CN222851397U - Calibrating device and wafer loading device - Google Patents
Calibrating device and wafer loading device Download PDFInfo
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- CN222851397U CN222851397U CN202421759161.4U CN202421759161U CN222851397U CN 222851397 U CN222851397 U CN 222851397U CN 202421759161 U CN202421759161 U CN 202421759161U CN 222851397 U CN222851397 U CN 222851397U
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Abstract
本申请提供一种校准装置及晶圆装载装置，校准装置包括底座、多个支柱、多个支架和传感设备，多个支柱设置在底座上，多个支架设置在多个支柱上，用于放置待测晶圆片，支架的上表面与底座的下表面的距离为预设距离，传感设备设置于多个支架中的至少一个上，用于对待测晶圆片进行移动监测得到监测数据，监测数据可以体现待测晶圆片的移动，这样在待测晶圆片被机械手臂拿起之前待测晶圆片和机械手臂刚完全接触，监测数据可以用于确定待测晶圆片和机械手臂刚完全接触时机械手臂的纵向位置，即可以通过校准装置的传感设备对机械手臂的纵向位置进行校准，标准化了机械手臂在纵向的校准，提高机械手臂的校准准确性和校准效率，减少校准误差。
The present application provides a calibration device and a wafer loading device. The calibration device includes a base, multiple pillars, multiple brackets and a sensing device. The multiple pillars are arranged on the base, and the multiple brackets are arranged on the multiple pillars for placing wafers to be tested. The distance between the upper surface of the bracket and the lower surface of the base is a preset distance. The sensing device is arranged on at least one of the multiple brackets for performing movement monitoring on the wafer to be tested to obtain monitoring data. The monitoring data can reflect the movement of the wafer to be tested. In this way, before the wafer to be tested is picked up by the robotic arm, the wafer to be tested and the robotic arm are just in full contact. The monitoring data can be used to determine the longitudinal position of the robotic arm when the wafer to be tested and the robotic arm are just in full contact. That is, the longitudinal position of the robotic arm can be calibrated by the sensing device of the calibration device, thereby standardizing the longitudinal calibration of the robotic arm, improving the calibration accuracy and calibration efficiency of the robotic arm, and reducing the calibration error.
Description
Technical Field
The present utility model relates to the field of semiconductor manufacturing, and in particular, to a calibration apparatus and a wafer loading apparatus.
Background
In semiconductor manufacturing, wafers need to be efficiently transported and positioned between different process modules on a production line, and equipment front end devices (Equipment Front End Module, EFEM) are critical to this task. The equipment front end assembly includes at least front opening unified pods (Front Opening Unified Pod, foup) for storing wafers, a loader (Loadport) for carrying Foup, and an operating robot for retrieving and storing wafers from Foup into Foup.
The robot arm is used for transporting wafers in semiconductor devices, and the position of the robot arm for grabbing the wafers needs to be calibrated before the robot arm is used. At present, when the mechanical arm is calibrated to a longitudinal (Z-direction) position of a wafer in a wafer box, the mechanical arm is required to be controlled to a designated horizontal position (XY position) and then the height of the mechanical arm is adjusted finely, so that the mechanical arm is enabled to be at a proper position, and then the position coordinates are recorded, wherein the proper position is the position where the mechanical arm is just in full contact with the back surface of a wafer, and in the actual operation process, whether the mechanical arm is in contact with the wafer is required to be judged manually and subjectively.
However, when the robot moves in the wafer box, the light in the wafer box is dim, and the back of the wafer will map out the mirror image of the robot, so that the position observation of the robot is difficult. In addition, because whether the mechanical arm is in contact with the wafer is judged by subjective judgment, the judgment of the position is influenced by multiple factors such as an observation angle and the like, and inaccurate results are easy to generate.
Disclosure of utility model
Therefore, an objective of the present application is to provide a calibration device and a wafer loading device, which are provided with a sensor device for the calibration device, so as to improve the calibration accuracy and the calibration efficiency of the mechanical arm.
The embodiment of the application provides a calibration device, which comprises:
A base;
A plurality of struts disposed on the base;
The supports are arranged on the supports and used for placing wafers to be tested, and the distance between the upper surface of each support and the lower surface of the base is a preset distance;
The sensing equipment is arranged on at least one of the plurality of brackets and is used for carrying out mobile monitoring on the wafer to be detected to obtain monitoring data, and the monitoring data are used for determining the longitudinal position of the mechanical arm when the wafer to be detected and the mechanical arm are just in full contact.
