Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
DE1903082B2 - Halbleiterbauelement - Google Patents
[go: Go Back, main page]

DE1903082B2 - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
DE1903082B2
DE1903082B2 DE19691903082 DE1903082A DE1903082B2 DE 1903082 B2 DE1903082 B2 DE 1903082B2 DE 19691903082 DE19691903082 DE 19691903082 DE 1903082 A DE1903082 A DE 1903082A DE 1903082 B2 DE1903082 B2 DE 1903082B2
Authority
DE
Germany
Prior art keywords
semiconductor component
semiconductor
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19691903082
Other languages
English (en)
Other versions
DE1903082A1 (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of DE1903082A1 publication Critical patent/DE1903082A1/de
Publication of DE1903082B2 publication Critical patent/DE1903082B2/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H10D64/0111—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
DE19691903082 1968-01-23 1969-01-22 Halbleiterbauelement Ceased DE1903082B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP386668 1968-01-23

Publications (2)

Publication Number Publication Date
DE1903082A1 DE1903082A1 (de) 1969-07-31
DE1903082B2 true DE1903082B2 (de) 1971-09-30

Family

ID=11569101

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19691903082 Ceased DE1903082B2 (de) 1968-01-23 1969-01-22 Halbleiterbauelement

Country Status (5)

Country Link
CH (1) CH485323A (de)
DE (1) DE1903082B2 (de)
FR (1) FR2000604A1 (de)
GB (1) GB1246858A (de)
SE (1) SE354379B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2559838C2 (de) * 1974-07-13 1982-10-14 Olympus Optical Co., Ltd., Tokyo Elektromotor mit Vorrichtung zur Erzeugung von Drehzahlsignalen
FR2328286A1 (fr) * 1975-10-14 1977-05-13 Thomson Csf Procede de fabrication de dispositifs a semiconducteurs, presentant une tres faible resistance thermique, et dispositifs obtenus par ledit procede
JPS5678130A (en) * 1979-11-30 1981-06-26 Hitachi Ltd Semiconductor device and its manufacture
EP1286393A3 (de) * 2001-06-28 2004-03-03 F & K Delvotec Bondtechnik GmbH Schaltkreisgehäuse

Also Published As

Publication number Publication date
GB1246858A (en) 1971-09-22
SE354379B (de) 1973-03-05
CH485323A (de) 1970-01-31
FR2000604A1 (de) 1969-09-12
DE1903082A1 (de) 1969-07-31

Similar Documents

Publication Publication Date Title
AT318003B (de) Halbleiterbauelement
AT310812B (de) Integriertes Halbleiterbauelement
CH511511A (de) Halbleiter-Anordnung
CH506883A (de) Halbleiterbauelement
CH504099A (de) Halbleiterbauelement
CH496148A (de) Bauelement
CH492302A (de) Halbleiterbauelement
AT320025B (de) Halbleitervorrichtung
CH508983A (de) Halbleiter-Bauelement
AT300961B (de) Halbleiteranordnung
CH487504A (de) Halbleitervorrichtung
CH508279A (de) Halbleiterbauelement
DE1903342B2 (de) Halbleitervorrichtung
DE1949174B2 (de) Halbleiterbauelement
CH484515A (de) Steuerbares Halbleiterbauelement
AT328688B (de) Mehrschaliges bauelement
DE1903082B2 (de) Halbleiterbauelement
CH493942A (de) Halbleitervorrichtung
CH510346A (de) Halbleiteranordnung
AT301689B (de) Halbleiterbauelement
CH518009A (de) Halbleiteranordnung
CH539341A (de) Halbleiterbauelement
AT278907B (de) Halbleiterelement
CH508276A (de) Halbleiterbauelement
CH499876A (de) Halbleiterbauelement

Legal Events

Date Code Title Description
BHV Refusal