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GB2157494B - A hermetic package for tab bonded silicon die - Google Patents
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GB2157494B - A hermetic package for tab bonded silicon die - Google Patents

A hermetic package for tab bonded silicon die

Info

Publication number
GB2157494B
GB2157494B GB08509224A GB8509224A GB2157494B GB 2157494 B GB2157494 B GB 2157494B GB 08509224 A GB08509224 A GB 08509224A GB 8509224 A GB8509224 A GB 8509224A GB 2157494 B GB2157494 B GB 2157494B
Authority
GB
United Kingdom
Prior art keywords
silicon die
bonded silicon
hermetic package
tab bonded
tab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08509224A
Other versions
GB8509224D0 (en
GB2157494A (en
Inventor
Stanley Bracey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB08118776A external-priority patent/GB2103418B/en
Application filed by Individual filed Critical Individual
Priority to GB08509224A priority Critical patent/GB2157494B/en
Publication of GB8509224D0 publication Critical patent/GB8509224D0/en
Publication of GB2157494A publication Critical patent/GB2157494A/en
Application granted granted Critical
Publication of GB2157494B publication Critical patent/GB2157494B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
GB08509224A 1981-06-18 1985-04-10 A hermetic package for tab bonded silicon die Expired GB2157494B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08509224A GB2157494B (en) 1981-06-18 1985-04-10 A hermetic package for tab bonded silicon die

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB08118776A GB2103418B (en) 1981-06-18 1981-06-18 Packaging of electronics components
GB08509224A GB2157494B (en) 1981-06-18 1985-04-10 A hermetic package for tab bonded silicon die

Publications (3)

Publication Number Publication Date
GB8509224D0 GB8509224D0 (en) 1985-05-15
GB2157494A GB2157494A (en) 1985-10-23
GB2157494B true GB2157494B (en) 1986-10-08

Family

ID=26279837

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08509224A Expired GB2157494B (en) 1981-06-18 1985-04-10 A hermetic package for tab bonded silicon die

Country Status (1)

Country Link
GB (1) GB2157494B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4842662A (en) * 1988-06-01 1989-06-27 Hewlett-Packard Company Process for bonding integrated circuit components
US4980753A (en) * 1988-11-21 1990-12-25 Honeywell Inc. Low-cost high-performance semiconductor chip package

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514273B2 (en) * 1964-08-21 1974-08-22 Nippon Electric Co., Ltd., Tokio Semiconductor arrangement
NL6903229A (en) * 1969-03-01 1970-09-03
FR2116353B1 (en) * 1970-10-19 1976-04-16 Ates Componenti Elettron
JPS52116074A (en) * 1976-03-26 1977-09-29 Hitachi Ltd Electronic part
JPS5683050A (en) * 1979-12-12 1981-07-07 Toshiba Corp Semiconductor device

Also Published As

Publication number Publication date
GB8509224D0 (en) 1985-05-15
GB2157494A (en) 1985-10-23

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee