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DE2335940B2 - Use of a solder alloy - Google Patents
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DE2335940B2 - Use of a solder alloy - Google Patents

Use of a solder alloy

Info

Publication number
DE2335940B2
DE2335940B2 DE2335940A DE2335940A DE2335940B2 DE 2335940 B2 DE2335940 B2 DE 2335940B2 DE 2335940 A DE2335940 A DE 2335940A DE 2335940 A DE2335940 A DE 2335940A DE 2335940 B2 DE2335940 B2 DE 2335940B2
Authority
DE
Germany
Prior art keywords
solder alloy
strontium
bismuth
antimony
barium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE2335940A
Other languages
German (de)
Other versions
DE2335940A1 (en
Inventor
Juergen Dr. 5300 Bonn-Beuel Gobrecht
Heinz Dipl.-Ing. 5301 Alfter Schoer
Werner Dr.-Ing. 5300 Bonn Schultze
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vereinigte Aluminium Werke AG
Original Assignee
Vereinigte Aluminium Werke AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vereinigte Aluminium Werke AG filed Critical Vereinigte Aluminium Werke AG
Priority to DE2335940A priority Critical patent/DE2335940B2/en
Priority to AT563574A priority patent/AT333096B/en
Priority to CA204,512A priority patent/CA1051693A/en
Priority to IT69199/74A priority patent/IT1046934B/en
Priority to GB30650/74A priority patent/GB1480502A/en
Priority to FR7424036A priority patent/FR2236608B2/fr
Priority to NL7409347A priority patent/NL7409347A/en
Priority to SE7409156A priority patent/SE412180C/en
Priority to NO742535A priority patent/NO134248C/no
Priority to LU70516A priority patent/LU70516A1/xx
Priority to DK376074AA priority patent/DK140687B/en
Priority to SU742050310A priority patent/SU633455A3/en
Priority to CH966474A priority patent/CH562653A5/xx
Priority to BE2053749A priority patent/BE817578R/en
Priority to ZA00744510A priority patent/ZA744510B/en
Priority to JP49080272A priority patent/JPS5070251A/ja
Publication of DE2335940A1 publication Critical patent/DE2335940A1/en
Priority to AT176375A priority patent/AT333097B/en
Publication of DE2335940B2 publication Critical patent/DE2335940B2/en
Priority to US05/836,766 priority patent/US4173302A/en
Priority to JP4113679A priority patent/JPS5547362A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C
    • B23K35/286—Al as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacture And Refinement Of Metals (AREA)

Description

Gegenstand der HauptpatentanmeldungP 19 62 760.2 ist die Verwendung einer Lotlegieriing, bestehend aus 4 bis 20% Silicium und aus je 0,01 bis 10%, vorzugsweise je 2%, Wismut, Strontium, Barium und/oder Antimon, Rest Aluminium und herstellungsbedingte Verunreinigungen, als Lot zum flußmittelfreien Löten von Aluminiumwerkstoffen in einer nicht oxidierenden Atmosphäre bzw. in einem niedrigen Vakuum.The subject of the main patent application P 19 62 760.2 is the use of a solder alloy consisting of 4 to 20% silicon and from 0.01 to 10% each, preferably 2% each, bismuth, strontium, barium and / or Antimony, the remainder aluminum and production-related impurities, as solder for flux-free soldering of aluminum materials in a non-oxidizing atmosphere or in a low vacuum.

Gegenstand der ZusatzpatentanmeldungSubject of the additional patent application

P 21 43 905.6 hierzu ist ein Lot zum flußmiüelfreien Löten von Aluminiumwerkstoffen, bestehend aus 4 bis 20% Silicium und aus 0,01 bis 10%, vorzugsweise 0,05 bis 2%, Wismut, Strontium, Barium und/oder Antimon, Rest Aluminium und herstellungsbedingte Verunreinigungen, dessen Merkmal darin besteht, daß an Stelle oder zusammen mit Wismut, Strontium, Barium und/oder Antimon ein Gehalt an Beryllium in Mengen von 0,00001 bis 1,0%, vorzugsweise 0,0002 bis 0,1 %, vorhanden ist.P 21 43 905.6 for this is a plumb bob that is free of fluids Brazing of aluminum materials, consisting of 4 to 20% silicon and 0.01 to 10%, preferably 0.05 up to 2%, bismuth, strontium, barium and / or antimony, the remainder aluminum and production-related impurities, whose characteristic is that instead of or together with bismuth, strontium, Barium and / or antimony contain beryllium in amounts of 0.00001 to 1.0%, preferably 0.0002 to 0.1% is present.

Diese Lotlegierungen haben sich in die Praxis gut eingeführt.These solder alloys have become well established in practice.

Sie stellen aber beim Löten noch verhältnismäßig hohe Anforderungen an das Vorhandensein einer nicht oxidierenden Atmosphäre bzw. eines niedrigen Vakuums.But they still make relatively high demands on the presence of a soldering device non-oxidizing atmosphere or a low vacuum.

Der Erfindung liegt die Aufgabe zugrunde, eineThe invention is based on the object of a

Lotlegierudg zum Löten in einer nicht oxidierenden Atmosphäre bzw. in einem niedrigen Vakuum zu schaffen, bei der es möglich isl, die genannten Anfor-Solder alloy for soldering in a non-oxidizing atmosphere or in a low vacuum create where it is possible to meet the requirements

deruiigen herabzuschrauben.unscrewed.

Gegenstand der Erii.idung ist die Verwendung einer Lotlegierung, bestehend aus 4 bis 20%, Silicium und aus je 0,01 bis 10% Wismut, Strontium, Barium und/oder Antimon,'Rest Aluminium und herstellungsbedingte Verunreinigungen, als Lot zum I1ußmiueltrc:" Löten von Aluminiumwerkstoffen in einer nicht OM.uierenden Atmosphäre nach Patentanmeldung P 19 62 760.2 mit der Maßgabe, daß die Lotlegierung gegebenenfalls 0,00001 bis 1,0% Beryllium enthält nach Zusatzpatent-The subject of the invention is the use of a solder alloy, consisting of 4 to 20% silicon and 0.01 to 10% each of bismuth, strontium, barium and / or antimony, the remainder aluminum and production-related impurities, as a solder for the I1ußmiueltrc : "Soldering aluminum materials in a non-OM.

*5 anmeldung P 21 43 965.6, dadurch gekennzeichnet, daß die Lotlegierung an Stelle von Wismut, Strontium, Barium und/oder Antimon oder zusammen mit diesen 0,0001 bis 1 % Natrium enthält. Versuche haben ergeben, daß bei Einsatz des Na-haltigen Lotes nicht* 5 registration P 21 43 965.6, characterized in that the solder alloy contains 0.0001 to 1% sodium instead of bismuth, strontium, barium and / or antimony or together with these. Experiments have shown that when using the Na-containing solder not

mehr so strenge Anforderungen wie bisher hinsichtlich des Sauerstoffgehaltes der Lötatmosphäre bzw. der Höhe des Vakuums gestellt zu werden brauchen, während gleiche oder bessere Ergebnisse wie bzw. ah nach den obengenannten Anmeldungen erzielbar sind.more stringent requirements than before with regard to the oxygen content of the soldering atmosphere or the Level of vacuum need to be put while equal or better results as or ah are achievable after the above registrations.

Bei einer vorteilhaften Ausführungsform der Erfindung ist vorgesehen, daß die Lotlegierung 0,05 bis 2% Wismut, Strontium, Barium und/oder Antimon, gegebenenfalls 0,0002 bis 0,1% Beryllium und 0,005 bis 0,1 % Natrium enthält.In an advantageous embodiment of the invention it is provided that the solder alloy 0.05 to 2% Bismuth, strontium, barium and / or antimony, optionally 0.0002 to 0.1% beryllium and 0.005 to Contains 0.1% sodium.

Ausführungsbcispiele
1 2 3Execution examples
1 2 3

Siliziumsilicon 11,511.5 7,97.9 9,39.3 10,810.8 8,48.4 Manganmanganese 0,060.06 0,040.04 0,090.09 0,070.07 0,030.03 40 Magnesium40 magnesium 0,030.03 0,040.04 0,030.03 0,060.06 0,060.06 Eiseniron 0,360.36 0,350.35 0,350.35 0,0360.036 0,0370.037 Titantitanium 0,040.04 0,030.03 0,030.03 0,020.02 0,030.03 Kupfercopper 0,030.03 0,010.01 0,080.08 0,020.02 0,060.06 45 Zink 45 zinc 0,050.05 0,100.10 0,070.07 0,050.05 0,040.04 Wismutbismuth —- 0,120.12 —- —- —- Antimonantimony —- —.-. 0,230.23 —- Strontiumstrontium —- —- —- 0,570.57 —- Bariumbarium .—.— —- —- —- 1,611.61 Natriumsodium 0,0070.007 0,0310.031 0,0120.012 0,0650.065 0,0470.047 Restrest Alt miniumOld minium

Claims (2)

Patentansprüche:Patent claims: 1. Verwendung einer Lotlegierung, bestehend aus 4 bis 20% Silicium und aus je 0,01 bis 10% Wismut, Strontium, Barium u,nd/oder Antimon, Rest Aluminium und herslelfungsbedingte Verunreinigungen, als Lot zum flußmittelfreien Löten von Aluminiumwerkstoffen in einer nicht oxidierenden Atmosphäre nach Patentanmeldung P 19 62 760.2 mit der Maßgabe, daß die Lollegierung gegebenenfalls 0,00001 bis 1,0%, Beryllium enthält nach Zusatzpatentanmeldung P 2143 965.6, dadurch gekennzeichnet, daß die Lotlegierung an Stelle von Wismut, Strontium, Barium und/oder Antimon oder zusammen mit diesen 0,0001 bis 1 % Natrium enthält.1. Use of a solder alloy consisting of 4 to 20% silicon and 0.01 to 10% each Bismuth, strontium, barium and / or antimony, the remainder aluminum and impurities resulting from the process, As a solder for flux-free soldering of aluminum materials in a non-oxidizing Atmosphere according to patent application P 19 62 760.2 with the proviso that the Lollalloy optionally 0.00001 to 1.0%, contains beryllium according to additional patent application P 2143 965.6, characterized in that that the solder alloy instead of bismuth, strontium, barium and / or antimony or together with these contains 0.0001 to 1% sodium. 2. Verwendung einer Lotlegierung nach Anspruch 1 für den Zweck nach Anspruch 1, dadurch gekennzeichnet, daß die Lotlegierung 0,05 bis 2% Wismut, Strontium, Barium und/oder Antimon, gegebenenfalls 0,0002 bis 0,1 % Beryllium und 0,005 bis 0,1 % Natrium enthält.2. Use of a solder alloy according to claim 1 for the purpose according to claim 1, characterized characterized in that the solder alloy 0.05 to 2% bismuth, strontium, barium and / or antimony, optionally contains 0.0002 to 0.1% beryllium and 0.005 to 0.1% sodium.
DE2335940A 1969-12-15 1973-07-14 Use of a solder alloy Withdrawn DE2335940B2 (en)

Priority Applications (19)

Application Number Priority Date Filing Date Title
DE2335940A DE2335940B2 (en) 1973-07-14 1973-07-14 Use of a solder alloy
AT563574A AT333096B (en) 1973-07-14 1974-07-08 SOLDER FOR FLUX-LESS SOLDERING ALUMINUM MATERIALS
CA204,512A CA1051693A (en) 1973-07-14 1974-07-10 Process and alloy for brazing aluminum-containing articles
IT69199/74A IT1046934B (en) 1973-07-14 1974-07-10 PROCEDURE FOR THE BRAZING OF ALUMINUM-BASED MATERIALS
GB30650/74A GB1480502A (en) 1973-07-14 1974-07-10 Method of brazing aluminium and aluminium alloys
FR7424036A FR2236608B2 (en) 1973-07-14 1974-07-10
NL7409347A NL7409347A (en) 1973-07-14 1974-07-10 METHOD FOR SOLDERING ALUMINUM MATERIALS.
SE7409156A SE412180C (en) 1973-07-14 1974-07-11 LOTS FOR FLUID MEDIA-FREE WELDING OF ALUMINUM MATERIAL
NO742535A NO134248C (en) 1973-07-14 1974-07-11
LU70516A LU70516A1 (en) 1973-07-14 1974-07-12
DK376074AA DK140687B (en) 1973-07-14 1974-07-12 Solder alloy.
SU742050310A SU633455A3 (en) 1973-07-14 1974-07-12 Solder for soldering aluminium
CH966474A CH562653A5 (en) 1973-07-14 1974-07-12
BE2053749A BE817578R (en) 1973-07-14 1974-07-12 PROCESS FOR BRAZING ALUMINUM AND ITS ALLOYS
ZA00744510A ZA744510B (en) 1973-07-14 1974-07-15 A soldering alloy
JP49080272A JPS5070251A (en) 1973-07-14 1974-07-15
AT176375A AT333097B (en) 1973-07-14 1975-03-07 FLUX-LESS SOLDERING OF ALUMINUM MATERIALS
US05/836,766 US4173302A (en) 1969-12-15 1977-09-26 Process and alloy for brazing aluminum-containing articles
JP4113679A JPS5547362A (en) 1973-07-14 1979-04-06 Wax alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2335940A DE2335940B2 (en) 1973-07-14 1973-07-14 Use of a solder alloy

Publications (2)

Publication Number Publication Date
DE2335940A1 DE2335940A1 (en) 1975-01-30
DE2335940B2 true DE2335940B2 (en) 1975-06-12

Family

ID=5886952

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2335940A Withdrawn DE2335940B2 (en) 1969-12-15 1973-07-14 Use of a solder alloy

Country Status (5)

Country Link
JP (1) JPS5547362A (en)
BE (1) BE817578R (en)
DE (1) DE2335940B2 (en)
SU (1) SU633455A3 (en)
ZA (1) ZA744510B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3510949A1 (en) * 1984-03-30 1985-10-10 Sumitomo Precision Products Co. Ltd., Amagasaki, Hyogo ALUMINUM SOLDER ALLOY

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61112994U (en) * 1984-12-28 1986-07-17
JP5844212B2 (en) 2012-05-07 2016-01-13 株式会社Uacj Aluminum alloy brazing sheet
JP6518460B2 (en) * 2015-03-03 2019-05-22 昭和電工株式会社 Method of manufacturing heat dissipation device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2143965C3 (en) * 1971-09-02 1981-11-26 Vereinigte Aluminium-Werke Ag, 5300 Bonn Use of a solder for flux-free brazing of aluminum materials in protective gas, inert gas or vacuum
DE1962760C3 (en) * 1969-12-15 1980-04-03 Vereinigte Aluminium-Werke Ag, 5300 Bonn Use of an aluminum-based solder for flux-free brazing of aluminum materials in protective gas, inert gas or vacuum
JPS504466A (en) * 1973-05-18 1975-01-17

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3510949A1 (en) * 1984-03-30 1985-10-10 Sumitomo Precision Products Co. Ltd., Amagasaki, Hyogo ALUMINUM SOLDER ALLOY

Also Published As

Publication number Publication date
JPS5547362A (en) 1980-04-03
DE2335940A1 (en) 1975-01-30
SU633455A3 (en) 1978-11-15
BE817578R (en) 1974-11-04
ZA744510B (en) 1975-07-30
JPS5641689B2 (en) 1981-09-30

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