sealing material to fill the gap between the chip 233 and the second solder resist layer 232 disposed on the second substrate 231 to form the package 234 in the present embodiment, the distance between the side of the chip 233 close to the second substrate 231 and the second solder resist layer 232 disposed on the second substrate 231 is 40 ± 10 μm.
The side of the second substrate 231, to which the chip 233 is soldered, is provided with a package 234, the package 234 is distributed in a gap between the chip 233 and the second solder resist layer 232 and also covers the chip 233, and the package 234 and the surface of the second substrate 231, which is close to the chip 233, are attached in a sealing manner. In another alternative embodiment, the package body 234 is closely attached to the second substrate 231 and is flush with a surface of the second substrate 231, which is far away from the chip 233. The package 234 in this embodiment is an insulating sealing resin.
In the circuit board welding structure provided in the embodiment, the plurality of grooves are formed in the first substrate, so that the first pads arranged in the grooves are arranged corresponding to the pins of the components, and the grooves can contain liquid soldering tin in a secondary backflow process, so that short circuit of the components caused by overflow of the liquid soldering tin is avoided; the whole part can be broken into parts by arranging the plurality of grooves, so that the bubbles of the unit area of the liquid soldering tin are reduced, the overflow of the liquid soldering tin due to expansion with heat and contraction with cold of the gas in the secondary backflow process is further avoided, the short circuit of the first substrate of the packaged component is further effectively avoided, and the excellent rate of the product is improved.
The above embodiments are merely examples and are not intended to limit the scope of the present disclosure, and all modifications, equivalents, and flow charts using the contents of the specification and drawings are included in the scope of the present disclosure.
Claims (10)
1. The utility model provides a packaging substrate, its characterized in that packaging substrate is used for welding components and parts, packaging substrate is used for the welding a side surface of components and parts is provided with a plurality of recesses, the recess bottom is provided with the pad, the pad with the pin of components and parts corresponds the setting, the recess is used for welding the pin with the soldering tin of pad is acceptd liquid when melting soldering tin.
2. The package substrate of claim 1, wherein the package substrate is further provided with a solder mask layer, the solder mask layer being disposed at an outer edge of the opening of the groove.
3. The package substrate according to claim 1, wherein the package substrate is further provided with a solder resist layer covering a position of a side surface of the package substrate for soldering the component other than the groove.
4. The packaging substrate of claim 2 or 3, wherein the solder mask layer is a solder mask ink layer, the thickness of the solder mask ink layer is 10-35 μm, and the solder mask ink layer is a photosensitive ink.
5. A package structure comprises a first substrate, a component and a plastic package layer,
the first substrate is used for welding the component, a plurality of grooves are formed in the surface of one side of the first substrate, which is used for welding the component, a first bonding pad is arranged at the bottom of each groove, the first bonding pad is arranged corresponding to a pin of the component, and the grooves are used for accommodating liquid soldering tin when the soldering tin for welding the pin and the first bonding pad is melted;
the component is arranged on one side of the opening of the first substrate groove and is connected with the first bonding pad arranged on the first substrate through a first solder ball; wherein the first solder ball is solid solder;
and a plastic packaging layer is arranged on the periphery of the component.
6. The package structure of claim 5, wherein the first substrate is further provided with a first solder resist layer, the first solder resist layer being disposed at an outer edge of the opening of the groove.
7. The package structure according to claim 5, wherein the first substrate is further provided with a first solder resist layer, and the first solder resist layer covers a position of a side surface of the first substrate for soldering the component, except for the groove.
8. The package structure according to claim 6 or 7, wherein a distance between the first solder resist layer and the component is 40 ± 10 μm.
9. The package structure of claim 5, wherein the component comprises a second substrate, a chip, and a package,
the second substrate is used for welding the chip, a plurality of blind holes are formed in the surface of one side of the second substrate, which is used for welding the chip, a second bonding pad is arranged at the bottom of each blind hole, the second bonding pads are arranged corresponding to pins of the chip, and the blind holes are used for accommodating liquid soldering tin when the soldering tin for welding the pins of the chip and the second bonding pads is melted;
the chip is arranged on one side of the blind hole opening of the second substrate and is connected with the second bonding pad arranged on the second substrate through a second solder ball;
the packaging body at least covers the outer side of the chip.
10. A welding structure of a circuit board is characterized by comprising a packaging substrate, a component, a plastic packaging layer and a circuit board,
one side of the packaging substrate is used for welding the component, the surface of one side of the packaging substrate, which is used for welding the component, is provided with a plurality of grooves, the bottom of each groove is provided with a bonding pad, the bonding pads are arranged corresponding to pins of the component, and the grooves are used for accommodating liquid soldering tin when the soldering tin for welding the pins and the bonding pads is melted;
the component is arranged on one side of the packaging substrate, which is provided with the groove opening, and is connected with the bonding pad arranged on the packaging substrate through a solder ball;
the plastic packaging layer is arranged on one side of the packaging substrate, which is used for welding the component, and is used for packaging the component on the packaging substrate, and the plastic packaging layer is fixedly connected with the packaging substrate;
the circuit board is arranged on one side, far away from the component, of the packaging substrate, and the circuit board is welded with the packaging substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020902204.5U CN212322992U (en) | 2020-05-25 | 2020-05-25 | Welding structure of packaging substrate, packaging structure and circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020902204.5U CN212322992U (en) | 2020-05-25 | 2020-05-25 | Welding structure of packaging substrate, packaging structure and circuit board |
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| CN212322992U true CN212322992U (en) | 2021-01-08 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114336119A (en) * | 2021-12-21 | 2022-04-12 | 东南电子股份有限公司 | Plug-in device |
| CN115279011A (en) * | 2021-11-16 | 2022-11-01 | 天芯互联科技有限公司 | Circuit board and circuit board processing method |
-
2020
- 2020-05-25 CN CN202020902204.5U patent/CN212322992U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115279011A (en) * | 2021-11-16 | 2022-11-01 | 天芯互联科技有限公司 | Circuit board and circuit board processing method |
| CN114336119A (en) * | 2021-12-21 | 2022-04-12 | 东南电子股份有限公司 | Plug-in device |
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