Optionally, the sensing device includes a pressure sensor, and the monitoring data includes a pressure signal, and the pressure signal changes and is greater than a position of the mechanical arm in a time period of zero, for determining a longitudinal position of the mechanical arm.
Optionally, the sensing device includes a distance sensor, and the monitoring data includes a distance signal, where the distance signal changes from zero to a position of the mechanical arm within a time period of a first preset value, and is used to determine a longitudinal position of the mechanical arm.
Optionally, the sensing device includes a displacement sensor, and the monitoring data includes a displacement signal, where the displacement signal changes from zero to a position of the mechanical arm within a time period of a second preset value, and is used to determine a longitudinal position of the mechanical arm.
Optionally, the plurality of struts include a first strut and a second strut, the first strut and the second strut are symmetrically disposed on two sides of the base, the plurality of struts include a first strut and a second strut, the first strut is disposed on a side of the first strut facing the second strut, and the second strut is disposed on a side of the second strut facing the first strut.
Optionally, the first support and the second support extend along a first direction, and the first direction is perpendicular to a connecting line direction of the first support and the second support, or the first support and the second support are arc-shaped supports, and circle centers of the first support and the second support are located between the first support and the second support.
Optionally, the minimum distance between the first support and the second support is 290mm, the maximum distance between the first support and the second support is 310mm, the dimension of the first support in the vertical direction of the extending direction of the first support is 5-8mm, and the dimension of the second support in the vertical direction of the extending direction of the second support is 5-8mm.
Optionally, the base is provided with a positioning hole for fixing the calibration device to a supporting table of the wafer loading device, the supporting table is provided with a supporting foot, the supporting foot and the positioning hole are correspondingly arranged, and when the calibration device is fixed to the supporting table, the supporting foot is clamped into the positioning hole.
Optionally, the calibration device further comprises:
and the display device is arranged on the base and used for displaying the monitoring data.
The embodiment of the application also provides a wafer loading device, which comprises:
a supporting table for placing the wafer cassette, the wafer box is used for loading wafers;
And the calibrating device is fixed on the supporting table.
The embodiment of the application provides a calibration device and a wafer loading device, wherein the calibration device comprises a base, a plurality of supports and sensing equipment, the supports are arranged on the base, the supports are arranged on the supports and are used for placing wafers to be tested, the distance between the upper surface of each support and the lower surface of the base is a preset distance, the sensing equipment is arranged on at least one of the supports and is used for carrying out mobile monitoring on the wafers to be tested to obtain monitoring data, the monitoring data can reflect the movement of the wafers to be tested, and thus, before the wafers to be tested are lifted by a mechanical arm, the wafers to be tested are just completely contacted with the mechanical arm, whether the mechanical arm is just completely contacted with the wafers can be accurately determined, therefore, the monitoring data can be used for determining the longitudinal positions of the mechanical arm when the wafers to be tested are just completely contacted with the mechanical arm, namely, the longitudinal positions of the mechanical arm can be calibrated through the sensing equipment of the calibration device, the calibration accuracy and the calibration efficiency of the mechanical arm are improved, and the calibration error is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 shows a schematic structural diagram of a calibration device according to an embodiment of the present application;
FIG. 2 is a schematic top view of a calibration device according to an embodiment of the present application;
FIG. 3 is a top view of another calibration device according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a monitoring system according to an embodiment of the present application;
FIG. 5 is a schematic diagram of the working principle of a pressure sensor according to an embodiment of the present application;
fig. 6 is a schematic structural diagram of a distance sensor according to an embodiment of the present application.
Detailed Description
In order to make the present application better understood by those skilled in the art, the following description will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, but the present application may be practiced in other ways other than those described herein, and persons skilled in the art will readily appreciate that the present application is not limited to the specific embodiments disclosed below.
While the embodiments of the present application have been illustrated and described in detail in the drawings, the cross-sectional view of the device structure is not to scale in the general sense for ease of illustration, and the drawings are merely exemplary and should not be construed as limiting the scope of the application. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
For a better understanding of the technical solutions and technical effects of the present application, specific embodiments will be described in detail below with reference to the accompanying drawings.
Referring to fig. 1, a schematic structural diagram of a calibration device according to an embodiment of the present application is shown, referring to fig. 2, a schematic top view of a calibration device according to an embodiment of the present application is shown, referring to fig. 3, a top view of another calibration device according to an embodiment of the present application is shown, where the calibration device may include a base 100, a plurality of posts 101, a plurality of brackets 102, and a sensing device 103.
In an embodiment of the present application, the calibration device may be a tool for calibrating a robot designed with reference to a wafer cassette structure, and the tool may include a base 100, where the base 100 is used to support other components, and the calibration device may be fixed on a support table of the wafer loading device by the base 100.
The size of the base 100 may be determined according to the size of the wafer to be tested placed thereon, and when the size of the wafer to be tested is 300mm, the size of the base 100 may be 380mm×350mm.
Referring to fig. 3, the base 100 may be provided with a positioning hole 105 for fixing the alignment device to a support table of the wafer loading device, the support table having legs, the legs and the positioning hole 105 being correspondingly disposed. Such that the legs snap into the locating holes 105 when the alignment device is secured to the support table. The shape, number, size and position of the positioning holes 105 may be determined according to the shape, number, size and position of the legs of the support table, and as an example, the shape of the positioning holes 105 may be circular, the number of the positioning holes 105 may be three, the size of the positioning holes 105 may be 12mm, the positions of the positioning holes 105 may be in an equilateral triangle arrangement in the base 100, and the distance between two adjacent positioning holes 105 is 230mm.
The plurality of support posts 101 are disposed on the base 100, and the plurality of supports 102 are disposed on the plurality of support posts 101 for placing the wafer 200 to be tested. The wafer 200 to be tested may be a wafer, or may be a plastic dummy wafer disposed on a reference wafer, and its size may be consistent with or inconsistent with the size of a conventional wafer.
The number of the plurality of pillars 101 is at least two, for example, 2 or 3, etc., and taking the plurality of pillars 101 as 2 as an example, the plurality of pillars 101 may include a first pillar and a second pillar, and the first pillar and the second pillar may be symmetrically disposed at both sides of the base. The first pillar and the second pillar may extend along a first direction, that is, they are arranged in parallel, or the first pillar and the second pillar are arc-shaped pillars, and the centers of the circles of the first pillar and the second pillar are between the first pillar and the second pillar, for example, the centers of the circles of the first pillar and the second pillar may coincide, so that the first pillar and the second pillar are along the edge of the wafer to be tested.
The plurality of brackets 102 are provided on the plurality of struts 101, and each strut 101 may be provided with one bracket 102 or may be provided with a plurality of brackets 102. The distance between each support 102 and the base 100 is equal to form a wafer fixing plane parallel to the surface of the base, so that the wafer 200 to be tested fixed on each support 102 is arranged parallel to the surface of the base 100. When the number of the support posts 101 is 2 and the number of the holders 102 is 2, the holders 102 may be extended in a direction parallel to the surface of the susceptor to constitute a wafer fixing plane parallel to the surface of the susceptor.
The support 102 has a cubic structure protruding from the inner side of the pillar 101, and may extend in the first direction or along the direction of the inner wall of the pillar 101, and when the pillar 101 has a planar structure and extends in the first direction, the support 102 may extend in the first direction, and when the pillar 101 has a circular arc shape, the support 102 may form a circular arc shape along the inner wall of the pillar or may extend in the first direction. Taking the number of the brackets 102 as 2 as an example, the plurality of brackets 102 may include a first bracket and a second bracket, the first bracket is disposed on a side of the first pillar facing the second pillar, and the second bracket is disposed on a side of the second pillar facing the first pillar, that is, the first bracket and the second bracket are disposed on inner sides of the first pillar and the second pillar. When the first support column and the second support column form the wafer placing grid, the placing grid only has two outer walls formed by the first support column and the second support column, so that the placing condition of the wafer to be tested can be observed conveniently.
The support 102 is used to form a wafer holding plane so that an upper surface of the support 102 may be parallel to a surface of the base 100. The lower surface of the bracket 102 may or may not be parallel to the upper surface. The longitudinal dimension of the bracket 102 may be set according to the actual situation, or the bracket 102 may not have a lower surface, but may extend to the lower side of the post 101 to contact the base 100.
The distance between the upper surface of the bracket 102 and the lower surface of the base 100 is a preset distance, the preset distance may be the distance between the support member in the conventional wafer cassette and the lower surface of the base 100, and at this time, the position of the wafer to be tested on the bracket 102 is the same as the wafer storage position in the conventional wafer cassette, so that the actual longitudinal position of the mechanical arm determined according to the above is also applicable to the wafer storage of the conventional wafer cassette, for example, the preset distance is 43mm, the preset distance may also be other distances, and the distance has a fixed difference with the distance between the support member in the conventional wafer cassette and the lower surface of the base, so that the actual longitudinal position of the mechanical arm determined according to the above and the fixed difference may determine the calibration result applicable to the wafer storage of the conventional wafer cassette.
The positions of the plurality of supports 101 and the plurality of supports 102 may be determined according to the size of the wafer to be tested, for example, when the size of the wafer to be tested 200 is 300mm, as shown in fig. 3, the minimum distance between the first support and the second support is smaller than the size of the wafer to be tested, for example, 290mm, and the maximum distance between the first support and the second support is larger than the size of the wafer to be tested, for example, 310mm. The first support has a dimension of 5-8mm in the vertical direction of the extending direction of the first support, i.e. the dimension of the first support in the vertical direction of the first direction is 5-8mm when the first support extends in the first direction, or the dimension of the first support in the radial direction of the first support is 5-8mm when the first support is circular arc-shaped, and the second support has a dimension of 5-8mm in the vertical direction of the extending direction of the second support, i.e. the dimension of the second support in the vertical direction of the first direction is 5-8mm when the second support extends in the first direction, or the dimension of the second support in the radial direction of the second support is 5-8mm when the second support is circular arc-shaped.
The sensing device 103 is disposed on at least one of the plurality of supports 102, and is used for performing movement monitoring on the wafer 200 to be tested to obtain monitoring data, wherein the monitoring data can embody movement of the wafer 200 to be tested, so that the wafer to be tested and the mechanical arm just contact completely before the wafer 200 to be tested is lifted by the mechanical arm, and therefore, whether the mechanical arm contacts the wafer 200 to be tested can be accurately determined, and therefore, the longitudinal position of the mechanical arm when the wafer to be tested and the mechanical arm just contact completely can be determined, namely, the longitudinal position of the mechanical arm can be calibrated through the sensing device of the calibrating device, the calibration accuracy and the calibration efficiency of the mechanical arm are improved, and the calibration error is reduced.
Referring to fig. 4, a schematic monitoring diagram is shown in which the gripper 300 of the mechanical arm starts to move upwards below the wafer 200 to be tested until contacting the bottom plate of the wafer 200 to be tested, and then continues to move upwards, and the wafer 200 to be tested generates an upward force, which makes the pressure of the wafer 200 to be tested on the support 102 become smaller until the wafer 200 to be tested is lifted, and the pressure of the wafer 200 to be tested on the support 102 is reduced to zero. Before the wafer 200 to be tested is lifted by the mechanical arm, the longitudinal position of the mechanical arm needs to be calibrated, and in the process that the wafer to be tested is lifted by the mechanical arm, the distance between the wafer to be tested and the bracket is gradually increased, and the displacement of the wafer to be tested is gradually increased.
The calibration device may further comprise a display device 104, which may be arranged on the base for displaying the monitoring data. The display device 104 may be disposed on a sidewall of the base 100 to visualize the calibration process. The display device 104 may be used as a pressure reading area from which a worker may obtain monitoring data.
In an embodiment of the present application, the sensing device 103 may include a pressure sensor, which is a device or apparatus capable of sensing a pressure signal and converting the pressure signal into a usable output electrical signal according to a certain rule. The obtained monitoring data may be a pressure signal, and the position of the mechanical arm in a time period when the pressure signal changes and is greater than zero is used for determining the longitudinal position of the mechanical arm.
Referring to fig. 5, a schematic diagram of a working principle of a pressure sensor according to an embodiment of the present application is shown, where the pressure sensor includes a pressure sensitive element and a signal processing unit set, the pressure sensitive element may be a piezoresistor, the signal processing unit set may include a sensitive ammeter, a power supply, a computing unit, and the like, and pressure sensitive voltages present different resistances under different pressures, so that currents of the sensitive ammeter correspondingly change, and therefore, a corresponding relationship exists between currents and pressures of the sensitive ammeter, and accordingly, the computing unit may determine, in real time, a pressure of a wafer to be measured on a support according to the currents of the sensitive ammeter.
When the mechanical arm contacts with the wafer 200 to be tested, and then the resistance value of the piezoresistor is changed all the time in the process that the wafer 200 to be tested is completely lifted by the mechanical arm, after the signal conversion, the process that the pressure value gradually decreases to 0 from the maximum value can be observed in the pressure reading area, and the process that the pressure value starts to change until the pressure value decreases to 0 can be considered that the wafer and the mechanical arm are just completely contacted at the moment, and the position where the mechanical arm is located is the Z-direction position required by the mechanical arm calibration at the moment. Therefore, the pressure sensor is added in the calibration device, the pressure of the wafer to be measured on the support can be obtained in real time, and whether the mechanical arm is contacted with the wafer or not is judged by observing the change of the pressure reading value during calibration.
In an embodiment of the present application, the sensing device 103 may include a distance sensor, where the monitoring data includes a distance signal, and the position of the mechanical arm in a period of time when the distance signal changes from zero to a first preset value is used to determine the longitudinal position of the mechanical arm.
Referring to fig. 6, a schematic structural diagram of a distance sensor according to an embodiment of the present application is shown, where the distance sensor may be an optical distance measuring sensor, and the optical distance measuring sensor may include an optical driving circuit, an optical detecting circuit and a signal processing circuit, where the optical driving circuit may control emission of detecting light, the optical detecting circuit may receive reflected light reflected from a wafer to be detected, and the signal processing circuit may determine a distance between the wafer to be detected and the sensor according to an emission time of the detecting light and a receiving time of the reflected light.
When the wafer to be measured is placed on the support, the distance between the wafer to be measured and the sensor is 0, and when the mechanical arm contacts the wafer to be measured and ascends, the reading value of the sensor gradually becomes larger, and the position of the mechanical arm in the time period when the reading value is smaller than the first preset value is the Z-direction position required by the calibration of the mechanical arm. The first preset value can take a smaller value, for example, 1mm, and can accurately achieve calibration of the mechanical arm for the partial vacuum mechanical arm.
In an embodiment of the present application, the sensing device 103 may include a displacement sensor, where the monitoring data includes a displacement signal, and the position of the mechanical arm in a period of time when the displacement signal changes from zero to a second preset value is used to determine the longitudinal position of the mechanical arm.
The embodiment of the application provides a calibration device, which comprises a base, a plurality of supports and sensing equipment, wherein the supports are arranged on the base, the supports are arranged on the supports and are used for placing wafers to be tested, the distance between the upper surface of each support and the base is a preset distance, the sensing equipment is arranged on at least one of the supports and is used for carrying out mobile monitoring on the wafers to be tested to obtain monitoring data, the monitoring data can reflect the movement of the wafers to be tested, and thus, before the wafers to be tested are picked up by a mechanical arm, the wafers to be tested are just in full contact with the mechanical arm, whether the mechanical arm is in full contact with the wafers can be accurately determined, and therefore, the longitudinal position of the mechanical arm can be calibrated through the sensing equipment of the calibration device, the calibration accuracy and the calibration efficiency of the mechanical arm in the longitudinal direction are standardized, and the calibration error is reduced.
Based on the above calibration device, the embodiment of the application further provides a wafer loading device, which comprises a supporting table and the aforementioned calibration device, wherein the supporting table is used for placing a wafer box, the wafer box is used for loading a wafer, and the calibration device is fixed on the supporting table, that is, the calibration device and the wafer box can be both fixed on the supporting table.
The foregoing is merely a preferred embodiment of the present application, and the present application has been disclosed in the above description of the preferred embodiment, but is not limited thereto. Any person skilled in the art can make many possible variations and modifications to the technical solution of the present application or modifications to equivalent embodiments using the methods and technical contents disclosed above, without departing from the scope of the technical solution of the present application. Therefore, any simple modification, equivalent variation and modification of the above embodiments according to the technical substance of the present application still fall within the scope of the technical solution of the present application.
Claims (10)
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| Application Number | Priority Date | Filing Date | Title |
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| CN202421759161.4U CN222851397U (en) | 2024-07-23 | 2024-07-23 | Calibrating device and wafer loading device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202421759161.4U CN222851397U (en) | 2024-07-23 | 2024-07-23 | Calibrating device and wafer loading device |
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| CN222851397U true CN222851397U (en) | 2025-05-09 |
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