GB2149206B - Improvements in semiconductor devices - Google Patents
Improvements in semiconductor devicesInfo
- Publication number
- GB2149206B GB2149206B GB08425665A GB8425665A GB2149206B GB 2149206 B GB2149206 B GB 2149206B GB 08425665 A GB08425665 A GB 08425665A GB 8425665 A GB8425665 A GB 8425665A GB 2149206 B GB2149206 B GB 2149206B
- Authority
- GB
- United Kingdom
- Prior art keywords
- semiconductor devices
- semiconductor
- devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/031—Manufacture or treatment of conductive parts of the interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
- H10D64/0111—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors
- H10D64/0112—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors using conductive layers comprising silicides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/90—Thermal treatments, e.g. annealing or sintering
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB838327486A GB8327486D0 (en) | 1983-10-13 | 1983-10-13 | Semiconductor devices |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8425665D0 GB8425665D0 (en) | 1984-11-14 |
| GB2149206A GB2149206A (en) | 1985-06-05 |
| GB2149206B true GB2149206B (en) | 1987-04-08 |
Family
ID=10550159
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB838327486A Pending GB8327486D0 (en) | 1983-10-13 | 1983-10-13 | Semiconductor devices |
| GB08425665A Expired GB2149206B (en) | 1983-10-13 | 1984-10-11 | Improvements in semiconductor devices |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB838327486A Pending GB8327486D0 (en) | 1983-10-13 | 1983-10-13 | Semiconductor devices |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS6098620A (en) |
| GB (2) | GB8327486D0 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5028554A (en) * | 1986-07-03 | 1991-07-02 | Oki Electric Industry Co., Ltd. | Process of fabricating an MIS FET |
| JPS6370516A (en) * | 1986-09-12 | 1988-03-30 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Method of forming metal contact |
| US6468899B1 (en) * | 2001-06-27 | 2002-10-22 | Agere Systems Guardian Corp. | Contactless local interconnect process utilizing self-aligned silicide |
-
1983
- 1983-10-13 GB GB838327486A patent/GB8327486D0/en active Pending
-
1984
- 1984-10-11 GB GB08425665A patent/GB2149206B/en not_active Expired
- 1984-10-12 JP JP59214043A patent/JPS6098620A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| GB8327486D0 (en) | 1983-11-16 |
| GB2149206A (en) | 1985-06-05 |
| JPS6098620A (en) | 1985-06-01 |
| GB8425665D0 (en) | 1984-11-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |