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GB2138339B - Applying and securing solder-coated or solderable spheres to solderable or solder-coated terminal pads - Google Patents
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GB2138339B - Applying and securing solder-coated or solderable spheres to solderable or solder-coated terminal pads - Google Patents

Applying and securing solder-coated or solderable spheres to solderable or solder-coated terminal pads

Info

Publication number
GB2138339B
GB2138339B GB08310602A GB8310602A GB2138339B GB 2138339 B GB2138339 B GB 2138339B GB 08310602 A GB08310602 A GB 08310602A GB 8310602 A GB8310602 A GB 8310602A GB 2138339 B GB2138339 B GB 2138339B
Authority
GB
United Kingdom
Prior art keywords
solder
solderable
spheres
coated
cover plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08310602A
Other versions
GB8310602D0 (en
GB2138339A (en
Inventor
Ian Murrey Connell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Welwyn Electronics Ltd
Original Assignee
Welwyn Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Welwyn Electronics Ltd filed Critical Welwyn Electronics Ltd
Priority to GB08310602A priority Critical patent/GB2138339B/en
Publication of GB8310602D0 publication Critical patent/GB8310602D0/en
Publication of GB2138339A publication Critical patent/GB2138339A/en
Application granted granted Critical
Publication of GB2138339B publication Critical patent/GB2138339B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/255—Materials of outermost layers of multilayered bumps, e.g. material of a coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

Electronic components (1) are located one in each of a number of recesses (3) in a support (4) and a cover plate (5), with apertures (6) aligned with the terminal pads (2), is provided to overlie the component(s) (1) on the support (4). The cover plate (5) is not wettable by molten solder. With the cover plate (5) uppermost and in registration with each component (1) spheres (9) are applied to the cover plate (5) which is dimensioned such that one sphere (9) enters each aperture (6) and contacts a terminal pad (2). Heat is applied to melt the solder on the spheres (9) and/or pads (2). After cooling, the cover plate (5) is removed, allowing the component(s) with attached spheres to be removed from the support. The spheres provide a stand-off for the components from a circuit board. <IMAGE>
GB08310602A 1983-04-19 1983-04-19 Applying and securing solder-coated or solderable spheres to solderable or solder-coated terminal pads Expired GB2138339B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08310602A GB2138339B (en) 1983-04-19 1983-04-19 Applying and securing solder-coated or solderable spheres to solderable or solder-coated terminal pads

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08310602A GB2138339B (en) 1983-04-19 1983-04-19 Applying and securing solder-coated or solderable spheres to solderable or solder-coated terminal pads

Publications (3)

Publication Number Publication Date
GB8310602D0 GB8310602D0 (en) 1983-05-25
GB2138339A GB2138339A (en) 1984-10-24
GB2138339B true GB2138339B (en) 1986-05-14

Family

ID=10541332

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08310602A Expired GB2138339B (en) 1983-04-19 1983-04-19 Applying and securing solder-coated or solderable spheres to solderable or solder-coated terminal pads

Country Status (1)

Country Link
GB (1) GB2138339B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4704305A (en) * 1984-03-06 1987-11-03 Northern Telecom Limited Automatic solder paste application to circuit boards
US4796560A (en) * 1984-03-06 1989-01-10 Northern Telecom Limited Automatic solder paste application to circuit boards
US4646435A (en) * 1985-10-04 1987-03-03 Raychem Corporation Chip carrier alignment device and alignment method
EP0263221A1 (en) * 1986-10-08 1988-04-13 International Business Machines Corporation Method of forming solder bumps on metal contact pads of a substrate
US5048747A (en) * 1989-06-27 1991-09-17 At&T Bell Laboratories Solder assembly of components
US5145104A (en) * 1991-03-21 1992-09-08 International Business Machines Corporation Substrate soldering in a reducing atmosphere
US5244143A (en) * 1992-04-16 1993-09-14 International Business Machines Corporation Apparatus and method for injection molding solder and applications thereof
US5197655A (en) * 1992-06-05 1993-03-30 International Business Machines Corporation Fine pitch solder application
JPH0828583B2 (en) * 1992-12-23 1996-03-21 インターナショナル・ビジネス・マシーンズ・コーポレイション Multilayer printed circuit board, manufacturing method thereof, and ball dispenser
DE19618099A1 (en) * 1996-05-06 1997-11-13 Siemens Ag Compound conductor system and method for producing electrically conductive connections between two or more conductor structures
DE19634646A1 (en) * 1996-08-27 1998-03-05 Pac Tech Gmbh Selective soldering process
FR2796761B1 (en) * 1999-07-23 2003-07-25 Sorep Erulec METHOD AND DEVICE FOR PLACING CONNECTING BALLS ON A SUBSTRATE
US7946470B2 (en) * 2005-12-30 2011-05-24 Semx Corporation Method for depositing solder material on an electronic component part using separators
CN108012457A (en) * 2018-01-19 2018-05-08 南京利景盛电子有限公司 A kind of soft or hard compoboard double-sided bottom welds a reflux technique method

Also Published As

Publication number Publication date
GB8310602D0 (en) 1983-05-25
GB2138339A (en) 1984-10-24

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee