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GB2160707B - Ga as integrated circuit package - Google Patents
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GB2160707B - Ga as integrated circuit package - Google Patents

Ga as integrated circuit package

Info

Publication number
GB2160707B
GB2160707B GB8512092A GB8512092A GB2160707B GB 2160707 B GB2160707 B GB 2160707B GB 8512092 A GB8512092 A GB 8512092A GB 8512092 A GB8512092 A GB 8512092A GB 2160707 B GB2160707 B GB 2160707B
Authority
GB
United Kingdom
Prior art keywords
integrated circuit
circuit package
package
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8512092A
Other versions
GB8512092D0 (en
GB2160707A (en
Inventor
Tushar R Gheewala
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gigabit Logic Inc
Original Assignee
Gigabit Logic Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gigabit Logic Inc filed Critical Gigabit Logic Inc
Publication of GB8512092D0 publication Critical patent/GB8512092D0/en
Publication of GB2160707A publication Critical patent/GB2160707A/en
Application granted granted Critical
Publication of GB2160707B publication Critical patent/GB2160707B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/698—Semiconductor materials that are electrically insulating, e.g. undoped silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
GB8512092A 1984-05-14 1985-05-13 Ga as integrated circuit package Expired GB2160707B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US60972884A 1984-05-14 1984-05-14

Publications (3)

Publication Number Publication Date
GB8512092D0 GB8512092D0 (en) 1985-06-19
GB2160707A GB2160707A (en) 1985-12-24
GB2160707B true GB2160707B (en) 1988-10-19

Family

ID=24442081

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8512092A Expired GB2160707B (en) 1984-05-14 1985-05-13 Ga as integrated circuit package

Country Status (4)

Country Link
JP (1) JPS6116539A (en)
DE (1) DE3516954A1 (en)
FR (1) FR2564244B1 (en)
GB (1) GB2160707B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4754317A (en) * 1986-04-28 1988-06-28 Monolithic Memories, Inc. Integrated circuit die-to-lead frame interconnection assembly and method
US4774635A (en) * 1986-05-27 1988-09-27 American Telephone And Telegraph Company At&T Bell Laboratories Semiconductor package with high density I/O lead connection
FR2623662B1 (en) * 1987-11-20 1990-03-09 Labo Electronique Physique CONNECTION DEVICE FOR ULTRA-FAST DIGITAL INTEGRATED CIRCUITS
JPH0226243U (en) * 1988-08-08 1990-02-21
US5089878A (en) * 1989-06-09 1992-02-18 Lee Jaesup N Low impedance packaging
US5063177A (en) * 1990-10-04 1991-11-05 Comsat Method of packaging microwave semiconductor components and integrated circuits
US20030089998A1 (en) * 2001-11-09 2003-05-15 Chan Vincent K. Direct interconnect multi-chip module, method for making the same and electronic package comprising same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0007993A1 (en) * 1978-07-12 1980-02-20 Siemens Aktiengesellschaft Conductor plate for mounting and electrically connecting semiconductor chips
JPS5687395A (en) * 1979-12-18 1981-07-15 Fujitsu Ltd Semiconductor device
CA1115852A (en) * 1980-01-09 1982-01-05 Jacques R. St. Louis Mounting and packaging of silicon devices on ceramic substrates, and assemblies containing silicon devices
JPS6041861B2 (en) * 1980-03-25 1985-09-19 三菱電機株式会社 semiconductor equipment
JPS57154861A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Package
US4437141A (en) * 1981-09-14 1984-03-13 Texas Instruments Incorporated High terminal count integrated circuit device package
GB2117564B (en) * 1982-03-26 1985-11-06 Int Computers Ltd Mounting one integrated circuit upon another
JPS58210650A (en) * 1982-06-01 1983-12-07 Fujitsu Ltd Semiconductor device
GB2136203B (en) * 1983-03-02 1986-10-15 Standard Telephones Cables Ltd Through-wafer integrated circuit connections

Also Published As

Publication number Publication date
JPS6116539A (en) 1986-01-24
FR2564244A1 (en) 1985-11-15
DE3516954A1 (en) 1985-11-14
GB8512092D0 (en) 1985-06-19
FR2564244B1 (en) 1988-12-02
GB2160707A (en) 1985-12-24

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee