CN217426697U

CN217426697U - Semiconductor element transfer apparatus

Info

Publication number: CN217426697U
Application number: CN202220345658.6U
Authority: CN
Inventors: 赵凯; 梁猛; 林海涛; 卢升; 时威
Original assignee: Shanghai Shiyu Precision Machinery Co ltd
Current assignee: Shanghai Shiyu Precision Equipment Co ltd
Priority date: 2022-02-21
Filing date: 2022-02-21
Publication date: 2022-09-13
Anticipated expiration: 2032-02-21
Also published as: WO2023155411A1

Abstract

The utility model discloses a semiconductor element transfer apparatus can realize that intelligent work piece processing is carried, need not artificial operation, and the transfer process is smooth, and fast, efficient, can guarantee processing cycle's stability to save the cost of labor, and through being equipped with flip structure, the upset of work piece when can realizing the transfer and carry solves the problem that needs the upset to special work piece. The utility model discloses can carry out the position distribution that each spare part is different according to the production requirement of process at the back, reach the modularization transfer and transport, realize intelligent work piece processing and carry, need not artificial operation, the transfer process is smooth, and fast, efficient, can guarantee processing cycle's stability to save the cost of labor, and through being equipped with flip structure, the upset of work piece when can realizing the transfer and carry, the solution needs the problem of upset to special work piece.

Description

Semiconductor element transfer apparatus

Technical Field

The invention relates to the technical field of workpiece transfer and conveying, in particular to semiconductor element transfer equipment.

Background

The existing semiconductor element transfer equipment cannot modularly arrange and meet the requirements of different process production, and cannot enable a workshop to run a product line fully automatically, the cleanliness grade cannot meet higher requirements, the production and processing of products are influenced, the period of processing and transportation is prolonged, the accuracy of a construction period cannot be guaranteed, and the transfer device with the adsorption arm is designed.

Disclosure of Invention

According to an embodiment of the present invention, there is provided a semiconductor element transfer apparatus including:

the transfer module is used for transferring and conveying the workpieces;

and the overturning module is arranged on one side of the transfer module and is used for butting and overturning the workpieces transferred and conveyed by the transfer module.

Further, the transfer module includes:

the transfer box body is positioned on one side of the turnover module;

the transfer box body driving device is positioned at the bottom of the transfer box body and is used for driving the transfer box body to move;

the forking device is positioned in the transfer box body and is used for forking the workpiece;

the forking device driving device is arranged in the transfer box body and is connected with the forking device and used for driving the forking device to move;

the first conveying belt is arranged in the transfer box body and used for conveying workpieces.

Further, the transfer case body driving device includes:

and the first rotating mechanism is arranged at the bottom of the transfer box body and is used for driving the transfer box body to rotate.

Further, the transfer box body driving device further comprises:

the first Y-axis driving mechanism is arranged at the bottom of the rotating mechanism and used for driving the transfer box body to move along the Y axis;

the X-axis driving mechanism is arranged at the bottom of the first Y-axis driving mechanism and is used for driving the transfer box body to move along the X axis;

and the first Z-axis driving mechanism is arranged at the bottom of the first Y-axis driving mechanism and is used for driving the transfer box body to move along the Z axis.

Further, the picker driving device includes:

the output end of the second Z-axis driving mechanism is connected with the forking device and is used for driving the forking device to move along the Z axis;

and the output end of the second Y-axis driving mechanism is connected with the second Z-axis driving mechanism and is used for driving the forking device to move along the Y axis.

Further, the transfer module further comprises: and the code reader is connected with the transfer box body.

Further, the flipping module comprises:

the frame body is positioned on one side of the transfer module;

the third Z-axis driving mechanism is arranged on the frame body;

the butt joint box body is arranged on the output end of the third Z-axis driving mechanism;

the second conveying belt is arranged in the butt joint box body and is used for butt joint of the workpieces transferred and conveyed by the transfer module;

the linear module is connected with the output end of the third Z-axis driving mechanism;

the jacking platform is arranged at the output end of the linear module, and a pair of electric check blocks are arranged on two sides of the jacking platform;

the pair of turnover mechanisms are respectively arranged on two sides of the top of the frame body;

the pair of pneumatic clamping jaws are respectively arranged at the output ends of the pair of turnover mechanisms.

Further, the method also comprises the following steps: and the grabbing and rotating module is arranged on one side of the overturning module and is used for grabbing and rotating the overturned workpiece.

Further, the grabbing rotation module comprises:

the sucker is arranged at the top of the overturning module and used for sucking the overturned workpiece;

and the sucker driving device is arranged on one side of the turnover module and is connected with the sucker and used for driving the sucker to move.

Further, the suction cup driving device includes:

the fourth Z-axis driving mechanism is arranged on one side of the overturning module and used for providing driving force along the Z axis;

and the output end of the second rotating mechanism is connected with the sucker and is used for driving the sucker to rotate.

According to the semiconductor element transfer equipment provided by the embodiment of the invention, different position distribution of each part can be carried out according to the production requirements of the subsequent process, so that modular transfer is realized, intelligent workpiece processing and conveying are realized, manual operation is not needed, the transfer process is smooth, the speed is high, the efficiency is high, the stability of the processing period can be ensured, the labor cost is saved, and the workpiece can be turned over during transfer conveying by arranging the turning structure, so that the problem that the special workpiece needs to be turned over is solved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and are intended to provide further explanation of the technology claimed.

Drawings

Fig. 1 is a schematic perspective view of a first structure of a semiconductor component handling apparatus according to an embodiment of the present invention.

Fig. 2 is a schematic perspective view of a second perspective structure of a semiconductor component handling apparatus according to an embodiment of the present invention.

Fig. 3 is a schematic perspective view of an inversion module of a semiconductor component transfer apparatus according to an embodiment of the present invention.

Fig. 4 is a schematic perspective view of a transfer module of a semiconductor component transfer apparatus according to an embodiment of the present invention.

Detailed Description

The present invention will be further explained by the following detailed description of preferred embodiments thereof, which is to be read in connection with the accompanying drawings.

First, a semiconductor device transfer apparatus according to an embodiment of the present invention will be described with reference to fig. 1 to 3, which is used for transferring and transferring workpieces (such as PCB boards, wafers, etc.), and the application scenarios of the apparatus are wide.

As shown in fig. 1 to 4, the semiconductor device transferring apparatus according to the embodiment of the present invention includes a transferring module and an inverting module.

Specifically, as shown in fig. 1-2, in this embodiment, the transfer module is used for carrying out the transfer to the work piece and carrying, and the upset module setting is in one side of transfer module for the work piece that the transfer of butt joint, upset transfer module was carried, through mutually supporting of transfer module and upset module, can realize automatic transport of work piece, butt joint, upset, need not artificial operation, the transfer process is smooth, and fast, efficient, can guarantee processing cycle's stability, and save the cost of labor.

Further, as shown in fig. 1 to 2 and 4, in the embodiment, the transit module includes: a transfer box body 11, a transfer box body driving device, a forking device 13, a forking device driving device and a first conveying belt 15. Transfer box 11 is located one side of upset module, transfer box drive arrangement is located transfer box 11's bottom, be used for driving transfer box 11 and move, be convenient for transfer box 11 carries out position adjustment, thereby adapt to the transfer module of butt joint different positions, improve the flexibility, the fork is got ware 13 and is located transfer box 11, be used for forking the work piece and get, the fork is got ware drive arrangement and is set up in transfer box 11, the fork is got ware drive arrangement and is got ware 13 with the fork and link to each other, be used for driving the fork and get the ware 13 and move, thereby make the fork get ware 13 can fork the work piece and get, and place the work piece after getting the fork on first conveyer belt 15, first conveyer belt 15 sets up in transfer box 11, be used for carrying the work piece.

Further, as shown in fig. 1 to 2, in the present embodiment, the driving device for the transfer case includes: the first rotating mechanism 121 is arranged at the bottom of the transfer box body 11, and is used for driving the transfer box body 11 to rotate, so that workpieces can be conveyed at different angles, and the conveying device is more flexible and convenient.

Further, as shown in fig. 1-2, in this embodiment, the driving device of the transfer box further includes: a first Y-axis drive mechanism 122, an X-axis drive mechanism 123, and a first Z-axis drive mechanism 124. The first Y-axis driving mechanism 122 is arranged at the bottom of the rotating mechanism, the first Y-axis driving mechanism adopts a motor lead screw driving mechanism and is used for driving the transfer box body 11 to move along the Y axis, the X-axis driving mechanism 123 is arranged at the bottom of the first Y-axis driving mechanism 122, the X-axis driving mechanism 123 adopts a motor belt driving mechanism and is used for driving the transfer box body 11 to move along the X axis, the first Z-axis driving mechanism 124 is arranged at the bottom of the first Y-axis driving mechanism 122, the first Z-axis driving mechanism 124 adopts a motor lead screw driving mechanism and is used for driving the transfer box body 11 to move along the Z axis, and the transfer box body 11 can be adjusted in the positions of the Y axis, the X axis and the Z axis by the mutual cooperation of the first Y-axis driving mechanism 122, the X-axis driving mechanism 123 and the first Z-axis driving mechanism 124, so as to be conveniently matched with the overturning module for use.

Further, as shown in fig. 1 to 2 and 4, in the present embodiment, the fork driving device includes: a second Z-axis drive mechanism 141 and a second Y-axis drive mechanism 142. The second Z-axis driving mechanism 141 is disposed in the transfer box 11, an output end of the second Z-axis driving mechanism 141 is connected to the forking device 13, the second Z-axis driving mechanism 141 adopts an air cylinder driving mechanism for driving the forking device 13 to move along the Z-axis, the second Y-axis driving mechanism 142 is disposed in the transfer box 11, an output end of the second Y-axis driving mechanism 142 is connected to the second Z-axis driving mechanism 141, the second Y-axis driving mechanism 142 adopts a motor screw driving mechanism for driving the forking device 13 to move along the Y-axis, the forking device 13 can be driven to move along the Z-axis by the second Z-axis driving mechanism 141 so as to adjust the forking height, and the forking device 13 can move along the Y-axis by the second Y-axis driving mechanism 142 so as to cooperate with each other, so that the forking device 13 can fork the workpiece.

Further, as shown in fig. 1 to 2 and 4, in this embodiment, the transfer module further includes: the code reader 16 is connected with the transfer box body 11, and the code reader 16 is used for reading codes of workpieces, identifying the identification of the workpieces and facilitating the record statistics of the workpieces.

Further, as shown in fig. 1 to 3, in the present embodiment, the flipping module includes: the device comprises a frame body 21, a third Z-axis driving mechanism 22, a butt joint box body 23, a second conveying belt 24, a linear module 25, a jacking platform 26, a pair of turnover mechanisms 27 and a pair of pneumatic clamping jaws 28. The rack body 21 is located at one side of the transfer module, the rack body 21 is used for supporting, the third Z-axis driving mechanism 22 is arranged on the rack body 21, the third Z-axis driving mechanism 22 adopts a motor lead screw driving mechanism and is used for driving the butt joint box body 23 and the linear module 25 to move along the Z-axis direction, the butt joint box body 23 is arranged at the output end of the third Z-axis driving mechanism 22, the second conveyer belt 24 is arranged in the butt joint box body 23 and is used for butt joint of workpieces transferred by the transfer module, the linear module 25 is connected with the output end of the third Z-axis driving mechanism 22, the linear module 25 is used for driving the jacking platform 26 to lift, namely to move along the Z-axis direction, the jacking platform 26 is arranged at the output end of the linear module 25, the jacking platform 26 is used for placing workpieces, a pair of electric stoppers 261 are arranged at two sides of the jacking platform 26, the electric stoppers 261 are used for blocking the workpieces to prevent the workpieces from falling, the pair of turnover mechanisms 27 are respectively arranged on two sides of the top of the frame body 21, the pair of pneumatic clamping jaws 28 are respectively arranged at the output ends of the pair of turnover mechanisms 27, the pair of pneumatic clamping jaws 28 are used for grabbing a workpiece, and the pair of turnover mechanisms 27 drive the pair of pneumatic clamping jaws 28 to turn over so as to drive the workpiece to turn over.

Further, as shown in fig. 1 to 2, in this embodiment, the semiconductor device transferring apparatus according to an embodiment of the present invention further includes: and the grabbing and rotating module is arranged on one side of the overturning module and is used for grabbing and rotating the overturned workpiece.

Further, as shown in fig. 1-2, in the present embodiment, the grabbing rotation module includes: suction cup 31 and suction cup 31 driving means. The sucking disc 31 sets up at the top of upset module for adsorb the work piece after the upset, and sucking disc 31 drive arrangement sets up in one side of upset module, and sucking disc 31 drive arrangement is connected with sucking disc 31 for drive sucking disc 31 motion, make sucking disc 31 can adsorb the work piece.

Further, as shown in fig. 1-2, in the present embodiment, the driving device of the suction cup 31 includes: a fourth Z-axis drive mechanism 321, and a second rotation mechanism 322. The fourth Z-axis driving mechanism 321 is disposed on one side of the flipping module, the fourth Z-axis driving mechanism 321 is a motor screw driving mechanism for providing a driving force along the Z-axis to enable the suction cup 31 to move up and down, the second rotating mechanism 322 is disposed at an output end of the second Z-axis driving mechanism 141, the second rotating mechanism 322 is a motor driving mechanism, and an output end of the second rotating mechanism 322 is connected to the suction cup 31 for driving the suction cup 31 to rotate.

When the device is used, the first Y-axis driving mechanism 122, the X-axis driving mechanism 123 and the first Z-axis driving mechanism 124 are matched with each other to drive the transfer box body 11 to adjust the positions of an X axis, a Y axis and a Z axis, so that the transfer box body 11 is opposite to the butt-joint box body 23, then the second Y-axis driving mechanism 142 drives the forking device 13 to advance to a proper position and stop, the second Z-axis driving mechanism 141 drives the forking device 13 to ascend to a proper height to a workpiece position, the forking device 13 forks the workpiece, then the second Y-axis driving mechanism 142 drives the forking device 13 to retreat and reset, when passing through the code reader 16, the code reader 16 reads the workpiece and records the code, and after retreating to a proper position, the second Z-axis driving mechanism 141 drives the forking device 13 to descend, so that the workpiece falls on the first conveying belt 15, then the transfer box body 11 is driven to rotate by 180 degrees by the first rotating mechanism 121, at the moment, the first conveyer belt 15 and the second conveyer belt 24 run simultaneously, the electric stop block 261 at the rear end of the jacking platform 26 is laid down to prevent the electric stop block 261 from interfering the butt joint of the workpieces, then the first conveyer belt 15 conveys the workpieces, the second conveyer belt 24 butts the workpieces conveyed by the first conveyer belt 15, the workpieces are placed in the butt joint box body 23 and are positioned on the jacking platform 26, the jacking platform 26 is flush with the second conveyer belt 24, the electric stop block 261 at the rear end of the jacking platform 26 stands to block the workpieces, then the jacking platform 26 is lifted to a turning position through the linear module 25, the pair of pneumatic clamping jaws 28 grab and clamp the workpieces on the jacking platform 26, then the third Z-axis driving mechanism 22 drives the butt joint box body 23 and the linear module 25 to descend to proper positions without blocking turning, then the pair of turning mechanisms 27 run to drive the workpieces to turn over, after the overturning is completed, the jacking platform 26 receives the workpiece, and then if an adsorption action is needed, the jacking platform 26 descends to the level with the second conveying belt 24, the fourth Z-axis driving mechanism 321 drives the suction cup 31 to descend to the proper position to suck the workpiece on the jacking platform 26, then at the proper height of ascending, the second rotating mechanism 322 drives the suction cup 31 to rotate, so as to drive the workpiece to rotate, the rotated workpiece is conveyed to the next procedure, if no adsorption action is available, the jacking platform 26 descends to the bottommost part, the workpiece falls onto the second conveying belt 24 at the moment, and the workpiece is conveyed to the next procedure through the second conveying belt 24. And the scheme can also carry out different position distribution of each part according to the requirements of the subsequent process so as to achieve the modularized transfer.

The semiconductor element transfer equipment according to the embodiment of the invention is described above with reference to fig. 1 to 4, and can perform different position allocation of each part according to the production requirements of the subsequent processes to achieve modularized transfer and transfer, so as to realize intelligent workpiece processing and conveying, without manual operation, smooth transfer process, high speed and high efficiency, ensure the stability of the processing period, save labor cost, and realize workpiece turning during transfer and conveying by providing a turning structure, thereby solving the problem that a special workpiece needs to be turned.

It should be noted that, in the present specification, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

While the present invention has been described in detail with reference to the preferred embodiments, it should be understood that the above description should not be taken as limiting the invention. Various modifications and alterations to this invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be determined from the following claims.

Claims

1. A semiconductor component handling apparatus, comprising:

the transfer module is used for transferring and conveying the workpieces;

2. The semiconductor component handling device of claim 1, wherein the relay module comprises:

the transfer box body is positioned on one side of the overturning module;

the forking device driving device is arranged in the transfer box body, and is connected with the forking device and used for driving the forking device to move;

3. The semiconductor component handling apparatus according to claim 2, wherein the transfer case driving means comprises:

the first rotating mechanism is arranged at the bottom of the transfer box body and used for driving the transfer box body to rotate.

4. The semiconductor component handling apparatus of claim 3, wherein the transfer case driving means further comprises:

5. The semiconductor component handling device of claim 2, wherein the picker drive means comprises:

6. The semiconductor component handling device of claim 2, wherein the relay module further comprises: and the code reader is connected with the transfer box body.

7. The semiconductor component handling device of claim 1, wherein the flipping module comprises:

the frame body is positioned on one side of the transfer module;

the third Z-axis driving mechanism is arranged on the frame body;

8. The semiconductor component handling device of claim 5, further comprising: and the grabbing and rotating module is arranged on one side of the overturning module and is used for grabbing and rotating the overturned workpiece.

9. The semiconductor component handling device of claim 8, wherein the capture rotation module comprises:

the sucker driving device is arranged on one side of the turnover module and connected with the sucker and used for driving the sucker to move.

10. The semiconductor component handling device of claim 9, wherein the chuck actuating device comprises:

and the second rotating mechanism is arranged at the output end of the second Z-axis driving mechanism, and the output end of the second rotating mechanism is connected with the sucker and used for driving the sucker to rotate.