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FR2758908B1 - Boitier d'encapsulation hyperfrequences bas cout - Google Patents
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FR2758908B1 - Boitier d'encapsulation hyperfrequences bas cout - Google Patents

Boitier d'encapsulation hyperfrequences bas cout

Info

Publication number
FR2758908B1
FR2758908B1 FR9700786A FR9700786A FR2758908B1 FR 2758908 B1 FR2758908 B1 FR 2758908B1 FR 9700786 A FR9700786 A FR 9700786A FR 9700786 A FR9700786 A FR 9700786A FR 2758908 B1 FR2758908 B1 FR 2758908B1
Authority
FR
France
Prior art keywords
low cost
encapsulation box
cost microwave
microwave
encapsulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9700786A
Other languages
English (en)
Other versions
FR2758908A1 (fr
Inventor
Doriane Levy
Michel Brizoux
Isabelle Favier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR9700786A priority Critical patent/FR2758908B1/fr
Publication of FR2758908A1 publication Critical patent/FR2758908A1/fr
Application granted granted Critical
Publication of FR2758908B1 publication Critical patent/FR2758908B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/216—Waveguides, e.g. strip lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
FR9700786A 1997-01-24 1997-01-24 Boitier d'encapsulation hyperfrequences bas cout Expired - Fee Related FR2758908B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9700786A FR2758908B1 (fr) 1997-01-24 1997-01-24 Boitier d'encapsulation hyperfrequences bas cout

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9700786A FR2758908B1 (fr) 1997-01-24 1997-01-24 Boitier d'encapsulation hyperfrequences bas cout

Publications (2)

Publication Number Publication Date
FR2758908A1 FR2758908A1 (fr) 1998-07-31
FR2758908B1 true FR2758908B1 (fr) 1999-04-16

Family

ID=9502957

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9700786A Expired - Fee Related FR2758908B1 (fr) 1997-01-24 1997-01-24 Boitier d'encapsulation hyperfrequences bas cout

Country Status (1)

Country Link
FR (1) FR2758908B1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000058691A (ja) 1998-08-07 2000-02-25 Sharp Corp ミリ波半導体装置
US6740959B2 (en) * 2001-08-01 2004-05-25 International Business Machines Corporation EMI shielding for semiconductor chip carriers
JP4594237B2 (ja) * 2003-09-04 2010-12-08 パナソニック株式会社 半導体装置
FR3061629A1 (fr) * 2017-01-03 2018-07-06 Stmicroelectronics (Grenoble 2) Sas Procede de fabrication d'un capot pour boitier electronique et boitier electronique comprenant un capot
FR3061628A1 (fr) * 2017-01-03 2018-07-06 Stmicroelectronics (Grenoble 2) Sas Procede de fabrication d'un capot d'encapsulation pour boitier electronique et boitier electronique comprenant un capot
FR3061630B1 (fr) 2017-01-03 2021-07-09 St Microelectronics Grenoble 2 Procede de fabrication d'un capot pour boitier electronique et boitier electronique comprenant un capot
RU2654970C1 (ru) * 2017-05-02 2018-05-23 Акционерное общество "Научно-производственное предприятие "Исток" имени А.И. Шокина" (АО "НПП "Исток" им. Шокина") Интегральная схема СВЧ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3573137D1 (en) * 1984-10-03 1989-10-26 Sumitomo Electric Industries Material for a semiconductor device and process for its manufacture
DE3843787A1 (de) * 1988-12-24 1990-07-05 Standard Elektrik Lorenz Ag Verfahren und leiterplatte zum montieren eines halbleiter-bauelements
DE69401040T2 (de) * 1993-07-12 1997-06-05 Nippon Electric Co Gehäusestruktur für Mikrowellenschaltung
FR2710195B1 (fr) * 1993-09-14 1995-10-13 Thomson Csf Assemblage antenne-circuit électronique.
US5473512A (en) * 1993-12-16 1995-12-05 At&T Corp. Electronic device package having electronic device boonded, at a localized region thereof, to circuit board
CN1166912A (zh) * 1995-03-02 1997-12-03 电路元件股份有限公司 供频率范围高达90GHz的微波电路用低成本、高性能封装

Also Published As

Publication number Publication date
FR2758908A1 (fr) 1998-07-31

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Legal Events

Date Code Title Description
CD Change of name or company name
ST Notification of lapse