DE2304539B2 - METHOD OF PRODUCING RESISTORS BY PRINTING RESISTANT LAYERS FROM RESISTANT PASTE - Google Patents

Description

The present invention relates to a method of manufacturing resistors by Printing of resistive layers made of conductive particles and a glass frit containing resistive pastes on a substrate, the electrodes for supply and Conductors and, if required, capacitor electrodes with interposed dielectric layers. and by subsequent drying and baking of the pastes, either individually or together with the other layers with the option of one Resistance paste vary the achievable resistance value / u.

Such a method is known from the journal ETZ-B (1972), H.4, pp. 85-88.

In order to obtain a large contradicting spectrum, if several basic values are to be generated next to one another on a substrate, pastes are used there different compositions and according to the desired basic resistance values printed one after the other on the substrate.

The various basic resistance values are generated by the metal and / or metal oxide ft5 and the glass content of the paste can be varied. In this procedure there are different pastes and one several times Printing process for various basic values

necessary.

It can also be found in this reference point. Dielektrikumspasten printed capacitors as Abdeckpaslen for protection of resistances against moisture and mechanical Damaged · -gen / u use. These further prints can be applied without first having to bake the lower layer.

It is also known from this, the electrical values of the printed resistors during baking through corresponding oxidation and reduction processes to adjust. However, the range of variation that can be achieved in this way is very limited.

It is also known to use a suitable resistor paste for producing the thick film resistors through a mask odor ei.i sieve on a proportionately To apply heat-resistant substrate in such a way that the paste has two electrodes arranged on the substrate bridged and that the Piisfc then unicr Formation of a vitreous resistance body «, fired and finally the resistance body through partial Sanding down. Etching or any other suitable method to the desired resistance «cn is adjusted (DT-OS 19 24 679). Here hänyi der Generated Widcrslandsgrundwen from the composition of the Pasic.

It is also known from OE-PS 1 37 832. Manufacture resistance layers that a Ceramic substrate with a glaze or enamel layer and a finely divided layer applied to it Conductor or semiconductor particles existing resistance layer is coated and at elevated temperature, in which the first-mentioned layer softens, conductive or semi-conductive particles from the resistance layer be stored, whereby these sink into the glaze or enamel layer. However, this is only on complete coverage of both layers. With this method the resistance value increases Resistance layer through removal of citric particles in the general too.

Finally, it is known from DT-PS 8 21 ObO the contact points of .shefts the resistors Stand layer under or over a tightly fitting metal layer provided at the contact points to raise.

The present invention is concerned with the object of using as few resistor pastes as possible different basic values or with only one resistance paste with a defined basic value and As few printing processes as possible, a very large range of variation in the final resistance values to be achieved to be able to manufacture. This range of variation is soli be much larger than is possible by conducting the penetration process.

According to the invention, this object is achieved in that one resistance layer and one during the baking process a part of the glass frit of the resistance paste receiving layer is applied one after the other in this way be that one covers the other at least partially on one or both sides and that then the Burn-in process takes place.

In the process according to the invention, the glass frit goes into the Widcrsiand paste during the baking process the this receiving layer over. As a result, more conductive particles of the resistor paste come together in contact and the resistance value is lowered. This lowering of the resistance value can suffocate over the entire opposing surface

ken. However, Rs can also only be part of the Resistance curses with the glass friltc absorbing layer ζ. B. be overprinted, so dall in easier In this way, a fine gradation of the desired resistance value can be achieved.

The invention is described below with reference to the exemplary embodiments illustrated in the drawing:

Γ i g. I a substrate with connecting electrodes.

F i {. '. 2 to 4 a substrate with connection electrodes and a dielectric layer.

F i g. 5 and 6 each have a resistor according to the invention.

F i g. 7 a substrate with terminal electrodes and one Capacitor electrode.

Fig. S a substrate with a dielectric layer.

F i g. 9 shows a resistance-condenser combination according to the invention.

1 with a substraiplat is denoted, with electrically conductive lllekiroden 2 and 3 is provided. The latter are of the usual design and can be made in the way that a silver pase or another conductive paste on the .Substraiplättchen I {lufgebrachi is.

Between the two electrodes 2 and J, w ic /. 15. do F i g. 2. i and 4 / own, a layer 5 is applied to the places required for the final resistance value or required lengths and widths. the can accommodate glass fritie during the later fin-burning process. This can consist, for example, of a ceramic frit, such as that used as a dielectric ». kcliichl is used in the production of printed condensate. For example, it consists of a mixture of glass frit with barium titanai.

In Fig. 5 is the glass frit receiving layer 5 with a resistance layer 4 so overpressure! That this the lllektrode. 2 and 3 contacted. The opposing layer 4 can also be applied to this, and the layer 5, which adheres to the glass frit, can be applied, as in FIG. b tlargcslcllt. In both cases, in the area in which the two layers 4 and 5 overlap, part of the glass frit of the resistance layer 4 penetrates into the layer 5 and the resistance value per unit area is reduced in this area.

If you change z. B. with a constant area of the resistive layer 4, the area of the glass frit absorbing Layer 5. so the entire resistance layer 4 or only a partial area of the same in its Consistent values per unit area are reduced and thus a very large range of variation is covered will. For example, the layer 5 extends / wipe electrodes 2 and 3 and this is narrow as the resistance layer 4 (/. B. according to FIG. J or 4). so a resistor is formed, which is made up of two parallel Strips with differentiated resistance «crt per Unit area. These are also connected electrically in parallel. The two layers can too be applied so that the separate conductive layers formed are electrically in series.

After the layers have been fired, the resistor (s) can be replaced in a known manner by partial Ablation. / _ B. by etching or grinding on the desired resistance values can be adjusted. It is then expedient with a protective layer overdrawn.

The use of a Dielekinkumspusie as a glass frit Receiving layer 5 is particularly advantageous in the case of components with resistors and capacitors in printing technology on a common substrate I. For example, as shown in FIG. 7 shown, the Connection electrodes 2 and 3 of the resistor to be created and one electrode layer 6 of one Capacitor applied to the substrate I. Then you can use the entrance hall existing Glass frit receiving layer 5 and the dielectric layer 7 applied in a common process step, e.g. by printing (I ig. 8). Thereafter, the layer 5 is overprinted with resistance paste and the resistance layer 4 is formed and a counter electrode 8 is printed onto the dielectric layer 7

The individual layers 2, 3: 4; 5, 6; 7; 8 b / w. 2, 3; 4; 5 can be stoved after each application or / together after application.

[-line further elaboration looks at the cons Stand connection electrodes 2, 3 only after application to apply the resistance layer 4 and / or 5 and then burn in this arrangement crsl.

With the method according to the invention it is possible, for. B. at a resistance range of 2 k £ 2 per Area unit reduces the temperature to about 50 per cent To achieve unit area.

1 sheet of drawings

Claims (4)

Patent claims: 1. Process for the production of resistors by printing resistive layers from jettable particles and a glass frit containing resistive pastes on a substrate, the electrodes for supply and discharge lines. if required, has capacitor electrodes with an interposed dielectric layer, and by subsequent drying and baking of the pastes, either individually or together with the other layers, with the possibility of varying the resistance value that can be achieved with a resistance paste, characterized in that a resistor bag ( 4) and a layer (5) that absorbs part of the glass frit of the resistor paste during the baking process is applied one after the other in such a way that one covers the other at least partially on one or both sides and that the egg baking process then takes place (FIGS. 1 to 5 or b) . 2. The method according to claim 1, characterized in that first the electrode layer (2, 3) for a resistor and the electrode layer (6) for a capacitor are applied and dried, that then the additional layer (5) and the dielectric layer (7) are applied and dried so that then the resistance layer (4) and finally the counter electrode layer (8) are printed (F ^; g. 7 to 9). 3. The method according to any one of claims 1 or 2, characterized in that the connection electrodes (2) and (3) can only be printed after the application of the individual layers (4,5; 7,8). 4. The method according to any one of claims 1 to J. characterized in that each resistor and / or capacitor after burn-in is balanced and provided with a Schulz layer.