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GB2126802B - High density packaging for electronic circuits - Google Patents
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GB2126802B - High density packaging for electronic circuits - Google Patents

High density packaging for electronic circuits

Info

Publication number
GB2126802B
GB2126802B GB08225182A GB8225182A GB2126802B GB 2126802 B GB2126802 B GB 2126802B GB 08225182 A GB08225182 A GB 08225182A GB 8225182 A GB8225182 A GB 8225182A GB 2126802 B GB2126802 B GB 2126802B
Authority
GB
United Kingdom
Prior art keywords
high density
electronic circuits
density packaging
packaging
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08225182A
Other versions
GB2126802A (en
Inventor
John Alan Scarlett
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB08225182A priority Critical patent/GB2126802B/en
Priority to DE19833330466 priority patent/DE3330466A1/en
Publication of GB2126802A publication Critical patent/GB2126802A/en
Application granted granted Critical
Publication of GB2126802B publication Critical patent/GB2126802B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09445—Pads for connections not located at the edge of the PCB, e.g. for flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB08225182A 1982-09-03 1982-09-03 High density packaging for electronic circuits Expired GB2126802B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB08225182A GB2126802B (en) 1982-09-03 1982-09-03 High density packaging for electronic circuits
DE19833330466 DE3330466A1 (en) 1982-09-03 1983-08-24 HIGH PACKING DENSITY ARRANGEMENT OF INTEGRATED CIRCUITS

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08225182A GB2126802B (en) 1982-09-03 1982-09-03 High density packaging for electronic circuits

Publications (2)

Publication Number Publication Date
GB2126802A GB2126802A (en) 1984-03-28
GB2126802B true GB2126802B (en) 1985-06-05

Family

ID=10532681

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08225182A Expired GB2126802B (en) 1982-09-03 1982-09-03 High density packaging for electronic circuits

Country Status (2)

Country Link
DE (1) DE3330466A1 (en)
GB (1) GB2126802B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5228192A (en) * 1990-10-29 1993-07-20 Harris Corporation Method of manufacturing a multi-layered ic packaging assembly
IT1293021B1 (en) * 1997-07-10 1999-02-11 Sme Elettronica Spa SEMICONDUCTOR POWER MODULE.
RU2119276C1 (en) * 1997-11-03 1998-09-20 Закрытое акционерное общество "Техно-ТМ" Three-dimensional flexible electronic module
DE50207814D1 (en) * 2001-09-27 2006-09-21 Siemens Ag ELECTRICAL CIRCUIT ARRANGEMENT MADE OF SEVERAL ELECTRICALLY CONNECTED CIRCUIT COMPONENTS
WO2008020361A2 (en) * 2006-08-14 2008-02-21 Koninklijke Philips Electronics N.V. Deformable integrated circuit device
EP2365740B1 (en) * 2010-03-12 2018-08-22 Omron Corporation Illuminating device
DE102013106305A1 (en) * 2012-06-20 2013-12-24 Samsung Electro-Mechanics Co., Ltd. Portable terminal

Also Published As

Publication number Publication date
GB2126802A (en) 1984-03-28
DE3330466A1 (en) 1984-03-08

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee