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GB2138205B - Methods of manufacturing a microwave circuit - Google Patents
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GB2138205B - Methods of manufacturing a microwave circuit - Google Patents

Methods of manufacturing a microwave circuit

Info

Publication number
GB2138205B
GB2138205B GB08310000A GB8310000A GB2138205B GB 2138205 B GB2138205 B GB 2138205B GB 08310000 A GB08310000 A GB 08310000A GB 8310000 A GB8310000 A GB 8310000A GB 2138205 B GB2138205 B GB 2138205B
Authority
GB
United Kingdom
Prior art keywords
manufacturing
methods
microwave circuit
microwave
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08310000A
Other versions
GB8310000D0 (en
GB2138205A (en
Inventor
Ronald Stephen Watts
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Priority to GB08310000A priority Critical patent/GB2138205B/en
Publication of GB8310000D0 publication Critical patent/GB8310000D0/en
Publication of GB2138205A publication Critical patent/GB2138205A/en
Application granted granted Critical
Publication of GB2138205B publication Critical patent/GB2138205B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/099—Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
GB08310000A 1983-04-13 1983-04-13 Methods of manufacturing a microwave circuit Expired GB2138205B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08310000A GB2138205B (en) 1983-04-13 1983-04-13 Methods of manufacturing a microwave circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08310000A GB2138205B (en) 1983-04-13 1983-04-13 Methods of manufacturing a microwave circuit

Publications (3)

Publication Number Publication Date
GB8310000D0 GB8310000D0 (en) 1983-05-18
GB2138205A GB2138205A (en) 1984-10-17
GB2138205B true GB2138205B (en) 1986-11-05

Family

ID=10541036

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08310000A Expired GB2138205B (en) 1983-04-13 1983-04-13 Methods of manufacturing a microwave circuit

Country Status (1)

Country Link
GB (1) GB2138205B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4238137A1 (en) * 1992-11-12 1994-05-19 Ant Nachrichtentech Hybrid semiconductor structure mfg. system - with semiconductor chips incorporating semiconductor components attached to semiconductor carrier substrate
KR100431031B1 (en) * 1996-10-10 2004-07-27 삼성전자주식회사 Semiconductor chip mounting method
US6038133A (en) * 1997-11-25 2000-03-14 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module and method for producing the same
FR2819080B1 (en) * 2000-12-28 2004-02-06 Thomson Csf METHOD FOR ASSEMBLING A COMPONENT SUCH AS AN INTEGRATED CIRCUIT ON A SUBSTRATE
RU2527661C1 (en) * 2013-02-11 2014-09-10 Открытое акционерное общество "Концерн радиостроения "Вега" Method of gang bonding of crystals in assembling highly-dense electronic modules
US11133866B2 (en) 2014-02-25 2021-09-28 Pharmaseq, Inc. All optical identification and sensor system with power on discovery
US10882258B1 (en) * 2016-01-22 2021-01-05 Pharmaseq, Inc. Microchip affixing probe and method of use
RU2651543C1 (en) * 2016-12-07 2018-04-20 Акционерное общество "Авиаавтоматика" имени В.В. Тарасова" Method of manufacturing microelectronic node
EP4104317A4 (en) 2020-02-14 2024-03-06 P-Chip Ip Holdings Inc. Light-triggered transponder
US12003967B2 (en) 2020-09-17 2024-06-04 P-Chip Ip Holdings Inc. Devices, systems, and methods using microtransponders

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1058296A (en) * 1963-06-28 1967-02-08 Rca Corp Composite insulator-semiconductor wafer and method of making same
US3381369A (en) * 1966-02-17 1968-05-07 Rca Corp Method of electrically isolating semiconductor circuit components
US3615946A (en) * 1967-12-01 1971-10-26 Gen Electric Method of embedding semiconductor chip within a dielectric layer flush with surface
DE2610539A1 (en) * 1976-03-12 1977-09-22 Siemens Ag SEMICONDUCTOR COMPONENT WITH ELECTRICAL CONTACTS AND METHOD FOR MAKING SUCH CONTACTS

Also Published As

Publication number Publication date
GB8310000D0 (en) 1983-05-18
GB2138205A (en) 1984-10-17

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19980413