GB2158995A - Improvements in and relating to the absorption of electromagnetic radiation - Google Patents
Improvements in and relating to the absorption of electromagnetic radiation Download PDFInfo
- Publication number
- GB2158995A GB2158995A GB08404296A GB8404296A GB2158995A GB 2158995 A GB2158995 A GB 2158995A GB 08404296 A GB08404296 A GB 08404296A GB 8404296 A GB8404296 A GB 8404296A GB 2158995 A GB2158995 A GB 2158995A
- Authority
- GB
- United Kingdom
- Prior art keywords
- microwave absorbing
- absorbing material
- semiconductor
- coating
- protrusions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000010521 absorption reaction Methods 0.000 title abstract description 11
- 230000005670 electromagnetic radiation Effects 0.000 title description 3
- 239000000463 material Substances 0.000 claims abstract description 53
- 239000004065 semiconductor Substances 0.000 claims abstract description 22
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 7
- 239000010703 silicon Substances 0.000 claims abstract description 7
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 6
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000002019 doping agent Substances 0.000 claims abstract description 4
- 229910052785 arsenic Inorganic materials 0.000 claims abstract description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000006260 foam Substances 0.000 claims abstract 2
- 229920000642 polymer Polymers 0.000 claims abstract 2
- 239000000758 substrate Substances 0.000 claims description 14
- 239000011358 absorbing material Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 4
- 239000012535 impurity Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Microwave reflectance of a material is reduced (and absorption increased) by forming parallel closely spaced apart grooves in the surface of the material and coating the grooved surface with a thin coating of a semiconductor material such as Silicon or Germanium, with or without a dopant such as Arsenic. The coated grooved surface can be rendered smooth by using an infill material of low dielectric constant such as a low density polymer foam.
Description
SPECIFICATION Improvements in and relating to the absorption of
electromagnetic radiation
Field of invention
This invention concerns the absorption of electro
magnetic radiation and particularly microwaves such
as are used in micrnwaveradarinstallations.
Background to the invention
There are situations in which it is desirable to reduce
the radar reflectance of an object and to this end the
surface of the object is covered or coated with a
material which is adapted to absorb micro-wave
energy so as to reduce the amount of energy reflected
from the surface when impinged by a microwave
pulse.
One application for such material is in the produc tion of a radio frequency anechoic chamberto permit microwave antenna measurements to be performed.
The aim of such a chamber isto simulate 'free space'
conditions albeit in a confined indoor environment, by
reducing reflectionsfromthe room boundaries.
A second application for such material is in the
covering of installations, buildings, craft and equip
ment and vehicles to reduce the chance of detection of
such by enemy radar.
It is an object ofthe present invention to provide an
improved form of material to achieve the above.
PriorArt
There are basically three types of absorbent mate
rial in use today namely: 1) a material based on the principle of matched
magnetic permeability and dielectric constant
2) resonance absorption material usually a quarter
wavelength thick operating over a relatively narrow
frequency band and
3) materials which are broad band in response and the impedance ofwhich across the thickness of the
material varies from that of free space to that ofthe medium over an appreciable thickness in terms of the wavelengths of radiation likelyto be incidentthereon.
Summary of the invention
According to the present invention a microwave
absorbing material is constructed from
1) sheet substrate material having formed in one face thereof a plurality of regularly spaced and
similarly shaped protrusions so as to form a rectilinear
lattice of grooves, and
2) a layer of semiconductor material on the grooved
surface ofthe substrate.
Typically the substrate is a metal sheet and prefer
red semiconductor materials are germanium and
silicon.
Preferably the coating of semiconductor material is
of substantially uniform thickness so that the semi
conductor coating itself follows the shape and configuration of the protrusions in the surface of the
substrate.
Absorption of microwaves is noticed at or a round 2.5GHz if the semiconductor material is intrinsic germanium. The frequency at which absorption is most noticeable increases if the germanium is lightly doped.
If intrinsic silicon is used the frequency at which absorption is most noticeable occurs at or around 1.5
MHz. Relatively high doping levels in the silicon raises this frequency to frequencies in the microwave region.
Atypical dopant is arsenic.
By utilising deep troughs and small pitch between protrusions, the coated substrate surface is found to absorb over a wide range of frequencies.
In addition to varying the depth of the grooves and the pitch of the protrusions, the bandwidth to the surface can be controlled by appropriate choice of coating material. If crystalline semiconductor material is used forthe coating material then a more sharply defined frequency response is obtained than if amorphous semiconductor material such as amorphous silicon is used. Consequently if wide bandwidth is required, amorphous semiconductor material is utilisedforthe coating.
It is believed that the absorption characteristic noted of these materials represents a redistribution of energy, the metallic substrate surface representing a perfect conductor so that no incident energy is transmitted into the material ofthe substrate.
Theory relating to so-called Floquet waves suggests that in a perfectly conducting grating the attenuation or apparent absorption of a diffracted wave in a diffraction grating or similar is attributed to a coupling of some ofthe incident energy into leaky surface waves which propagate on the periodic surface of the grating. In priciple even very slight surface roughness can stimulate coupling if the incident plane wave has transverse magnetic polarisation (ie there is magnetic field component parallel to the axis of propagation).
The absorption characteristic is also observed forTE polarisation but here it is only observed when the surface is a deeply modulated grating iewhen the modulation depth is comparable with wavelength.
The present invention provides for the coating of a grooved substrate surface which can be likened to a diffraction grating, with a semiconductor material which possesses complex permittivity at the frequencies ofthe radiation which isto be absorbed by the surface so that resonances occur in the surface.
From the work undertaken by S L Chuang and J A
Kong and detailed in an article entitled 'wave scattering and guidance by dielectric wave guides with periodic surfaces' in the Journal of the American
Optical Society Vol. 73, No. 5 May 1983, the quanta of the resulting oscillation in the surface plasma of the material is referred to as a plasmon. A requirement for plasmon generation is that the permittivity of the material should be complex and it appears that for this condition to occurthe imaginary part ofthe permittiv ityjslw (where s is the conductivity of the material and wthe angularfrequency) should be comparable with the real part of the permittivity.If either part of the permittivity dominates then the material is either a dielectric or a conductor and the plasmon effect is not observed.
If appearsthat semiconductor materials possess
The claims were filed later than the filing date within the period prescribed
by Rule 25(1) of the Patents Rules 1982. complex permittivity at frequencies in the microwave region and doping the materials allowsforvariation of the frequency atwhich the plasmon effect is most likely to be observed.
The invention will now be described by way of example with reference to the accompanying drawing in which the single figure is a cross-section to an enlarged scale through one embodiment of the invention.
Referring to the drawing, a metal orsimilarmaterial having conducting properties serves as a substrate and depending on the nature of the material can either be formed with two-dimensional corrugations so as to form an egg tray-like structure or may be a solid sheet of material one face of which is formed with a regular pattern of protrusions arranged in rows and columns.
In the example shown in the drawing each protrusion is assumed to have a solid sinusoidal form and one such protrusion is designated by reference numeral 10.
Overlaying the protrusions such as 10 is a semiconductorfilm ofthe orderof 1 to 10 microns thick. This film is designated by reference numeral 12 and is typically doped silicon.
Since the material is intended to form the outer skin of an object, it may be desirable to removethe surface roughness created by the protrusions and to this end the troughs and valleys between the protrusions may be filled with a low dielectric constant infill material such as a low density polymerfoam shown at 14.
Where this type of material forms a skin 16 during curing, the outer skin 16,which just touches the peaks
of the coated protrusions, will form a smooth outer
surface.
The production of a smooth outer surface may be
important for aerodynamic reasons or simply to facilitate in cleaning the surface.
Claims (16)
1. Microwave absorbing material constructed from:
i) sheet substrate material having formed in one face thereof a plurality of regularly spaced and similarly shaped protrusions so as to form a rectilinear lattice of grooves, and
ii) a layer of semiconductor material on the groove surface of the substrate.
2. Microwave absorbing material as claimed in claim 1, wherein the substrate is metal,
3. Microwave absorbing material as claimed in claim 1 or 2, wherein the semiconductor material is germanium or silicon.
4. Microwave absorbing material as claimed in claim 1,2 or 3, wherein the coating of semiconductor material is of substantially uniform thickness so that the semiconductor coating itselffollows the shape and configuration of the protrusions in the surface of the substrate.
5. Microwave absorbing material as claimed in any ofthe preceding claims, wherein the semiconductor material is doped with one or more impurities.
6. Microwave absorbing material as claimed in claim 5, where;n the dopant is arsenic.
7. Microwave absorbing material as claimed in any of the preceding claims, wherein the protrusions are separated by deep troughs and the spacing between protrusions is small.
8. Microwave absorbing material as claimed in any of the preceding claims, wherein crystalline semiconductor material is used for the coating material.
9. Microwave absorbing material as claimed in any of claims 1 to 7, wherein amorphous semiconductor material is utilised forthe coating material.
10. Microwave absorbing material comprising a substrate having a finishing surface coated with a semiconductor material which possesses complex permitivity at the frequencies of the radiation which is to be absorbed by the surface, so that resonances occur in the surface.
11. Microwave absorbing material as claimed in any ofthe preceding claims, wherein valleys between the protrusions are filled with low dielectric constant infill material.
12. Microwave absorbing material as claimed in claim 11 wherein the infill material is a low density polymerfoam.
13. A method of reducing microwave reflectance of a surface comprising the steps of
(a) forming parallel grooves in the said surface, and
(b) coating the grooved surface with a semiconductor material.
14. A method as claimed in claim 13, wherein the semiconductor material is silicon or germanium, with orwithouta dopant.
15. A method as claimed in claim 13 or 14, wherein the grooved semiconductor coated surface is rendered smooth by filling the grooves with a low dielectric constant infill material.
16. A method as claimed in claim 15, wherein the infill material isa low density polymer foam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB08404296A GB2158995A (en) | 1984-02-18 | 1984-02-18 | Improvements in and relating to the absorption of electromagnetic radiation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB08404296A GB2158995A (en) | 1984-02-18 | 1984-02-18 | Improvements in and relating to the absorption of electromagnetic radiation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB2158995A true GB2158995A (en) | 1985-11-20 |
Family
ID=10556798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08404296A Withdrawn GB2158995A (en) | 1984-02-18 | 1984-02-18 | Improvements in and relating to the absorption of electromagnetic radiation |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2158995A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2184861A (en) * | 1985-11-08 | 1987-07-01 | Sec Dep For Trade & Industry T | Metallic surface with projections filled with absorbent material |
| RU2124788C1 (en) * | 1997-12-04 | 1999-01-10 | Военный инженерно-космический университет имени А.Ф.Можайского | Electromagnetic wave absorber |
| FR2767018A1 (en) * | 1997-07-29 | 1999-02-05 | Thomson Csf | Bi-periodic grating for hertzian wave screening |
| US6077792A (en) * | 1997-07-14 | 2000-06-20 | Micron Technology, Inc. | Method of forming foamed polymeric material for an integrated circuit |
| WO2001015274A1 (en) * | 1999-08-25 | 2001-03-01 | Qinetiq Limited | Low frequency electromagnetic absorption surface |
| US6413827B2 (en) | 2000-02-14 | 2002-07-02 | Paul A. Farrar | Low dielectric constant shallow trench isolation |
| US6614092B2 (en) | 2000-08-16 | 2003-09-02 | Micron Technology, Inc. | Microelectronic device package with conductive elements and associated method of manufacture |
| US6670719B2 (en) | 1999-08-25 | 2003-12-30 | Micron Technology, Inc. | Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture |
| US6677209B2 (en) | 2000-02-14 | 2004-01-13 | Micron Technology, Inc. | Low dielectric constant STI with SOI devices |
| US6872671B2 (en) | 1999-08-25 | 2005-03-29 | Micron Technology, Inc. | Insulators for high density circuits |
| US6890847B1 (en) | 2000-02-22 | 2005-05-10 | Micron Technology, Inc. | Polynorbornene foam insulation for integrated circuits |
| RU2309495C2 (en) * | 2005-12-23 | 2007-10-27 | Федеральное государственное унитарное предприятие "Научно-производственное объединение прикладной механики им. академика М.Ф.Решетнева" | Electromagnetic wave absorber |
| US7335965B2 (en) | 1999-08-25 | 2008-02-26 | Micron Technology, Inc. | Packaging of electronic chips with air-bridge structures |
| US7405454B2 (en) | 2003-03-04 | 2008-07-29 | Micron Technology, Inc. | Electronic apparatus with deposited dielectric layers |
| US8501563B2 (en) | 2005-07-20 | 2013-08-06 | Micron Technology, Inc. | Devices with nanocrystals and methods of formation |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB609060A (en) * | 1946-03-05 | 1948-09-24 | Athur Harold Stevens | Improvements in or relating to an absorption device for ultra high frequency radiant energy |
| GB795510A (en) * | 1954-06-11 | 1958-05-21 | Siemens Ag | Improvements in or relating to arrangements for reducing or preventing the reflection of electromagnetic waves |
| GB829614A (en) * | 1958-07-08 | 1960-03-02 | Edward Bellamy Mcmillan | Microwave-radiation absorbers |
| GB879489A (en) * | 1958-06-24 | 1961-10-11 | Edward Bellamy Mcmillan | Absorber for short radio waves |
| GB1030483A (en) * | 1963-03-12 | 1966-05-25 | Siemens Ag | Structures of low-reflectivity for attenuating electromagnetic waves |
| GB1074851A (en) * | 1959-07-03 | 1967-07-05 | Eltro Gmbh | Radar wave absorbing structural material |
| GB1074898A (en) * | 1961-02-02 | 1967-07-05 | Eltro Gmbh | Improvements in devices for absorbing elector-magnetic waves |
| GB1074892A (en) * | 1956-08-27 | 1967-07-05 | Eltro Gmbh | Roofing boards having high frequency electro-magnetic absorbing properties |
| GB1074896A (en) * | 1957-01-15 | 1967-07-05 | Eltro Gmbh | Non-metallic packing material with interference absorption for electromagnetic waves |
| GB1074893A (en) * | 1956-08-31 | 1967-07-05 | Eltro Gmbh | Radar camouflage for moving objects such as aircraft and ships |
| GB1170420A (en) * | 1966-12-30 | 1969-11-12 | Eltro Gmbh | Improvements in or relating to a Spatial Absorber for Electromagnetic Waves |
| US4353069A (en) * | 1980-09-10 | 1982-10-05 | Handel Peter H | Absorptive coating for the reduction of the reflective cross section of metallic surfaces and control capabilities therefor |
-
1984
- 1984-02-18 GB GB08404296A patent/GB2158995A/en not_active Withdrawn
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB609060A (en) * | 1946-03-05 | 1948-09-24 | Athur Harold Stevens | Improvements in or relating to an absorption device for ultra high frequency radiant energy |
| GB795510A (en) * | 1954-06-11 | 1958-05-21 | Siemens Ag | Improvements in or relating to arrangements for reducing or preventing the reflection of electromagnetic waves |
| GB1074892A (en) * | 1956-08-27 | 1967-07-05 | Eltro Gmbh | Roofing boards having high frequency electro-magnetic absorbing properties |
| GB1074893A (en) * | 1956-08-31 | 1967-07-05 | Eltro Gmbh | Radar camouflage for moving objects such as aircraft and ships |
| GB1074971A (en) * | 1957-01-15 | 1967-07-05 | Eltro Gmbh | Non-metallic packing material with interfernce absorption for electromagnetic waves |
| GB1074896A (en) * | 1957-01-15 | 1967-07-05 | Eltro Gmbh | Non-metallic packing material with interference absorption for electromagnetic waves |
| GB879489A (en) * | 1958-06-24 | 1961-10-11 | Edward Bellamy Mcmillan | Absorber for short radio waves |
| GB829614A (en) * | 1958-07-08 | 1960-03-02 | Edward Bellamy Mcmillan | Microwave-radiation absorbers |
| GB1074851A (en) * | 1959-07-03 | 1967-07-05 | Eltro Gmbh | Radar wave absorbing structural material |
| GB1074898A (en) * | 1961-02-02 | 1967-07-05 | Eltro Gmbh | Improvements in devices for absorbing elector-magnetic waves |
| GB1030483A (en) * | 1963-03-12 | 1966-05-25 | Siemens Ag | Structures of low-reflectivity for attenuating electromagnetic waves |
| GB1170420A (en) * | 1966-12-30 | 1969-11-12 | Eltro Gmbh | Improvements in or relating to a Spatial Absorber for Electromagnetic Waves |
| US4353069A (en) * | 1980-09-10 | 1982-10-05 | Handel Peter H | Absorptive coating for the reduction of the reflective cross section of metallic surfaces and control capabilities therefor |
Cited By (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2184861A (en) * | 1985-11-08 | 1987-07-01 | Sec Dep For Trade & Industry T | Metallic surface with projections filled with absorbent material |
| US6734562B1 (en) | 1997-07-14 | 2004-05-11 | Micron Technology, Inc. | Integrated circuit device structure including foamed polymeric material |
| US6077792A (en) * | 1997-07-14 | 2000-06-20 | Micron Technology, Inc. | Method of forming foamed polymeric material for an integrated circuit |
| FR2767018A1 (en) * | 1997-07-29 | 1999-02-05 | Thomson Csf | Bi-periodic grating for hertzian wave screening |
| RU2124788C1 (en) * | 1997-12-04 | 1999-01-10 | Военный инженерно-космический университет имени А.Ф.Можайского | Electromagnetic wave absorber |
| US6909171B2 (en) | 1999-08-25 | 2005-06-21 | Micron Technology, Inc. | Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture |
| US6872671B2 (en) | 1999-08-25 | 2005-03-29 | Micron Technology, Inc. | Insulators for high density circuits |
| GB2370420B (en) * | 1999-08-25 | 2003-08-13 | Qinetiq Ltd | Low frequency electromagnetic absorption surface |
| US7387912B2 (en) | 1999-08-25 | 2008-06-17 | Micron Technology, Inc. | Packaging of electronic chips with air-bridge structures |
| US6642881B1 (en) | 1999-08-25 | 2003-11-04 | Qinetiq Limited | Low frequency electromagnetic absorption surface |
| US6670719B2 (en) | 1999-08-25 | 2003-12-30 | Micron Technology, Inc. | Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture |
| US7335965B2 (en) | 1999-08-25 | 2008-02-26 | Micron Technology, Inc. | Packaging of electronic chips with air-bridge structures |
| WO2001015274A1 (en) * | 1999-08-25 | 2001-03-01 | Qinetiq Limited | Low frequency electromagnetic absorption surface |
| GB2370420A (en) * | 1999-08-25 | 2002-06-26 | Qinetiq Ltd | Low frequency electromagnetic absorption surface |
| US6677209B2 (en) | 2000-02-14 | 2004-01-13 | Micron Technology, Inc. | Low dielectric constant STI with SOI devices |
| US6413827B2 (en) | 2000-02-14 | 2002-07-02 | Paul A. Farrar | Low dielectric constant shallow trench isolation |
| US6770537B2 (en) | 2000-02-14 | 2004-08-03 | Micron Technology, Inc. | Low dielectric constant shallow trench isolation |
| US6781192B2 (en) | 2000-02-14 | 2004-08-24 | Micron Technology, Inc. | Low dielectric constant shallow trench isolation |
| US6780721B2 (en) | 2000-02-14 | 2004-08-24 | Micron Technology, Inc. | Low dielectric constant shallow trench isolation |
| US6737723B2 (en) | 2000-02-14 | 2004-05-18 | Micron Technology, Inc. | Low dielectric constant shallow trench isolation |
| US6756653B2 (en) | 2000-02-14 | 2004-06-29 | Micron Technology, Inc. | Low dielectric constant shallow trench isolation |
| US6953983B2 (en) | 2000-02-14 | 2005-10-11 | Micron Technology, Inc. | Low dielectric constant STI with SOI devices |
| US6890847B1 (en) | 2000-02-22 | 2005-05-10 | Micron Technology, Inc. | Polynorbornene foam insulation for integrated circuits |
| US6709968B1 (en) | 2000-08-16 | 2004-03-23 | Micron Technology, Inc. | Microelectronic device with package with conductive elements and associated method of manufacture |
| US6614092B2 (en) | 2000-08-16 | 2003-09-02 | Micron Technology, Inc. | Microelectronic device package with conductive elements and associated method of manufacture |
| US7405454B2 (en) | 2003-03-04 | 2008-07-29 | Micron Technology, Inc. | Electronic apparatus with deposited dielectric layers |
| US8501563B2 (en) | 2005-07-20 | 2013-08-06 | Micron Technology, Inc. | Devices with nanocrystals and methods of formation |
| US8921914B2 (en) | 2005-07-20 | 2014-12-30 | Micron Technology, Inc. | Devices with nanocrystals and methods of formation |
| RU2309495C2 (en) * | 2005-12-23 | 2007-10-27 | Федеральное государственное унитарное предприятие "Научно-производственное объединение прикладной механики им. академика М.Ф.Решетнева" | Electromagnetic wave absorber |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |